CN220149700U - Electroplating equipment for transient suppression diode - Google Patents
Electroplating equipment for transient suppression diode Download PDFInfo
- Publication number
- CN220149700U CN220149700U CN202320826683.0U CN202320826683U CN220149700U CN 220149700 U CN220149700 U CN 220149700U CN 202320826683 U CN202320826683 U CN 202320826683U CN 220149700 U CN220149700 U CN 220149700U
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- CN
- China
- Prior art keywords
- electroplating
- diode
- transient suppression
- plating
- cell body
- Prior art date
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- 238000009713 electroplating Methods 0.000 title claims abstract description 98
- 230000001052 transient effect Effects 0.000 title claims abstract description 26
- 230000001629 suppression Effects 0.000 title claims abstract description 25
- 238000003860 storage Methods 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims description 27
- 210000005056 cell body Anatomy 0.000 claims description 15
- 239000007921 spray Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000013011 mating Effects 0.000 claims 1
- 239000003351 stiffener Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 8
- 239000002699 waste material Substances 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 2
- 238000011084 recovery Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 36
- 239000012535 impurity Substances 0.000 description 7
- 239000007787 solid Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses electroplating equipment for a transient suppression diode, which comprises an electroplating device and a diode placement frame, wherein the electroplating device comprises an electroplating tank body, one side of the electroplating tank body is provided with an electroplating liquid storage tank, a connecting pipe is led out from the bottom end of the electroplating liquid storage tank, the opposite other end of the connecting pipe is connected to the inlet end of a lifting pump, the outlet end of the lifting pump is connected with a conveying pipe, the conveying pipe is fixed on the electroplating tank body through a fixing piece, one side of the electroplating tank body is provided with a power supply box, the top of the power supply box is led out of a wire, one end of the wire is connected with an anode fixing structure, an anode substance is arranged on the anode fixing structure, the anode fixing structure extends into electroplating liquid in the electroplating tank body, and the diode is placed on the diode placement frame. The utility model can solve the problems of remarkable increase of electroplating waste liquid amount and recovery processing cost caused by incapability of accurately adding the electroplating liquid in the transient suppression diode electroplating process.
Description
Technical Field
The utility model relates to the technical field of diode production, in particular to electroplating equipment for a transient suppression diode.
Background
A transient suppression diode (TVS) is a solid-state semiconductor device for protecting a sensitive semiconductor from a transient voltage surge, and has the advantages of small clamping coefficient, small volume, quick response, small leakage current, high reliability and the like. The stability of the surface layer of the transient suppression diode is greatly affected by the electroplating process in the production process of the transient suppression diode.
At present, the electroplating liquid cannot be accurately added in the electroplating process of the electroplating equipment for the transient suppression diode, so that the electroplating waste liquid amount is obviously increased, and the cost of recycling and treating the electroplating waste liquid is increased.
Disclosure of Invention
The utility model aims at: in order to solve the problem that the electroplating waste liquid amount and the recycling cost are obviously increased due to the fact that the electroplating liquid cannot be accurately added in the transient suppression diode electroplating process, the electroplating equipment for the transient suppression diode is provided.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a transient suppression electroplating device for diode, including electroplating device, the diode rack, electroplating device is including electroplating the cell body, electroplating cell body one side sets up the plating solution bin, the connecting pipe is drawn forth to plating solution bin bottom, the opposite other end of connecting pipe is connected on the entrance point of elevator pump, the conveyer pipe is connected to the exit end of elevator pump, the conveyer pipe passes through the mounting to be fixed on electroplating cell body, electroplating cell body one side sets up the power supply box, the electric wire is drawn forth at the top of power supply box, electric wire one end connection positive pole fixed knot constructs, set up the positive pole material on the positive pole fixed knot constructs, in positive pole fixed knot constructs stretches into the plating solution in the electroplating cell body, the diode is placed on the diode rack.
As a further description of the above technical solution:
the upper end of the electroplating solution storage box is provided with a matched cover plate with a handle, and new electric buffer solution is placed in the electroplating solution storage box.
As a further description of the above technical solution:
the lifting pump and the connecting pipe are arranged in the lifting pump box, and the conveying pipe penetrates through the lifting pump box up and down and enters the external environment from the upper end of the lifting pump box.
As a further description of the above technical solution:
the conveying pipes extend from the inside of the lifting pump box to the upper end of the electroplating tank body and are distributed along the trend of the upper end of the electroplating tank body.
As a further description of the above technical solution:
a plurality of spray heads are arranged on the conveying pipe.
