CN220173428U

CN220173428U - Heating bag structure

Info

Publication number: CN220173428U
Application number: CN202321478099.7U
Authority: CN
Inventors: 权蕾; 彭锦晒
Original assignee: Dongguan Taikang Electronics Technology Co ltd
Current assignee: Dongguan Taikang Electronics Technology Co ltd
Priority date: 2023-06-12
Filing date: 2023-06-12
Publication date: 2023-12-12
Anticipated expiration: 2033-06-12

Abstract

The utility model discloses a heating bag structure, which relates to the technical field of electric heating structures and comprises a packaging frame and electrode plates, wherein hanging buckles are uniformly and integrally arranged on the peripheral sides of the electrode plates, the electrode plates are mutually buckled with the packaging frame through the hanging buckles, and pins extending to the outer side of the packaging frame are arranged at one end of each electrode plate; the middle part of the pin is provided with a positioning hole, and the side end of the packaging frame is provided with a positioning column matched with the positioning hole; a C-shaped chamfer is arranged at the edge of one side of the positioning hole far away from the packaging frame, and a limiting part matched with the C-shaped chamfer is arranged at the end part of the positioning column far away from the packaging frame; through increasing the locating hole that has C type chamfer in the pin department of electrode slice, when I/M moulds plastics, the plastic will have the locating hole vacancy part of C type chamfer to fill completely, forms a plastic cylinder with reverse triangle and hangs knot structure, ensures that the product is receiving great plug force or other strength factors etc. that the pin is difficult for taking place to warp, upwarp/down groveling etc. adverse phenomenon.

Description

Heating bag structure

Technical Field

The utility model relates to the technical field of electric heating structures, in particular to a heating bag structure.

Background

The PTC heating bag is also called as a PTC heater, and comprises a PTC heating element, positive and negative electrode plates and a packaging shell, is a novel electric heater, and has the technical advantages of high heat exchange efficiency, safety, reliability, automatic constant temperature, low power consumption, quick temperature rise, small volume and the like, so that the PTC heating bag becomes one of the most widely applied electric heater materials at present.

The structure of the existing heating package product is characterized in that the periphery of the electrode plate is provided with a hanging buckle structure, the hanging buckle structure and the plastic main body are mutually buckled, a locking effect is achieved after the I/M injection molding of the electrode plate, the electrode plate part and the plastic main body part are prevented from being separated, for example, patent application number 201920781124.6 discloses a PTC heating assembly and a PTC heating package, the PTC heating assembly comprises a heating element, electrode plates arranged on two sides of the heating element, and insulating films arranged on the outer sides of the two electrode plates, and the PTC heating assembly further comprises a packaging frame, wherein the packaging frame is wrapped on the circumference of the heating element and located between the two electrode plates. The PTC heating bag has good sealing and heat dissipation effects, good pressure resistance, and long service life, and avoids phenomena such as electric arc, electric flashover and the like, breakdown and fracturing.

However, in the prior art, similar to the above-disclosed heating pack product, under the influence of a large plugging force or other force factors, the pin portion is easy to deform, tilt up/down, and the like, which results in incorrect pin opposite-plugging positions of the product, and thus the product cannot work normally, so a heating pack structure is proposed to improve the above-mentioned problems.

Disclosure of Invention

The present utility model is directed to a heating pack structure, which solves the above-mentioned problems of the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a heating package structure, includes encapsulation frame and electrode slice, the even integration in week side of electrode slice is provided with hangs and detains, and the electrode slice detains each other with encapsulation frame through hanging, the one end of electrode slice is provided with the pin that extends to the encapsulation frame outside:

the middle part of the pin is provided with a positioning hole, the side end of the packaging frame is provided with a positioning column, and the positioning column is matched with the positioning hole;

the locating hole is provided with C type chamfer along department in one side hole of keeping away from encapsulation frame, the locating column is provided with the spacing portion with C type chamfer looks adaptation in the tip of keeping away from encapsulation frame.

Preferably, the package frame is provided with a positioning groove, and the positioning groove is matched with the pin.

Preferably, the thickness of the part of the pin, which is positioned outside the packaging frame, is larger than the thickness of the electrode plate.

Preferably, the thickness of the part of the pin, which is positioned outside the packaging frame, is twice the thickness of the electrode plate.

Preferably, the thickness of the electrode plate is at least 0.3mm, and the thickness of the part of the pin, which is positioned outside the packaging frame, is at least 0.6mm.

Preferably, the portion of the leads outside the package frame is folded 180 ° to form a folded portion.

In summary, the utility model has the technical effects and advantages that:

1. according to the utility model, the electrode plate is mutually buckled with the packaging frame through the hanging buckle, so that the electrode plate I/M is provided with the locking effect after injection molding, the electrode plate is prevented from being separated from the packaging frame, one end of the electrode plate is provided with the pin extending to the outer side of the packaging frame, the pin extends to the outer side of the packaging frame to be convenient for connecting other structures, when the packaging frame and the electrode plate are installed, the positioning groove is matched with the pin, the preliminary positioning effect can be achieved, and the relative fixing effect of the electrode plate and the packaging frame can be further enhanced through the matching positioning effect of the positioning column and the positioning hole.

2. According to the utility model, as the positioning holes with the C-shaped chamfers are added at the pins of the electrode plates, during I/M injection molding, the plastic fills the blank parts of the positioning holes with the C-shaped chamfers completely, so that a plastic cylinder hanging buckle structure with inverted triangles is formed, the product is ensured to be difficult to deform, warp up/down and other bad phenomena such as high plugging force or other force factors, and the product can stably work during use.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic overall perspective view of the present embodiment;

fig. 2 is a schematic diagram of a split structure in the present embodiment;

fig. 3 is a schematic view of the structure of the C-shaped chamfer in the present embodiment;

fig. 4 is a schematic structural diagram of the lead in the present embodiment.

In the figure: 1. a package frame; 11. a positioning groove; 12. positioning columns; 121. a limit part; 2. an electrode sheet; 21. pins; 22. hanging buckle; 23. positioning holes; 231. c-shaped chamfering; 24. a folding part.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples: a heat pack structure shown with reference to fig. 1-3 includes a package frame 1 and electrode pads 2.

Wherein, the even integration in week side of electrode slice 2 is provided with and hangs knot 22, and electrode slice 2 is detained 22 each other with encapsulation frame 1 through hanging, has the hasp effect after reaching electrode slice 2I/M and moulds plastics, prevents that electrode slice 2 and encapsulation frame 1 from breaking away from, and electrode slice 2's one end is provided with the pin 21 that extends to encapsulation frame 1 outside, and the setting that pin 21 extends to encapsulation frame 1 outside can be convenient for connect other structures.

The middle part of pin 21 is provided with locating hole 23, and the reference column 12 is installed to encapsulation frame 1's side, and reference column 12 and locating hole 23 looks adaptation, through the cooperation positioning action of reference column 12 and locating hole 23, can further strengthen the relative fixed action of electrode slice 2 and encapsulation frame 1.

The locating hole 23 is kept away from the one side hole edge department of encapsulation frame 1 and is provided with C type chamfer 231, the locating column 12 is kept away from the tip of encapsulation frame 1 and is provided with the spacing portion 121 with C type chamfer 231 looks adaptation, specifically, because the pin 21 department of electrode slice 2 has increased the locating hole 23 that has C type chamfer 231, when I/M moulds plastics, the plastic will have the locating hole 23 vacancy part filling of C type chamfer 231 complete, form a plastic cylinder string knot structure that has the reverse triangle, ensure that the product is receiving great plug power or other strength factors etc. that the difficult emergence of pin 21 warp, upwarp/down groveling etc. adverse phenomena, the product can stable operation when using.

Wherein, be provided with constant head tank 11 on the encapsulation frame 1, and constant head tank 11 and pin 21 looks adaptation can play preliminary positioning action when encapsulation frame 1 and electrode slice 2 are installed.

