CN220155531U - Power management chip with explosion-proof structure - Google Patents

Abstract

The utility model discloses a power management chip with an explosion-proof structure, which comprises a chip main body, a first limit groove, a protective shell and pins, wherein the top of the chip main body is provided with the protective shell, the bottom of the protective shell is provided with a first heat conducting fin, the first heat conducting fin is welded with a second heat conducting fin, the first heat conducting fin is provided with a plurality of groups on the protective shell, the bottom of the first heat conducting fin is provided with a plurality of groups, the left side of the outside of the chip main body is provided with the first limit groove, one side of the chip main body is provided with two groups, and the center position of the right side of the outside of the chip main body is provided with the second limit groove. According to the utility model, the contact area with the inside is increased through the first heat conducting fin and the second heat conducting fin, and heat can be transferred from a higher object to a lower object, so that after the heat is transferred to the first heat conducting fin and the second heat conducting fin, the heat is transferred to the protective shell and finally emitted to the surrounding environment, and the heat radiation capability of the chip is increased.

Description

Power management chip with explosion-proof structure

Technical Field

The utility model relates to the technical field of chips, in particular to a power management chip with an explosion-proof structure.

Background

The power management chip is a chip which plays roles in converting, distributing, detecting and other electric energy management of electric energy in an electronic equipment system, is mainly responsible for identifying the power supply amplitude of a CPU, generating corresponding short moment waves and pushing a post-stage circuit to output power, has wide application range, has important significance in improving the performance of the whole machine, is directly related to the selection of the power management chip and the requirement of a system, has difficult crossing cost in development of the digital power management chip, has power supply for all electronic equipment, and has different requirements on the power supply for different systems. In order to exert the best performance of the electronic system, the most suitable power management mode needs to be selected, and the existing power management chip can generate a large amount of heat when controlling voltage and current, and if the heat is not timely dissipated, the internal structure of the chip is damaged.

Disclosure of Invention

The utility model aims to provide a power management chip with an explosion-proof structure, which solves the problem that the prior power management chip provided in the background art can generate a large amount of heat when controlling voltage and current, and the heat is not timely dissipated, so that the structure inside the chip is damaged.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a power management chip of explosion-proof structure, includes chip main part, first spacing groove, protecting crust and pin, the top of chip main part is provided with the protecting crust, the protecting crust bottom is provided with first conducting strip, the welding has the second conducting strip on the first conducting strip, first conducting strip is provided with the multiunit on the protecting crust, the second conducting strip is provided with the multiunit in the bottom of first conducting strip, first spacing groove has been seted up in the outside left side of chip main part, first spacing groove is provided with two sets of in one side of chip main part, the central point of the outside right side of chip main part puts and is provided with the second spacing groove.

Preferably, pins are arranged on two sides of the outer portion of the chip main body, a plurality of pins are arranged on the chip main body, the pins are uniformly arranged on the chip main body, penetrate through the chip main body and bend downwards, and the pins play a role in conducting electricity.

Preferably, a second buckle is arranged on the side wall of the inside of the protective shell, a plurality of groups of second buckles are arranged in the protective shell, and the second buckle is made of elastic materials.

Preferably, a first buckle is arranged in the chip main body, a plurality of groups of first buckles are arranged on the chip main body, the first buckles are made of elastic materials, the first buckles are matched with the second buckles, and the first buckles and the second buckles play a fixed role.

Preferably, the inside welding of chip main part has main control module, the inside one side that is close to main control module of chip main part is provided with signal detection module, the inside one side of chip main part is inlayed and is had charge control module, the inside opposite side of chip main part is inlayed and is had power supply management module, the inside bottom that is close to of chip main part is inlayed and is had the resistance, the inside one side that is close to the resistance of chip main part is inlayed and is had the diode.

Preferably, the signal detection module is electrically connected with the main control module, the signal detection module is electrically connected with the charging control module, and the charging control module, the power supply management module, the resistor and the diode are electrically connected with each other.

Compared with the prior art, the utility model has the beneficial effects that: the power management chip of the explosion-proof structure has reasonable structure and has the following advantages:

(1) The chip radiating efficiency is high through being provided with chip main part, the protecting crust, first conducting strip and second conducting strip, and the radiating effect is good, consequently, through being provided with the protecting crust in the outside of chip main part, the inside bottom of protecting crust is provided with first conducting strip, and be provided with the second conducting strip on the first conducting strip, increase with inside area of contact through first conducting strip and second conducting strip, and the heat can be transferred lower object from higher object, thereby transfer the heat to on first conducting strip and the second conducting strip, then the heat is transferred to on the protecting crust, finally give off in the surrounding environment, thereby increase the heat dispersion of chip.

(2) Can conveniently take off the protecting crust through chip main part, the protecting crust, first buckle and second buckle, be convenient for follow-up maintenance, consequently, be provided with the second buckle through the inner wall at the protecting crust, be provided with first buckle in chip main part, first buckle and second buckle mutually support, because first buckle and second buckle adopt elastic material to make, thereby through breaking the protecting crust off with the fingers and thumb, can make first buckle and second buckle separate each other, be convenient for take off the protecting crust, maintain the component of inside, the protecting crust has still played explosion-proof effect.

(3) The chip can be prevented from being damaged by welding reversely when being welded by being provided with the first limiting groove and the second limiting groove, so that the chip is prevented from being damaged by welding reversely when being arranged on the main body of the chip.

Drawings

FIG. 1 is a schematic top view of the exterior structure of the present utility model;

FIG. 2 is a schematic cross-sectional elevation view of the present utility model;

FIG. 3 is a schematic top view of the internal structure of the present utility model;

FIG. 4 is a schematic side view of the exterior structure of the present utility model;

fig. 5 is an enlarged schematic view of the structure of fig. 2 a according to the present utility model.

In the figure: 1. a chip main body; 2. a first limit groove; 3. the second limit groove; 4. pins; 5. a protective shell; 6. a first heat conductive sheet; 7. a second heat conductive sheet; 8. a main control module; 9. a signal detection module; 10. a resistor; 11. a diode; 12. a first buckle; 13. a second buckle; 14. a charge control module; 15. and a power supply management module.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present utility model are within the scope of protection of the present utility model.

Referring to fig. 1-5, an embodiment of the present utility model is provided: the power management chip with the explosion-proof structure comprises a chip main body 1, a first limit groove 2, a protective shell 5 and pins 4, wherein the protective shell 5 is arranged at the top of the chip main body 1, a first heat conducting fin 6 is arranged at the bottom of the protective shell 5, a second heat conducting fin 7 is welded on the first heat conducting fin 6, a plurality of groups of the first heat conducting fins 6 are arranged on the protective shell 5, a plurality of groups of the second heat conducting fins 7 are arranged at the bottom of the first heat conducting fin 6, the first limit groove 2 is formed in the left side outside the chip main body 1, two groups of the first limit groove 2 are formed in one side of the chip main body 1, a second limit groove 3 is formed in the center position of the right side outside the chip main body 1, and protrusions which are mutually matched with the first limit groove 2 and the second limit groove 3 are arranged on a main board when the chip is mounted on the main board, so that chip damage caused by chip welding is avoided;

the contact area with the inside is increased through the first heat conducting fin 6 and the second heat conducting fin 7, and heat is transferred from a higher object to a lower object, so that after the heat is transferred to the first heat conducting fin 6 and the second heat conducting fin 7, the heat is transferred to the protective shell 5 and finally emitted to the surrounding environment, and the heat dissipation capacity of the chip is increased;

pins 4 are arranged on two sides of the outer part of the chip main body 1, the pins 4 are arranged on the chip main body 1, the pins 4 are uniformly arranged on the chip main body 1, the pins 4 penetrate through the chip main body 1 and bend downwards, second buckles 13 are arranged on the side wall of the inner part of the protective shell 5, a plurality of groups of second buckles 13 are arranged in the protective shell 5, and the second buckles 13 are made of elastic materials;

the chip main body 1 is provided with a first buckle 12, the first buckle 12 is provided with a plurality of groups on the chip main body 1, the first buckle 12 is made of elastic materials, and the first buckle 12 and the second buckle 13 are mutually matched;

the first buckle 12 and the second buckle 13 are matched with each other, and the first buckle 12 and the second buckle 13 are made of elastic materials, so that the first buckle 12 and the second buckle 13 can be separated from each other by breaking the protective shell 5, the protective shell 5 is convenient to take down, and the internal elements are maintained;

the main control module 8 is welded inside the chip main body 1, the signal detection module 9 is arranged on one side, close to the main control module 8, inside the chip main body 1, the charging control module 14 is embedded on one side, close to the resistor 10, inside the chip main body 1, the power supply management module 15 is embedded on the other side, close to the resistor 10, inside the chip main body 1, and the diode 11 is embedded on one side, close to the resistor 10, inside the chip main body 1;

the signal detection module 9 is electrically connected with the main control module 8, the signal detection module 9 is electrically connected with the charging control module 14, and the charging control module 14, the power supply management module 15, the resistor 10 and the diode 11 are electrically connected with each other;

when the chip is mounted on the main board, the first limit groove 2 and the second limit groove 3 are arranged on the chip main body 1, and when the chip is mounted on the main board, the protrusions which are mutually matched with the first limit groove 2 and the second limit groove 3 are arranged on the main board, so that the chip damage caused by chip welding reaction is avoided, the first buckle 12 is arranged in the chip main body 1, the first buckle 12 and the second buckle 13 are mutually matched, and the first buckle 12 and the second buckle 13 are made of elastic materials, so that the first buckle 12 and the second buckle 13 can be mutually separated by breaking the protective shell 5, the protective shell 5 is convenient to be taken down, elements in the chip are maintained, when the chip generates larger heat, the contact area with the inside is increased through the first heat conducting sheet 6 and the second heat conducting sheet 7, the heat can be transferred from a higher object to a lower object, the heat is transferred to the first heat conducting sheet 6 and the second heat conducting sheet 7, and then the heat is transferred to the protective shell 5, and the heat dissipation capacity of the chip is increased.

Claims (6)

1. Power management chip of explosion-proof structure, its characterized in that: including chip main part (1), first spacing groove (2), protection shell (5) and pin (4), the top of chip main part (1) is provided with protection shell (5), be provided with first conducting strip (6) of protection shell (5) bottom, the welding has second conducting strip (7) on first conducting strip (6), first conducting strip (6) are provided with the multiunit on protection shell (5), second conducting strip (7) are provided with the multiunit in the bottom of first conducting strip (6), first spacing groove (2) have been seted up in the left side of chip main part (1) outside, first spacing groove (2) are provided with two sets of in one side of chip main part (1), the central point on the outside right side of chip main part (1) is provided with second spacing groove (3).

2. The explosion-proof power management chip of claim 1, wherein: the chip comprises a chip main body (1), wherein pins (4) are arranged on two sides of the outside of the chip main body (1), a plurality of pins (4) are arranged on the chip main body (1), the pins (4) are uniformly arranged on the chip main body (1), and the pins (4) penetrate through the chip main body (1) and bend downwards.

3. The explosion-proof power management chip of claim 1, wherein: the side wall inside the protective shell (5) is provided with a second buckle (13), a plurality of groups of second buckles (13) are arranged inside the protective shell (5), and the second buckles (13) are made of elastic materials.

4. The explosion-proof power management chip of claim 1, wherein: the chip is characterized in that a first buckle (12) is arranged in the chip main body (1), a plurality of groups of first buckles (12) are arranged on the chip main body (1), the first buckles (12) are made of elastic materials, and the first buckles (12) are matched with the second buckles (13).

5. The explosion-proof power management chip of claim 1, wherein: the novel chip is characterized in that a main control module (8) is welded inside the chip main body (1), a signal detection module (9) is arranged on one side, close to the main control module (8), inside one side of the chip main body (1) is inlaid with a charging control module (14), the other side inside the chip main body (1) is inlaid with a power supply management module (15), a resistor (10) is inlaid at the bottom, close to the inside of the chip main body (1), and a diode (11) is inlaid at one side, close to the resistor (10), inside the chip main body (1).

6. The explosion-proof power management chip of claim 5, wherein: the signal detection module (9) is electrically connected with the main control module (8), the signal detection module (9) is electrically connected with the charging control module (14), and the charging control module (14), the power supply management module (15), the resistor (10) and the diode (11) are electrically connected with each other.