CN220154783U - Resolution ratio amplifying device - Google Patents

Abstract

The utility model provides a resolution ratio amplifying device, and relates to the technical field of optical display. The resolution amplification device provided by the utility model comprises a PCB and a polarization component fixedly arranged on the PCB; the polarization component comprises an elastic sheet and optical glass arranged on the elastic sheet, the elastic sheet is hollow and annular to encircle the periphery fixed on the optical glass, a first positioning hole is formed in a preset position of the elastic sheet, the polarization component is fixedly connected with the PCB through a support column, one end of the support column extends into the corresponding position of the first positioning hole of the elastic sheet by using an SMT process, and the other end of the support column is attached to the corresponding position on the PCB by using the SMT process. The resolution ratio amplification device obtained by the design is capable of positioning the connection between the support column and the polarization component and between the support column and the PCB at a preset position, so that the assembly precision is higher, meanwhile, the connection between the PCB and the polarization component is more accurate, the assembly error is reduced, and the stability of connection is improved.

Description

Resolution ratio amplifying device

Technical Field

The utility model relates to the technical field of optical display, in particular to a resolution amplification device.

Background

The resolution ratio amplifying device is generally formed by connecting a PCB and a polarization component, when the resolution ratio amplifying device is electrified, the polarization component can vibrate by utilizing a magnetic field to wholly displace light beams and generate mutually overlapped pictures, so that the resolution ratio is improved, and the resolution ratio amplifying device is widely applied to the optical display fields such as projectors and the like.

The existing resolution ratio amplification device is used for directly connecting a PCB (printed circuit board) with a polarization component through a support column, but because the support column is used for directly connecting the PCB with the polarization component only through an adhesive mode, an elastic piece of the polarization component is difficult to effectively position with the PCB and the support column, and therefore, the position of each component can be offset in the installation process, so that the assembly precision is reduced, and the assembly stability is poor.

Disclosure of Invention

The utility model provides a resolution amplification device with higher assembly precision and stability, which solves the problems of lower assembly precision and poorer assembly stability of the existing resolution amplification device.

Embodiments of the present utility model are implemented as follows:

in one aspect of the embodiment of the utility model, a resolution ratio amplifying device is provided, which comprises a PCB and a polarization component fixedly arranged on the PCB; the polarization component comprises an elastic sheet and optical glass arranged on the elastic sheet, the elastic sheet is hollow and annular to encircle the periphery fixed on the optical glass, a first positioning hole is formed in a preset position of the elastic sheet, the polarization component is fixedly connected with the PCB through a support column, one end of the support column extends into the corresponding position of the first positioning hole of the elastic sheet by using an SMT process, and the other end of the support column is attached to the corresponding position on the PCB by using the SMT process.

Optionally, the support column includes a connection table, and opposite side surfaces of the connection table are respectively used as a first end surface and a second end surface; the first positioning column is arranged on the first end face, and when the polarization component is fixedly connected with the PCB through the support column, the support column is attached to the surface of the PCB through the second end face, and the first positioning column of the support column is used for being clamped into the first positioning hole of the elastic sheet, so that the elastic sheet is attached to the first end face of the connecting table.

Optionally, one end of the first positioning column far away from the first end face is provided with a limiting cap, and the diameter of the limiting cap is larger than that of the first positioning hole.

Optionally, the second terminal surface of connecting table is equipped with the second reference column, is provided with the second locating hole on the PCB board, and the support column passes through the laminating of second terminal surface and sets up in the PCB board surface, and the second reference column card on the support column is gone into in the second locating hole.

Optionally, when the second end face of the support column is attached to the surface of the PCB, the end of the second positioning column contacts the bottom wall of the second positioning hole, and the end of the second positioning column is attached to the bottom wall of the second positioning hole by using an SMT process.

Optionally, the support column is made of nonmetal material, and the first end face and the second end face of the connecting table are provided with conductive layers; or, the support column is made of conductive metal.

Optionally, the support column is non-metal material, and when the first terminal surface and the second terminal surface of connection platform all are equipped with the conducting layer, the position that the surface of PCB board corresponds the second terminal surface is equipped with the pad.

Optionally, the second terminal surface of connecting table has seted up first screw, and PCB board surface processing has the second screw, is provided with countersunk head screw in the second screw, and countersunk head screw's head is fixed in the second screw, afterbody protrusion in the surface of PCB board, and when the laminating of the second terminal surface of support column set up in PCB board surface, countersunk head screw's afterbody card was gone into in the first screw.

Optionally, the elastic piece comprises a first elastic part, the first elastic part is rectangular, the four right-angle ends of the first elastic part are respectively provided with a second elastic part, the second elastic parts are respectively and elastically connected with the adjacent sides of the first elastic part through elastic strips, and the connection points of the two elastic strips on the second elastic part are spaced; each side edge of the first elastic part is parallel to the two elastic strips, and the two elastic strips are connected with the middle position of the side edge of the second elastic part in a V-shaped structure.

Optionally, an elastic rubber pad is arranged on the surface of the edge of the PCB and used for buffering and damping when the resolution amplification device and the user equipment are installed.

Optionally, the polarizing component further comprises a plurality of magnets, the plurality of magnets are distributed on the elastic sheet and located on the periphery of the optical glass, and a magnetic field for deflecting the optical glass is formed between the plurality of layers of electromagnetic induction coils on the PCB and the magnets.

Optionally, the PCB further includes a signal collection module, a feedback module, and a signal processing module.

The beneficial effects of the embodiment of the utility model include: the resolution ratio amplifying device provided by the embodiment of the utility model comprises a PCB and a polarization component fixedly arranged on the PCB; the PCB and the polarization component can vibrate so as to deflect the polarization component to displace the whole light beam and generate pictures which are mutually overlapped, thereby effectively improving the resolution; the polarizing component comprises an elastic sheet and optical glass arranged on the elastic sheet, and the elastic sheet is hollow and annular so as to encircle and be fixed on the periphery of the optical glass, so that the connection between the polarizing components is more stable; the pre-set position of the elastic sheet is provided with a first positioning hole, the polarization component and the PCB are fixedly connected through the support column, one end of the support column extends into the corresponding position on the PCB by using the SMT technology, and the other end of the support column is attached to the corresponding position on the PCB by using the SMT technology, so that the support column can accurately and rapidly position the polarization component and the PCB at the pre-installation position when connecting the polarization component and the PCB, the PCB and the polarization component are not easy to shift in position in the installation process, and the assembly precision is improved; the positions of all the parts of the resolution ratio amplification device after assembly are precisely corresponding and the connection relation is more stable. The resolution ratio amplification device obtained by the design is capable of positioning the connection between the support column and the polarization component and between the support column and the PCB at a preset position, so that the assembly precision is higher, meanwhile, the connection between the PCB and the polarization component is more accurate, the assembly error is reduced, and the stability of connection is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a resolution amplification apparatus according to an embodiment of the present utility model;

FIG. 2 is an exploded view of a resolution amplification device according to an embodiment of the present utility model;

FIG. 3 is a schematic diagram of a support column according to an embodiment of the present utility model;

FIG. 4 is a second schematic diagram of a support column according to an embodiment of the present utility model;

fig. 5 is a schematic structural diagram of connection between a support column and an elastic sheet and between the support column and a PCB board according to an embodiment of the present utility model;

FIG. 6 is a second schematic diagram of a connection structure between a support column and an elastic sheet and a PCB according to an embodiment of the present utility model;

FIG. 7 is a schematic diagram of a structure of a support column with a first screw hole according to an embodiment of the present utility model;

FIG. 8 is a second schematic view of a structure of a support column with a first screw hole according to an embodiment of the present utility model;

FIG. 9 is a schematic diagram of a connection structure between a support post and a countersunk head screw according to an embodiment of the present utility model;

FIG. 10 is a second schematic view of a connection structure between a support post and a countersunk head screw according to an embodiment of the present utility model;

fig. 11 is a schematic structural diagram of a PCB board according to an embodiment of the present utility model;

fig. 12 is a second schematic structural diagram of a PCB board according to an embodiment of the present utility model;

FIG. 13 is a schematic diagram of an assembly structure of an elastic rubber pad and a mounting hole according to an embodiment of the present utility model;

FIG. 14 is a second schematic structural view of an elastic rubber pad and mounting hole assembly according to an embodiment of the present utility model;

FIG. 15 is a second embodiment of a resolution enhancement device according to the present utility model.

Icon: 100-resolution amplification means; 110-a PCB board; 111-second positioning holes; 112-bonding pads; 113-a second screw hole; 114-an electromagnetic induction coil; 115-mounting holes; 116-IC chip; 120-polarizing component; 121-an elastic sheet; 1211-a first positioning hole; 1212-a first resilient portion; 1213-a second elastic portion; 1214-elastic strips; 122-magnet; 123-optical glass; 130-support columns; 131-connecting the tables; 1311-a first end face; 1312-a second end face; 132-a first positioning column; 1321-limit cap; 133-a second positioning post; 134-a first screw hole; 140-countersunk head screws; 150-elastic rubber cushion.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, not all embodiments. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

In the description of the present utility model, it should be understood that terms indicating orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are merely used for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection or signal connection; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood by those skilled in the art according to the specific circumstances.

Referring to fig. 1 and 2, in one aspect of the embodiment of the present utility model, a resolution amplifying device 100 is provided, which includes a PCB 110 and a polarization component 120 fixedly disposed on the PCB 110; the polarizing component 120 includes an elastic sheet 121 and an optical glass 123 disposed on the elastic sheet 121, wherein the elastic sheet 121 is hollow and annular to surround and fix on the periphery of the optical glass 123, a first positioning hole 1211 is disposed at a preset position of the elastic sheet 121, the polarizing component 120 is fixedly connected with the PCB board 110 through a support column 130, one end of the support column 130 extends into the first positioning hole 1211 of the elastic sheet 121 by SMT process for mounting, and the other end is mounted on a corresponding position on the PCB board 110 by SMT process.

Specifically, the utility model provides a resolution amplification device 100, which is provided with a PCB 110, wherein a polarization component 120 is fixedly connected above the PCB 110 so as to provide a certain supporting effect for the polarization component 120; of course, besides the PCB 110, the polarization component 120 may be fixed on various boards such as a metal board and a ceramic board, which can fix and support the polarization component 120, and the utility model adopts the PCB 110 and the polarization component 120 to directly connect, which can make the structure of the resolution amplification device 100 more concise and reduce the production cost.

The polarizing assembly 120 includes an elastic sheet 121. The elastic sheet 121 is an annular plate surface with a hollowed-out middle part, and the middle part of the elastic sheet is provided with a piece of light-transmitting optical glass 123, so that light can pass through the elastic sheet 121 to irradiate on the optical glass 123. In a preferred embodiment of the present utility model, four first positioning holes 1211 are pre-arranged around the annular region of the elastic sheet 121 in advance, so as to be used for penetrating the support column 130 into the first positioning holes 1211, and the first positioning holes 1211 play a certain role in positioning the support column 130.

One end of the support column 130 is connected to the elastic sheet 121 through the first positioning hole 1211 and mounted through an SMT process; the other end is attached to a corresponding position of the PCB 110 using an SMT process to interconnect the polarization component 120 and the PCB 110 through the support posts 130. In a preferred embodiment of the present utility model, the support column 130 has a cylindrical structure, however, the support column 130 may be provided in other shapes adapted to the first positioning hole 1211, which is not limited in any way.

It should be noted that, first, in the embodiment of the present utility model, the annular area of the elastic sheet 121 is preset with a plurality of first positioning holes 1211 in advance, and the support columns 130 can be more accurately assembled between the elastic sheet 121 and the PCB 110 through the arrangement of the first positioning holes 1211, so that the assembly accuracy is improved.

In a preferred embodiment of the present utility model, the first positioning holes 1211 are provided in four, and are respectively provided at four corners of the elastic sheet 121; of course, the specific number and the setting position of the first positioning holes 1211 may be adjusted according to the actual installation situation and the requirement, so long as the positioning effect of the support column 130 can be achieved, which is not limited in any way by the present utility model.

The current support column is connected with the polarization component and the PCB board through the mode of pasting generally, and this kind of mode very easily leads to the support column to take place the position offset in the installation, also causes the relative position of polarization component and PCB board to take place the displacement easily, leads to the lower or poor problem of assembly stability of assembly precision easily. In the utility model, the first positioning holes 1211 are preset on the elastic sheet 121 in advance, so that the positioning is performed when the support column 130 is installed, the position deviation generated in the installation process of the polarization component 120, the PCB 110 and the support group can be effectively prevented, the installation error is reduced, and the assembly precision and the connection stability are improved.

Second, in the embodiment of the present utility model, two ends of the supporting column 130 are respectively mounted on the corresponding positions of the elastic sheet 121 and the PCB 110 by SMT process. The SMT technology is adopted for installation, so that the PCB 110 is not required to be drilled with a plug-in hole, and the support column 130 can be directly welded on the surface of the PCB; the connection mode can improve the assembly tightness of the resolution amplification device 100, reduce the volume and the weight of the resolution amplification device, have higher reliability and vibration resistance, and can ensure that the resolution amplification device 100 is connected more reliably and stably.

The resolution amplification device 100 provided by the embodiment of the utility model comprises a PCB 110 and a polarization component 120 fixedly arranged on the PCB 110; the PCB 110 and the polarization component 120 can vibrate to deflect the polarization component 120 to displace the whole light beam and generate images superimposed with each other, thereby effectively improving resolution; the polarization assembly 120 includes an elastic sheet 121 and an optical glass 123 disposed on the elastic sheet 121, the elastic sheet 121 having a hollow ring shape to surround the outer circumference of the optical glass 123, so that the connection between the polarization assemblies 120 is more stable; the preset position of the elastic sheet 121 is provided with the first positioning hole 1211, the polarization component 120 and the PCB 110 are fixedly connected through the support column 130, one end of the support column 130 extends into the first positioning hole 1211 of the elastic sheet 121 for mounting by using an SMT process, the other end of the support column 130 is mounted on the corresponding position on the PCB 110 by using the SMT process, and the support column 130 can accurately and rapidly position through the first positioning hole 1211 at the pre-mounting position when the polarization component 120 and the PCB 110 are connected, so that the PCB 110 and the polarization component 120 are not easy to generate position offset in the mounting process, and the assembly precision is improved; the assembled resolution enhancement device 100 also has more stable connection relations with accurate correspondence between the positions of the components. The resolution amplification device 100 obtained by the design above locates the connection between the support column 130 and the polarization component 120 and the PCB 110 at a preset position, so that the assembly accuracy is higher, meanwhile, the connection between the PCB 110 and the polarization component 120 is more accurate, the assembly error is reduced, and the stability of the connection is improved.

In one embodiment of the present utility model, as shown in fig. 15, the elastic sheet 121 includes a first elastic portion 1212, the first elastic portion 1212 is rectangular, and second elastic portions 1213 are respectively disposed at four right-angle ends of the first elastic portion 1212, the second elastic portions 1213 are respectively elastically connected to adjacent sides of the first elastic portion 1212 through elastic strips 1214, and connection points of the two elastic strips 1214 on the second elastic portions 1213 are spaced apart; each side edge of the first elastic portion 1212 is parallel to two elastic strips 1214, and the two elastic strips 1214 are connected to the middle position of the side edge of the second elastic portion 1213 in a V-shaped structure.

Specifically, the elastic sheet 121 of the present utility model is composed of three mutually connected parts, which includes a first elastic part 1212 with a hollow middle for placing the optical glass 123 and a second elastic part 1213 respectively disposed around the first elastic part 1212, the first elastic part 1212 being annular; elastic strips 1214 extending towards opposite ends are arranged at the middle parts of four side edges of the first annular part, and the two elastic strips 1214 of each side edge are parallel to the side edges; two elastic strips 1214 extend to the left and right sides and are connected to opposite sides of the second elastic portion 1213, so that the elastic sheet 121 has a loop-shaped structure; wherein the connection points of the two elastic strips 1214 on the second elastic portion 1213 are spaced apart from each other and are not integrally connected.

By such arrangement, the stress of the connection point between the first elastic part 1212 and each second elastic part 1213 can be more dispersed through the connection of the elastic strip 1214 and the second elastic part 1213, so that the elastic sheet 121 is prevented from being broken in the vibration process, and the service life and stability of the product are improved; meanwhile, the connection points of the two elastic strips 1214 on the second elastic portion 1213 are spaced apart, so that the vibration of the elastic sheet 121 along the X-axis and along the Y-axis can be independent of each other, further improving the stability and reliability of the resolution amplifying device 100.

In one possible embodiment of the present utility model, as shown in fig. 3, 4, 5 and 6, the support column 130 includes a connection stage 131, and opposite side surfaces of the connection stage 131 serve as a first end surface 1311 and a second end surface 1312, respectively; when the polarizing component 120 and the PCB 110 are fixedly connected by the support column 130, the support column 130 is attached to the surface of the PCB 110 by the second end surface 1312, and the first positioning column 132 of the support column 130 is used for being clamped into the first positioning hole 1211 of the elastic sheet 121, so that the elastic sheet 121 is attached to the first end surface 1311 of the connecting table 131.

Specifically, the support column 130 includes a connection stage 131, and opposite side surfaces of the connection stage 131 are a first end surface 1311 and a second end surface 1312. When the support column 130 is disposed between the PCB 110 and the elastic sheet 121, the first end surface 1311 thereof is attached to the elastic sheet 121, and the second end surface 1312 is attached to the PCB 110, so as to be tightly connected to the PCB 110 and the elastic sheet 121, respectively.

A first positioning column 132 is arranged in the middle of the first end surface 1311, and the first positioning column 132 can be clamped into the first positioning hole 1211 of the elastic sheet 121 so as to well position the support column 130; when the support column 130 is disposed between the PCB 110 and the elastic piece 121, the first positioning column 132 is clamped into the first positioning hole 1211, and the second end face 1312 is attached to the PCB 110.

Further, as shown in fig. 3 and 5, a limiting cap 1321 is disposed at an end of the first positioning post 132 away from the first end surface 1311, and the diameter of the limiting cap 1321 is larger than the diameter of the first positioning hole 1211.

Specifically, when the first positioning post 132 is snapped into the first positioning hole 1211, a limiting cap 1321 may be further disposed at an end of the first positioning post 132 away from the first end surface 1311, where the setting direction of the limiting cap 1321 is parallel to the setting direction of the elastic sheet 121, so as to further limit and position the support post 130 to prevent the support post from falling off.

By the arrangement of the first positioning column 132, one end of the supporting column 130 can be stably clamped into the elastic sheet 121, so that the assembly accuracy is improved; and the spacing cap 1321 that the tip of first reference column 132 set up can further carry out spacing and location to support column 130, prevents that support column 130 from taking place to drop, has improved the stability of assembly.

Further, as shown in fig. 3 and 5, the second end face 1312 of the connection platform 131 is provided with a second positioning post 133, the PCB board 110 is provided with a second positioning hole 111, the support post 130 is attached to the surface of the PCB board 110 through the second end face 1312, and the second positioning post 133 on the support post 130 is clamped into the second positioning hole 111.

Specifically, the second end surface 1312 of the connection platform 131 is provided with a second positioning post 133, correspondingly, the PCB board 110 is provided with a second positioning hole 111 for clamping in the second positioning post 133, and when the second end surface 1312 of the support post 130 is attached to the surface of the PCB board 110, the support post 130 can clamp in the second positioning post 133 into the second positioning hole 111 to limit and position the second positioning post 133.

The second positioning hole 111 is formed in the PCB 110, and the second positioning post 133 corresponding to the second positioning post 133 on the connecting table 131 can be clamped into the second positioning hole 111, so that the connection stability between the support column 130 and the PCB 110 is improved, and positioning can be further realized in the assembly process of the support column 130 and the PCB 110.

Further, as shown in fig. 5 and 6, when the second end surface 1312 of the support post 130 is attached to the surface of the PCB 110, the end of the second positioning post 133 contacts the bottom wall of the second positioning hole 111, and the end of the second positioning post 133 is attached to the bottom wall of the second positioning hole 111 by SMT.

Specifically, when the second end surface 1312 of the support pillar 130 is disposed on the surface of the PCB in a bonding manner, the second positioning pillar 133 is snapped into the second positioning hole 111. At this time, the second positioning post 133 can be completely contacted with the bottom wall of the second positioning hole 111, and the end of the second positioning post 133 is attached to the bottom wall of the second positioning hole 111 by the SMT process, so that the support post 130 is connected to the PCB. By the arrangement mode, the PCB 110 can be well contacted with the support column 130, good current conduction is realized, and the resolution amplification device 100 has higher reliability.

In another embodiment of the present utility model, the support columns 130 are made of non-metal materials, and conductive layers are disposed on the first end surface 1311 and the second end surface 1312 of the connection platform 131; alternatively, the support posts 130 are made of conductive metal.

Specifically, the support columns 130 may be made of non-metal or conductive metal. When the support columns 130 are made of non-metal materials, the first end surface 1311 and the second end surface 1312 of the connection platform 131 of the support columns 130 are provided with conductive layers, so that when the support columns 130 made of non-metal materials are arranged between the elastic sheet 121 and the PCB 110, the first end surface 1311 is tightly attached to the elastic sheet 121, the second end surface 1312 is tightly attached to the PCB 110, and a good current path is formed through the conductive layers. Such an arrangement can achieve good current conduction, and the resolution amplification apparatus 100 is more reliable.

Further, the support columns 130 are made of non-metal materials, and when the first end surface 1311 and the second end surface 1312 of the connection platform 131 are both provided with conductive layers, the positions of the surface of the PCB 110 corresponding to the second end surface 1312 are provided with the pads 112.

Specifically, when the support columns 130 are made of non-metal materials, conductive layers for forming good current paths are disposed on the first end surface 1311 and the second end surface 1312 of the connection platform 131, and correspondingly, the pads 112 are disposed at positions where the surface of the PCB 110 contacts the second end surface 1312, as shown in fig. 11, and the pads 112 and the conductive layers are in contact with each other to form good conductive paths. Of course, if the support columns 130 are made of conductive metal, the pads 112 do not need to be disposed on the surface of the PCB 110 corresponding to the second end face 1312, and as shown in fig. 12, the support columns 130 made of conductive metal can realize electrical conduction. By providing the bonding pad 112, the bonding pad 112 and the conductive layer can be mutually matched to realize good current conduction, so that the resolution amplification device 100 has higher reliability.

In one embodiment of the present utility model, as shown in fig. 7, 8, 9 and 10, a first screw hole 134 is formed in a second end face 1312 of the connection platform 131, a second screw hole 113 is machined on the surface of the PCB board 110, a countersunk head screw 140 is disposed in the second screw hole 113, a head portion of the countersunk head screw 140 is fixed in the second screw hole 113, a tail portion of the countersunk head screw protrudes out of the surface of the PCB board 110, and when the second end face 1312 of the support column 130 is attached to the surface of the PCB board 110, the tail portion of the countersunk head screw 140 is clamped into the first screw hole 134.

Specifically, the second end surface 1312 of the connection platform 131 may be provided with a first screw hole 134, and correspondingly, the PCB surface is provided with a second screw hole 113 communicating with the first screw hole 134. A countersunk head screw 140 is provided in the second screw hole 113.

The head of the countersunk head screw 140 is fixed in the second screw hole 113, and the tail is protruded on the surface of the PCB 110, so that the protruded tail is inserted into the first screw hole 134. After the support column 130 is attached to the PCB 110 through the SMT process, the countersunk screws 140 are provided for locking, so that the support column 130 and the PCB 110 are more stably connected, and the service life and reliability of the resolution amplification device 100 are prolonged.

In one embodiment of the present utility model, an elastic rubber pad 150 is provided on the surface of the edge of the PCB 110 for buffering and damping when the resolution amplification apparatus 100 is mounted with the user equipment.

Specifically, as shown in fig. 13, an elastic rubber pad 150 is further provided on the edge surface of the PCB 110. In a preferred scheme of the utility model, a plurality of mounting holes 115 for connecting the PCB 110 with the user equipment are formed at the edge of the PCB 110, and elastic rubber pads 150 are arranged at the periphery of the mounting holes 115, so that deformation of the product due to external force in and after the mounting process is avoided, the reliability of the performance of the product is ensured, and the stability and consistency of the product are also improved.

The mounting hole 115 may be a through hole or a stepped hole, as shown in fig. 14. Correspondingly, the shape structure of the elastic rubber pad 150 is also matched with the shape structure of the mounting hole 115, so as to realize the function of buffering and damping in the mounting process, and the specific structure of the mounting hole 115 and the elastic rubber pad 150 is not limited in the utility model.

In an embodiment of the present utility model, the polarizing component 120 further includes a plurality of magnets 122, wherein the plurality of magnets 122 are disposed on the elastic sheet 121 and located on the outer periphery of the optical glass 123, and a magnetic field for deflecting the optical glass 123 is formed between the multi-layer electromagnetic induction coil 114 on the PCB board 110 and the magnets 122.

Specifically, as shown in fig. 2, the polarizing component 120 further includes a plurality of magnets 122, where the plurality of magnets 122 are disposed on a surface of the elastic sheet 121 near the PCB 110 and located on the outer periphery of the optical glass 123. In a preferred embodiment of the present utility model, the magnets 122 include four magnets 122, and the four magnets 122 are respectively arranged on four sides of the optical glass 123;

in a preferred embodiment of the present utility model, the electromagnetic induction coils 114 of the PCB 110 are disposed at positions corresponding to the four magnets 122 of the PCB 110, and when the polarization component 120 is connected to the PCB 110, the positions of the multilayer electromagnetic induction coils 114 on the PCB 110 and the magnets 122 are in one-to-one correspondence to generate a magnetic field. Of course, in other embodiments, the number of the magnets 122 may be adjusted according to practical needs, for example, 3, 2, etc., which is not limited in any way by the present utility model. The basic working principle of the resolution amplification device 100 is realized and the reliability of the resolution amplification device 100 is improved through the mutual matching of the magnet 122 and the plating electromagnetic induction coil 114 on the PCB 110. When the PCB 110 is energized, under the combined action of the magnetic field and the current, the polarization component 120 realizes polarization around the X-axis and the Y-axis, so that the light beam incident into the optical glass 123 is displaced integrally, and the images superimposed with each other are generated, thereby improving the definition of the images.

Further, the PCB 110 further includes a signal collecting module, a feedback module, and a signal processing module. In a preferred embodiment of the present utility model, as shown in fig. 11 and 12, two IC chips 116 are disposed on the PCB 110, and when the resolution amplification apparatus 100 is mutually connected with the user equipment, a signal collecting module, a feedback module, and a signal processing module in the IC chips 116 can implement signal communication and processing with the user equipment, so that the reliability of the resolution amplification apparatus 100 is further improved.

The above description is only an example of the present utility model and is not intended to limit the scope of the present utility model, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (10)

1. The resolution ratio amplifying device is characterized by comprising a PCB and a polarization component fixedly arranged on the PCB; the polarization component comprises an elastic sheet and optical glass arranged on the elastic sheet, the elastic sheet is hollow and annular to encircle and be fixed on the periphery of the optical glass, a first positioning hole is formed in a preset position of the elastic sheet, the polarization component is fixedly connected with the PCB through a support column, one end of the support column extends into the elastic sheet through an SMT process, and the other end of the support column is attached to a corresponding position on the PCB through the SMT process.

2. The resolution amplification apparatus according to claim 1, wherein the support column includes a connection stage, opposite side surfaces of the connection stage being a first end surface and a second end surface, respectively; the first end face is provided with a first positioning column, when the polarization component is fixedly connected with the PCB through the support column, the support column is arranged on the surface of the PCB in a lamination mode through the second end face, and the first positioning column of the support column is used for being clamped into the first positioning hole of the elastic sheet, so that the elastic sheet is laminated to the first end face of the connecting table.

3. The resolution amplification device according to claim 2, wherein a limit cap is provided at an end of the first positioning column away from the first end face, and the diameter of the limit cap is larger than that of the first positioning hole.

4. The resolution amplification device according to claim 2, wherein a second positioning column is arranged on a second end face of the connection table, a second positioning hole is formed in the PCB, the support column is attached to the surface of the PCB through the second end face, and the second positioning column on the support column is clamped into the second positioning hole.

5. The resolution amplification device according to claim 4, wherein when the second end surface of the support column is attached to the surface of the PCB, the end of the second positioning column contacts the bottom wall of the second positioning hole, and the end of the second positioning column is attached to the bottom wall of the second positioning hole by an SMT process.

6. The resolution amplification device according to claim 2, wherein the support columns are made of non-metal materials, conductive layers are arranged on the first end face and the second end face of the connection table, and bonding pads are arranged on the surface of the PCB corresponding to the second end face; or, the support column is made of conductive metal.

7. The resolution amplification device according to claim 2, wherein a first screw hole is formed in the second end face of the connection table, a second screw hole is formed in the surface of the PCB, a countersunk head screw is arranged in the second screw hole, the head of the countersunk head screw is fixed in the second screw hole, the tail of the countersunk head screw protrudes out of the surface of the PCB, and when the second end face of the support column is attached to the surface of the PCB, the tail of the countersunk head screw is clamped into the first screw hole.

8. The resolution amplification device according to claim 1, wherein the elastic sheet comprises a first elastic portion, the first elastic portion is rectangular, second elastic portions are respectively arranged at four right-angle ends of the first elastic portion, the second elastic portions are respectively elastically connected with adjacent sides of the first elastic portion through elastic strips, and connection points of the two elastic strips on the second elastic portions are spaced; each side edge of the first elastic part is parallel to two elastic strips, and the two elastic strips are connected with the middle position of the side edge of the second elastic part in a V-shaped structure.

9. The resolution amplification device according to claim 1, wherein an elastic rubber pad is arranged on the surface of the edge of the PCB board for buffering and damping when the resolution amplification device is mounted with the user equipment.

10. The resolution amplification apparatus according to claim 1, wherein the polarization component further comprises a plurality of magnets, the plurality of magnets are disposed on the elastic sheet in a distributed manner and located on the outer periphery of the optical glass, and a magnetic field for deflecting the optical glass is formed between the plurality of layers of electromagnetic induction coils on the PCB board and the magnets.