As a further description of the above technical solution:
the baffle is arranged on the power supply box, the baffle is provided with a mounting plate, and the mounting plate is fixed on the electroplating tank body through a fastener.
As a further description of the above technical solution:
the electric wire runs through the baffle, and the department of running through sets up sealed pad.
As a further description of the above technical solution:
the bottom of diode rack sets up the diode and places the district, and the bottom of diode is placed the district and is set up a plurality of through-holes, and the side of diode rack sets up the strengthening rib.
In summary, due to the adoption of the technical scheme, compared with the prior art, the utility model has the following beneficial effects:
1. the electroplating solution storage tank is arranged, the electroplating solution is pumped into the conveying pipe through the lifting pump, the conveying pipe of the electroplating solution extends to the upper end of the electroplating tank body from the inside of the lifting pump, and is distributed along the trend of the upper end of the electroplating tank body, and the electroplating tank is put into the electroplating tank from the spray head on the conveying pipe, so that the electroplating solution can be accurately replaced in real time and in a dosage, and the time loss of transferring the electroplating solution is reduced.
2. The bottom of diode rack sets up the diode and places the district, and the diode of being convenient for is placed and is shifted, and the bottom of diode is placed the district and is set up a plurality of through-holes for the suspended solid impurity that produces in the electroplating process filters out, avoids solid impurity to pile up and pollute the chip.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a front cross-sectional view of an electroplating apparatus for a transient suppression diode.
Fig. 2 is a left side view of a plating apparatus in a plating equipment for a transient suppression diode.
Fig. 3 is a top view of an electroplating apparatus for a transient suppression diode.
Legend description:
1. an electroplating device; 2. a diode placement rack; 3. electroplating tank body; 4. a plating solution storage tank; 5. a cover plate with a handle; 6. new electroplating solution; 7. a connecting pipe; 8. a lift pump; 9. a delivery tube; 10. a lift pump box; 11. a fixing member; 12. a spray head; 13. a power supply box; 14. an electric wire; 15. a baffle; 16. a mounting plate; 17. an anode fixing structure; 18. an anode material; 19. electroplating solution; 20. a diode placement region; 21. a through hole; 22. reinforcing ribs.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Embodiment one:
referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a plating equipment for transient suppression diode, including electroplating device 1, diode rack 2, electroplating device 1 includes electroplating cell body 3, electroplating cell body 3 one side sets up plating solution bin 4, connecting pipe 7 is drawn forth to plating solution bin 4 bottom, the other end that connecting pipe 7 is relative is connected on the entrance point of elevator pump 8, conveyer pipe 9 is connected to the exit end of elevator pump 8, conveyer pipe 9 passes through mounting 11 to be fixed on electroplating cell body 3, electroplating cell body 3 one side sets up power supply box 13, electric wire 14 is drawn forth at power supply box 13 top, positive pole fixed knot constructs 17 are connected to electric wire 14 one end, set up anode substance 18 on the positive pole fixed knot constructs 17, positive pole fixed knot constructs 17 stretches into in the plating solution 19 in the electroplating cell body 3, the diode is placed on diode rack 2 for plating equipment stable in structure, each part is connected closely.
Embodiment two:
on the basis of the first embodiment, preferably, the upper end of the plating solution storage tank 4 is provided with a matched cover plate 5 with a handle, so that the plating solution is prevented from being polluted by impurities such as external dust, and a new plating solution 6 is placed in the plating solution storage tank 4, thereby facilitating the replacement of the plating solution in the plating tank.
Embodiment III:
on the basis of the first embodiment, preferably, the lift pump 8 and the connection pipe 7 are placed in the lift pump box 10, and the conveying pipe 9 penetrates the lift pump box 10 up and down and enters the external environment from the upper end of the lift pump box 10, so that the plating solution is lifted to a certain height.
Embodiment four:
on the basis of the first embodiment, preferably, the conveying pipe 9 extends from the lift pump box 10 to the upper end of the electroplating tank body 3 and is distributed along the trend of the upper end of the electroplating tank body 3, and the conveying pipe 9 is provided with a plurality of spray heads 12, so that the electroplating liquid can be accurately replaced in real time and in a dosage and is uniformly put into the electroplating tank, and the time loss of transferring the electroplating liquid is reduced.
Fifth embodiment:
on the basis of the first embodiment, preferably, the baffle 15 is disposed on the power supply box 13, the baffle 15 is provided with the mounting plate 16, the mounting plate 16 is fixed on the electroplating tank body 3 through the fastening piece, the electric wire 14 penetrates through the baffle 15, and the penetrating part is provided with the sealing gasket, so that the power supply box is prevented from being corroded by the conveying pipe leakage and the splashing of the electroplating liquid in the electroplating process, and the power supply problem is further caused.