Further, as shown in fig. 4, the thickness of the portion of the lead 21 located outside the package frame 1 is greater than the thickness of the electrode plate 2, and according to practical use requirements, the thickness of the portion of the lead 21 located outside the package frame 1 is at least 0.6mm, in order to ensure that the electrode plate 2 is normally used, the thickness of the electrode plate 2 is one half of the thickness of the portion of the lead 21 located outside the package frame 1, that is, the thickness of the electrode plate 2 is at least 0.3mm, and by adopting the design, the thickness of the material of the electrode plate 2 is integrally reduced by 1/2, the thickness of the lead 21 not only meets the requirement of stable contact with equipment, and ensures that a functional area of a product is not affected by the thickness in the use process, but also reduces material investment, and better controls the cost of the product.

Wherein, for convenience of manufacture, the portion of the lead 21 located outside the package frame 1 is folded 180 ° for the lead 21 to form the folded portion 24.

The working principle of the utility model is as follows: the electrode plate 2 is mutually buckled with the packaging frame 1 through the hanging buckle 22, so that the effect of locking the electrode plate 2I/M is achieved, the electrode plate 2 is prevented from being separated from the packaging frame 1, a pin 21 extending to the outer side of the packaging frame 1 is arranged at one end of the electrode plate 2, the pin 21 extends to the outer side of the packaging frame 1 and can be convenient for connecting other structures, when the packaging frame 1 and the electrode plate 2 are installed, the positioning groove 11 is matched with the pin 21, the preliminary positioning effect can be achieved, the relative fixing effect of the electrode plate 2 and the packaging frame 1 can be further enhanced through the matching positioning effect of the positioning column 12 and the positioning hole 23, and as the positioning hole 23 with the C-shaped chamfer 231 is additionally arranged at the pin 21 of the electrode plate 2, the empty part of the positioning hole 23 with the C-shaped chamfer 231 is filled completely by plastic in the I/M in the injection molding process, the plastic cylinder hanging buckle structure with the inverted triangle is formed, the product is ensured to be subjected to larger inserting and pulling force or other force factors, the pin 21 is not easy to deform, the upward/downward groveling and other adverse phenomena can be stably operated when the product is used;

the part of the pin 21, which is positioned at the outer side of the packaging frame 1, is formed by folding the pin 21 by 180 degrees to form a folding part 24, the whole thickness of the folding part 24 is at least 0.6mm, the thickness of the electrode plate 2 is one half of the thickness of the part of the pin 21, which is positioned at the outer side of the packaging frame 1, namely, the thickness of the electrode plate 2 is at least 0.3mm, the whole thickness of the electrode plate 2 can be reduced by 1/2 through the design, the thickness of the pin 21 can be in stable contact with equipment, the functional area of a product is not influenced by the thickness in the use process, meanwhile, the material investment is reduced, and the product cost is better controlled.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. The utility model provides a heating package structure, includes encapsulation frame (1) and electrode slice (2), the even integration in week side of electrode slice (2) is provided with and hangs knot (22), and electrode slice (2) are detained each other through hanging knot (22) and encapsulation frame (1), the one end of electrode slice (2) is provided with pin (21) that extend to encapsulation frame (1) outside, its characterized in that:

the middle part of the pin (21) is provided with a positioning hole (23), a positioning column (12) is arranged at the side end of the packaging frame (1), and the positioning column (12) is matched with the positioning hole (23);

the locating hole (23) is provided with C type chamfer (231) along department in one side hole of keeping away from encapsulation frame (1), the tip that encapsulation frame (1) was kept away from to reference column (12) is provided with spacing portion (121) with C type chamfer (231) looks adaptation.

2. A heating pack structure as claimed in claim 1, wherein: the packaging frame (1) is provided with a positioning groove (11), and the positioning groove (11) is matched with the pin (21).

3. A heating pack structure according to claim 1 or 2, wherein: the thickness of the part of the pin (21) positioned outside the packaging frame (1) is larger than that of the electrode plate (2).

4. A heat pack structure according to claim 3, wherein: the thickness of the part of the pin (21) positioned outside the packaging frame (1) is twice that of the electrode plate (2).

5. A heat pack structure as claimed in claim 4, wherein: the thickness of the electrode plate (2) is at least 0.3mm, and the thickness of the part of the pin (21) positioned outside the packaging frame (1) is at least 0.6mm.

6. A heat pack structure as claimed in claim 5, wherein: the part of the pin (21) positioned outside the packaging frame (1) is formed by folding the pin (21) for 180 degrees to form a folding part (24).