CN220163134U - Semi-automatic stripper for semiconductor power device - Google Patents

Semi-automatic stripper for semiconductor power device Download PDF

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Publication number
CN220163134U
CN220163134U CN202321721991.3U CN202321721991U CN220163134U CN 220163134 U CN220163134 U CN 220163134U CN 202321721991 U CN202321721991 U CN 202321721991U CN 220163134 U CN220163134 U CN 220163134U
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Prior art keywords
ejector
ejection
positioning
product
semi
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CN202321721991.3U
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Chinese (zh)
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王成才
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Lianshuo Semiconductor Technology Suzhou Co ltd
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Lianshuo Semiconductor Technology Suzhou Co ltd
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Abstract

The utility model provides a semi-automatic demoulding machine for a semiconductor power device, which comprises a workbench, wherein at least one group of sliding components are arranged on the workbench, a placing plate is arranged on a sliding block of each sliding component, positioning devices are arranged on two sides of the placing plate and are inserted into a product to be demoulded to be used for positioning the product to be demoulded; place board lower part and be equipped with ejection mechanism, including connecting two sets of first ejector blocks in the mould bottom, be connected with the ejector pin on the first ejector block, the ejector pin passes the mould and inserts the product tip in the mould, be equipped with the second ejector block in the middle of the first ejector block, be equipped with two rows of thimble on the second ejector block, the thimble passes the mould and top on the pin of product, this stripper is through taking the drawing of patterns product to fix a position on placing the board to the pin part of ejector pin top product through ejection mechanism has improved the atress homogeneity of product greatly, can realize quick drawing of patterns, and the ejecting setting buffering prevents bad product of top.

