CN220152675U - High-temperature-resistant LED module lamp - Google Patents
High-temperature-resistant LED module lamp Download PDFInfo
- Publication number
- CN220152675U CN220152675U CN202222812706.0U CN202222812706U CN220152675U CN 220152675 U CN220152675 U CN 220152675U CN 202222812706 U CN202222812706 U CN 202222812706U CN 220152675 U CN220152675 U CN 220152675U
- Authority
- CN
- China
- Prior art keywords
- lamp
- led
- led module
- aluminum
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 55
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 55
- 239000011324 bead Substances 0.000 claims abstract description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052796 boron Inorganic materials 0.000 claims abstract description 20
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 20
- 239000010703 silicon Substances 0.000 claims abstract description 20
- 241000258971 Brachiopoda Species 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 13
- CFOAUMXQOCBWNJ-UHFFFAOYSA-N [B].[Si] Chemical compound [B].[Si] CFOAUMXQOCBWNJ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000005388 borosilicate glass Substances 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000004411 aluminium Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 241001465382 Physalis alkekengi Species 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a high-temperature-resistant LED module lamp, which comprises a lamp shell, wherein a plurality of LED modules are arranged in the lamp shell from top to bottom; the LED module comprises a PCB aluminum-based light source board and a radiator arranged at the back of the PCB aluminum-based light source board, wherein the PCB aluminum-based light source board comprises an aluminum substrate and a plurality of LED light beads, and a high boron silicon lens is arranged outside each LED light bead; the high-boron silicon lamp comprises a lamp shell, and is characterized by further comprising a lens pressing plate, wherein through holes corresponding to the high-boron silicon lenses are arranged on the lens pressing plate, one closed end part of each high-boron silicon lens extends out of the through hole, and the lens pressing plate is fastened on the lamp shell. According to the high-temperature-resistant LED module lamp provided by the utility model, the high-borosilicate glass lens is adopted as the lens, the temperature resistance is up to 550 ℃, 12 7070 Gao Wendeng beads are adopted as a single module, and the high-temperature-resistant LED module lamp has good high-temperature resistance.
Description
Technical Field
The utility model relates to the technical field of lighting equipment, in particular to a high-temperature-resistant LED module lamp.
Background
With the development of technology, the light efficiency and the comprehensive utilization rate of a lamp adopting an LED as a light source are higher than those of a traditional lamp. This is mainly along with a lens assembly that is well-lit and well-designed for the LED itself. However, the LED generates a large amount of heat during the light emitting process, and if the heat dissipation is poor, the light efficiency and the lifetime of the LED are seriously affected. Particularly, the high-temperature LED lamp is applied to environments with very high temperature such as steel factories, for example, when steel materials are poured into the steel factory building, the temperature is too high, sometimes reaches hundreds of degrees centigrade, the contact temperature of lamps at the top of the factory building (generally, the mounting height of the lamps is about 30 meters), generally, the contact temperature is about 100-200, if a common lamp is adopted, the conditions of lamp non-brightness and lamp lens damage can occur, particularly, the conventional lens is mostly made of PC materials, and when the temperature of the lens made of the PC materials is about 120 degrees more, the lens is easy to melt at high temperature. In addition, the driving power supply of the LED is easy to fail if the driving power supply cannot radiate heat in time under the high-temperature condition.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a high-temperature-resistant LED module lamp.
In order to achieve the above purpose, the utility model provides a high temperature resistant LED module lamp, which comprises a lamp shell, wherein a plurality of LED modules are arranged in the lamp shell from top to bottom; the LED module comprises a PCB aluminum-based light source board and a radiator arranged at the back of the PCB aluminum-based light source board, wherein the PCB aluminum-based light source board comprises an aluminum substrate and a plurality of LED light beads, and a high boron silicon lens is arranged outside each LED light bead; the high-boron silicon lamp comprises a lamp shell, and is characterized by further comprising a lens pressing plate, wherein through holes corresponding to the high-boron silicon lenses are arranged on the lens pressing plate, one closed end part of each high-boron silicon lens extends out of the through hole, and the lens pressing plate is fastened on the lamp shell.
The LED light beads are 7070 Gao Wendeng-resistant beads.
As a preferable arrangement of the present utility model, the heat sink includes a connection plate and a plurality of heat radiating plates vertically fixed to one side of the connection plate; the plurality of radiating pieces are uniformly distributed along the length direction of the PCB aluminum-based light source board; and the other side of the connecting plate is connected with the PCB aluminum-based light source plate.
As the preferable arrangement of the utility model, the aluminum substrate is rectangular, a plurality of LED light beads are fixedly connected with the aluminum substrate, and the LED light beads are arranged in an array.
In a preferred arrangement of the utility model, a waterproof ring is arranged between the through hole and the high-boron silicon lens.
As the preferable arrangement of the utility model, a plurality of support rods are arranged on a side panel of the lamp shell far away from the LED module, and the end part of each support rod is connected with an aluminum plate; an LED driving power supply is arranged on the aluminum plate; and the LED driving power supply is electrically connected with the LED aluminum-based light source board through a power input line.
As the preferable arrangement of the utility model, the lamp also comprises a bracket, wherein the two sides of the lamp shell are connected to the bracket through bolts, and a plurality of mounting holes are arranged on the bracket.
The beneficial effects of the utility model are as follows:
(1) The high-temperature-resistant LED module lamp provided by the utility model has the advantages that the high-borosilicate glass lens is adopted as the lens, the temperature resistance is up to 550 ℃, 12 7070 Gao Wendeng beads are adopted as a single module, and the high-temperature-resistant LED module lamp has good high-temperature resistance; carry out efficient heat dissipation through the radiating member, the heat that LED light bead on the aluminium base light source board gives off radiates outward through aluminium base board conduction radiating member, because radiating member radiating area is big, is favorable to the life of lamp pearl like this.
(2) According to the utility model, the aluminum plate and the lamp shell are separated by the space, the heat generated by the LED driving power supply is transferred to the aluminum plate, the aluminum plate is not in contact with the lamp shell, and the heat is directly transferred to the air, so that the heat dissipation of the power supply is more facilitated, the service life of the power supply is prolonged, and if the temperature exceeds the bearing range of the power supply, an over-temperature control circuit built in the power supply can be self-regulated, the power is automatically reduced, and the heat generation is reduced.
Drawings
Fig. 1 is a schematic view of a first perspective three-dimensional structure of a novel steel-lined plastic storage tank.
Fig. 2 is a schematic diagram of a second perspective three-dimensional structure of the novel steel-lined plastic storage tank provided by the utility model.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Example 1
Referring to fig. 1-2, the utility model provides a high temperature resistant LED module lamp, comprising a lamp housing 1, wherein a plurality of LED modules are arranged in the lamp housing 1 from top to bottom; the LED module comprises a PCB aluminum-based light source board and a radiator arranged at the back of the PCB aluminum-based light source board, wherein the PCB aluminum-based light source board comprises an aluminum substrate and a plurality of LED light beads 2, and a high-boron silicon lens 3 is arranged outside each LED light bead 2; the high-boron silicon lamp comprises lamp housings 1, and is characterized by further comprising lens pressing plates 4, wherein through holes corresponding to the high-boron silicon lenses 3 are formed in the lens pressing plates 4, one closed end part of each high-boron silicon lens 3 extends out of each through hole, and the lens pressing plates 4 are fastened on the lamp housings 1 through screws.
As a preferred arrangement of this embodiment, the LED light beads are 7070 Gao Wendeng resistant beads.
As a preferable arrangement of the present embodiment, the heat sink includes a connection plate and a plurality of heat radiating plates vertically fixed to one side of the connection plate; the plurality of heat dissipation elements are uniformly distributed along the length direction of the PCB aluminum-based light source board; and the other side of the connecting plate is connected with the PCB aluminum-based light source plate.
As the preferred setting of this embodiment, the aluminum substrate is rectangle, a plurality of LED light beads 2 with aluminum substrate rigid coupling, LED light bead 2 array arrangement, specifically, LED light bead 2 is two rows, every row 6 array arrangements.
In order to realize the waterproof effect of the lamp, water mist enters the lamp, and as the preferable arrangement of the embodiment, a waterproof ring is arranged between the through hole and the high-boron silicon lens 3.
As a preferable arrangement of the embodiment, both sides of the lamp housing 1 are connected to the bracket 5 by bolts, and a plurality of mounting holes 6 are provided on the bracket 5. The mounting holes 6 are used to secure the bracket 5 to an external connection such as a column, beam or wall in a factory building.
In the embodiment, the high borosilicate glass lens is adopted as the lens, the temperature resistance is up to 550 ℃, and 12 7070 Gao Wendeng beads are adopted as a single module, so that the high-temperature-resistant glass lens has good high-temperature resistance; carry out efficient heat dissipation through the radiating member, the heat that LED light bead on the aluminium base light source board gives off radiates outward through aluminium base board conduction radiating member, because radiating member radiating area is big, is favorable to the life of lamp pearl like this.
Example 2
Referring to fig. 1-2, the utility model provides a high temperature resistant LED module lamp, comprising a lamp housing 1, wherein a plurality of LED modules are arranged in the lamp housing 1 from top to bottom; the LED module comprises a PCB aluminum-based light source board and a radiator arranged at the back of the PCB aluminum-based light source board, wherein the PCB aluminum-based light source board comprises an aluminum substrate and a plurality of LED light beads 2, and a high-boron silicon lens 3 is arranged outside each LED light bead 2; the high-boron silicon lamp comprises lamp housings 1, and is characterized by further comprising lens pressing plates 4, wherein through holes corresponding to the high-boron silicon lenses 3 are formed in the lens pressing plates 4, one closed end part of each high-boron silicon lens 3 extends out of each through hole, and the lens pressing plates 4 are fastened on the lamp housings 1 through screws.
As a preferred arrangement of this embodiment, the LED light beads are 7070 Gao Wendeng resistant beads.
As a preferable arrangement of the present embodiment, the heat sink includes a connection plate and a plurality of heat radiating plates vertically fixed to one side of the connection plate; the plurality of heat dissipation elements are uniformly distributed along the length direction of the PCB aluminum-based light source board; and the other side of the connecting plate is connected with the PCB aluminum-based light source plate.
As the preferred setting of this embodiment, the aluminum substrate is rectangle, a plurality of LED light beads 2 with aluminum substrate rigid coupling, LED light bead 2 array arrangement, specifically, LED light bead 2 is two rows, every row 6 array arrangements.
In order to realize the waterproof effect of the lamp, water mist enters the lamp, and as the preferable arrangement of the embodiment, a waterproof ring is arranged between the through hole and the high-boron silicon lens 3.
As a preferable arrangement of the embodiment, a plurality of support rods 7 are arranged on a side panel of the lamp housing 1, which is far away from the LED module, and an aluminum plate 8 is connected with the end part of each support rod 7; an LED driving power supply 9 is arranged on the aluminum plate 8; the LED driving power supply 9 is electrically connected with the LED aluminum-based light source board through a power input line. As a preferable mode of this embodiment, a screw hole may be formed at the end of the support rod 7, a through hole is correspondingly formed in the aluminum plate 8, and the aluminum plate 8 is fixed at the end of the support rod 7 by passing a bolt through the through hole and connecting with the screw hole.
As a preferable arrangement of the embodiment, both sides of the lamp housing 1 are connected to the bracket 5 by bolts, and a plurality of mounting holes 6 are provided on the bracket 5. The mounting holes 6 are used to secure the bracket 5 to an external connection such as a column, beam or wall in a factory building.
In this embodiment, through spacing aluminum plate and lamps and lanterns casing, the heat that LED drive power supply produced reaches aluminum plate, and aluminum plate does not contact with lamps and lanterns casing, directly transmits the heat to the air, more is favorable to the heat dissipation of power like this, prolongs its life.
Example 3
On the basis of embodiment 2, an over-temperature automatic power reduction circuit is built in the LED driving power supply 9. The over-temperature automatic power reduction circuit is in the prior art, and can adopt a power supply timing power reduction and over-temperature automatic power reduction circuit system provided by the Chinese patent CN201910192175.X, or a power supply high-temperature protection method, a circuit and an LED illuminant provided by the CN201810073340. X to automatically reduce the power supply power in the over-temperature process so as to automatically regulate and reduce the output power of the power supply and reduce the heat generation when the temperature exceeds the self-bearing range of the power supply.
Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the utility model and form different embodiments. For example, in the claims below, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the utility model and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Claims (7)
1. The high-temperature-resistant LED module lamp comprises a lamp shell and is characterized in that a plurality of LED modules are arranged in the lamp shell from top to bottom; the LED module comprises a PCB aluminum-based light source board and a radiator arranged at the back of the PCB aluminum-based light source board, wherein the PCB aluminum-based light source board comprises an aluminum substrate and a plurality of LED light beads, and a high boron silicon lens is arranged outside each LED light bead; the high-boron silicon lamp comprises a lamp shell, and is characterized by further comprising a lens pressing plate, wherein through holes corresponding to the high-boron silicon lenses are arranged on the lens pressing plate, one closed end part of each high-boron silicon lens extends out of the through hole, and the lens pressing plate is fastened on the lamp shell.
2. The high temperature resistant LED module light of claim 1, wherein the LED light beads are 7070 Gao Wendeng beads.
3. The high temperature resistant LED module lamp of claim 1, wherein the aluminum substrate is rectangular, a plurality of the LED beads are fixedly connected with the aluminum substrate, and the LED beads are arranged in an array.
4. The high temperature resistant LED module light fixture of claim 1, wherein a waterproof ring is disposed between the through hole and the high boron silicon lens.
5. The high temperature resistant LED module lamp of claim 1, wherein a side panel of the lamp housing remote from the LED module is provided with a plurality of support rods, and an aluminum plate is connected to an end of each support rod; an LED driving power supply is arranged on the aluminum plate; and the LED driving power supply is electrically connected with the LED aluminum-based light source board through a power input line.
6. The high temperature resistant LED module lamp of claim 1, wherein the LED driving power supply incorporates an over-temperature automatic power reduction circuit.
7. The high temperature resistant LED module lamp of claim 1, further comprising a bracket, wherein both sides of the lamp housing are connected to the bracket by bolts, and wherein a plurality of mounting holes are provided in the bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222812706.0U CN220152675U (en) | 2022-10-25 | 2022-10-25 | High-temperature-resistant LED module lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222812706.0U CN220152675U (en) | 2022-10-25 | 2022-10-25 | High-temperature-resistant LED module lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220152675U true CN220152675U (en) | 2023-12-08 |
Family
ID=89018150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222812706.0U Active CN220152675U (en) | 2022-10-25 | 2022-10-25 | High-temperature-resistant LED module lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220152675U (en) |
-
2022
- 2022-10-25 CN CN202222812706.0U patent/CN220152675U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9927078B2 (en) | Multifunctional module-type light | |
| CN201606852U (en) | Double light source via hole radiating LED street lamp | |
| CN201475704U (en) | Through hole radiating LED lamp | |
| CN102352975B (en) | Dustproof, waterproof and multipurpose LED (light emitting diode) light power source assembly | |
| CN201844234U (en) | LED lighting device and LED lighting lamp | |
| CN202253204U (en) | LED (Light Emitting Diode) street lamp modified from conventional street lamp | |
| CN102759045B (en) | Easy-radiating LED streetlamp | |
| CN220152675U (en) | High-temperature-resistant LED module lamp | |
| CN210004251U (en) | LED ceiling lamp with heat dissipation function | |
| CN202228980U (en) | Dustproof waterproof multifunctional light-emitting diode (LED) light power supply assembly | |
| CN201582762U (en) | LED lamp assembly and LED street lamp | |
| CN202521377U (en) | Light-emitting diode (LED) awning lamp | |
| CN202017980U (en) | Easily-combined flat-type light emitting diode (LED) ceiling recessed lamp | |
| CN202303050U (en) | LED (light emitting diode) lighting device | |
| CN101776227B (en) | LED light assembly and LED street light | |
| CN201819125U (en) | Active heat dissipation LED pendent lamp | |
| CN204005599U (en) | A kind of LED Mining lamps and lanterns | |
| KR20190014745A (en) | LED illumination lamp | |
| CN203605106U (en) | LED mining lamp | |
| CN201844300U (en) | LED (light-emitting diode) lighting device | |
| CN202017911U (en) | LED water proof dust proof bulkhead lamp | |
| CN213746336U (en) | Factory lamp | |
| CN201487719U (en) | LED street lamp capable of dissipating heat by means of through holes | |
| CN201177227Y (en) | Combined type light-emitting diode lamp | |
| CN202834921U (en) | Light-emitting diode (LED) light source assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |