CN220112692U - Shell splicing device - Google Patents
Shell splicing device Download PDFInfo
- Publication number
- CN220112692U CN220112692U CN202321195421.5U CN202321195421U CN220112692U CN 220112692 U CN220112692 U CN 220112692U CN 202321195421 U CN202321195421 U CN 202321195421U CN 220112692 U CN220112692 U CN 220112692U
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- CN
- China
- Prior art keywords
- plate
- buffering
- shell
- buffer
- connecting rod
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003139 buffering effect Effects 0.000 claims abstract description 27
- 238000009434 installation Methods 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims description 30
- 239000004065 semiconductor Substances 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 8
- 238000001125 extrusion Methods 0.000 description 4
- 210000001503 joint Anatomy 0.000 description 4
- 238000010030 laminating Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a shell splicing device which comprises a shell placing platform and an air pressure lifting rod, wherein a supporting vertical frame is fixedly embedded at the outer edge of the shell placing platform, the air pressure lifting rod is fixedly arranged at the bottom surface of the middle end of the top of the supporting vertical frame, an assembling straight plate is arranged at the bottom end of the air pressure lifting rod, an assembling containing groove is formed in the bottom surface of the assembling straight plate, a buffer pressurizing plate is arranged in the assembling containing groove, a buffer spring is arranged on the top surface of the buffer pressurizing plate, and the buffer spring is positioned in the assembling containing groove. This shell splicing apparatus drives the straight board of equipment through the atmospheric pressure lifter and pushes down, extrudees semiconductor device shell through the buffering pressurization board of the installation of equipment straight board bottom center to buffering pressurization board accessible buffer spring contracts the operation, conveniently carries out the buffering of pressurization in-process, avoids the too big damage that causes of gliding range semiconductor device shell.
Description
Technical Field
The utility model relates to the technical field of semiconductor equipment shells, in particular to a shell splicing device.
Background
The semiconductor device shell is the protective frame for semiconductor component to can accomodate the internal component, improve the security performance, in the in-process of shell concatenation, need splice work through the extrusion, but the shell splicing apparatus in the present market still has following problem:
the whole splicing operation of the shell of the semiconductor device pushes the shell to be clamped through the pressing mechanism, and the whole butt-joint extrusion assembly is fixed, so that proper buffering cannot be carried out, and damage can be caused to the shell of the semiconductor device when the whole pressing amplitude is overlarge.
Aiming at the problems, the novel design is carried out on the basis of the original shell splicing device.
Disclosure of Invention
The utility model aims to provide a shell splicing device, which solves the problems that in the prior art, the shell splicing device is common in the market at present, the whole splicing operation of the shell of the semiconductor equipment is carried out, the shell is pushed, extruded and clamped through a pressing mechanism, the whole butt joint extrusion assembly is fixed, proper buffering cannot be carried out, and the shell of the semiconductor equipment is damaged when the whole pressing range is overlarge.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a shell splicing apparatus, includes that the shell is put platform and pneumatic lifting rod, the outside of shell is put the platform and is inlayed fixed mounting and is supported the grudging post, and the top middle-end bottom fixed mounting who supports the grudging post has pneumatic lifting rod, the equipment straight board is installed to the bottom of pneumatic lifting rod, and the installation is seted up the bottom surface of equipment straight board and is accomodate the groove, the internally mounted who installs accomodates the groove has the buffering and applys the board, and the top surface of buffering and applys the board installs buffer spring to buffer spring is located the inside of installing accomodate the groove, the connecting rod is installed to the top surface of buffering and applys the board, and the connecting rod passes the top surface of equipment straight board, spacing plectane is installed on the top of connecting rod, and the bottom surface of spacing plectane is provided with the buffering rubber ring to the buffering rubber ring cup joints the top outside of installing at the connecting rod.
Preferably, the assembling straight plate and the pneumatic lifting rod are connected in a threaded manner, and the assembling straight plate and the supporting vertical frame are connected in a fitting manner.
Preferably, the buffer pressing plate and the assembling straight plate form a telescopic structure through the buffer spring and the mounting and accommodating groove, and the bottom surface of the buffer pressing plate is lower than the bottom surface of the assembling straight plate.
Preferably, the connecting rods are symmetrically distributed on the buffer pressing plate, and the connecting rods and the buffer pressing plate are arranged in an integrated structure.