Description

Semi-automatic stripper for semiconductor power device
Technical Field
The utility model relates to the field of semiconductor processing equipment, in particular to a semi-automatic demoulding machine for a semiconductor power device.
Background
The power device shell terminal and shell of the semiconductor power device disclosed in the utility model with the patent publication number of CN209785924U are provided with more pins, the pins are thinner, the power device is realized in an ultrasonic welding mode, in order to improve the compactness and efficiency of a product, an injection molding mode can be used, as shown in fig. 1, the pins are put into a mold, the product is demolded after being injected with glue into the inside (the back of the terminal in the drawing, the vertical part of the terminal is not demolded in the mold in the drawing), but due to the special structure of the product, the demolding is difficult, the direct mold is ejected, the demolding cannot be smoothly, the pins are broken, or the problem that an injection molding piece is damaged is more, and the common ejection often has the condition that the demolding cannot be performed.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a semi-automatic demoulding machine for a semiconductor power device, which comprises a workbench, wherein at least one group of sliding components are arranged on the workbench, a placing plate is arranged on a sliding block of the sliding components, positioning devices are arranged on two sides of the placing plate, and the positioning devices are inserted into a product to be demoulded and used for positioning the product to be demoulded;
the lower part of the placing plate is provided with an ejection mechanism, the ejection mechanism comprises two groups of first ejector blocks connected to the bottom of the die, ejector rods are connected to the first ejector blocks, the ejector rods penetrate through the die and are inserted into the end parts of products in the die, a second ejector block is arranged in the middle of the first ejector blocks, two rows of ejector pins are arranged on the second ejector blocks, and the ejector pins penetrate through the die and are ejected onto pins of the products.
Preferably, the sliding assembly comprises two positioning seats, a screw rod is rotationally connected between the positioning seats, a gear is arranged at the end part of the screw rod, a driving motor is arranged at the lower part of the workbench, the output end of the driving motor is connected with a synchronizing wheel, and the synchronizing wheel is connected with the gear through a belt.
Preferably, the workbench is provided with a sliding rail, the lower part of the placing plate is provided with a sliding sleeve, and the sliding sleeve is matched with the sliding rail.
Preferably, the positioning device comprises a side pushing cylinder, and the output end of the side pushing cylinder is connected with a positioning plate.
Preferably, the ejection mechanism comprises an ejection cylinder, the ejection cylinder is fixed at the bottom of the workbench through a connecting column, the output end of the ejection cylinder is connected with a push plate, a plurality of ejection columns are arranged on the push plate, and the ejection columns are aligned with the first ejection block and the second ejection block.
Preferably, the ejection mechanism comprises a screw rod module, the screw rod module is fixed at the bottom of the workbench through a fixing frame, a top plate is connected to a sliding block of the screw rod module, and an ejection block is connected to the top plate and aligned with the first ejection block and the second ejection block.
Preferably, the placing plate is provided with at least three groups of positioning blocks, one side of each positioning block opposite to the positioning block is provided with an inclined plane, the bottom of each positioning block is provided with a slot corresponding to the positioning device, and the output end of each positioning device passes through the corresponding slot.
Preferably, the first top block and the second top block are provided with guide posts at the center, one end of each guide post is inserted on the mold, the guide posts are sleeved with springs, and the springs are pressed on the mold.
The semi-automatic demoulding machine for the semiconductor power device has the following beneficial effects: this stripper is through will taking the drawing of patterns product to fix a position on placing the board to through the pin part of ejection mechanism's thimble top product, improved the atress homogeneity of product greatly, can realize quick drawing of patterns, and ejecting setting buffering prevents the bad product of top.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are required to be used in the description of the embodiments will be briefly described below.
FIG. 1 is a schematic view of a product to be demolded according to the present utility model;
fig. 2 is a schematic perspective view of embodiment 1 of the present utility model;
FIG. 3 is a bottom perspective view of embodiment 1 of the present utility model;
FIG. 4 is a schematic view of a placement plate of the present utility model;
FIG. 5 is a schematic view of the installation of a first top plate and a second top plate of the present utility model;
FIG. 6 is a schematic view of a second embodiment of an ejection mechanism of the present utility model;
wherein, 1, a workbench; 2. a sliding assembly; 3. placing a plate; 4. a positioning device; 5. a first top block; 6. a second top block; 7. a push rod; 8. a thimble; 9. a positioning seat; 10. a screw rod; 11. a gear; 12. a driving motor; 13. a belt; 14. a slide rail; 15. a side pushing cylinder; 16. a positioning plate; 17. an ejection cylinder; 18. a connecting column; 19. a push plate; 20. a top column; 21. a screw rod module; 22. a fixing frame; 23. a top plate; 24. an ejection block; 25. a positioning block; 26. an inclined plane; 27. a guide post; 28. and (3) a spring.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
As shown in fig. 2 and 3, the utility model provides a semi-automatic demolding machine for a semiconductor power device, which comprises a workbench 1, wherein at least one group of sliding components 2 are arranged on the workbench 1, the sliding components 2 can be two or more groups and are used for adjusting positions after a mechanical arm on a production line grabs and places a product to be demolded, after demolding, the sliding components 2 move, and a towed mold is conveyed to be grabbed by the mechanical arm so as to facilitate demolding of the next product, specifically: the sliding assembly 2 comprises two positioning seats 9, a screw rod 10 is rotationally connected between the positioning seats 9, a gear 11 is arranged at the end part of the screw rod 10, a driving motor 12 is arranged at the lower part of the workbench 1, a synchronizing wheel is connected with the output end of the driving motor 12, the synchronizing wheel is connected with the gear 11 through a belt 13, the driving motor 12 is arranged at the lower part of the workbench 1 to facilitate the reduction of the space interference of an upper structure, the conveying is facilitated, the screw rod 10 is driven to rotate through the driving motor 12, a sliding rail 14 is arranged on the workbench 1, a sliding sleeve is arranged at the lower part of the placing plate 3, and the sliding sleeve is matched with the sliding rail 14 to ensure the stability of the placing plate 3 in the transmission process.
As shown in fig. 4, the sliding block of the sliding assembly 2 is provided with a placing plate 3, when the manipulator grabs a product from the injection molding machine, the product is placed on the placing plate 3, at least three groups of positioning blocks 25 are arranged on the placing plate 3, one side opposite to the positioning blocks 25 is provided with an inclined plane 26, the inclined plane 26 can guide the product, the three groups of positioning blocks 25 can limit the product to be demolded, the bottom of the positioning block 25 is provided with a slot corresponding to the positioning device 4, the output end of the positioning device 4 passes through the slot, two sides of the placing plate 3 are provided with positioning devices 4, the positioning devices 4 comprise side pushing cylinders 15, the output end of the side pushing cylinders 15 is connected with positioning plates 16, when the product is placed on the placing plate 3, the positioning plates 16 extend out through the side pushing cylinders 15, pass through the slot and are inserted into grooves at the edges of the product to realize positioning,
as shown in fig. 5, the lower part of the placement plate 3 is provided with an ejection mechanism, the ejection mechanism includes two groups of first ejector blocks 5 connected to the bottom of the mold, the first ejector blocks 5 are connected to the mold through guide posts 27, the first ejector blocks 5 can move along the guide posts 27, ejector rods 7 are connected to the first ejector blocks 5, the ejector rods 7 penetrate through the mold and are inserted into the end parts of the product in the mold, a second ejector block 6 is arranged in the middle of the first ejector blocks 5, the second ejector blocks 6 are also connected to the lower part of the mold through the guide posts 27, and two rows of ejector pins 8 are arranged, the ejector pins 8 penetrate through the mold and are ejected onto pins of the product, and by starting the ejection mechanism at the lower part, a first embodiment of the ejection mechanism is as follows: the ejection mechanism comprises an ejection cylinder 17, the ejection cylinder 17 is fixed at the bottom of the workbench 1 through a connecting column 18, the output end of the ejection cylinder 17 is connected with a push plate 19, a plurality of ejection columns 20 are arranged on the push plate 19, the ejection columns 20 are aligned with the first ejection block 5 and the second ejection block 6, the ejection cylinder 17 ejects out, the push plate 19 can be pushed to push the first ejection block 5 and the second ejection block 6, the ejector rod 7 on the first ejection block 5 can push the plastic part of a product, the position of the second ejection block 6 is in the middle, corresponding holes are formed in a die, the ejector pins 8 penetrate through the holes of the die, ejection is carried out on each terminal, the uniformity of stress of the whole product is guaranteed, and in addition, in order to prevent the ejection of the ejector pins 8, the first ejection block 5 and the second ejection block 6 are particularly provided with a central guide pillar 27, one end of the guide pillar 27 is inserted in the die, a spring 28 is sleeved on the guide pillar 27, and the spring 28 is limited on the die 28 through the spring, and the excessive ejection of the die is prevented.
In order to enable more stable ejection, the ejection force is insufficient in individual cases, and as shown in fig. 6, a second embodiment of the ejection mechanism is as follows: the screw rod 10 module is arranged, the screw rod 10 module is fixed at the bottom of the workbench 1 through the fixing frame 22, a top plate 23 is connected to a sliding block of the screw rod 10 module, a pushing block is fixed to the top plate 23, an ejection block 24 is connected to the top plate 23 and aligned with the first ejection block 5 and the second ejection block 6, the screw rod 10 module is vertically arranged through the form of the screw rod 10 module, and the screw rod 10 module is relatively continuous in force application due to relatively slow movement of the module, so that a product can be ejected more stably compared with the ejection speed of a cylinder, separation between the ejector pin 8 and the product is prevented, and the yield is improved.

