CN220173477U - Through hole PCB packaging layout of multi-row pin connector and electronic equipment - Google Patents
Through hole PCB packaging layout of multi-row pin connector and electronic equipment Download PDFInfo
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- CN220173477U CN220173477U CN202321446357.3U CN202321446357U CN220173477U CN 220173477 U CN220173477 U CN 220173477U CN 202321446357 U CN202321446357 U CN 202321446357U CN 220173477 U CN220173477 U CN 220173477U
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- 230000008054 signal transmission Effects 0.000 description 3
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Abstract
The utility model discloses a through hole PCB packaging layout of a multi-row pin connector and electronic equipment. The circuit comprises a first pin hole group and a second pin hole group, wherein the first pin hole group comprises a plurality of first pin through holes, and the second pin hole group comprises a plurality of second pin through holes; the first pin through holes are distributed at equal intervals, the hole centers are positioned in the first straight line, and the second pin through holes are distributed at equal intervals, and the hole centers are positioned in the second straight line; the hole center distance between each first pin through hole and the adjacent second pin through hole is a first distance, the distance between the hole center of each first pin through hole and the hole center of the adjacent second pin through hole along the direction parallel to the first straight line is a second distance, the hole center distance between the adjacent first pin through holes is a third distance, and the hole center distance between the adjacent second pin through holes is a fourth distance; the third interval is more than or equal to the first interval and more than the second interval, and the fourth interval is more than or equal to the first interval and more than or equal to the second interval. The utility model can increase the high-speed signal shielding in the PCB package.
Description
Technical Field
The utility model relates to the technical field of communication, in particular to a through hole PCB packaging layout of a multi-row pin connector and electronic equipment.
Background
Pins of the connector are connected with a PCB (Printed Circuit Board ) board through packaging, and PCB packaging layout refers to arrangement of the pins of the connector in a through hole mode in the circuit board according to a connector pin arrangement mode, and the pins of the connector are connected with the inner wall of the through hole to realize signal conduction.
As shown in fig. 1, in a conventional PCB packaging layout, since the steps of the pins of a product such as a connector are smaller, all the pin through holes cannot be arranged in a row in the process, and the pin through holes need to be packaged in multiple rows, the space between adjacent pin through holes is B, the space between adjacent pin through holes in the same row is a after the pin through holes are divided in multiple rows, and the space between the minimum holes of two pin through holes in two rows is C.
Disclosure of Invention
In view of the above, the present utility model provides a through-hole PCB package layout of a multi-row pin connector and an electronic device, which are used for solving the technical problem that the crosstalk of the existing PCB package layout is large and the high-speed signal transmission quality is affected.
In order to solve the technical problems, the first technical scheme adopted by the utility model is as follows:
a through-hole PCB packaging layout of a multi-row pin connector, comprising a first pin hole set comprising a plurality of first pin through holes and a second pin hole set comprising a plurality of second pin through holes;
the first pin through holes are distributed at equal intervals and the hole centers are positioned on a first straight line, the second pin through holes are distributed at equal intervals and the hole centers are positioned on a second straight line, the first straight line and the second straight line are parallel and are arranged at intervals, and the second pin through holes are positioned between two adjacent first pin through holes;
the hole center distance between each first pin through hole and the adjacent second pin through hole is a first distance, the hole center distance between each first pin through hole and the adjacent second pin through hole along the direction parallel to the first straight line is a second distance, the hole center distance between the adjacent first pin through holes is a third distance, and the hole center distance between the adjacent second pin through holes is a fourth distance; the third interval is larger than or equal to the first interval and larger than the second interval, and the fourth interval is larger than or equal to the first interval and larger than the second interval.
In some embodiments of the through-hole PCB package layout of the multi-row pin connector, the through-hole PCB package layout further comprises a plurality of first GND vias and a plurality of second GND vias;
each first GND via hole is positioned on one side, far away from the second pin hole group, of the first pin hole group, and the distance between each first pin via hole and the hole center adjacent to the first GND via hole is a fifth distance, wherein the third distance is more than or equal to the fifth distance;
each second GND via hole is located at one side, far away from the first pin hole group, of the second pin hole group, the distance between each second pin via hole and the hole center adjacent to the second GND via hole is a sixth distance, and the fourth distance is larger than or equal to the sixth distance.
In some embodiments of the through-hole PCB packaging layout of the multi-row pin connector, the first GND vias are arranged at equal intervals and the hole center is located in a third line, and the third line is parallel to the first line.
