CN220181305U - Dyestripping equipment suitable for wafer processing - Google Patents
Dyestripping equipment suitable for wafer processing Download PDFInfo
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- CN220181305U CN220181305U CN202321217853.1U CN202321217853U CN220181305U CN 220181305 U CN220181305 U CN 220181305U CN 202321217853 U CN202321217853 U CN 202321217853U CN 220181305 U CN220181305 U CN 220181305U
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- processing
- film
- film tearing
- platform
- displacement adjusting
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- 238000006073 displacement reaction Methods 0.000 claims abstract description 38
- 239000012528 membrane Substances 0.000 claims description 4
- 239000013307 optical fiber Substances 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 abstract description 3
- 238000012544 monitoring process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 29
- 238000000034 method Methods 0.000 description 7
- 238000007665 sagging Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 241000446313 Lamella Species 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Abstract
The utility model relates to film tearing equipment suitable for wafer processing, which comprises an equipment platform, wherein a main displacement adjusting device is arranged on the equipment platform, a processing bracket is arranged on the main displacement adjusting device, a jacking device is arranged on the processing bracket, a film tearing platform is arranged on the jacking device, a reserved processing hole is arranged at the position of the processing bracket corresponding to the film tearing platform, an auxiliary displacement adjusting device is arranged on the equipment platform, a film clamping device is arranged on the auxiliary displacement adjusting device, and a sensing device is arranged on one side of the processing bracket, which is positioned at the reserved processing hole. From this, can realize full-automatic quick dyestripping, and ensure that perpendicular string of film does not appear gluing during the dyestripping, the film can not take place the secondary contact with the wafer, also can not bond to other positions of processing equipment, accessible follow-up collection device carries out centralized collection processing. The sensing device is adopted for implementation monitoring, so that coordination operation among other devices is facilitated, and effective implementation adjustment of parameters such as height, film tearing stroke and the like can be realized during film tearing.
Description
Technical Field
The utility model relates to a film tearing device, in particular to a film tearing device suitable for wafer processing.
Background
For semiconductor processing, the wafer is stored and then properly protected and isolated, often with a film wrapped around the wafer. The film needs to be taken out when the actual processing is performed. At present, a film tearing device is often adopted to realize the stripping of the film.
However, existing film tearing apparatus employ a bottom-up or diagonal path to tear the film. During this time, sagging of the film occurs due to gravity or static electricity, resulting in repeated attachment of the torn film to the wafer, causing secondary pollution. Meanwhile, the film may be in contact with other components of the equipment after sagging, so that subsequent recovery is affected, and the film is easy to fall off and other using defects are caused.
In view of the above-mentioned drawbacks, the present inventors have actively studied and innovated to create a film tearing apparatus suitable for wafer processing, which has a more industrially useful value.
Disclosure of Invention
In order to solve the technical problems, the utility model aims to provide a film tearing device suitable for wafer processing.
The utility model relates to a film tearing device suitable for wafer processing, which comprises a device platform, wherein a main displacement adjusting device is arranged on the device platform, and the main displacement adjusting device comprises the following components: the device is characterized in that a processing support is arranged on the main displacement adjusting device, a jacking device is arranged on the processing support, a film tearing platform is arranged on the jacking device, a reserved processing hole is formed in the position of the processing support corresponding to the film tearing platform, an auxiliary displacement adjusting device is arranged on the equipment platform, a film clamping device is arranged on the auxiliary displacement adjusting device, and a sensing device is arranged on one side of the processing support, which is located in the reserved processing hole.
Further, the above-mentioned dyestripping equipment suitable for wafer processing, wherein, processing support is including the bottom plate, the bottom plate links to each other with the main displacement adjusting device, be provided with a plurality of bearing frame on the bottom plate perpendicularly, the top of bearing the frame is provided with the top plate, reserving the processing hole has been seted up on the top plate, still be provided with the intermediate lamella between the bearing frame, jacking device's bottom links to each other with the intermediate lamella.
Still further, above-mentioned dyestripping equipment suitable for wafer processing, wherein, jacking device is including the installation base, be provided with the electric jar on the installation base, the work end of electric jar is provided with the loading board, the dyestripping platform links to each other with the loading board.
Still further, the above-mentioned dyestripping equipment suitable for wafer processing, wherein, the clamp membrane device is including the lifting support that links to each other with vice displacement adjustment device, the upper end of lifting support is provided with clip subassembly, clip subassembly's opening corresponds with the dyestripping platform.
Still further, the above-mentioned dyestripping equipment suitable for wafer processing, wherein, the lifting support is the zigzag support, the top of zigzag support is provided with the altitude mixture control board, clip assembly links to each other with the altitude mixture control board, clip assembly is electric clip or is pneumatic clip.
Furthermore, the film tearing device suitable for wafer processing is described above, wherein the sensing device is an optical fiber reflection sensor.
Furthermore, the above-mentioned dyestripping equipment suitable for wafer processing, wherein, main displacement adjusting device, vice displacement adjusting device are linear electric motor.
Still further, the above-mentioned dyestripping equipment suitable for wafer processing, wherein, be provided with the lift plate on the equipment platform, vice displacement adjustment device installs on the lift plate.
Still further, the above-mentioned dyestripping equipment suitable for wafer processing, wherein, be provided with a plurality of mounting holes on the equipment platform.
By means of the scheme, the utility model has at least the following advantages:
1. can realize full-automatic quick dyestripping, and guarantee that perpendicular string of film does not appear gluing during the dyestripping, the film can not take place the secondary contact with the wafer, also can not bond to other positions of processing equipment, and the accessible is follow-up collection device carries out centralized collection and handles.
2. The sensing device is adopted for implementation monitoring, so that coordination operation among other devices is facilitated, and effective implementation adjustment of parameters such as height, film tearing stroke and the like can be realized during film tearing.
3. The whole structure is simple, the existing film tearing equipment can be modified, and the implementation cost is low.
4. The wafer is not scratched during use due to the proper abdication space, and the butt joint of the front working procedure and the rear working procedure can be realized.
The foregoing description is only an overview of the present utility model, and is intended to provide a better understanding of the present utility model, as it is embodied in the following description, with reference to the preferred embodiments of the present utility model and the accompanying drawings.
Drawings
Fig. 1 is a schematic structural view of a film tearing apparatus suitable for wafer processing.
The meaning of each reference numeral in the figures is as follows.
1. Main displacement adjusting device of equipment platform 2
3. Jacking device for machining support 4
5. 6 pair of displacement adjusting device of dyestripping platform
7. Sensor of film clamping device 8
9. Lifting bracket 10 lifting plate
11. Wafer 12 film
13. Bearing plate
Detailed Description
The following describes in further detail the embodiments of the present utility model with reference to the drawings and examples. The following examples are illustrative of the utility model and are not intended to limit the scope of the utility model.
The dyestripping equipment suitable for wafer processing of fig. 1 through, including equipment platform 1, be provided with main displacement adjusting device 2 on the equipment platform 1, its difference lies in: the main displacement adjusting device 2 is provided with a processing bracket 3, so that centralized layout support of each subsequent device is conveniently provided. Meanwhile, in order to avoid unnecessary sagging of the film 12 during the tearing process, the film is not adhered to other places of the processing support 3 or improperly covered by the wafer 11 due to the sagging of gravity, the processing support 3 is provided with a jacking device 4, and the jacking device 4 is provided with a film tearing platform 5. And, considering the requirement of stepping down during implementation, the processing support 3 is provided with reserved processing hole corresponding to the position of the dyestripping platform 5. In order to realize stable tearing of the film 12 and continuous separation from one end to the other end, the auxiliary displacement adjusting device 6 is arranged on the equipment platform 1, and the film clamping device 7 is arranged on the auxiliary displacement adjusting device 6. Thus, the tearing reserved end of the film 12 can be clamped, and tearing cracking or sliding is avoided. Furthermore, in order to implement the process of sensing the tearing film during processing, the jacking device 4 is convenient to correspondingly lift, the phenomenon that the film 12 sags is better avoided, and the sensing device 8 is arranged on one side of the processing bracket 3, which is positioned at the reserved processing hole.
In connection with a preferred embodiment of the utility model, in order to achieve an orderly layered layout, the processing rack 3 used comprises a bottom plate, which is connected to the main displacement adjustment device 2. Simultaneously, be provided with a plurality of bearing frames on the bottom plate perpendicularly, the top of bearing frame is provided with the top plate. And a reserved processing hole is formed in the top plate. Furthermore, a middle layer plate is arranged between the bearing frames, and the bottom of the jacking device 4 is connected with the middle layer plate.
Further, the jacking device 4 comprises a mounting base, an electric cylinder is arranged on the mounting base, a bearing plate 13 is arranged at the working end of the electric cylinder, and the film tearing platform 5 is connected with the bearing plate 13. Thus, the effective height adjustment of the film tearing platform 5 can be realized, and the film sagging phenomenon can be prevented better.
In combination with practical implementation, the film clamping device 7 comprises a lifting bracket 9 connected with the auxiliary displacement adjusting device 6, the upper end of the lifting bracket 9 is provided with a clip assembly, and an opening of the clip assembly corresponds to the film tearing platform 5. Thus, one end of the film 12 can be effectively clamped, the film 12 can be conveniently torn off, and meanwhile clamping force is kept, so that the film 12 cannot fall off. Meanwhile, considering path planning in the process of film tearing, the proper operation height can be lifted, a proper film tearing distance is provided, the lifting support 9 is a Z-shaped support, the top of the Z-shaped support is provided with a height adjusting plate, the clamp assembly is connected with the height adjusting plate, and the clamp assembly is an electric clamp or a pneumatic clamp.
Still further, in order to enable efficient real-time tear state sensing, the sensing device 8 employed is an optical fiber reflection sensor. Meanwhile, in order to shorten the displacement response time, and adapt to proper movement intervals according to different sizes of wafers 11, smooth film tearing is realized, and the main displacement adjusting device 2 and the auxiliary displacement adjusting device 6 adopted by the utility model are linear motors.
In order to have a preferred preset height during real time, the equipment platform 1 is provided with a lifting plate 10, and the secondary displacement adjustment device 6 is mounted on the lifting plate 10. In this way, the auxiliary displacement adjusting device 6 can have a proper installation height, and then the film clamping device 7 has a better initial height and a proper film tearing distance.
Furthermore, considering the machine platform that can adapt to various wafer 11 processing equipment, realize quick stable installation location, be provided with a plurality of mounting holes on equipment platform 1. Thereby, locking positioning can be performed by the corresponding bolts.
The working principle of the utility model is as follows:
the wafer 11 is placed on the film tearing stage 5 by means of a corresponding handling device. And then, the film tearing platform 5 adsorbs and positions the bottom of the wafer 11 through a corresponding mechanism. The secondary displacement adjustment device 6 then carries the membrane clamping device 7 to one side of the wafer 11. Then, the film clamping device 7 clamps one end of the film 12 and gradually withdraws under the guidance of the auxiliary displacement adjusting device 6 to tear the film. At the same time, the jacking device 4 starts to operate, so that the film tearing platform 5 is gradually lifted. During this time, the torn film 12 always has a better levelness and does not sag. Meanwhile, the sensing device 8 can sense the position of the film clamping device 7 and the position of the film 12, so that the jacking device 4 can conveniently control the height in real time, and the situation that the film 12 is vertically hung and stuck is avoided.
As can be seen from the above text expressions and the accompanying drawings, the utility model has the following advantages:
1. can realize full-automatic quick dyestripping, and guarantee that perpendicular string of film does not appear gluing during the dyestripping, the film can not take place the secondary contact with the wafer, also can not bond to other positions of processing equipment, and the accessible is follow-up collection device carries out centralized collection and handles.
2. The sensing device is adopted for implementation monitoring, so that coordination operation among other devices is facilitated, and effective implementation adjustment of parameters such as height, film tearing stroke and the like can be realized during film tearing.
3. The whole structure is simple, the existing film tearing equipment can be modified, and the implementation cost is low.
4. The wafer is not scratched during use due to the proper abdication space, and the butt joint of the front working procedure and the rear working procedure can be realized.
Furthermore, the description of the present utility model as to the orientation or positional relationship is based on the orientation or positional relationship shown in the drawings is for convenience of description and simplification of the description only, and is not intended to indicate or imply that the apparatus or configuration referred to must have a specific orientation or be operated in a specific orientation configuration, and thus should not be construed as limiting the present utility model.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, and it should be noted that it is possible for those skilled in the art to make several improvements and modifications without departing from the technical principle of the present utility model, and these improvements and modifications should also be regarded as the protection scope of the present utility model.
Claims (9)
1. Dyestripping equipment suitable for wafer processing, including the equipment platform, be provided with main displacement adjusting device on the equipment platform, its characterized in that: the device is characterized in that a processing support is arranged on the main displacement adjusting device, a jacking device is arranged on the processing support, a film tearing platform is arranged on the jacking device, a reserved processing hole is formed in the position of the processing support corresponding to the film tearing platform, an auxiliary displacement adjusting device is arranged on the equipment platform, a film clamping device is arranged on the auxiliary displacement adjusting device, and a sensing device is arranged on one side of the processing support, which is located in the reserved processing hole.
2. The film tearing apparatus of claim 1 adapted for wafer processing, wherein: the processing support comprises a bottom plate, the bottom plate is connected with a main displacement adjusting device, a plurality of bearing frames are vertically arranged on the bottom plate, a top plate is arranged at the top of each bearing frame, reserved processing holes are formed in the top plate, a middle plate is further arranged between the bearing frames, and the bottom of the jacking device is connected with the middle plate.
3. The film tearing apparatus of claim 1 adapted for wafer processing, wherein: the jacking device comprises a mounting base, an electric cylinder is arranged on the mounting base, a bearing plate is arranged at the working end of the electric cylinder, and the film tearing platform is connected with the bearing plate.
4. The film tearing apparatus of claim 1 adapted for wafer processing, wherein: the membrane clamping device comprises a lifting bracket connected with the auxiliary displacement adjusting device, a clamp assembly is arranged at the upper end of the lifting bracket, and an opening of the clamp assembly corresponds to the membrane tearing platform.
5. The film tearing apparatus of claim 4 adapted for wafer processing, wherein: the lifting support is a Z-shaped support, a height adjusting plate is arranged at the top of the Z-shaped support, the clamp assembly is connected with the height adjusting plate, and the clamp assembly is an electric clamp or a pneumatic clamp.
6. The film tearing apparatus of claim 1 adapted for wafer processing, wherein: the sensing device is an optical fiber reflection sensor.
7. The film tearing apparatus of claim 1 adapted for wafer processing, wherein: the main displacement adjusting device and the auxiliary displacement adjusting device are all linear motors.
8. The film tearing apparatus of claim 1 adapted for wafer processing, wherein: the equipment platform is provided with a lifting plate, and the auxiliary displacement adjusting device is arranged on the lifting plate.
9. The film tearing apparatus of claim 1 adapted for wafer processing, wherein: and a plurality of mounting holes are formed in the equipment platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321217853.1U CN220181305U (en) | 2023-05-19 | 2023-05-19 | Dyestripping equipment suitable for wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321217853.1U CN220181305U (en) | 2023-05-19 | 2023-05-19 | Dyestripping equipment suitable for wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220181305U true CN220181305U (en) | 2023-12-15 |
Family
ID=89111799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321217853.1U Active CN220181305U (en) | 2023-05-19 | 2023-05-19 | Dyestripping equipment suitable for wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220181305U (en) |
-
2023
- 2023-05-19 CN CN202321217853.1U patent/CN220181305U/en active Active
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