CN220188573U - Direct-insert type power semiconductor module test fixture - Google Patents

Abstract

The utility model discloses a direct-insert type power semiconductor module testing fixture which comprises a base and a detection platform arranged at the upper end of the base, wherein a plurality of detection holes b are formed in the outer wall of the upper end of the detection platform at equal intervals to adapt to pins of different semiconductor modules, a fixed frame is arranged at the upper end of the base and positioned at the rear end of the detection platform, a driver is arranged at the front end of the fixed frame, a driving rod is fixedly connected to the lower end of the driver, a pressing plate is in transmission connection with the lower end of the driving rod, a control button is arranged on the outer wall of the front end of the base close to the right side, a fixing plate is fixedly connected to the lower end of the pressing plate, a soft block is embedded in the outer wall of the front end of the fixing plate, separation grooves are formed in the soft block to divide the soft block into a plurality of blocks to adapt to different semiconductor module shapes, and the different semiconductor modules can be stably abutted and fixed by the pressing plate through the fixing plate, the soft block and the separation grooves.

Description

Direct-insert type power semiconductor module test fixture

Technical Field

The utility model belongs to the technical field of test fixtures, and particularly relates to a direct-insertion type power semiconductor module test fixture.

Background

When the semiconductor module is detected, the semiconductor module and the detection base are required to be inserted, the pins on the semiconductor module and the detection holes between the detection bases are more tightly inserted through the clamping blocks applying pressure downwards, so that the detection accuracy is improved, but when the pressing plates are used for laminating and pressing different semiconductor modules, the upper end forms of the different semiconductor modules are different, the pressing plates cannot be matched with the semiconductor modules with different forms to clamp the semiconductor modules with the protruding tops, only the protruding parts can be abutted to clamp, the area of the abutting clamping is small, and the protruding parts are easy to be deformed and damaged downwards when the larger pressure is applied to the protruding parts in a butt joint mode.

Disclosure of Invention

The utility model aims to provide a direct-insert type power semiconductor module testing clamp, which solves the problem that the compacting plate provided in the background art cannot be adapted to semiconductor modules with different forms for clamping when clamping the semiconductor modules with more convex tops.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the direct-insertion type power semiconductor module testing fixture comprises a base and a detection platform arranged at the upper end of the base;

a plurality of detection holes b are formed in the outer wall of the upper end of the detection platform at equal intervals so as to be matched with pins of different semiconductor modules;

the upper end of the base and the rear end of the detection platform are provided with a fixed frame;

the front end of the fixed frame is provided with a driver, the lower end of the driver is fixedly connected with a driving rod, the lower end of the driving rod is in transmission connection with a compacting plate, and the outer wall of the front end of the base is provided with a control button close to the right side to control the driving rod to shrink up and down;

the lower extreme fixedly connected with fixed plate of sticiss the board, the inside soft piece of embedded in front end outer wall of fixed plate is in order to laminate the semiconductor module of different forms, the inside of soft piece is provided with the separating groove in order to divide into a plurality of semiconductor module shapes in order to adapt to the difference with the soft piece.

Preferably, the front end outer wall of the fixed frame is embedded with connecting plates near the left side and the right side, and the front end outer walls of the two connecting plates are provided with scale bars.

Preferably, the soft blocks are made of memory sponge materials, and the soft blocks are the same in size.

Preferably, a plurality of positioning rods are arranged in the fixed frame, and connecting blocks which are in transmission connection with the positioning rods are arranged on the outer wall of the rear end of the compacting plate close to the left side and the right side.

Preferably, a detection hole a which is opened upwards is formed in the center of the outer wall of the upper end of the detection platform, and a switch is arranged on the left side, close to the center of the outer wall of the front end of the base.

Preferably, the base drives lower extreme outer wall four corners department and all is provided with the stabilizer blade, control button and switch all adopt push type design.

Preferably, the driving rod can perform up-and-down telescopic operation, and the driving rod can drive the clamping plate to move up and down so as to clamp and loosen the semiconductor module.

Compared with the prior art, the utility model provides the direct-insert power semiconductor module testing fixture, which has the following beneficial effects:

through installation fixed plate, soft piece and separating groove, when carrying out the butt to the semiconductor module of upper end form difference, a plurality of soft pieces that separate through separating groove in the fixed plate can adapt to the different forms of different semiconductor module upper ends and carry out the butt, and do not influence each other between a plurality of soft pieces, can carry out the adaptation to the protruding and the sunken of different degree on the semiconductor module to make different semiconductor module all can be pressed the board and carry out stable butt fixedly.

Drawings

Fig. 1 is a schematic structural diagram of a test fixture for an in-line power semiconductor module according to the present utility model.

Fig. 2 is a schematic view showing a partial structure of a fixing plate area according to the present utility model.

Fig. 3 is a schematic top view of a fixing plate area according to the present utility model.

In the figure: 1. a base; 2. a support leg; 3. a detection hole a; 4. a fixed frame; 5. a pressing plate; 6. a connecting block; 7. a positioning rod; 8. a driving rod; 9. a driver; 10. a fixing plate; 11. a detection hole b; 12. a detection platform; 13. a switch; 14. a scale bar; 15. a connecting plate; 16. a soft block; 17. a separation groove; 18. control buttons.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides a direct-insert power semiconductor module test fixture as shown in fig. 1-3, which comprises a base 1 and a detection platform 12 arranged at the upper end of the base 1;

a plurality of detection holes b11 are equidistantly formed in the outer wall of the upper end of the detection platform 12 so as to be matched with pins of different semiconductor modules;

the upper end of the base 1 and the rear end of the detection platform 12 are provided with a fixed frame 4;

the front end of the fixed frame 4 is provided with a driver 9, the lower end of the driver 9 is fixedly connected with a driving rod 8, the lower end of the driving rod 8 is in transmission connection with a pressing plate 5, a control button 18 is arranged on the outer wall of the front end of the base 1 close to the right side to control the driving rod 8 to shrink up and down, pins on a semiconductor module to be detected penetrate downwards into a detection hole b11 at the upper end of the detection platform 12, and then the driver 9 is controlled by pressing the control button 18 at the lower side to enable the driving rod 8 to drive the pressing plate 5 to move downwards onto the semiconductor module to be clamped and fixed, so that the semiconductor module and the detection platform 12 are more tightly spliced;

the lower extreme fixedly connected with fixed plate 10 of tight clamp plate 5, the inside of front end outer wall of fixed plate 10 is embedded to have soft piece 16 in order to laminate the semiconductor module of different forms, the inside of soft piece 16 is provided with separating groove 17 in order to divide into a plurality of in order to adapt to different semiconductor module shapes with soft piece 16, press down the removal at tight clamp plate 5 and laminate between the semiconductor module and press from both sides the fastening timing, soft piece 16 in fixed plate 10 divide into a plurality of soft pieces 16 under separating groove 17's separation, a plurality of soft pieces 16 are when contacting with the semiconductor module, can laminate the unsmooth position on the semiconductor module surface of adaptation different forms, avoid tight clamp plate 5 to the condition emergence of semiconductor module centre gripping not closely enough.

As shown in fig. 2, the front end outer wall of the fixed frame 4 is close to the left side and the right side and is embedded with connecting plates 15, the front end outer walls of the two connecting plates 15 are provided with scale bars 14, when the control button 18 controls the up-and-down telescopic operation of the driving rod 8, the scale bars 14 on the connecting plates 15 can be used for accurately controlling the downward moving distance, so that the situation that the damage to the semiconductor module is caused due to the overlong downward moving distance is avoided.

As shown in fig. 3, the soft blocks 16 are made of memory sponge materials, have softer textures, and can adapt to different shapes to be attached by adapting to the deformation of the shapes, and the soft blocks 16 are the same in size and can be tightly attached by adapting to the situations of semiconductor modules with different sizes in different positions.

As shown in fig. 1, a plurality of positioning rods 7 are arranged in the fixed frame 4, connecting blocks 6 which are in transmission connection with the positioning rods 7 are arranged on the outer wall of the rear end of the clamping plate 5 close to the left side and the right side, and when the clamping plate 5 moves up and down, the connecting blocks 6 are driven to move up and down on the positioning rods 7, so that the stability of the clamping plate 5 during up and down movement is improved.

As shown in fig. 1, an upward opening detection hole a3 is formed in the center of the outer wall of the upper end of the detection platform 12, a semiconductor module positioning block to be detected is inserted into the detection hole a3 for position fixing, a switch 13 is arranged near the left side of the center of the outer wall of the front end of the base 1, a working element in the base 1 is started to enter a working state by pressing the switch 13, supporting feet 2 are arranged at four corners of the outer wall of the lower end of the base 1, so that the base 1 is supported at a proper distance from a tabletop, liquid on the tabletop is prevented from entering the base 1, the control button 18 and the switch 13 are designed in a pressing mode, the control operation can be quickly performed by pressing the control button 18 and the switch 13, and the next operation can be quickly rebounded after the control button is pressed.

As shown in fig. 1, the driving rod 8 can perform up-and-down expansion operation, the driving rod 8 can drive the clamping plate 5 to move up and down to clamp and loosen the semiconductor module, and the clamping plate 5 is driven to clamp and fasten the semiconductor module on the detection platform 12 through the up-and-down expansion of the driving rod 8.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims (7)

1. The direct-insertion type power semiconductor module testing fixture comprises a base (1) and a detection platform (12) arranged at the upper end of the base (1);

a plurality of detection holes b (11) are equidistantly formed in the outer wall of the upper end of the detection platform (12) so as to be matched with pins of different semiconductor modules;

the upper end of the base (1) and the rear end of the detection platform (12) are provided with a fixed frame (4);

the front end of the fixed frame (4) is provided with a driver (9), the lower end of the driver (9) is fixedly connected with a driving rod (8), the lower end of the driving rod (8) is in transmission connection with a compacting plate (5), and the outer wall of the front end of the base (1) is provided with a control button (18) close to the right side to control the driving rod (8) to shrink up and down;

the method is characterized in that: the lower extreme fixedly connected with fixed plate (10) of sticiss board (5), the inside soft piece (16) of front end outer wall of fixed plate (10) is embedded in order to laminate the semiconductor module of different forms, the inside of soft piece (16) is provided with separating groove (17) in order to divide into a plurality of semiconductor module shapes in order to adapt to the difference with soft piece (16).

2. The in-line power semiconductor module test fixture of claim 1, wherein: connecting plates (15) are embedded in the outer walls of the front ends of the fixed frames (4) close to the left side and the right side, and scale strips (14) are arranged on the outer walls of the front ends of the two connecting plates (15).

3. The in-line power semiconductor module test fixture of claim 1, wherein: the soft blocks (16) are made of memory sponge materials, and the soft blocks (16) are the same in size.

4. The in-line power semiconductor module test fixture of claim 1, wherein: the inside of fixed frame (4) is provided with a plurality of locating levers (7), the rear end outer wall of sticiss board (5) is close to left and right sides and all is provided with connecting block (6) that carries out transmission connection on locating lever (7).

5. The in-line power semiconductor module test fixture of claim 1, wherein: the detection platform is characterized in that a detection hole a (3) which is opened upwards is formed in the center of the outer wall of the upper end of the detection platform (12), and a switch (13) is arranged on the left side, close to the center of the outer wall of the front end of the base (1).

6. An in-line power semiconductor module test fixture according to claim 1 or 5, wherein: the base (1) drives the outer wall four corners of the lower end to be provided with supporting legs (2), and the control button (18) and the switch (13) are designed in a pressing mode.

7. The in-line power semiconductor module test fixture of claim 1, wherein: the driving rod (8) can be used for performing up-down telescopic operation, and the driving rod (8) can drive the tight pressing plate (5) to move up and down so as to clamp and loosen the semiconductor module.