CN220139789U

CN220139789U - Circuit board assembly and motor vehicle lighting system

Info

Publication number: CN220139789U
Application number: CN202223344958.1U
Authority: CN
Inventors: W·W·A·赫菲尔斯; M·博尔根
Original assignee: Lumileds LLC
Current assignee: Lumileds LLC
Priority date: 2021-12-14
Filing date: 2022-12-14
Publication date: 2023-12-05
Anticipated expiration: 2032-12-14
Also published as: DE202022106998U1

Abstract

A circuit board assembly and a motor vehicle lighting system are described. A circuit board assembly includes a first stamped sheet metal component, a second stamped sheet metal component, and a Printed Circuit Board (PCB) between the first stamped sheet metal component and the second stamped sheet metal component. The first stamped sheet metal component includes: a first surface; a second surface opposite the first surface; and at least one stamped LED placement area on each of the first surface and the second surface configured for placement of LEDs.

Description

Circuit board assembly and motor vehicle lighting system

Technical Field

The present utility model relates generally to the field of vehicle lighting, and more particularly to a circuit board assembly and a motor vehicle lighting system.

Background

Halogen lamps have been the default light source for automotive front lighting for many years. However, in the current global automotive lighting industry, LED retrofit is winning market share. Such LED retrofit has been on the market for several years and is a popular after-market (aftermark) replacement for halogen headlamps. In particular for H7, there are different proposed systems of different costs.

Disclosure of Invention

Drawings

A more detailed understanding can be obtained from the following description, which is given by way of example in connection with the accompanying drawings, in which:

FIG. 1 is a schematic diagram illustrating a front surface of an example first heat sink member of an example circuit board assembly;

fig. 2 is a schematic diagram illustrating a front surface of the example first heat sink member of fig. 1 and a front surface of a Printed Circuit Board (PCB) of the example circuit board assembly;

FIG. 3 is a schematic diagram illustrating a front surface of an example circuit board assembly including the first heat sink member and PCB of FIGS. 1 and 2 and a second heat sink member;

FIG. 4 is a schematic diagram illustrating a rear surface of the example circuit board assembly of FIG. 3;

fig. 5 is a bottom view of the example circuit board assembly of fig. 3 and 4;

fig. 6 is a top view of the example circuit board assembly of fig. 3, 4, and 5;

fig. 7 is a side view of a first side surface of the example circuit board assembly of fig. 3, 4, 5, and 6;

fig. 8 is a side view of a second side surface of the example circuit board assembly of fig. 3, 4, 5, 6, and 7;

FIG. 9 is a diagram showing an example LED contact assembly for use in an example motor vehicle lighting assembly, including the example circuit board assemblies of FIGS. 3, 4 and 5, 6, 7 and 8;

FIG. 10 is a rear view of an example metal center ring of an example headlamp for an example motor vehicle lighting assembly;

FIG. 11 is a front view of an example metal center ring of an example headlamp for an example motor vehicle lighting assembly;

FIG. 12 is a schematic diagram illustrating a front surface of a motor vehicle lighting system including the example circuit board assemblies of FIGS. 3, 4, 5, 6, 7, and 8 and the example metal center ring of FIGS. 10 and 11;

FIG. 13 is a cross-sectional view illustrating an example headlamp including the automotive lighting system of FIG. 12;

fig. 14 is a flow chart of an example method of manufacturing a circuit board assembly, such as the circuit board assemblies of fig. 3, 4, 5, 6, 7, and 8;

FIG. 15 is an illustration of an example vehicle headlamp system; and

fig. 16 is an illustration of another example vehicle headlamp system.

Detailed Description

Examples of different light illumination system and/or light emitting diode embodiments are described more fully below with reference to the accompanying drawings. The examples are not mutually exclusive and features found in one example may be combined with features found in one or more other examples to implement further embodiments. Accordingly, it will be understood that the examples shown in the drawings are provided for illustrative purposes only and are not intended to limit the present disclosure in any way. Like numbers refer to like elements throughout.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms may be used to distinguish one element from another element. For example, a first element could be termed a second element and a second element could be termed a first element without departing from the scope of the present utility model. As used herein, the term "and/or" may include any and all combinations of one or more of the associated listed items.

It will be understood that when an element such as a layer, region or substrate is referred to as being "on" or "extending" another element, it can be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly extending onto" another element, there may be no intervening elements present. It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element and/or be connected or coupled to the other element via one or more intervening elements. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present between the element and the other element. It will be understood that these terms are intended to encompass different orientations of the element in addition to any orientation depicted in the figures.

Relative terms such as "lower," "upper," "lower," "horizontal" or "vertical" may be used herein to describe one element, layer or region's relationship to another element, layer or region as illustrated in the figures. It will be understood that these terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures.

The cost of current LED retrofit light bulbs is high due to the high cost of the mechanical components. Accordingly, it may be desirable to provide a lower cost LED retrofit solution. In particular, retrofit for certain industries may have greater cost pressures associated therewith, such as retrofit light bulbs manufactured for Original Equipment Manufacturers (OEMs) and after market retrofit light bulbs. The disadvantages of high costs can be overcome by redesigning the bulb and enabling different manufacturing techniques. The embodiments described herein provide a lower cost retrofit light bulb by utilizing a two-part stamped sheet metal heat sink and securing a printed circuit board (e.g., having electronic components thereon, such as a driver for an LED) between the two stamped sheet metal components. The LED may be mechanically coupled or directly attached to one of the stamped sheet metal parts to improve heat dissipation.

Fig. 1 is a schematic diagram illustrating a front surface 114 of an example first heat sink member 100 for an example circuit board assembly (not shown in fig. 1). In the example shown in fig. 1, the first heat sink member 100 has a stamped LED placement area 102 on one end, the LED placement area 102 being elevated relative to a recessed portion 104 at the opposite end. The first LED 110 may be mechanically coupled and/or directly connected to the front surface 114 of the first heat sink member 100, for example, by directly gluing or otherwise directly adhering the first LED 110 to the front surface 114. Openings or holes may be provided in the first heat sink member 100 that may be used to clamp the circuit board assemblies together, as will be described in more detail below. In the example shown in fig. 1, two holes 108a and 108b are shown. However, one of ordinary skill in the art will recognize that one or more than two holes may be used, or that other mechanisms may be used to perform clamping, consistent with the embodiments described herein.

The stamped LED placement area 102 may include a U-shaped (or other suitable shape) area 106a. The U-shaped region 106a may be recessed into the first surface 114, for example. Due to the stamping process used to form the first heat sink member 100, the U-shaped region 106a may be recessed such that a raised U-shaped region may be formed on the other side (described below with reference to fig. 4, which may protect the first LED 110, for example, during insertion of the final circuit board assembly into an application (e.g., an automotive lighting system, headlight, or retrofit light bulb).

The recessed portion 104 may include a number of first stamped fins at the end. That is, the first heat sink member 100 may also include a plurality of first stamped fins at an end of the first heat sink member 100 opposite the stamped LED placement area 102. In the example shown in fig. 1, three first stamped fins 112a, 112b, and 112c are shown. However, one of ordinary skill in the art will recognize that any number of first stamped fins may be used consistent with the embodiments described herein. For example, fins may be provided to achieve optimal heat transfer and heat loss through the fins using natural convection.

Fig. 2 is a schematic diagram illustrating the front surface 114 of the example first heat sink member 100 of fig. 1 and the front surface 208 of a Printed Circuit Board (PCB) 200 of an example circuit board assembly (not shown in fig. 2). In the example shown in fig. 2, PCB 200 is a substantially L-shaped body formed of any material suitable for use as a PCB. The L-shaped body may include a first portion 202, which may be rectangular or square, and a second strip or portion 204, which may be finger-shaped. In the example shown, the first portion of the PCB 200 rests on top of the front surface 114 of the recessed portion 104 of the first heat sink member 100. Thus, the front surface 208 of the PCB 200 may be coplanar or substantially coplanar (i.e., within a small tolerance) with the front surface 114 of the first heat sink member 100. The second portion 204 of the PCB 200 may also rest on the front surface 114 of the first heat sink member 100 and may be adjacent to the second side surface 804 of the first heat sink member 100 (see fig. 1). Given the shape of the PCB 200 and the first stamped fins 112a, 112b, and 112c, sufficient space may be left between the back surface 408 (see fig. 4) of the PCB opposite the front surface 208 and the first stamped fins 112a, 112b, and 112c. As will be described in more detail below, this space may enable placement of electronic components (e.g., circuitry and passive electronic components, which may constitute a driver for the LED) on the second portion 204 of the PCB 200, while still enabling the PCB 200 to be clamped between two heat sink members.

As will be described in more detail below, ultrasonic bonding techniques may be used to make electrical connections between the LED and the PCB. To ensure that the PCB 200 is secured in place and does not vibrate and cause damage during ultrasonic bonding, the PCB 200 may be secured to the first heat sink member 100, for example, by using Ultraviolet (UV) curable glue. As will be appreciated by those of ordinary skill in the art, the UV curable glue may be applied only between the first portion 202 of the PCB 200 and the side surface 804 of the first heat sink member, or may be applied in one or more areas between the PCB 200 and the front surface 114 of the first heat sink member 100.

PCB 200 may also include one or more openings or holes. In the example shown in fig. 2, one aperture 206 is shown. The aperture 206 may be aligned with the aperture 108b in the first heat sink portion 100 shown in fig. 1. Of course, those of ordinary skill in the art will recognize that more than one aperture may be used or no aperture may be used, or other mechanisms may be used to perform clamping consistent with the embodiments described herein.