Claims (8)

1. The semi-automatic demolding machine for the semiconductor power device is characterized by comprising a workbench, wherein at least one group of sliding assemblies are arranged on the workbench, a placing plate is arranged on a sliding block of each sliding assembly, positioning devices are arranged on two sides of the placing plate and are inserted into a product to be demolded to position the product to be demolded;
the lower part of the placing plate is provided with an ejection mechanism, the ejection mechanism comprises two groups of first ejector blocks connected to the bottom of the die, ejector rods are connected to the first ejector blocks, the ejector rods penetrate through the die and are inserted into the end parts of products in the die, a second ejector block is arranged in the middle of the first ejector blocks, two rows of ejector pins are arranged on the second ejector blocks, and the ejector pins penetrate through the die and are ejected onto pins of the products.
2. The semi-automatic stripper for semiconductor power devices according to claim 1, wherein the sliding assembly comprises two positioning seats, a screw rod is rotatably connected between the positioning seats, a gear is arranged at the end of the screw rod, a driving motor is arranged at the lower part of the workbench, the output end of the driving motor is connected with a synchronizing wheel, and the synchronizing wheel is connected with the gear through a belt.
3. The semi-automatic stripper for semiconductor power devices according to claim 1, wherein a slide rail is arranged on the workbench, a sliding sleeve is arranged at the lower part of the placing plate, and the sliding sleeve is matched with the slide rail.
4. The semi-automatic stripper of semiconductor power device of claim 1, wherein the positioning device comprises a side pushing cylinder, and the output end of the side pushing cylinder is connected with a positioning plate.
5. The semi-automatic stripper of semiconductor power device according to claim 1, wherein the ejection mechanism comprises an ejection cylinder, the ejection cylinder is fixed at the bottom of the workbench through a connecting column, the output end of the ejection cylinder is connected with a pushing plate, a plurality of ejection columns are arranged on the pushing plate, and the ejection columns are aligned with the first ejection block and the second ejection block.
6. The semi-automatic stripper of claim 1, wherein the ejector mechanism comprises a screw module fixed to the bottom of the table by a fixing frame, a top plate is connected to a sliding block of the screw module, and the top plate is connected to an ejector block and aligned with the first and second ejector blocks.
7. The semi-automatic stripper for semiconductor power devices according to claim 1, wherein at least three groups of positioning blocks are arranged on the placing plate, inclined planes are arranged on opposite sides of the positioning blocks, slots are arranged at positions, corresponding to the positioning devices, of the bottoms of the positioning blocks, and output ends of the positioning devices penetrate through the slots.
8. The semi-automatic stripper of semiconductor power device according to claim 1, wherein the first and second top blocks are provided with a guide post in the center, one end of the guide post is inserted into the mold, and a spring is sleeved on the guide post and is pressed against the mold.
CN202321721991.3U 2023-07-04 2023-07-04 Semi-automatic stripper for semiconductor power device Active CN220163134U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321721991.3U CN220163134U (en) 2023-07-04 2023-07-04 Semi-automatic stripper for semiconductor power device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321721991.3U CN220163134U (en) 2023-07-04 2023-07-04 Semi-automatic stripper for semiconductor power device

Publications (1)

Publication Number Publication Date
CN220163134U true CN220163134U (en) 2023-12-12

Family

ID=89061751

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321721991.3U Active CN220163134U (en) 2023-07-04 2023-07-04 Semi-automatic stripper for semiconductor power device

Country Status (1)

Country Link
CN (1) CN220163134U (en)

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