CN220116664U - Metal organic vapor deposition device - Google Patents
Metal organic vapor deposition device Download PDFInfo
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- CN220116664U CN220116664U CN202321484062.5U CN202321484062U CN220116664U CN 220116664 U CN220116664 U CN 220116664U CN 202321484062 U CN202321484062 U CN 202321484062U CN 220116664 U CN220116664 U CN 220116664U
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- vapor deposition
- metal organic
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 30
- 239000002184 metal Substances 0.000 title claims abstract description 27
- 238000006243 chemical reaction Methods 0.000 claims abstract description 84
- 230000007246 mechanism Effects 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000009826 distribution Methods 0.000 claims abstract description 22
- 239000000945 filler Substances 0.000 claims abstract description 3
- 238000003860 storage Methods 0.000 claims description 15
- 238000011049 filling Methods 0.000 claims description 13
- 238000004062 sedimentation Methods 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 2
- 238000003756 stirring Methods 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 55
- 238000000746 purification Methods 0.000 description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 12
- 239000002585 base Substances 0.000 description 12
- 239000011159 matrix material Substances 0.000 description 7
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 235000019645 odor Nutrition 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Chemical Vapour Deposition (AREA)
Abstract
The utility model provides a metal organic vapor deposition device. The metal organic vapor deposition device comprises a distribution box: the surface of block terminal is provided with the controller, the top fixed mounting of block terminal has the reaction box, the top fixed mounting of reaction box has transparent gas receiver, the surface intercommunication of transparent gas receiver has the gas filler pipe, be provided with in the transparent gas receiver and fill into the mechanism, the inner wall of reaction box bottom is provided with the heater, fixed mounting has the mounting panel in the reaction box, a plurality of thermovent have been seted up to the surface of mounting panel, the top fixed mounting of mounting panel has the square box, the pivot is installed to the square box rotation; through setting up rotary mechanism, conveniently drive substrate mechanism and rotate, rotatory substrate mechanism not only can stir the inside gas of reaction box, promotes its reaction, can increase the reaction area of gas and base member simultaneously, makes the even reaction in surface of base member form the film to this improves reaction efficiency.
Description
Technical Field
The utility model belongs to the technical field of vapor deposition, and particularly relates to a metal organic vapor deposition device.
Background
The vapor deposition technology is to form functional or decorative metal, nonmetal or compound coating on the surface of a workpiece by utilizing physical and chemical processes occurring in vapor phase; vapor deposition techniques can be classified into chemical vapor deposition, physical vapor deposition, and plasma vapor deposition according to film formation mechanisms; in the prior art, an organometallic chemical vapor deposition device is disclosed, the application number is 201720487244.6, and the device comprises a carrier gas supply unit, an organometallic tank, a double-tube heating furnace and a tail gas treatment unit which are connected in sequence; the device can greatly improve the deposition efficiency of the organic metal compound and reduce the film deposition cost through the structural design of the air inlet pipeline and the reactor.
However, the above structure has the disadvantages that the chemical vapor deposition apparatus directly leads the reaction gas to the substrate on the inner tube, and the contact area between the gas and the substrate is limited when deposition is performed, so that the deposition efficiency is low, and the reaction starts without uniform diffusion of the reaction gas, resulting in poor uniformity of the deposited film on the substrate surface, which needs to be improved.
Therefore, there is a need to provide a new metal organic vapor deposition apparatus that solves the above-mentioned technical problems.
Disclosure of Invention
The utility model solves the technical problem that the rotating mechanism is arranged to conveniently drive the substrate mechanism to rotate, and the rotating substrate mechanism not only can stir the gas in the reaction box to promote the reaction, but also can enlarge the reaction area of the gas and the matrix to lead the surface of the matrix to uniformly react to form a film, thereby improving the reaction efficiency.
In order to solve the technical problems, the metal organic vapor deposition device provided by the utility model comprises a distribution box: the surface of block terminal is provided with the controller, the top fixed mounting of block terminal has the reaction box, the top fixed mounting of reaction box has transparent gas receiver, the surface intercommunication of transparent gas receiver has the gas filler pipe, be provided with the mechanism of filling in the transparent gas receiver, the inner wall of reaction box bottom is provided with the heater, fixed mounting has the mounting panel in the reaction box, a plurality of cooling holes have been seted up on the surface of mounting panel, the top fixed mounting of mounting panel has the square box, the pivot is installed to the square box rotation, outside extending out the square box in the top of pivot, be provided with substrate mechanism in the reaction box, be provided with rotary mechanism in the reaction box, the top fixed mounting of reaction box has the sedimentation tank, the top fixed mounting of reaction box has the air pump, the inlet end of air pump is linked together with the reaction box; the rotary mechanism comprises a motor, a connecting rod, a first conical gear and a second conical gear, wherein the motor is fixedly arranged on the surface of one side of the reaction box, the connecting rod is rotatably arranged in the reaction box, the connecting rod is fixedly connected with the output end of the motor, the first conical gear is arranged in the square box, one end of the connecting rod extends into the square box and is fixedly connected with the first conical gear, the second conical gear is fixedly arranged on the surface of the rotating shaft, and the second conical gear is meshed with the first conical gear.
As a further scheme of the utility model, the filling mechanism comprises a push rod and a piston, the push rod is in sliding connection with the transparent air storage cylinder, the piston is slidably arranged in the transparent air storage cylinder, and the bottom end of the push rod extends into the transparent air storage cylinder and is fixedly connected with the piston.
As a further scheme of the utility model, the filling mechanism further comprises a gas distribution pipe, the gas distribution pipe is communicated with the bottom of the transparent gas storage cylinder, and the gas distribution pipe extends into the reaction box.
As a further scheme of the utility model, the substrate mechanism comprises a base body, a lining plate and a flow guide block, wherein the base body is fixedly connected with the top end of the rotating shaft, the lining plate is fixedly connected with the base body, and the flow guide block is fixedly connected with the lining plate.
As a further scheme of the utility model, the top of the distribution box is fixedly provided with a vacuum pump, and the air inlet end of the vacuum pump is communicated with the reaction box.
As a further scheme of the utility model, the air outlet end of the air pump is communicated with the sedimentation tank, two plug shells are fixedly arranged in the sedimentation tank, a purification shell is arranged between the two plug shells, and a lifting rod is fixedly arranged in the purification shell.
Compared with the related art, the metal organic vapor deposition device provided by the utility model has the following beneficial effects:
1. according to the utility model, the filling mechanism is arranged, the push rod is pushed to drive the piston to move, gas in the transparent gas storage cylinder is introduced into the reaction box through the gas distribution pipe, and the gas introduced into the reaction box can be controlled by observing the scales on the surface of the transparent gas storage cylinder, so that the influence on the reaction effect due to excessive or insufficient filling is avoided;
2. according to the utility model, the substrate mechanism is arranged, the rotating shaft drives the substrate to rotate, gas diffuses through the guide block and the lining plate, and the rotating substrate mechanism not only can agitate the gas in the reaction box and promote the reaction of the gas, but also can enlarge the reaction area of the gas and the substrate, so that the surface of the substrate uniformly reacts to form a film, and the reaction efficiency is improved;
3. according to the utility model, the rotating mechanism is arranged, the starting motor drives the connecting rod to rotate, the connecting rod drives the first conical gear to rotate, the first conical gear drives the second conical gear to rotate, the second conical gear drives the rotating shaft to rotate, and the rotating shaft drives the base body to rotate, so that the reaction between the base body and the gas is conveniently accelerated.
Drawings
The present utility model is further described below with reference to the accompanying drawings for the convenience of understanding by those skilled in the art.
FIG. 1 is a schematic perspective view of a metal organic vapor deposition apparatus according to the present utility model;
FIG. 2 is a schematic diagram showing the connection of the internal structures of a reaction tank and a transparent air reservoir in a metal organic vapor deposition device according to the present utility model;
FIG. 3 is a schematic view showing the structural connection of a substrate and a liner plate in a metal organic vapor deposition apparatus according to the present utility model;
FIG. 4 is a schematic diagram showing the structural connection of a settling tank, an air pump, an insert casing and a purge casing in a metal organic vapor deposition apparatus according to the present utility model;
FIG. 5 is a schematic diagram showing the structural connection of a deposition purifying shell and a lifting rod in a metal organic vapor deposition device.
In the figure: 1. a distribution box; 2. a controller; 3. a reaction box; 4. a transparent air cylinder; 5. a gas adding pipe; 6. a charging mechanism; 601. a push rod; 602. a piston; 603. an air distribution pipe; 7. a heater; 8. a mounting plate; 9. a heat radiation port; 10. a square box; 11. a rotating shaft; 12. a substrate mechanism; 1201. a base; 1202. a lining plate; 1203. a flow guiding block; 13. a rotation mechanism; 1301. a motor; 1302. a connecting rod; 1303. a first bevel gear; 1304. a second conical tooth; 14. a vacuum pump; 15. a sedimentation tank; 16. an air pump; 17. inserting a shell; 18. a purifying shell; 19. a lifting rod.
Detailed Description
Referring to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5 in combination, fig. 1 is a schematic perspective view of a metal organic vapor deposition apparatus according to the present utility model; FIG. 2 is a schematic diagram showing the connection of the internal structures of a reaction tank and a transparent air reservoir in a metal organic vapor deposition device according to the present utility model;
FIG. 3 is a schematic view showing the structural connection of a substrate and a liner plate in a metal organic vapor deposition apparatus according to the present utility model; FIG. 4 is a schematic diagram showing the structural connection of a settling tank, an air pump, an insert casing and a purge casing in a metal organic vapor deposition apparatus according to the present utility model; FIG. 5 is a schematic diagram showing the structural connection of a deposition purifying shell and a lifting rod in a metal organic vapor deposition device. The metal organic vapor deposition device comprises a distribution box 1: the surface of the distribution box 1 is provided with a controller 2, the top of the distribution box 1 is fixedly provided with a reaction box 3, the top of the reaction box 3 is fixedly provided with a transparent air storage cylinder 4, the surface of the transparent air storage cylinder 4 is communicated with an air adding pipe 5, the transparent air storage cylinder 4 is internally provided with an air filling mechanism 6, the inner wall of the bottom of the reaction box 3 is provided with a heater 7, the reaction box 3 is internally fixedly provided with a mounting plate 8, the surface of the mounting plate 8 is provided with a plurality of heat dissipation openings 9, the top of the mounting plate 8 is fixedly provided with a square box 10, the square box 10 is rotationally provided with a rotating shaft 11, the top of the rotating shaft 11 extends out of the square box 10, the reaction box 3 is internally provided with a substrate mechanism 12, the reaction box 3 is internally provided with a rotating mechanism 13, the top of the reaction box 3 is fixedly provided with a sedimentation box 15, the top of the reaction box 3 is fixedly provided with an air pump 16, and the air inlet end of the air pump 16 is communicated with the reaction box 3; the rotary mechanism 13 comprises a motor 1301, a connecting rod 1302, a first conical gear 1303 and a second conical gear 1304, wherein the motor 1301 is fixedly arranged on the surface of one side of the reaction box 3, the connecting rod 1302 is rotatably arranged in the reaction box 3, the connecting rod 1302 is fixedly connected with the output end of the motor 1301, the first conical gear 1303 is arranged in the square box 10, one end of the connecting rod 1302 extends into the square box 10 and is fixedly connected with the first conical gear 1303, the second conical gear 1304 is fixedly arranged on the surface of the rotary shaft 11, and the second conical gear 1304 is meshed with the first conical gear 1303.
As shown in fig. 2, the filling mechanism 6 includes a push rod 601 and a piston 602, the push rod 601 is slidably connected with the transparent air storage cylinder 4, the piston 602 is slidably mounted in the transparent air storage cylinder 4, the bottom end of the push rod 601 extends into the transparent air storage cylinder 4 and is fixedly connected with the piston 602, the filling mechanism 6 further includes a gas distribution pipe 603, the gas distribution pipe 603 is communicated with the bottom of the transparent air storage cylinder 4, and the gas distribution pipe 603 extends into the reaction tank 3;
through the effect of filling mechanism 6, promote push rod 601 and drive piston 602 and remove, will be to the gas in the transparent gas receiver 4 in letting in reaction tank 3 through gas distribution pipe 603, and through observing the scale on transparent gas receiver 4 surface, can be to letting in the interior gas of reaction tank 3 and handle the accuse, avoid filling too much or too little and influence the reaction effect.
As shown in fig. 2, the substrate mechanism 12 includes a base 1201, a liner 1202 and a guide block 1203, wherein the base 1201 is fixedly connected with the top end of the rotating shaft 11, the liner 1202 is fixedly connected with the base 1201, and the guide block 1203 is fixedly connected with the liner 1202;
through the action of the substrate mechanism 12, the rotating shaft 11 drives the base 1201 to rotate, gas diffuses through the flow guide block 1203 and the lining plate 1202, and the rotating substrate mechanism 12 not only can stir the gas in the reaction box 3 to promote the reaction, but also can enlarge the reaction area of the gas and the base 1201, so that the surface of the base 1201 uniformly reacts to form a film, thereby improving the reaction efficiency.
As shown in fig. 1, a vacuum pump 14 is fixedly installed at the top of the distribution box 1, and an air inlet end of the vacuum pump 14 is communicated with the reaction box 3.
Through the cooperation of the reaction box 3 and the vacuum pump 14, when in use, the vacuum pump 14 is started to pump the gas in the light reaction box 3 to be in a vacuum state, so that the filled gas can react with the matrix 1201 conveniently.
As shown in fig. 4 and 5, the air outlet end of the air pump 16 is communicated with the settling tank 15, two plug shells 17 are fixedly installed in the settling tank 15, a purifying shell 18 is arranged between the two plug shells 17, and a lifting rod 19 is fixedly installed in the purifying shell 18;
through the mutual cooperation of the sedimentation tank 15, the plug-in shells 17, the purification shells 18 and the lifting rods 19, when the purification liquid or the activated carbon particles in the purification shells 18 are used for a long time, the purification capacity of the purification liquid or the activated carbon particles also decreases, and when the purification liquid or the activated carbon particles need to be replaced, the lifting rods 19 are pulled to draw the purification shells 18 out of the two plug-in shells 17, the purification liquid or the activated carbon particles in the purification shells are replaced, and the purification liquid or the activated carbon particles are replaced in the sedimentation tank 15.
The working principle of the metal organic vapor deposition device provided by the utility model is as follows:
when in use, the vacuum pump 14 is started to pump the gas in the light reaction box 3 to be in a vacuum state, then the heater 7 is started to heat the interior of the reaction box 3, so that the gas in the reaction box 3 reacts with the matrix 1201 at high temperature, the push rod 601 is pushed to drive the piston 602 to move, the gas in the transparent gas storage cylinder 4 is introduced into the reaction box 3 through the gas distribution pipe 603, the starting motor 1301 drives the connecting rod 1302 to rotate, the connecting rod 1302 drives the first conical gear 1303 to rotate, the first conical gear 1303 drives the second conical gear 1304 to rotate, the second conical gear 1304 drives the rotating shaft 11 to rotate, the rotating shaft 11 drives the matrix 1201 to rotate, the gas diffuses through the flow guide block 1203 and the lining plate 1202, the rotating substrate mechanism 12 not only can stir the gas in the reaction box 3 to promote the reaction, but also can enlarge the reaction area of the gas and the matrix 1201, the surface of the matrix 1201 is uniformly reacted to form a film, so that the reaction efficiency is improved, tail gases are generated in the reaction process, partial impurities and harmful gases are doped in the tail gases, when the tail gases need to be treated after the reaction, the air pump 16 is started to pump the tail gases in the reaction tank 3 into the sedimentation tank 15, the tail gases are firstly subjected to sedimentation and impurity removal through alkali liquor at the bottom of the sedimentation tank 15, the introduced tail gases are initially purified, the initially purified tail gases can continuously rise, and when the tail gases pass through the purification shell 18, the purifying liquid or activated carbon particles placed in the purification shell 18 adsorb the harmful gases or odors in the tail gases and are discharged into the atmosphere, so that the harm to the environment or operators can be reduced, and the safety performance and the environmental protection of the sedimentation are improved.
It should be noted that, the device structure and the drawings of the present utility model mainly describe the principle of the present utility model, in terms of the technology of the design principle, the arrangement of the power mechanism, the power supply system, the control system, etc. of the device is not completely described, and on the premise that the person skilled in the art understands the principle of the present utility model, the specific details of the power mechanism, the power supply system and the control system can be clearly known, the control mode of the application file is automatically controlled by the controller, and the control circuit of the controller can be realized by simple programming of the person skilled in the art;
the standard parts used in the method can be purchased from the market, and can be customized according to the description of the specification and the drawings, the specific connection modes of the parts are conventional means such as mature bolts, rivets and welding in the prior art, the machines, the parts and the equipment are conventional models in the prior art, and the structures and the principles of the parts are all known by the skilled person through technical manuals or through conventional experimental methods.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents, and in other related technical fields, which are equally encompassed by the scope of the present utility model.
Claims (6)
1. A metal organic vapor deposition apparatus comprising a distribution box: the surface of block terminal is provided with the controller, the top fixed mounting of block terminal has the reaction box, the top fixed mounting of reaction box has transparent gas receiver, the surface intercommunication of transparent gas receiver has the gas filler pipe, be provided with the mechanism of filling in the transparent gas receiver, the inner wall of reaction box bottom is provided with the heater, fixed mounting has the mounting panel in the reaction box, a plurality of cooling holes have been seted up on the surface of mounting panel, the top fixed mounting of mounting panel has the square box, the pivot is installed to the square box rotation, outside extending out the square box in the top of pivot, be provided with substrate mechanism in the reaction box, be provided with rotary mechanism in the reaction box, the top fixed mounting of reaction box has the sedimentation tank, the top fixed mounting of reaction box has the air pump, the inlet end of air pump is linked together with the reaction box;
the rotary mechanism comprises a motor, a connecting rod, a first conical gear and a second conical gear, wherein the motor is fixedly arranged on the surface of one side of the reaction box, the connecting rod is rotatably arranged in the reaction box, the connecting rod is fixedly connected with the output end of the motor, the first conical gear is arranged in the square box, one end of the connecting rod extends into the square box and is fixedly connected with the first conical gear, the second conical gear is fixedly arranged on the surface of the rotating shaft, and the second conical gear is meshed with the first conical gear.
2. The metal organic vapor deposition apparatus according to claim 1, wherein: the filling mechanism comprises a push rod and a piston, the push rod is in sliding connection with the transparent air cylinder, the piston is slidably arranged in the transparent air cylinder, and the bottom end of the push rod extends into the transparent air cylinder and is fixedly connected with the piston.
3. The metal organic vapor deposition apparatus according to claim 2, wherein: the filling mechanism further comprises a gas distribution pipe, the gas distribution pipe is communicated with the bottom of the transparent gas storage cylinder, and the gas distribution pipe extends into the reaction box.
4. The metal organic vapor deposition apparatus according to claim 1, wherein: the substrate mechanism comprises a base body, a lining plate and a flow guide block, wherein the base body is fixedly connected with the top end of the rotating shaft, the lining plate is fixedly connected with the base body, and the flow guide block is fixedly connected with the lining plate.
5. The metal organic vapor deposition apparatus according to claim 1, wherein: the top fixed mounting of block terminal has the vacuum pump, the inlet end of vacuum pump is linked together with the reaction tank.
6. The metal organic vapor deposition apparatus according to claim 1, wherein: the air pump is characterized in that the air outlet end of the air pump is communicated with the settling tank, two insert shells are fixedly installed in the settling tank, a purifying shell is arranged between the two insert shells, and a lifting rod is fixedly installed in the purifying shell.
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CN202321484062.5U CN220116664U (en) | 2023-06-12 | 2023-06-12 | Metal organic vapor deposition device |
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CN202321484062.5U CN220116664U (en) | 2023-06-12 | 2023-06-12 | Metal organic vapor deposition device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118086860A (en) * | 2024-04-29 | 2024-05-28 | 成都晨发泰达航空科技股份有限公司 | Device and method for chemical vapor deposition aluminum coating of rotor blade |
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2023
- 2023-06-12 CN CN202321484062.5U patent/CN220116664U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118086860A (en) * | 2024-04-29 | 2024-05-28 | 成都晨发泰达航空科技股份有限公司 | Device and method for chemical vapor deposition aluminum coating of rotor blade |
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