Fig. 3 is a schematic diagram illustrating a front surface of an example circuit board assembly 310, the example circuit board assembly 310 including the first heat sink member 100 and PCB 200 of fig. 1 and 2 and a second heat sink member 300. In the example shown in fig. 3, a second heat sink member 300 is disposed over portions of the PCB 200 and portions of the first heat sink member 100. In this way, the PCB 200 may be clamped between the first heat sink member 100 and the second heat sink member 300. Because the PCB 200 is clamped between two heat sink members, contact between the heat sink members and the PCB can be maximized for good and efficient heat dissipation. Additionally, because the LED is attached to one of the heat sink members, good heat dissipation can be performed very efficiently. As shown, the second heat sink member 300 may include openings or holes that may be aligned with similar holes in the PCB 200 and the first heat sink member 100. In the example shown in fig. 3, the hole 306a may be aligned with the hole 108a in the first heat sink member 100, and the hole 306b may be aligned with the hole 206 in the PCB 200 and the hole 108b in the first heat sink member 100. Fasteners (not shown), such as rivets or screws, may be secured in the aligned holes to clamp the first heat sink member 100, PCB 200, and second heat sink member 300 together to form the circuit board assembly 310. Of course, one of ordinary skill in the art will recognize that one or more than two holes may be used, or that other mechanisms may be used to perform clamping, consistent with the embodiments described herein.

In the example shown in fig. 3, the second heat sink member 300 has a front surface 304 facing away from the PCB 200. Further, similar to the first heat sink member 100, the second heat sink member 300 may include a number of second stamped fins. In the illustrated example, three second stamped fins 302a, 302b, and 302c are shown. However, one of ordinary skill in the art will recognize that any number of second stamped fins may be used consistent with the embodiments described herein. For example, fins may be provided to enhance heat dissipation from the LEDs and associated circuitry. Given the shape of PCB 200 and second stamped fins 302a, 302b, and 302c, sufficient space may be left between front surface 208 of PCB 200 and second stamped fins 302a, 302b, and 302c. As will be described in more detail below, this space may enable placement of electronic components (e.g., circuitry and passive electronic components, which may constitute a driver for the LED) on the second portion 204 of the PCB 200, while still enabling the PCB 200 to be clamped between two heat sink members.

As can be seen in fig. 3, a portion of the stamped LED placement area 102 on which the first LEDs 110 are mounted and an adjacent portion of the second portion 204 of the PCB 200 are exposed from the second heat sink member 300 via an opening (not labeled) in the second heat sink member 300. This may enable light emission from the first LED 110 and electrical coupling of the first LED 110 to the circuit board 204, for electrical coupling of the first LED 110 (e.g., to receive power) and/or for electrical coupling to a driver (not shown) that may be provided on the PCB 200. Additionally, portions of the second heat sink member 300 surrounding the first LED 110 may protect the first LED 110 in a manner similar to the manner in which the raised U-shaped portion 106b (described below with reference to fig. 4) protects the LEDs. The drivers and/or any other circuitry on the PCB 200 may be located on the areas of the PCB 200 exposed from the first and second heat sink members 100, 300 between the first stamped fins 112a, 112b, 112c of the first heat sink member 100 and the second stamped fins 302a, 302b, 302c of the second heat sink member 300.

In the example shown in fig. 3, the second heat sink member 300 includes an alignment member 308. As will be described in greater detail below, the alignment feature 308 may be used for alignment of the circuit board assembly 310 in applications (e.g., LED lighting systems and/or retrofit light bulbs). While a particular shape and type of alignment feature 308 is shown in fig. 3, one of ordinary skill in the art will recognize that different shapes and types of features may be used for alignment consistent with the embodiments described herein.

Fig. 4 is a schematic diagram illustrating a rear surface of the example circuit board assembly 310 of fig. 3. In particular, the rear surface 402 of the first heat sink member 100 is shown, and the rear surface 408 of the PCB 200 and the rear surfaces of the second stamped fins 302a, 302b, and 302c of the second heat sink member 300 are shown. Although the terms front surface and rear surface are used throughout the detailed description, these surfaces may also be referred to as a first surface and a second surface, and the first surface may refer to either a front surface or a rear surface. Similarly, the second surface may refer to, for example, a front or back surface opposite the first surface, as the case may be.

Similar to the front surface 114 of the first heat sink member 100 shown in fig. 1, the rear surface 402 of the first heat sink member 100 has a stamped LED placement area 102. However, with respect to the rear surface 402, the stamped LED placement area 102 of the rear surface 402 is recessed relative to the portion 104, and the portion 104 is raised relative to the stamped LED placement area 102, as compared to the front surface 114. The second LED 400 may be mechanically coupled or directly connected to the rear surface 402 of the first heat sink member 100, for example, by directly gluing or otherwise adhering the second LED 400 directly to the rear surface 402. In this manner, LEDs may be disposed on each side of the first heat sink member 100 (e.g., directly opposite the first LEDs 110 disposed on the first surface 114 of the first heat sink member 100).

The stamped LED placement area 102 may include a U-shaped (or other suitable shape) area 106b. The U-shaped region 106b may be raised or elevated, for example, relative to the rear surface 402, and may protect the second LED 400, for example, during insertion of the final circuit board assembly into an application (e.g., an automotive lighting system, headlamp, or retrofit light bulb). As depicted, the U-shaped regions 106a and 106b are stamped, for example, by deep drawing (deep drawing). Thus, the U-shaped region 106a on the front surface 114 is concave, while the U-shaped region 106b on the opposite rear surface 402 is raised or convex. This may enable protection of the LED while at the same time enabling it to be formed using a relatively inexpensive sheet or other metal and using a relatively inexpensive stamping/deep-drawing process. The first fins 112a, 112b, and 112c of the first heat sink member 100, the second fins 302a, 302b, and 302c of the second heat sink member, the raised/recessed portions 102 and 104 of the first heat sink member, and the alignment features 308 and 406 of the second heat sink member 300 and the first heat sink member 100, respectively, may also be formed using stamping/deep drawing. Accordingly, the first and second heat sink members 100 and 300 may also be referred to herein as first and second stamped sheet metal members, respectively. The metal sheet may be selected based on cost and efficiency as a heat sink. For example, the metal sheet may be formed of aluminum (Al) or an aluminum-containing metal, and may have an anodized surface to enable heat transfer by both radiation and convection.

As with the alignment feature 308 of the second heat sink member 300, the alignment feature 406 may be used for alignment of the circuit board assembly 310 in applications (e.g., LED lighting systems and/or retrofit light bulbs). While a particular shape and type of alignment feature 406 is shown in fig. 4, one of ordinary skill in the art will recognize that different shapes and types of features may be used for alignment consistent with the embodiments described herein.

Fig. 5 is a bottom view of the example circuit board assembly 310 of fig. 3 and 4. In the example shown in fig. 5, the bottom surface 600 of the PCB 200 is shown. The PCB 200 may be disposed between the first heat sink member 100 and the second heat sink member 300. The bottom surfaces of the first stamped fins 112a, 112b, and 112c of the first heat sink member 100 and the bottom surfaces of the second stamped fins 302a, 302b, and 302c of the second heat sink member 300 are shown.

Fig. 6 is a top view of the example circuit board assembly 310 of fig. 3, 4, and 5. In the example shown in fig. 6, a top surface 602 of the first heat sink member 100 and a top surface 604 of the second heat sink member 300 are shown. Accordingly, the top surface of the circuit board assembly 310 may have a rectangular shape that may fit into a metal center ring of, for example, a headlamp (described in more detail below).

Fig. 7 is a side view of a first side surface of the example circuit board assembly 310 of fig. 3, 4, 5, and 6. In the example shown in fig. 7, toward one end of the circuit board assembly 310 at the top of the drawing, the first side surfaces 700 and 704 of the second and first heat sink members 300 and 100, respectively, are in contact with each other (e.g., in direct contact or via another material (e.g., an optional adhesive and/or heat sink material)). Toward the opposite end of the circuit board assembly 310 at the bottom of the drawing, the front surface 208 of the PCB 200 is in contact with the second heat sink member 300 (e.g., in direct contact or via another material (e.g., optional adhesive and/or heat sink material)), and the back surface 408 of the PCB 200 is in contact with the first heat sink member 100 (e.g., in direct contact or via another material (e.g., optional adhesive and/or heat sink material)). A portion of the side surface 702 of the PCB 200 may be exposed from both the first heat sink member 100 and the second heat sink member 300.

Fig. 8 is a side view of a second side surface of the example circuit board assembly 310 of fig. 3, 4, 5, 6, and 7. In the example shown in fig. 8, at the top of the drawing and at the extreme ends of one end of the circuit board assembly 310 directly above the LEDs 400 and 110, the first side surfaces 800 and 804 of the second and first heat sink members 300 and 100, respectively, are in contact with each other (e.g., in direct contact or via another material (e.g., an optional adhesive and/or heat sink material)). For the remainder of the circuit board assembly 310 that is below this portion and extends to the fins, the front surface 208 of the PCB 200 is in contact with the second heat sink member 300 (e.g., directly or via another material (e.g., optional adhesive and/or heat sink material)), and the back surface 408 of the PCB 200 is in contact with the first heat sink member 100 (e.g., directly or via another material (e.g., optional adhesive and/or heat sink material)). A majority of the side surface 802 of the PCB 200 may be exposed from both the first heat sink member 100 and the second heat sink member 300.

Fig. 9 is a diagram illustrating an example LED contact assembly for use in an example motor vehicle lighting assembly including the example circuit board assemblies of fig. 3, 4, and 5, 6, 7, and 8. In the example shown in fig. 9, 402 may represent a rear surface of the first heat sink member. However, those of ordinary skill in the art will appreciate that similar components may be used on the front surface 114 of the first heat sink member or on both the front surface 114 and the rear surface 402 of the first heat sink member. 204 may represent a second portion 204 of the PCB on either side.

As shown in fig. 9, the LED 400 (or 110 on the front side of the first heat sink member) may be one LED or more than one LED. In the example shown in fig. 9, the second LED 400 includes three LEDs. However, consistent with the embodiments described herein, more than three LEDs or an entire array of LEDs in multiple rows and columns may be used.

In the example shown in fig. 9, the second LED 400 is attached to the rear surface 402 of the first heat sink member. In the example shown, the second LED 400 is disposed on an interposer that is electrically coupled to contact pads 904a and 904b, the contact pads 904a and 904b also being on the rear surface 402 of the first heat sink member. Although an interposer is shown, other types of electrical connection mechanisms may be used to make electrical connection between the second LED 400 and the contact pads 904a and 904 b. Corresponding contact pads 902a and 902b may be provided on the second portion 204 of the PCB, which may be electrically coupled to other circuitry on the PCB. Contact pads 904a and 904b may be electrically coupled to contact pads 902a and 902b via connectors 900a and 900b, which connectors 900a and 900b may be, for example, ribbon bonds or wire bonds.

As briefly described above, the ribbon bonding may be performed using ultrasonic energy, which may provide a significant amount of vibration to the PCB and heat sink component(s) below. Because of the finger shape of the second portion 204 of the PCB, if not well secured, this may cause the second portion 204 of the PCB to become a spring plate, which may cause damage and other potential problems during ribbon bonding. Thus, at least the second portion 204 of the PCB 200 may be secured to at least one of the first and second heat sink portions using UV curable glue. Those of ordinary skill in the art will appreciate that UV glue may be used between the side surface of the second portion 204 of the PCB 200 and the side surface of the adjacent first and/or second heat sink members, between the rear surface of the second portion 204 of the PCB 200 and the front surface of the first heat sink member, between the first surface of the second portion 204 of the PCB 200 and the rear surface of the second heat sink member, and/or between the first portion 202 of the PCB and one or both of the first and second heat sink members, consistent with embodiments described herein. Such UV glue may make the second portion 204 of the PCB mechanically very stiff so that the tape bonding may be performed using ultrasonic energy.

The use of ribbon bonding or wire bonding to make electrical connections between the LEDs on the first heat sink member 100 and the PCB 200, rather than other types of bonding that may not use top contact technology, may raise the temperature threshold of the circuit board assembly 310. For example, such top contact techniques may not be limited by the solder joint temperature limitations (e.g., 120 ℃) that may be required using other contact techniques. In applications such as OEM applications, cost reduction is critical, and the use of top contact technology may enable the use of LEDs that may operate at temperatures up to 150 ℃ for such applications, for example.

Fig. 10 is a rear view of an example metal center ring 1000 of an example headlamp for an example motor vehicle lighting assembly. Fig. 11 is a front view of an example metal center ring 1000 for an example headlamp of an example motor vehicle lighting assembly. In automotive headlamps, it is very important to place the light emitting area of the lighting assembly (e.g. LED (s)) very precisely at the focal point of the reflector. The metal center ring 1000 shown in fig. 10 and 11 may be part of a headlamp and may be used to center the light emitting area of the lighting assembly relative to the focal point of the reflector. The metal center ring 1000 may resemble the metal portion of an H7 halogen lamp, allowing the circuit board assembly 310 to be used as a so-called retrofit lamp (which may mimic, for example, an H7 halogen lamp). For automotive lighting applications, the alignment between the LED and the reflector focal point is much higher than for ordinary lighting, with precision alignment requirements, for example, within a few tenths of a millimeter (mm).

In the example shown in fig. 10, the rear surface 1008 of the metal center ring 1000 is shown, and in the example shown in fig. 11, the front surface 1010 of the metal center ring 1000 is shown. The illustrated metal centering ring 1000 includes an opening 1002. When fully assembled, the circuit board assembly 310 may be inserted through the opening 1002. As shown in fig. 6, the top surface of the circuit board assembly 310 may have a rectangular shape, and the opening 1002 may be similarly rectangular shaped, such that the top surface of the circuit board assembly 310 may pass through the opening 1002 and fit tightly within the opening 1002.

Within the opening 1002, alignment features 1004 and 1006 may be provided. Such alignment features may be used to properly align the circuit board assembly 310 with respect to the reflector. In the example shown, the alignment features 1004 and 1006 are snap-fits. When the circuit board assembly 310 is inserted through the opening 1002, the snap-fits 1004 and 1006 may move over the top of the circuit board assembly 310 and slide into features of the circuit board assembly 310. Such features in circuit board assembly 310 may be alignment features 308 and 406 shown in fig. 3 and 4, respectively, for example. In the example shown, the snap-fits 1004 and 1006 and the alignment features 308 and 406 may be positioned such that when the circuit board assembly 310 is fitted in the opening 1002 in the metal center ring 1000 and the metal center ring 1000 is in place in the headlamp, the light emitting areas will be properly aligned with respect to the focal point of the reflector in the headlamp. In this way, the snap-fits 1004 and 1006 may automatically engage the alignment features 308 and 406 as the snap-fits 1004 and 1006 slide over the circuit board assembly 310 and reach the alignment features 308 and 406. While snap-fit and alignment features having specific features are shown in the drawings, one of ordinary skill in the art will appreciate that these are merely examples and that other alignment features and alignment features consistent with the embodiments described herein may be used. Also shown in fig. 11 are side retaining features 1012 and 1014, the side retaining features 1012 and 1014 may be used, for example, to prevent movement or rotation of the circuit board assembly 310 when in place within the opening 1002 in the metal center ring 1000.

Fig. 12 is a schematic diagram illustrating a front surface of a motor vehicle lighting system 1200, the motor vehicle lighting system 1200 including the example circuit board assemblies of fig. 3, 4, 5, 6, 7, and 8 and the example metal center ring of fig. 10 and 11. As shown in fig. 12, the circuit board assembly 310 is secured within an opening 1002 in the metal center ring 1000, with snap-fits 1004 and 1006 secured in alignment members 308 and 406 (not shown).

Fig. 13 is a cross-sectional view illustrating an example headlamp 1304 including the automotive lighting system of fig. 12. As shown in fig. 13, the circuit board assembly 310 is located in the center of the headlamp 1304. The light emitting area of the circuit board assembly 310 may be disposed in the illumination area 1302 of the headlamp 1304. The driver may be disposed in the lower portion 1300 of the headlight 1304. In the embodiments described herein, the lower portion 1300 of the headlamp 1304 may include fins 112a, 112b, 112c, 302a, 302b, and 302c, and the electronic components that make up the driver may be located on the circuit board 200 (as shown) in the exposed areas between the fins in the lower portion 1300 of the headlamp.

Fig. 14 is a flow chart of an example method of manufacturing a circuit board assembly, such as circuit board assembly 310 of fig. 3, 4, 5, 6, 7, and 8. In the example shown in fig. 14, the method includes hot stamping a first sheet metal component to form a first heat sink component (1400). The second sheet metal component may be hot stamped to form a second heat sink component (1402). The PCB may be secured between the first sheet metal member and the second sheet metal member (1404). Advantageously, the first and second heat sink members may be manufactured in the same process step (i.e. in one step).

As described above, stamping may be a deep-drawing process and may be used to inexpensively create several features of the first and second heat sink members from relatively inexpensive sheet metal. For example, stamping may include: forming a depressed U-shaped region on one side of the first sheet metal part and a raised U-shaped region on an opposite side of the first sheet metal part to form LED receiving regions on both sides of the first sheet metal part; and hot stamping the first and second sheet metal parts to form a plurality of fins on opposite ends of the first and second sheet metal parts, rather than the depressed U-shaped regions and the raised U-shaped regions. They may correspond to, for example, the U-shaped regions 106a and 106b and the fins 112a, 112b, 112c and/or 302a, 302b and 302c of fig. 1 and 4.

As described above, all or portions of the PCB may be adhered to the first heat sink member (e.g., using UV glue). Additionally, the PCB may be secured between the first and second heat sink members by securing at least one fastener through the first heat sink member, the PCB, and the second heat sink member.

Fig. 15 is an illustration of an example vehicle headlamp system 1500, which example vehicle headlamp system 1500 may incorporate one or more of the embodiments and examples described herein. The example vehicle headlamp system 1500 shown in fig. 15 includes a power line 1502, a data bus 1504, an input filter and protection module 1506, a bus transceiver 1508, a sensor module 1510, an LED direct current to direct current (DC/DC) module 1512, a logic Low Dropout (LDO) module 1514, a microcontroller 1516, and an active headlamp 1518.

Power line 1502 may have an input to receive power from a vehicle and data bus 1504 may have an input/output through which data may be exchanged between the vehicle and vehicle headlamp system 1500. For example, the vehicle headlamp system 1500 may receive instructions from other locations in the vehicle, such as turn on turn signals or turn on headlamps, and may send feedback to other locations in the vehicle if desired. The sensor module 1510 may be communicatively coupled to the data bus 1504 and may provide additional data to the vehicle headlamp system 1500 or other locations in the vehicle, for example, regarding the environmental conditions (e.g., time of day, rain, fog, or ambient light level), vehicle status (e.g., parked, in motion, speed of motion, or direction of motion), and the presence/location of other objects (e.g., vehicles or pedestrians). A headlight controller separate from any vehicle controller communicatively coupled to the vehicle data bus may also be included in the vehicle headlight system 1500. In fig. 15, the headlamp controller may be a microcontroller, such as microcontroller (μc) 1516. Microcontroller 1516 can be communicatively coupled to data bus 1504.

An input filter and protection module 1506 may be electrically coupled to power line 1502 and may support various filters, for example, to reduce conducted emissions and provide power immunity. Additionally, the input filter and protection module 1506 may provide electrostatic discharge (ESD) protection, load dump protection, alternator field decay protection, and/or reverse polarity protection.

The LED DC/DC module 1512 may be coupled between the input filter and protection module 1506 and the active headlamp 1518 to receive the filtered power and provide a drive current to power LEDs in an array of LEDs in the active headlamp 1518. The LED DC/DC module 1512 may have an input voltage of between 7 volts and 18 volts, with a nominal voltage of approximately 13.2 volts, and the output voltage may be slightly higher (e.g., 0.3 volts) than the maximum voltage of the LED array (e.g., as determined by factors or local calibration and operating condition adjustments due to load, temperature, or other factors).

Logic LDO module 1514 may be coupled to input filter and protection module 1506 to receive the filtered power. Logic LDO module 1514 may also be coupled to microcontroller 1516 and active headlamp 1518 to provide power to the electronics (such as CMOS logic) in microcontroller 1516 and/or active headlamp 1518.

Bus transceiver 1508 may, for example, have a Universal Asynchronous Receiver Transmitter (UART) or a Serial Peripheral Interface (SPI) interface, and may be coupled to microcontroller 1516. Microcontroller 1516 can convert vehicle inputs based on or including data from sensor module 1510. The converted vehicle input may include a video signal that may be transmitted to an image buffer in the active headlamp 1518. In addition, microcontroller 1516 can load default image frames and test open/shorted pixels during startup. In an embodiment, the SPI interface may load an image buffer in CMOS. The image frames may be full frames, differential or partial frames. Other features of microcontroller 1516 may include control interface monitoring of CMOS states, including die temperature and logic LDO output. In an embodiment, the LED DC/DC output may be dynamically controlled to minimize headroom (headroom). In addition to providing image frame data, other headlamp functions may be controlled, such as complementary use in conjunction with side marker lights or turn signal lights, and/or activation of daytime running lights.

Fig. 16 is an illustration of another example vehicle headlamp system 1600. The example vehicle headlamp system 1600 shown in fig. 16 includes an application platform 1602, two LED lighting systems 1606 and 1608, and secondary optics 1610 and 1612.

The LED lighting system 1608 may emit a light beam 1614 (shown in fig. 16 between arrows 1614a and 1614 b). The LED illumination system 1606 can emit a light beam 1616 (shown in fig. 16 between arrows 1616a and 1616 b). In the embodiment shown in fig. 16, the secondary optic 1610 is adjacent to the LED lighting system 1608, and light emitted from the LED lighting system 1608 passes through the secondary optic 1610. Similarly, secondary optic 1612 is adjacent to LED lighting system 1606, and light emitted from LED lighting system 1606 passes through secondary optic 1612. In an alternative embodiment, the secondary optics 1610/1612 are not provided in the vehicle headlamp system.

Where included, the secondary optics 1610/1612 may be or include one or more light guides. One or more of the light guides may be edge-lit or may have an internal opening defining an internal edge of the light guide. LED illumination systems 1608 and 1606 can be inserted into the interior opening of one or more light guides such that they inject light into the interior edge (interior opening light guide) or exterior edge (edge lit light guide) of one or more light guides. In embodiments, one or more light guides may shape the light emitted by the LED illumination systems 1608 and 1606 in a desired manner, such as, for example, having a gradient, a chamfer distribution, a narrow distribution, a wide distribution, or an angular distribution.

The application platform 1602 may provide power and/or data to the LED lighting systems 1606 and/or 1608 via a line 1604, which line 1604 may include one or more of, or a portion of, the power line 1502 and the data bus 1504 of fig. 15. One or more sensors (which may be sensors in the vehicle headlamp system 1600 or other additional sensors) may be internal or external to the housing of the application platform 1602. Alternatively or additionally, as shown in the example vehicle headlamp system 1500 of fig. 15, each LED lighting system 1608 and 1606 can include its own sensor module, connection and control module, power module, and/or LED array.

In an embodiment, the vehicle headlamp system 1600 may represent a motor vehicle having a steerable light beam, wherein the LEDs may be selectively activated to provide the steerable light. For example, an array of LEDs or emitters may be used to define or project a shape or pattern, or to illuminate only selected portions of a roadway. In an example embodiment, the infrared camera or detector pixels within the LED illumination systems 1606 and 1608 may be sensors (e.g., similar to the sensors in the sensor module 1510 of fig. 15) that identify portions of the scene that require illumination (e.g., a road or pedestrian intersection).

Having described the embodiments in detail, those skilled in the art will appreciate that, given the present description, modifications may be made to the embodiments described herein without departing from the spirit of the inventive concept. Therefore, it is intended that the scope of the utility model not be limited to the specific embodiments illustrated and described.

Claims

1. A circuit board assembly, the circuit board assembly comprising:

a first stamped sheet metal component comprising:

the first surface of the first plate is provided with a first surface,

a second surface opposite to the first surface, and

at least one stamped LED placement area on each of the first surface and the second surface configured for placement of LEDs;

a second stamped sheet metal component; and

a printed circuit board between the second surface of the first stamped sheet metal component and the second stamped sheet metal component.

2. The assembly of claim 1, wherein:

the at least one stamped LED placement area is at one end of the first stamped sheet metal component,

the first stamped sheet metal part further comprises a plurality of first stamped fins at an end of the first stamped sheet metal part opposite the at least one stamped LED placement region,

the second stamped sheet metal part further comprises a plurality of second stamped fins, and

portions of the printed circuit board between the plurality of first stamped fins and the plurality of second stamped fins are exposed from both the first stamped sheet metal part and the second stamped sheet metal part.

3. The assembly of claim 1, wherein:

the at least one stamped LED placement region is elevated relative to a recessed portion of the first stamped sheet metal component, a plurality of stamped fins are located on the recessed portion,

a first portion of the printed circuit board is on the second surface of the first stamped sheet metal component in the recessed portion and the second portion of the printed circuit board is proximate to the side surface of the at least one stamped LED placement area that is raised and the second portion of the printed circuit board is exposed from both the first stamped sheet metal component and the second stamped sheet metal component.

4. The assembly of claim 3, wherein the second portion of the printed circuit board is mechanically coupled to a side surface of the at least one stamped LED placement area via an Ultraviolet (UV) curable glue.

5. The assembly of claim 1, wherein the at least one stamped LED placement region is a recessed U-shaped region on the first or second surface of the first stamped sheet metal component and a raised U-shaped region on the other of the first or second surface of the first stamped sheet metal component.

6. The assembly of claim 1, further comprising at least one fastener extending through each of the first stamped sheet metal component, the printed circuit board, and the second stamped sheet metal component to clamp them together.

7. A motor vehicle lighting system, the motor vehicle lighting system comprising:

a first stamped sheet metal component comprising a first surface and a second surface opposite the first surface;

at least one first LED attached to a first surface of the first stamped sheet metal component;

at least one second LED attached to a second surface of the first stamped sheet metal component;

a second stamped sheet metal component;

a printed circuit board between the second surface of the first stamped sheet metal part and the second stamped sheet metal part; and

at least one electronic component on the printed circuit board.

8. The system of claim 7, wherein a portion of the first stamped sheet metal component having the at least one first LED and the at least one second LED attached thereto is raised relative to a recessed portion of the first stamped sheet metal component.

9. The system of claim 8, wherein a first portion of the printed circuit board is on a second surface of the first stamped sheet metal component in the recessed portion and a second portion of the printed circuit board is proximate a side surface of the portion of the first stamped sheet metal component, the at least one first LED and the at least one second LED being attached on the side surface.

10. The system of claim 9, wherein a second portion of the printed circuit board is exposed from both the first stamped sheet metal component and the second stamped sheet metal component.

11. The system of claim 10, wherein the system further comprises:

a plurality of contact pads on the second portion of the printed circuit board; and

a plurality of wire bonds or ribbon bonds electrically coupling the at least one first LED and the at least one second LED to respective ones of the plurality of contact pads.

12. The system of claim 7, wherein at least one electronic component on the printed circuit board comprises drivers for the at least one first LED and the at least one second LED.

13. The system of claim 12, wherein:

the at least one first LED and the at least one second LED are attached at a first end to the first stamped sheet metal part,

the first stamped sheet metal component further includes a plurality of first stamped fins at a second end of the first stamped sheet metal component opposite the at least one first LED and the at least one second LED,

14. The system of claim 13, wherein the driver is on the portion of the printed circuit board between the first stamped fin and the second stamped fin that is exposed from both the first stamped sheet metal component and the second stamped sheet metal component.

15. The system of claim 7, further comprising a metallic center ring of the headlamp, the metallic center ring comprising:

an opening having the same shape as the top surface of the first stamped sheet metal part and the top surface of the second stamped sheet metal part, and

a plurality of snap-fit configured to snap into place with a plurality of corresponding stamped features on the first stamped sheet metal component and the second stamped sheet metal component.

16. The system of claim 15, wherein the first stamped sheet metal component, the printed circuit board, and the second stamped sheet metal component are disposed in openings of a metallic center ring of the headlamp, wherein the snap-fit is secured in place against corresponding stamped features on the first stamped sheet metal component and the second stamped sheet metal component.