CN220139839U

CN220139839U - PCB board pad tin cream smearing device

Info

Publication number: CN220139839U
Application number: CN202320154688.3U
Authority: CN
Inventors: 陶李; 王科; 李泉涌
Original assignee: Coreach Electronic Technology Co ltd
Current assignee: Coreach Electronic Technology Co ltd
Priority date: 2023-02-08
Filing date: 2023-02-08
Publication date: 2023-12-05
Anticipated expiration: 2033-02-08

Abstract

The utility model discloses a PCB bonding pad solder paste smearing device, which comprises a base, wherein a carrier plate is arranged above the base and used for placing a PCB bonding pad; the support plate is connected with the base through a plurality of groups of connecting rods, a fixing rod is fixedly arranged on the support plate, and a smearing pressing plate is movably arranged on the fixing rod; the smearing pressing plate is provided with a plurality of smearing holes, and the smearing holes correspond to the positions of the patches of the PCB bonding pads; a connecting bracket is fixedly arranged on the base, a smearing brush is arranged on the connecting bracket, and the smearing brush is used for smearing solder paste on a PCB bonding pad; the matching of the positioning rod and the positioning hole plays a role in positioning the coating pressing plate, so that the accurate alignment of the coating hole and the PCB patch position can be ensured, the coating precision of the solder paste is improved, the coating pressing plate is provided with the coating hole for coating the solder paste, the coating hole corresponds to the PCB pad patch position, and the coating hole can ensure the coating accuracy of the solder paste on the PCB.

Description

PCB board pad tin cream smearing device

Technical Field

The utility model relates to the technical field of printed circuit boards, in particular to a PCB bonding pad solder paste smearing device.

Background

Many electronic components, such as chips, resistors, capacitors, and inductors, are generally disposed on a Printed Circuit Board (PCB) in an electronic product to form a circuit with a specific function; therefore, a plurality of solder joints for soldering the electronic components are arranged on the PCB, and in order to obtain a better soldering effect and improve soldering efficiency, a layer of solder paste is first coated on the solder joints of the PCB before soldering the electronic components. However, the sample sticking of the PCB in the current market is still more traditional, the hand-spot solder paste is slow, and the uniformity of the solder paste on the PCB bonding pad is poor.

The Chinese patent with application number 201721553149.8 discloses a device for spraying PCB solder paste, wherein two fixed support plates are respectively fixed on two sides of a base; the crossbeam both ends respectively with two fixed support plates rigid coupling, and the crossbeam can be in two fixed support plates longitudinal movement, and wherein the crossbeam is located the top of moving workbench. The movable spray head is arranged on the cross beam, and can transversely move on the cross beam, wherein the movable spray head is used for spraying solder paste on the PCB, the PCB solder paste spraying device is used for brushing the solder paste, leakage repairing of the solder paste is reduced, and uniformity of solder paste brushing is guaranteed. However, in the technical scheme, the PCB has no good protection effect in the brushing process, and the components on the back of the PCB are easy to damage.

Disclosure of Invention

The utility model aims to provide a PCB board bonding pad solder paste smearing device, which protects components on the back of a PCB board through a sponge pad, and when the PCB board is smeared with solder paste under pressure, the components are effectively protected by utilizing the elasticity of the sponge pad, so that the technical problem of damage to the components caused by the action of the pressure is prevented.

The aim of the utility model can be achieved by the following technical scheme:

the PCB bonding pad solder paste smearing device comprises a base, wherein a carrier plate is arranged above the base and used for placing a PCB bonding pad; the support plate is connected with the base through a plurality of groups of connecting rods, a fixing rod is fixedly arranged on the support plate, and a smearing pressing plate is movably arranged on the fixing rod;

the coating pressing plate is provided with a plurality of coating holes, and the coating holes correspond to the patch positions of the PCB bonding pads;

the PCB is characterized in that a connecting support is fixedly arranged on the base, and a smearing brush is arranged on the connecting support and used for smearing solder paste on a PCB bonding pad.

As a further scheme of the utility model: the upper end of the carrier plate is provided with a sponge cushion for protecting the PCB.

As a further scheme of the utility model: the support plate is fixedly provided with a positioning rod, and the smearing pressing plate is provided with a positioning hole matched with the positioning rod.

As a further scheme of the utility model: the lower end of the carrier plate is fixedly provided with an electromagnet, and the painting pressing plate is fixedly provided with a positioning magnet matched with the electromagnet.

As a further scheme of the utility model: the screw rod is rotatably arranged on the connecting support, a driving motor for driving the screw rod to rotate is fixedly arranged on the connecting support, a screw rod sliding block is arranged on the screw rod in a threaded manner, and a driving cylinder for driving the smearing brush to move up and down is fixedly arranged at the lower end of the screw rod sliding block.

As a further scheme of the utility model: the connecting rod slides and runs through the connection on the base, the fixed baffle that is provided with of connecting rod lower extreme.

As a further scheme of the utility model: the connecting rod periphery cover is equipped with the spring, the spring is used for connecting baffle and base.

The utility model has the beneficial effects that:

(1) The cooperation of locating lever and locating hole then plays the effect of location to paint the clamp plate to can ensure to paint hole and PCB board paster position counterpoint accuracy, improve the smearing precision of tin cream, paint the clamp plate and then be provided with on the clamp plate and paint the hole and be used for paining the tin cream, paint the hole and correspond with the paster position of PCB board pad, paint the hole and can ensure the accuracy of paining the PCB board tin cream, improved the void ratio of pad, guaranteed the homogeneity of tin cream on the PCB pad, promoted quality in step.

(2) The components on the back of the PCB are protected through the foam-rubber cushion, and when the PCB is coated with solder paste and subjected to pressure, the components are effectively protected by utilizing the elasticity of the foam-rubber cushion, so that the components are prevented from being damaged under the action of the pressure.

(3) Through setting up the cooperation realization to scribbling the clamp plate fixed of electro-magnet and location magnet, when needs to compress tightly the PCB board, then be the state of attracting between electro-magnet and the location magnet, adsorb the clamp plate of paining through magnetic force and compress tightly on the PCB board, can ensure to paining the stable compaction of clamp plate to the PCB board.

Drawings

The utility model is further described below with reference to the accompanying drawings.

FIG. 1 is a schematic view of the overall structure of the present utility model;

FIG. 2 is a schematic top view of the carrier plate of the present utility model;

fig. 3 is a schematic structural view of the smearing platen of the present utility model.

In the figure: 1. a base; 2. a connecting rod; 3. a carrier plate; 4. a sponge cushion; 5. a fixed rod; 6. a positioning rod; 7. an electromagnet; 8. coating a pressing plate; 81. a connection hole; 82. positioning holes; 83. smearing holes; 84. positioning a magnet; 9. a connecting bracket; 10. a driving motor; 11. a threaded screw rod; 12. a screw rod sliding block; 13. a drive cylinder; 14. coating a brush; 15. a baffle; 16. and (3) a spring.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the utility model relates to a solder paste smearing device for a solder pad of a PCB board, wherein a carrier plate 3 is arranged above a base 1, and the carrier plate 3 is used for placing the solder pad of the PCB board; because the PCB board needs to be placed on the carrier plate 3 and smeared with solder paste, and when components and parts are arranged on the back of the PCB board, in order to protect the components and parts, the damage to the components and parts caused by smearing the solder paste is prevented, then a sponge cushion 4 is arranged at the upper end of the carrier plate 3, the components and parts on the back of the PCB board are protected through the sponge cushion 4, and when the PCB board is smeared with solder paste under pressure, the components and parts are effectively protected by utilizing the elasticity of the sponge cushion 4, and the damage to the components and parts caused by the action of the pressure is prevented.

In order to ensure the stability of the PCB board when brushing solder paste, the PCB board is pressed by arranging the smearing pressing plate 8 above the carrier plate 3, the smearing holes 83 are formed in the smearing pressing plate 8 and are used for smearing solder paste, the smearing holes 83 correspond to the positions of the pads of the PCB board, the smearing brush 14 is used for smearing the upper surface of the smearing pressing plate 8, the smearing brush 14 is used for smearing the surface of the PCB board through the smearing holes 83, and the accuracy of smearing the solder paste of the PCB board can be ensured by arranging the smearing holes 83.

For conveniently adjusting the smearing pressing plate 8, a fixing rod 5 and a positioning rod 6 are fixedly arranged on the carrier plate 3, a connecting hole 81 and a positioning hole 82 which are matched with the fixing rod 5 and the positioning rod 6 are arranged on the smearing pressing plate 8, the smearing pressing plate 8 is movably connected to the fixing rod 5 and can slide along the fixing rod 5 and rotate around the fixing rod 5, the cooperation of the positioning rod 6 and the positioning hole 82 plays a role in positioning the smearing pressing plate 8, so that the accurate alignment of the smearing hole 83 and the surface mount position of the PCB can be ensured, and the smearing precision of solder paste is improved.

Because the smearing pressing plate 8 is movably arranged on the fixing rod 5, when the PCB is pressed and smeared with solder paste, the smearing pressing plate 8 is required to keep stability, so that the fixation of the smearing pressing plate 8 is realized through the matching of the electromagnet 7 and the positioning magnet 84, when the PCB is required to be pressed, the electromagnet 7 and the positioning magnet 84 are in a mutually attracted state, the smearing pressing plate 8 is adsorbed and pressed on the PCB through magnetic force, the stable pressing of the smearing pressing plate 8 on the PCB can be ensured, and when the solder paste is smeared, the smearing pressing plate 8 is pushed upwards through magnetic force, so that the smearing pressing plate 8 is loosened to press the PCB, and the PCB after the solder paste is smeared is taken out conveniently.

The base 1 is fixedly provided with a connecting bracket 9, the connecting bracket 9 is provided with a smearing brush 14, and the smearing brush 14 is used for smearing solder paste on a PCB bonding pad. A threaded screw rod 11 is rotatably arranged on the connecting support 9, a driving motor 10 for driving the threaded screw rod 11 to rotate is fixedly arranged on the connecting support 9, a screw rod sliding block 12 is threadedly arranged on the threaded screw rod 11, and a driving cylinder 13 for driving the smearing brush 14 to move up and down is fixedly arranged at the lower end of the screw rod sliding block 12.

In order to facilitate smearing of PCB solder paste, the screw thread lead screw 11 is driven to rotate by the driving motor 10, the lead screw sliding block 12 is driven to move by utilizing the lead screw transmission principle, the connecting bracket 9 plays a role in guiding and limiting the lead screw sliding block 12, the lead screw sliding block 12 drives the smearing brush 14 to horizontally move, the smearing brush 14 is used for smearing solder paste on the PCB, the smearing brush 14 is connected with an external solder paste paint box, and when the PCB is required to be smeared, the driving cylinder 13 drives the smearing brush 14 to downwardly move, so that the smearing brush 14 is tightly pressed and attached on the smearing pressing plate 8, and the smearing brush 14 is driven to reciprocate under the action of the lead screw transmission to realize the smearing of solder paste on the PCB.

In order to further ensure the protection of components on the PCB, the connecting rod 2 is connected to the base 1 in a sliding and penetrating manner, and a baffle 15 is fixedly arranged at the lower end of the connecting rod 2. The connecting rod 2 periphery cover is equipped with spring 16, and spring 16 is used for connecting baffle 15 and base 1, through spring 16's elastic action for the PCB board is when carrying out the solder paste and scribbles, scribbles brush 14 and presses the PCB board, can make the PCB board downwardly moving under spring 16's effect, thereby prevents to cause the damage of PCB board components and parts because of the pressure is too big.

The foregoing describes one embodiment of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.

Claims

1. The PCB bonding pad solder paste smearing device comprises a base (1), wherein a carrier plate (3) is arranged above the base (1), and the carrier plate (3) is used for placing a PCB bonding pad; the device is characterized in that the carrier plate (3) is connected with the base (1) through a plurality of groups of connecting rods (2), a fixing rod (5) is fixedly arranged on the carrier plate (3), and a smearing pressing plate (8) is movably arranged on the fixing rod (5);

a plurality of smearing holes (83) are formed in the smearing pressing plate (8), and the smearing holes (83) correspond to the positions of the patches of the PCB bonding pads;

the PCB is characterized in that a connecting support (9) is fixedly arranged on the base (1), a smearing brush (14) is arranged on the connecting support (9), and the smearing brush (14) is used for smearing solder paste on a PCB bonding pad.

2. The device for applying solder paste to the bonding pads of the PCB according to claim 1, wherein a foam cushion (4) for protecting the PCB is arranged at the upper end of the carrier plate (3).

3. The device for smearing solder paste on the bonding pads of the PCB according to claim 1, wherein a positioning rod (6) is fixedly arranged on the carrier plate (3), and a positioning hole (82) matched with the positioning rod (6) is formed in the smearing pressing plate (8).

4. The device for smearing solder paste on the bonding pads of the PCB according to claim 1, wherein an electromagnet (7) is fixedly arranged at the lower end of the carrier plate (3), and a positioning magnet (84) matched with the electromagnet (7) is fixedly arranged on the smearing pressing plate (8).

5. The PCB bonding pad tin paste smearing device according to claim 1, wherein a threaded screw rod (11) is rotatably arranged on the connecting support (9), a driving motor (10) for driving the threaded screw rod (11) to rotate is fixedly arranged on the connecting support (9), a screw rod sliding block (12) is arranged on the threaded screw rod (11) in a threaded mode, and a driving cylinder (13) for driving the smearing brush (14) to move up and down is fixedly arranged at the lower end of the screw rod sliding block (12).

6. The device for smearing the solder paste on the bonding pads of the PCB according to claim 1, wherein the connecting rod (2) is connected to the base (1) in a sliding penetrating manner, and a baffle (15) is fixedly arranged at the lower end of the connecting rod (2).

7. The device for applying solder paste to a solder pad of a PCB according to claim 6, wherein a spring (16) is sleeved on the periphery of the connecting rod (2), and the spring (16) is used for connecting the baffle (15) and the base (1).