Example six:
on the basis of the first embodiment, preferably, the bottom of the diode placement frame 2 is provided with the diode placement area 20, so that the placement and the transfer of the diode are facilitated, and the bottom of the diode placement area 20 is provided with the plurality of through holes 21, so that suspended solid impurities generated in the electroplating process are filtered out, the chips are prevented from being polluted due to accumulation of the solid impurities, and the side surface of the diode placement frame 2 is provided with the reinforcing ribs 22, so that the stability of the diode placement frame is enhanced.
In summary, due to the adoption of the technical scheme, the electroplating device for the transient suppression diode has the following beneficial effects compared with the prior art:
1. the electroplating solution storage tank is arranged, the electroplating solution is pumped into the conveying pipe through the lifting pump, the conveying pipe of the electroplating solution extends to the upper end of the electroplating tank body from the inside of the lifting pump, and is distributed along the trend of the upper end of the electroplating tank body, and the electroplating tank is put into the electroplating tank from the spray head on the conveying pipe, so that the electroplating solution can be accurately replaced in real time and in a dosage, and the time loss of transferring the electroplating solution is reduced.
2. The bottom of diode rack sets up the diode and places the district, and the diode of being convenient for is placed and is shifted, and the bottom of diode is placed the district and is set up a plurality of through-holes for the suspended solid impurity that produces in the electroplating process filters out, avoids solid impurity to pile up and pollute the chip.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (8)
1. The utility model provides a transient suppression electroplating device for diode, its characterized in that, including electroplating device (1), diode rack (2), electroplating device (1) is including electroplating cell body (3), electroplating cell body (3) one side sets up plating solution bin (4), connecting pipe (7) are drawn forth to plating solution bin (4) bottom, connecting pipe (7) opposite other end is connected on the entrance point of elevator pump (8), conveyer pipe (9) are connected to the exit end of elevator pump (8), conveyer pipe (9) are fixed through mounting (11) on electroplating cell body (3), electroplating cell body (3) one side sets up power supply box (13), electric wire (14) are drawn forth at power supply box (13) top, positive pole fixed knot constructs (17) are connected to electric wire (14) one end, set up positive pole material (18) on positive pole fixed knot constructs (17) stretch into in electroplating solution (19) in electroplating cell body (3), the diode is placed on diode rack (2).
2. The plating apparatus for a transient suppression diode according to claim 1, wherein a mating cover plate (5) with a handle is provided at an upper end of the plating solution storage tank (4), and a new plating solution (6) is placed in the plating solution storage tank (4).
3. Electroplating apparatus for a transient suppression diode according to claim 1, characterized in that the lift pump (8) and the connecting pipe (7) are placed in a lift pump box (10), the conveying pipe (9) penetrating the lift pump box (10) up and down and entering the external environment from the upper end of the lift pump box (10).
4. A plating apparatus for a transient suppression diode according to claim 3, characterized in that the conveying pipe (9) extends from inside the lift pump box (10) to the upper end of the plating tank (3) and is distributed along the upper end of the plating tank (3).
5. Electroplating apparatus for a transient suppression diode according to claim 4, characterized in that a plurality of spray heads (12) are provided on the delivery tube (9).
6. Electroplating apparatus for transient suppression diodes according to claim 1, characterized in that a baffle (15) is provided on the power box (13), the baffle (15) is provided with a mounting plate (16), and the mounting plate (16) is fixed on the electroplating tank body (3) by means of fasteners.
7. Electroplating apparatus for a transient suppression diode according to claim 6, wherein the wire (14) extends through the baffle (15) with a gasket disposed there through.
8. Electroplating apparatus for transient suppression diodes according to claim 1, characterized in that the bottom of the diode holder (2) is provided with a diode placement area (20), the bottom of the diode placement area (20) is provided with a plurality of through holes (21), and the side of the diode holder (2) is provided with a stiffener (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320826683.0U CN220149700U (en) | 2023-04-14 | 2023-04-14 | Electroplating equipment for transient suppression diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320826683.0U CN220149700U (en) | 2023-04-14 | 2023-04-14 | Electroplating equipment for transient suppression diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220149700U true CN220149700U (en) | 2023-12-08 |
Family
ID=89018523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320826683.0U Active CN220149700U (en) | 2023-04-14 | 2023-04-14 | Electroplating equipment for transient suppression diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220149700U (en) |
-
2023
- 2023-04-14 CN CN202320826683.0U patent/CN220149700U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |