CN210615685U - Equipment for mounting sensor ceramic wafer and base - Google Patents
Equipment for mounting sensor ceramic wafer and base Download PDFInfo
- Publication number
- CN210615685U CN210615685U CN201921545034.3U CN201921545034U CN210615685U CN 210615685 U CN210615685 U CN 210615685U CN 201921545034 U CN201921545034 U CN 201921545034U CN 210615685 U CN210615685 U CN 210615685U
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- base
- sensor
- fixedly connected
- cylinder
- supporting plate
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses an equipment for sensor potsherd and pedestal mounting belongs to sensor potsherd and pedestal mounting field. The equipment for mounting the sensor ceramic wafer and the base comprises a base, wherein a sensor ceramic wafer placing table and a sensor base placing table are arranged on the base, a front air cylinder and a rear air cylinder are fixedly connected to the base through a fixing table, and a first supporting plate is fixedly connected to a first piston rod on the front air cylinder and the rear air cylinder; the utility model discloses utilize slip post and buffer spring on the vacuum suction nozzle to play the cushioning effect, the better potsherd that adsorbs, the setting that connects and second spout and insert the post can realize vacuum suction nozzle's fine motion buffering from top to bottom, high-efficient quick absorption potsherd, cylinder and front and back cylinder about absorbing the rebooting behind the potsherd, insert the potsherd on the sensor base of placing the bench, then the equipment, the equipment is quick, but mass production equipment sensor, satisfy market demand down.
Description
Technical Field
The utility model relates to a sensor potsherd and pedestal mounting technical field especially relate to an equipment for sensor potsherd and pedestal mounting.
Background
The sensor is a detection device, can feel the information measured, and can convert the information into electrical signals or other information output in required form according to a certain rule, so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like.
Disclosure of Invention
The utility model aims at solving the problems in the prior art, and provides a device for mounting a sensor ceramic wafer and a base.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a device for mounting a sensor ceramic wafer and a base comprises a base, wherein a sensor ceramic wafer placing table and a sensor base placing table are arranged on the base, a front air cylinder and a rear air cylinder are fixedly connected to the base through a fixing table, a first supporting plate is fixedly connected to a first piston rod on the front air cylinder and the rear air cylinder, an upper air cylinder and a lower air cylinder are fixedly connected to the first supporting plate, a second supporting plate is fixedly connected to a second piston rod on the upper air cylinder and the lower air cylinder, a connecting column is fixedly connected to the second supporting plate in a penetrating manner, a vacuum suction nozzle is slidably connected to the lower end of the connecting column, a first sliding chute matched with the vacuum suction nozzle is formed in the connecting column, a sliding column is fixedly connected to the upper end of the vacuum suction nozzle, a buffer spring is sleeved on the sliding column, two ends of the buffer spring are respectively connected with the vacuum, the spliced pole upper end fixedly connected with connects, set up the second spout in the joint, the slip post upper end is equipped with the post of inserting that the second spout matches, it has seted up the through-hole on the post to insert, through-hole, second spout and vacuum suction channel intercommunication, there is the straw through nut threaded connection on the joint.
Preferably, the first supporting plate is fixedly connected with a guide sleeve through a fixing bolt, a guide post is slidably connected onto the guide sleeve, and the lower end of the guide post is fixedly connected with the second supporting plate.
Preferably, the upper end of the connecting column is in threaded connection with an upper nut and a lower nut, and the lower end of the lower nut abuts against the second supporting plate.
Preferably, the number of the connecting columns is 4-8, and the connecting columns are uniformly distributed on the second supporting plate.
Preferably, the number of the guide posts is two, and the guide posts are uniformly distributed on the second supporting plate.
Compared with the prior art, the utility model provides an equipment for sensor potsherd and pedestal mounting possesses following beneficial effect:
1. the device for mounting the sensor ceramic chip and the base comprises a sensor ceramic chip, a sensor base, a front cylinder, a rear cylinder, a first piston rod, a connecting column, an upper cylinder, a lower cylinder, a connecting column, a sliding column, a buffer spring, a connector, a second chute and an inserting column, wherein the sensor ceramic chip is arranged on a ceramic chip placing table in advance, the sensor base is arranged on the sensor base placing table, the first piston rod on the front cylinder and the rear cylinder is moved back and forth through the first supporting plate by starting the front cylinder and the rear cylinder, the upper cylinder and the lower cylinder are started, the second piston rod on the upper cylinder and the lower cylinder drives the connecting column to move downwards through the second supporting plate, so that the vacuum suction nozzle is driven to move downwards, the buffer effect can be achieved by utilizing the sliding column and the buffer spring on the vacuum suction nozzle, the ceramic wafer is inserted into the sensor base on the sensor base placing table, then the sensor base is assembled, the assembly is rapid, the sensor can be produced and assembled on a large scale, and the current market demand is met.
Drawings
Fig. 1 is a top view of a sensor ceramic plate and a base mounting device according to the present invention;
fig. 2 is a front view of a sensor ceramic plate and a base mounting device according to the present invention;
fig. 3 is a side view of a sensor ceramic plate and a base mounting device according to the present invention;
fig. 4 is a schematic structural view of a second supporting plate and a connecting column of the sensor ceramic plate and the base mounting device according to the present invention;
fig. 5 is a schematic sectional structure view of a second supporting plate and a connecting column of the sensor ceramic plate and the pedestal mounting device according to the present invention.
In the figure: 1. a base; 2. a fixed table; 3. front and rear cylinders; 4. a first piston rod; 5. a first support plate; 6. an upper cylinder and a lower cylinder; 7. a second piston rod; 8. a second support plate; 9. a straw; 10. a vacuum nozzle; 11. a ceramic wafer placing table; 12. a sensor base placing table; 13. fixing the bolt; 14. a guide sleeve; 15. a guide post; 16. connecting columns; 17. screwing a nut; 18. a lower nut; 19. a joint; 20. a nut; 21. a second chute; 22. a vacuum suction channel; 23. a through hole; 24. a first chute; 25. a sliding post; 26. a buffer spring; 27. and (5) inserting the column.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-5, an apparatus for mounting a sensor ceramic wafer and a base comprises a base 1, a sensor ceramic wafer placing table 11 and a sensor base placing table 12 are arranged on the base 1, a front cylinder 3 and a rear cylinder 3 are fixedly connected on the base 1 through a fixing table 2, a first support plate 5 is fixedly connected on a first piston rod 4 on the front cylinder 3 and the rear cylinder 3, an upper cylinder 6 and a lower cylinder 6 are fixedly connected on the first support plate 5, a second support plate 8 is fixedly connected on a second piston rod 7 on the upper cylinder 6 and the lower cylinder 6, a connecting column 16 is fixedly connected on the second support plate 8 in a penetrating way, a vacuum suction nozzle 10 is slidably connected at the lower end of the connecting column 16, a first chute 24 matched with the vacuum suction nozzle 10 is arranged on the connecting column 16, a sliding column 25 is fixedly connected at the upper end of the vacuum suction nozzle 10, a buffer spring 26 is sleeved on, a vacuum suction channel 22 communicated with the sliding column 25 and the vacuum suction nozzle 10 is formed in the sliding column 25, the upper end of the connecting column 16 is fixedly connected with a joint 19, a second sliding groove 21 is formed in the joint 19, an inserting column 27 matched with the second sliding groove 21 is arranged at the upper end of the sliding column 25, a through hole 23 is formed in the inserting column 27, the through hole 23, the second sliding groove 21 and the vacuum suction channel 22 are communicated, and a suction pipe 9 is connected to the joint 19 through a nut 20 in a threaded mode;
when the device is installed, the sensor ceramic wafer is placed on the ceramic wafer placing table 11 in advance, the sensor base is placed on the sensor base placing table 12, firstly, the front and back air cylinders 3 are started, the first piston rods 4 on the front and back air cylinders 3 move back and forth through the first supporting plate 5 and move to the upper part of the ceramic wafer placing table 11, the upper and lower air cylinders 6 are started, the second piston rods 7 on the upper and lower air cylinders 6 drive the connecting columns 16 to move downwards through the second supporting plates 8, so that the vacuum suction nozzle 10 is driven to move downwards, a buffer effect can be achieved by utilizing the sliding columns 25 and the buffer springs 26 on the vacuum suction nozzle 10, the ceramic wafer is better adsorbed, the joints 19, the second sliding grooves 21 and the inserting columns 27 are arranged to achieve up-and-down micro-motion buffering of the vacuum suction nozzle 10, the ceramic wafer is efficiently and quickly absorbed, the ceramic wafer is inserted into the sensor base on the sensor base placing table 12, then the assembly is carried out, the assembly is fast, the sensor can be produced and assembled on a large scale, and the current market demand is met.
The upper end of the connecting column 16 is in threaded connection with an upper nut 17 and a lower nut 18, the lower end of the lower nut 18 abuts against the second supporting plate 8, and the connecting column 16 can be fixed on the second supporting plate 8 more stably.
The number of the connecting columns 16 is 4-8, and the connecting columns are uniformly distributed on the second supporting plate 8, so that the absorption and the assembly of a plurality of ceramic plates can be realized simultaneously, and the working efficiency is improved.
The number of guide posts 15 is two, and evenly distributed is on second backup pad 8, ensures the more stable lift of second backup pad 8.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. The device for mounting the sensor ceramic chip and the base comprises a base (1), wherein a sensor ceramic chip placing table (11) and a sensor base placing table (12) are arranged on the base (1), and is characterized in that a front cylinder (3) and a rear cylinder (3) are fixedly connected to the base (1) through a fixing table (2), a first supporting plate (5) is fixedly connected to a first piston rod (4) on the front cylinder (3) and the rear cylinder (3), an upper cylinder (6) and a lower cylinder (6) are fixedly connected to the first supporting plate (5), a second supporting plate (8) is fixedly connected to a second piston rod (7) on the upper cylinder (6) and the lower cylinder (6), a connecting column (16) is fixedly connected to the second supporting plate (8) in a penetrating manner, a vacuum suction nozzle (10) is slidably connected to the lower end of the connecting column (16), and a first chute (24) matched with the vacuum, vacuum nozzle (10) upper end fixedly connected with slip post (25), the cover has buffer spring (26) on slip post (25), buffer spring (26) both ends link to each other with vacuum nozzle (10) and first spout (24) roof respectively, the vacuum that sets up the intercommunication is inhaled on slip post (25) and vacuum nozzle (10) and is said (22), spliced pole (16) upper end fixedly connected with connects (19), it has second spout (21) to open in joint (19), slip post (25) upper end is equipped with the post (27) of inserting that second spout (21) match, through-hole (23) have been seted up on inserting post (27), through-hole (23), second spout (21) and vacuum are inhaled and say (22) intercommunication, there is straw (9) through nut (20) threaded connection on joint (19).
2. The sensor ceramic plate and base mounting device as recited in claim 1, wherein the first supporting plate (5) is fixedly connected with a guide sleeve (14) through a fixing bolt (13), a guide post (15) is slidably connected on the guide sleeve (14), and the lower end of the guide post (15) is fixedly connected with the second supporting plate (8).
3. The sensor ceramic plate and base mounting device as recited in claim 1, wherein the upper end of the connecting column (16) is connected with an upper nut (17) and a lower nut (18) by screw thread, and the lower end of the lower nut (18) is abutted against the second supporting plate (8).
4. Device for sensor ceramic wafer and base mounting according to any of claims 1-3, characterized in that the number of connecting columns (16) is 4-8 and they are evenly distributed on the second support plate (8).
5. The sensor ceramic wafer and pedestal mounting device as claimed in claim 2, wherein the number of the guide posts (15) is two and the guide posts are uniformly distributed on the second support plate (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921545034.3U CN210615685U (en) | 2019-09-18 | 2019-09-18 | Equipment for mounting sensor ceramic wafer and base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921545034.3U CN210615685U (en) | 2019-09-18 | 2019-09-18 | Equipment for mounting sensor ceramic wafer and base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210615685U true CN210615685U (en) | 2020-05-26 |
Family
ID=70763221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921545034.3U Expired - Fee Related CN210615685U (en) | 2019-09-18 | 2019-09-18 | Equipment for mounting sensor ceramic wafer and base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210615685U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113427859A (en) * | 2021-06-24 | 2021-09-24 | 深圳市百洋科技有限公司 | Thin type microcrystal high-temperature-resistant insulating ceramic chip and using method thereof |
-
2019
- 2019-09-18 CN CN201921545034.3U patent/CN210615685U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113427859A (en) * | 2021-06-24 | 2021-09-24 | 深圳市百洋科技有限公司 | Thin type microcrystal high-temperature-resistant insulating ceramic chip and using method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200526 Termination date: 20210918 |