In some embodiments of the through-hole PCB package layout of the multi-row pin connector, the second GND vias are arranged at equal intervals and the hole center is located in a fourth straight line, and the fourth straight line is parallel to the first straight line.
In some embodiments of the via PCB package layout of the multi-row pin connector, the third pitch is equal to the fourth pitch, each of the fifth pitches is equal, each of the sixth pitches is equal, and the fifth pitch is equal to the sixth pitch.
In some embodiments of the via PCB packaging layout of the multi-row pin connector, a line connecting each of the first GND via hole centers and each of the second pin via hole centers is perpendicular to the first straight line; and the connecting line of each second GND through hole core and each first pin through hole core is perpendicular to the first straight line.
In some embodiments of the via PCB package layout of the multi-row pin connector, the third pitch is greater than or equal to the fifth pitch is greater than the second pitch.
In some embodiments of the through-hole PCB package layout of the multi-row pin connector, the first pin hole group, the second pin hole group, each first GND via hole, and each second GND via hole form a connection unit, and the number of connection units is plural, and each connection unit is arranged at intervals along a direction perpendicular to the first line.
In some embodiments of the through-hole PCB packaging layout of the multi-row pin connector, the distance between the first straight line in one of the connection units and the second straight line in an adjacent connection unit is greater than or equal to the third pitch in size.
In order to solve the technical problems, the second technical scheme adopted by the utility model is as follows:
an electronic device comprising a circuit board provided with a through hole PCB packaging layout of the multi-row pin connector described in the above embodiment, and further comprising a connector provided with a plurality of first terminals and a plurality of second terminals, wherein each of the first terminals is inserted into each of the first pin through holes in a one-to-one correspondence manner, and each of the second terminals is inserted into each of the second pin through holes in a one-to-one correspondence manner.
The implementation of the embodiment of the utility model has at least the following beneficial effects:
the through hole PCB packaging layout of the multi-row pin connector is applied to electronic equipment, so that the through hole PCB packaging layout of the multi-row pin connector and the electronic equipment have the technical effect of less crosstalk, and particularly, the through hole PCB packaging layout of the multi-row pin connector is redesigned, the distance between holes is changed, the distance between the hole center of the first pin through hole and the hole center of the adjacent second pin through hole is larger than the distance between the hole center of the first pin through hole and the hole center of the adjacent second pin through hole along the direction parallel to the first straight line, the distance between the hole center of the adjacent first pin through hole is the third distance, the distance between the hole center of the adjacent second pin through hole is the fourth distance, and finally, the layout that the third distance is larger than or equal to the first distance and the fourth distance is larger than the second distance is formed, so that the crosstalk is reduced, and the technical problem that the high-speed signal transmission quality is influenced due to the fact that the conventional PCB packaging layout is larger is solved.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a conventional PCB package layout;
FIG. 2 is a schematic diagram illustrating the conventional PCB package layout of FIG. 1 when transmitting single-ended signals;
FIG. 3 is a schematic diagram illustrating the conventional PCB package layout of FIG. 1 when differential signals are transmitted;
FIG. 4 is a schematic diagram of a through-hole PCB package layout of a new multi-row pin connector of the present utility model;
FIG. 5 is a schematic diagram illustrating the new PCB package layout of FIG. 4 when single-ended signals are transmitted;
fig. 6 is a schematic diagram of the new PCB package layout of fig. 4 when differential signals are transmitted.
Wherein:
1. a first pin through hole; 2. a second pin through hole; 3. a first GND via; 4. a second GND via; 5. a first pitch; 6. a second pitch; 7. a fourth pitch; 8. a fifth pitch; 9. a sixth pitch; 10. and a connection unit.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Preferred embodiments of the present utility model are shown in the drawings. This utility model may, however, be embodied in many other different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Fig. 1 is a conventional PCB packaging layout, fig. 2 is a case when a single-ended signal is transmitted in the conventional PCB packaging layout, and fig. 3 is a case when a differential signal is transmitted in the conventional PCB packaging layout, because the step pitch of a product such as a connector pin is relatively small, all pin through holes cannot be arranged in a row in the process, and the product needs to be packaged by dividing into multiple rows of pin through holes, the space between adjacent pin through holes is B, after dividing into multiple rows, the space between adjacent pin through holes in the same row is a, and the space between the minimum centers of two pin through holes in two rows is C.
Referring to fig. 1-3 and 4-6, in one through-hole PCB package layout embodiment of a multi-row pin connector, a first pin hole set including a plurality of first pin through holes 1, a second pin hole set including a plurality of second pin through holes 2, a plurality of first GND through holes 3, and a plurality of second GND through holes 4 are included. The first pin through holes 1 are distributed at equal intervals, the hole centers are located on a first straight line, the second pin through holes 2 are distributed at equal intervals, the hole centers are located on a second straight line, the first straight line is parallel to the second straight line and is arranged at intervals, and the second pin through holes 2 are located between two adjacent first pin through holes 1. The hole center distance between each first pin through hole 1 and the adjacent second pin through hole 2 is a first distance 5, the hole center distance between each first pin through hole 1 and the hole center of the adjacent second pin through hole 2 along the direction parallel to the first straight line is a second distance 6, the hole center distance between the adjacent first pin through holes 1 is a third distance, and the hole center distance between the adjacent second pin through holes 2 is a fourth distance 7. The third interval is larger than or equal to the first interval 5 and larger than the second interval 6, and the fourth interval 7 is larger than or equal to the first interval 5 and larger than the second interval 6.
In this embodiment, the through hole PCB packaging layout of the multi-row pin connector is redesigned, the pitch relationship between the holes is changed, so that the hole center pitch between the first pin through hole 1 and the adjacent second pin through hole 2 is greater than the distance between the hole center of the first pin through hole 1 and the hole center of the adjacent second pin through hole 2 along the direction parallel to the first straight line, the hole center pitch between the adjacent first pin through holes 1 is the third pitch, the hole center pitch between the adjacent second pin through holes 2 is the fourth pitch 7, and finally, the layout with the third pitch greater than or equal to the first pitch 5 greater than the second pitch 6 and the fourth pitch 7 greater than or equal to the first pitch 5 greater than the second pitch 6 is formed, so that crosstalk is reduced, and the technical problem that the high-speed signal transmission quality is affected due to the greater crosstalk of the existing PCB packaging layout is solved.
In an embodiment of a through-hole PCB package layout of a multi-row pin connector, each first GND via hole 3 is located on a side of the first pin hole group that is far away from the second pin hole group, and a pitch between each first pin via hole 1 and a hole center adjacent to the first GND via hole 3 is a fifth pitch 8, where the third pitch is greater than or equal to the fifth pitch 8. Each second GND via hole 4 is positioned at one side of the second pin hole group far away from the first pin hole group, the distance between each second pin via hole 2 and the hole center adjacent to the second GND via hole 4 is a sixth distance 9, and a fourth distance 7 is more than or equal to the sixth distance 9.
In this embodiment, by setting the plurality of first GND through holes 3 and the plurality of second GND through holes 4, and setting the pitch between each first GND through hole 3 and the adjacent first pin through hole 1 to be equal to or smaller than the hole center pitch between two adjacent first pin through holes 1, and setting the pitch between each second GND through hole 4 and the adjacent second pin through hole 2 to be equal to or smaller than the hole center pitch between two adjacent second pin through holes 2, the circuit distance between each first pin through hole 1 and each second pin through hole 2 and GND can be shortened, so that the high-speed signal shielding inside the PCB package can be increased, and the high-speed transmission performance of the PCB package can be improved.
In addition, as will be understood from fig. 4, since each of the first pin through holes 1 is disposed at equal intervals and the second pin through holes 2 are disposed at equal intervals, and each of the second pin through holes 2 is located between two adjacent first pin through holes 1, so that each of the first pin through holes 1 and each of the second pin through holes 2 are arranged to connect the hole centers in sequence to form a zigzag shape, preferably each of the second pin through holes 2 is located right in between two adjacent first pin through holes 1, and conversely, each of the first pin through holes 1 is located right in between two adjacent second pin through holes 2, and in order to be able to form the above-mentioned relationship, the third interval is equal to the fourth interval 7, and when the third interval is equal to the fourth interval 7, it is possible to conveniently arrange longer distances.
It should be emphasized that, in this embodiment, the first GND via hole 3 and the second GND via hole 4 need not be arranged on a straight line, and need not be arranged at equal intervals, as long as the pitch can meet the requirement.
In an embodiment of the through-hole PCB package layout of the multi-row pin connector, the first GND vias 3 are arranged at equal intervals and the hole center is located in a third line, and the third line is parallel to the first line.
In this embodiment, it is understood that the first GND through holes 3 arranged along the third line can form three parallel rows of holes with the plurality of first pin through holes 1 and the plurality of second pin through holes 2, which is convenient for processing.
Further, in an embodiment of the through-hole PCB package layout of the multi-row pin connector, the second GND vias 4 are arranged at equal intervals and the hole center is located in a fourth straight line, and the fourth straight line is parallel to the first straight line. Similarly, as in the previous embodiment, four rows of holes can be formed, which is convenient for processing, reduces processing difficulty and improves uniformity.
It should be noted that, although the first GND vias 3 and the second GND vias 4 are all arranged at equal intervals, the interval between two adjacent first GND vias 3 is different from the interval between two adjacent first pin vias 1, so that the fifth pitches 8 are not necessarily the same value, and the sixth pitches 9 are also the same, and will not be described again.
In one embodiment of the through-hole PCB package layout of the multi-row pin connector, the third pitch is equal to the fourth pitch 7, each of the fifth pitches 8 is equal to the fourth pitch 7, each of the sixth pitches 9 is equal to the fifth pitch 8 is equal to the sixth pitch 9.
In this embodiment, the third pitch is equal to the fourth pitch 7, which means that the first pin through holes 1 and the second pin through holes 2 are arranged at equal intervals according to the pitch with the same size as each other, and the fifth pitch 8 is equal to the sixth pitch 9, and in combination with the previous embodiment, the first GND through holes 3 and the second GND through holes 4 are also arranged at equal intervals along a straight line, so that, firstly, four rows of holes formed by the first pin through holes 1, the second pin through holes 2, the first GND through holes 3 and the second GND through holes 4 are arranged at equal intervals and are parallel, and secondly, since the third pitch is equal to the fourth pitch 7, the fifth pitch 8 is equal to the sixth pitch 9, it can be deduced that the four rows of holes are arranged at equal intervals according to the same pitch, so that the integrity is further improved, and no disorder is formed after the four rows of holes are prolonged to a certain length.
In one embodiment of the through-hole PCB package layout of the multi-row pin connector, the line connecting the hole center of each first GND via 3 and the hole center of each second pin through-hole 2 is perpendicular to the first straight line. The connecting line of the hole centers of the second GND through holes 4 and the hole centers of the first pin through holes 1 is perpendicular to the first straight line.
In this embodiment, the connection line between the hole center of each first GND via hole 3 and the hole center of each second pin through hole 2 is perpendicular to the first line, which means that each first GND via hole 3 and each second pin through hole 2 are in one-to-one correspondence, and similarly, each second GND via hole 4 and each first pin through hole 1 are in one-to-one correspondence.
Further preferably, when the second pin through hole 2 is located at the middle of two adjacent first pin through holes 1, then a clean structure as shown in fig. 4-6 can be further formed.
In one embodiment of the via PCB package layout of the multi-row pin connector, the third pitch is greater than or equal to the fifth pitch 8 and greater than the second pitch 6.
In combination with the above embodiment, the third pitch is equal to or greater than the first pitch 5 > the second pitch 6, referring to fig. 4, the third pitch is a ', the fifth pitch 8 is C ', the first pitch 5 is E ', the second pitch 6 is B ', and the corresponding pitches A, C and B are compared with fig. 1, wherein C corresponds to C ', E ', the conventional PCB package layout is limited in arrangement mode, generally C > a > B, and the above embodiment can make C ' > B ' but smaller than the distance a ' of the adjacent PCB package through holes of the same row by reducing the pitch C ' between the adjacent rows of pins, and further increase the first GND through holes 3 and the second GND through holes 4 outside between the adjacent two through holes of the adjacent two rows of through holes, so as to shorten the loop distance E ' between the adjacent pin through holes and GND.
In an embodiment of a through-hole PCB package layout of a multi-row pin connector, a first pin hole group, a second pin hole group, each first GND via hole 3 and each second GND via hole 4 form a connection unit 10, and the number of connection units 10 is plural, and each connection unit 10 is arranged at intervals along a direction perpendicular to the first straight line. In the present embodiment, by providing a plurality of connection units 10, different connectors can be adapted, facilitating grouping. Preferably, the respective connection units 10 are arranged at equal intervals in a direction perpendicular to the first straight line.
In one through-hole PCB package layout embodiment of the multi-row pin connector, the distance between a first straight line in one connection unit 10 and a second straight line in an adjacent connection unit 10 is greater than or equal to the third pitch.
In this embodiment, it can be understood that when the number of the connection units 10 is three or more, there are two adjacent connection units 10 in the connection unit 10 located in the middle, and the distances from the first straight line in the middle connection unit 10 to the adjacent two second straight lines are respectively larger or smaller, so that the distances are all larger than or equal to the third spacing, and the distances from the first straight line to the adjacent two second straight lines in the middle connection unit 10 are larger than or equal to the fifth spacing 8, so that the shielding of the high-speed signals is increased.
The utility model also relates to an electronic device, which comprises a circuit board provided with the through hole PCB packaging layout of the multi-row pin connector in the previous embodiment, and further comprises a connector, wherein a plurality of first terminals and a plurality of second terminals are arranged on the connector, each first terminal is inserted into each first pin through hole 1 in a one-to-one correspondence manner, and each second terminal is inserted into each second pin through hole 2 in a one-to-one correspondence manner.
By applying the circuit board provided with the layout in the above embodiment, when products such as connectors are connected by the circuit board so laid out, shielding of high-speed signals can be increased, interference can be reduced, and transmission quality of the high-speed signals can be greatly improved. It will be appreciated that the terminals on the connector are also in two rows and are in one-to-one correspondence with the respective first pin through holes 1 and second pin through holes 2.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. The through hole PCB packaging layout of the multi-row pin connector is characterized by comprising a first pin hole group and a second pin hole group, wherein the first pin hole group comprises a plurality of first pin through holes, and the second pin hole group comprises a plurality of second pin through holes;
the first pin through holes are distributed at equal intervals and the hole centers are positioned on a first straight line, the second pin through holes are distributed at equal intervals and the hole centers are positioned on a second straight line, the first straight line and the second straight line are parallel and are arranged at intervals, and the second pin through holes are positioned between two adjacent first pin through holes;
the hole center distance between each first pin through hole and the adjacent second pin through hole is a first distance, the hole center distance between each first pin through hole and the adjacent second pin through hole along the direction parallel to the first straight line is a second distance, the hole center distance between the adjacent first pin through holes is a third distance, and the hole center distance between the adjacent second pin through holes is a fourth distance; the third interval is larger than or equal to the first interval and larger than the second interval, and the fourth interval is larger than or equal to the first interval and larger than the second interval.
2. The through-hole PCB packaging layout of the multi-row pin connector of claim 1, further comprising a plurality of first GND vias and a plurality of second GND vias;
each first GND via hole is positioned on one side, far away from the second pin hole group, of the first pin hole group, and the distance between each first pin via hole and the hole center adjacent to the first GND via hole is a fifth distance, wherein the third distance is more than or equal to the fifth distance;
each second GND via hole is located at one side, far away from the first pin hole group, of the second pin hole group, the distance between each second pin via hole and the hole center adjacent to the second GND via hole is a sixth distance, and the fourth distance is larger than or equal to the sixth distance.
3. The through-hole PCB packaging layout of the multi-row pin connector of claim 2, wherein each of the first GND vias is arranged at equal intervals and the hole center is located in a third straight line, and the third straight line is parallel to the first straight line.
4. The through-hole PCB packaging layout of the multi-row pin connector of claim 3, wherein the second GND vias are equally spaced and the hole center is located in a fourth straight line, which is parallel to the first straight line.
5. The via PCB package layout of a multi-row pin connector according to claim 4, wherein the third pitch is equal to the fourth pitch, each of the fifth pitches is equal to each of the sixth pitches, and each of the fifth pitches is equal to the sixth pitch.
6. The via PCB package layout of the multi-row pin connector of claim 5, wherein a line connecting each of the first GND via hole centers and each of the second pin via hole centers is perpendicular to the first straight line; and the connecting line of each second GND through hole core and each first pin through hole core is perpendicular to the first straight line.
7. The via PCB package layout of a multi-row pin connector of claim 2, wherein the third pitch is.
8. The through-hole PCB packaging layout of a multi-row pin connector of any one of claims 1-7, wherein the first pin hole set, the second pin hole set, each first GND via and each second GND via constitute a plurality of connection units, each of the connection units being arranged at intervals in a direction perpendicular to the first straight line.
9. The via PCB package layout of a multi-row pin connector according to claim 8, wherein the distance between the first straight line in one of the connection units and the second straight line in an adjacent connection unit is greater than or equal to the third pitch.
10. An electronic device, characterized in that the electronic device comprises a circuit board provided with a through hole PCB packaging layout of a multi-row pin connector according to any one of claims 1-9, the electronic device further comprises a connector, a plurality of first terminals and a plurality of second terminals are arranged on the connector, each first terminal is inserted into each first pin through hole in a one-to-one correspondence manner, and each second terminal is inserted into each second pin through hole in a one-to-one correspondence manner.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321446357.3U CN220173477U (en) | 2023-06-07 | 2023-06-07 | Through hole PCB packaging layout of multi-row pin connector and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321446357.3U CN220173477U (en) | 2023-06-07 | 2023-06-07 | Through hole PCB packaging layout of multi-row pin connector and electronic equipment |
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| CN220173477U true CN220173477U (en) | 2023-12-12 |
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