Preferably, the connection mode of the limiting circular plate and the connecting rod is threaded, and the diameter of the limiting circular plate is larger than that of the connecting rod.
Preferably, the buffer rubber ring is connected with the connecting rod in a clamping way, and the buffer rubber ring is connected with the limiting circular plate and the assembling straight plate in a fitting way.
Compared with the prior art, the utility model has the beneficial effects that: the shell splicing device comprises a shell, a shell splicing device and a shell splicing device,
1. the assembly straight plate is driven to press downwards through the air pressure lifting rod, the shell of the semiconductor device is extruded through the buffer pressurizing plate arranged at the center of the bottom surface of the assembly straight plate, and the buffer pressurizing plate can shrink through the buffer spring, so that buffering in the pressurizing process is facilitated, and damage to the shell of the semiconductor device due to overlarge sliding amplitude is avoided;
2. the buffering pressurization board accessible connecting rod, spacing plectane and buffering rubber ring restrict, avoid taking place to drop, keep holistic stability, in carrying out the repetitive flexible operation in-process simultaneously, cushion the impact through buffering rubber ring.
Drawings
FIG. 1 is a schematic view of the overall three-dimensional structure of the present utility model;
FIG. 2 is a schematic diagram of the overall front view of the present utility model;
FIG. 3 is a schematic view of the assembled straight plate in cross-section and three-dimensional structure of the utility model;
FIG. 4 is a schematic cross-sectional elevation view of an assembled panel of the present utility model.
In the figure: 1. a housing placement platform; 2. a supporting stand; 3. an air pressure lifting rod; 4. assembling a straight plate; 5. a mounting and accommodating groove; 6. buffering the pressurizing plate; 7. a buffer spring; 8. a connecting rod; 9. a limit circular plate; 10. and a buffer rubber ring.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a shell splicing apparatus, including shell put platform 1 and pneumatic lifting rod 3, the outside of shell put platform 1 is inlayed fixed mounting and is supported riser 2, and the top middle-end bottom fixed mounting of supporting riser 2 has pneumatic lifting rod 3, equipment straight board 4 is installed to the bottom of pneumatic lifting rod 3, and the bottom surface of equipment straight board 4 has been seted up and has been installed and accomodate groove 5, the internally mounted of installation accomodate groove 5 has buffering pressurization board 6, and buffering pressurization board 6's top surface installs buffer spring 7, and buffer spring 7 is located the inside of installation accomodate groove 5, connecting rod 8 is installed to buffering pressurization board 6's top surface, and connecting rod 8 passes the top surface of equipment straight board 4, spacing plectane 9 is installed on connecting rod 8's top, and the bottom surface of spacing plectane 9 is provided with buffering rubber ring 10, and buffering rubber ring 10 cup joints and installs the top outside at connecting rod 8.
The connection mode of equipment straight board 4 and pneumatic lifting rod 3 is threaded connection, and the connection mode of equipment straight board 4 and support grudging post 2 is the laminating and is connected, can be with equipment straight board 4 fixed mounting in the bottom of pneumatic lifting rod 3 to through the laminating of equipment straight board 4 and support grudging post 2, improve the steady of lifting process.
The buffer pressing plate 6 forms a telescopic structure with the assembly straight plate 4 through the buffer spring 7 and the installation containing groove 5, and the bottom surface of the buffer pressing plate 6 is lower than the bottom surface of the assembly straight plate 4, so that the buffer pressing plate 6 is conveniently in extrusion contact with a shell of the semiconductor equipment, pressing is carried out, the telescopic operation of the buffer pressing plate 6 can be buffered in the pressing process, and the safety performance of splicing is improved.
The connecting rods 8 are symmetrically distributed on the buffer pressing plate 6, the connecting rods 8 and the buffer pressing plate 6 are arranged in an integrated structure, the symmetrical distribution of the connecting rods 8 can improve the stability of the buffer pressing plate 6 in the operation process, and the phenomenon of inclination is avoided.
The connection mode of the limiting circular plate 9 and the connecting rod 8 is threaded, the diameter of the limiting circular plate 9 is larger than that of the connecting rod 8, the limiting circular plate 9 and the connecting rod 8 can be fixed, and the connecting rod 8 and the sliding position of the buffer pressing plate 6 can be positioned through the limiting circular plate 9.
The buffer rubber ring 10 is connected with the connecting rod 8 in a clamping manner, and the buffer rubber ring 10 is connected with the limit circular plate 9 and the assembling straight plate 4 in a fitting manner, so that impact in the subsequent telescopic operation process can be buffered through the buffer rubber ring 10.
Working principle: according to fig. 1-4, the semiconductor device housing can be placed on the top surface of the housing placement platform 1 after being in butt joint, then the air pressure lifting rod 3 is started, the air pressure lifting rod 3 drives the assembly straight plate 4 to slide down steadily, the assembly straight plate 4 drives the buffer pressing plate 6 to contact with the semiconductor device housing, the buffer pressing plate 6 applies pressure to the semiconductor device housing, meanwhile, the buffer pressing plate 6 slides in the mounting storage groove 5, the buffer pressing plate 6 pushes the buffer spring 7 to shrink, meanwhile, the buffer pressing plate 6 drives the connecting rod 8, the limiting circular plate 9 and the buffer rubber ring 10 to lift up, the pressing splicing of the semiconductor device housing can be carried out, meanwhile, the stable downward sliding is carried out to carry out the pressing splicing, the subsequent air pressure lifting rod 3 drives the assembly straight plate 4 to lift up and reset, the buffer pressing plate 6 drives the limiting circular plate 9 and the buffer rubber ring 10 to reset through the elasticity of the buffer spring 7, the buffer pressing plate 6 reduces the reset impact through the buffer rubber ring 10, and the strip structure of the buffer pressing plate 6 can carry out work on a plurality of groups of semiconductor device housings.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a shell splicing apparatus, includes shell and puts platform (1) and atmospheric pressure lifter (3), its characterized in that: the shell is put the outside of platform (1) and is inlayed fixed mounting and support grudging post (2), and support the top middle-end bottom fixed mounting of grudging post (2) and have atmospheric pressure lifter (3), equipment straight board (4) are installed to the bottom of atmospheric pressure lifter (3), and install and accomodate groove (5) have been seted up to the bottom surface of equipment straight board (4), the internally mounted who accomodates groove (5) has buffering pressurization board (6), and buffering pressurization board (6) top surface installs buffer spring (7) to buffer spring (7) are located the inside of installing and accomodating groove (5), connecting rod (8) are installed to the top surface of buffering pressurization board (6), and connecting rod (8) pass the top surface of equipment straight board (4), spacing plectane (9) are installed on the top of connecting rod (8), and the bottom surface of spacing plectane (9) is provided with buffering rubber ring (10), and buffering rubber ring (10) cup joints the top outside of installing at connecting rod (8).
2. The housing splice device of claim 1, wherein: the connecting mode of the assembling straight plate (4) and the air pressure lifting rod (3) is fixed by threads, and the connecting mode of the assembling straight plate (4) and the supporting vertical frame (2) is joint connection.
3. The housing splice device of claim 1, wherein: the buffer pressing plate (6) and the assembly straight plate (4) form a telescopic structure through the buffer spring (7) and the installation containing groove (5), and the bottom surface of the buffer pressing plate (6) is lower than the bottom surface of the assembly straight plate (4).
4. The housing splice device of claim 1, wherein: the connecting rods (8) are symmetrically distributed on the buffering pressurizing plate (6), and the connecting rods (8) and the buffering pressurizing plate (6) are arranged in an integrated structure.
5. The housing splice device of claim 1, wherein: the connection mode of the limiting circular plate (9) and the connecting rod (8) is a threaded fixation mode, and the diameter of the limiting circular plate (9) is larger than that of the connecting rod (8).
6. The housing splice device of claim 1, wherein: the buffer rubber ring (10) is connected with the connecting rod (8) in a clamping mode, and the buffer rubber ring (10) is connected with the limiting circular plate (9) and the assembling straight plate (4) in a fitting mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321195421.5U CN220112692U (en) | 2023-05-15 | 2023-05-15 | Shell splicing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321195421.5U CN220112692U (en) | 2023-05-15 | 2023-05-15 | Shell splicing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220112692U true CN220112692U (en) | 2023-12-01 |
Family
ID=88893474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321195421.5U Active CN220112692U (en) | 2023-05-15 | 2023-05-15 | Shell splicing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220112692U (en) |
-
2023
- 2023-05-15 CN CN202321195421.5U patent/CN220112692U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |