CN220108610U - Chip mounter debugging chip mounting platform for circuit board processing - Google Patents
Chip mounter debugging chip mounting platform for circuit board processing Download PDFInfo
- Publication number
- CN220108610U CN220108610U CN202321368434.8U CN202321368434U CN220108610U CN 220108610 U CN220108610 U CN 220108610U CN 202321368434 U CN202321368434 U CN 202321368434U CN 220108610 U CN220108610 U CN 220108610U
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- CN
- China
- Prior art keywords
- fixedly connected
- circuit board
- debugging
- board processing
- chip mounter
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- 230000005540 biological transmission Effects 0.000 claims abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 32
- 238000007639 printing Methods 0.000 claims description 16
- 238000002360 preparation method Methods 0.000 claims description 15
- 238000007790 scraping Methods 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 13
- 239000002994 raw material Substances 0.000 abstract description 10
- 230000007246 mechanism Effects 0.000 abstract description 3
- 230000001502 supplementing effect Effects 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a chip mounter debugging and mounting platform for circuit board processing, which comprises a fixed base, wherein a mounting frame is fixedly connected to the fixed base, a lifting cylinder penetrates through the mounting frame, a coating unit is fixedly connected to an execution output end of the lifting cylinder, and a feeding unit is fixedly connected to the mounting frame. The utility model belongs to the technical field of chip mounters, in particular relates to a chip mounter debugging chip mounting platform for circuit board processing, which effectively solves the problems that the chip mounter debugging chip mounting platform for circuit board processing in the current market is simple in structure, needs to be repeatedly added with coating solder paste manually, is low in efficiency, and cannot recover solder paste scattered on a table top, realizes the function of quickly supplementing a storage cylinder by a pump, reduces the trouble of manual operation, and is convenient to feed and discharge and scrape residual raw materials by using a transmission mechanism.
Description
Technical Field
The utility model belongs to the technical field of chip mounters, and particularly relates to a chip mounter debugging chip mounting platform for circuit board processing.
Background
Solder paste is a novel solder material which is generated along with SMT, and is a paste mixture formed by mixing soldering powder, soldering flux, other surfactants, thixotropic agents and the like. The solder is mainly used for soldering electronic components such as PCB surface resistance, capacitance, IC and the like in SMT industry.
The existing circuit board is generally coated with solder paste manually, and the efficiency is low, so that a piece of surface mounting equipment capable of accelerating the coating efficiency of the solder paste is needed.
Publication (bulletin) number: CN218772600U provides a chip mounter debugging paster platform for circuit board processing, can realize brushing the solder paste to the circuit board fast through the solder paste printing unit that can go up and down, so can improve work efficiency.
However, in the using process of the patent, the volume of the storage cylinder is limited, and raw materials need to be added in the operating process, so that the using efficiency is affected; in the coating process, the transmission disc is easy to remain, and the recovery treatment is inconvenient.
Disclosure of Invention
Aiming at the situation, in order to overcome the defects of the prior art, the utility model provides the chip mounter debugging chip mounting platform for circuit board processing, which effectively solves the problems that the chip mounter debugging chip mounting platform for circuit board processing in the current market is simple in structure, needs to be repeatedly added with coating solder paste manually, is low in efficiency and cannot recover solder paste scattered on a table top, realizes the function of rapidly supplementing a storage cylinder by a pump, reduces the trouble of manual operation, and has the functions of conveniently feeding and discharging and scraping residual raw materials by using a transmission mechanism.
The technical scheme adopted by the utility model is as follows: the utility model provides a chip mounter debugging and mounting platform for circuit board processing, which comprises a fixed base, wherein a mounting frame is fixedly connected to the fixed base, a lifting cylinder penetrates through the mounting frame, a coating unit is fixedly connected to an execution output end of the lifting cylinder, and a feeding unit is fixedly connected to the mounting frame.
Further, the coating unit comprises a printing box, a pushing cylinder penetrates through the printing box, a pushing component is fixedly connected to the output end of the pushing cylinder, and through holes are formed in the printing box in a distributed mode.
Further, the charging unit includes the material preparation jar, the rigid coupling has a storage cylinder on the mounting bracket, be equipped with charging hopper on the material preparation jar, the rigid coupling has the pump on the material preparation jar, it has the inlet pipe that UNICOM material preparation jar and storage cylinder set up to run through on the pump.
Further, a discharging hose is fixedly connected to the storage cylinder and the printing box.
Further, a transmission equipment frame is fixedly connected to the fixed base, a driving motor is arranged on the transmission equipment frame, and a conveying belt is arranged on the transmission equipment frame.
Further, a scraping component is fixedly connected to the transmission equipment frame, and the scraping component is flush with the conveyor belt.
Further, the through holes are provided with a plurality of groups.
The beneficial effects obtained by the utility model by adopting the structure are as follows:
1. the pump is arranged to perform the function of quickly supplementing the storage cylinder, so that the trouble of manual operation is reduced, and the operation efficiency can be improved;
2. utilize drive mechanism, make things convenient for the last unloading of circuit board processing to cooperation scrapes the work of material component, can scrape the residual raw materials in conveyer belt surface and retrieve.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present utility model;
FIG. 2 is a schematic view of the overall structure of another view according to an embodiment of the present utility model;
FIG. 3 is a schematic view of the internal structure of the charging unit;
fig. 4 is a schematic view of the internal structure of the coating unit.
Wherein, 1, a fixed base, 2, a mounting rack, 3, a lifting cylinder, 4, a printing box, 5, a pushing cylinder, 6, a pushing component, 7, a through hole, 8, a material preparation tank, 9 and a material storage cylinder, 10, an addition funnel, 11, a pump, 12, a feed pipe, 13, a discharge hose, 14, a transmission equipment rack, 15, a driving motor, 16, a conveyor belt, 17 and a scraping component.
Detailed Description
As shown in fig. 1, fig. 2, fig. 3 and fig. 4, the chip mounter debugging and chip mounting platform for circuit board processing provided by the utility model comprises a fixed base 1, wherein a mounting frame 2 is fixedly connected to the fixed base 1, a lifting cylinder 3 penetrates through the mounting frame 2, a coating unit is fixedly connected to an execution output end of the lifting cylinder 3, and a feeding unit is fixedly connected to the mounting frame 2.
The coating unit comprises a printing box 4, a pushing cylinder 5 penetrates through the printing box 4, a pushing component 6 is fixedly connected to the output end of the pushing cylinder 5, and through holes 7 are formed in the printing box 4 in a distributed mode.
The charging unit comprises a material preparation tank 8, a material storage cylinder 9 is fixedly connected to the mounting frame 2, a charging hopper 10 is arranged on the material preparation tank 8, a pump machine 11 is fixedly connected to the material preparation tank 8, and a material feeding pipe 12 communicated with the material preparation tank 8 and the material storage cylinder 9 is penetrated through the pump machine 11.
And a discharging hose 13 is fixedly connected to the storage cylinder 9 and the printing box 4.
The fixed base 1 is fixedly connected with a transmission equipment frame 14, a driving motor 15 is arranged on the transmission equipment frame 14, and a conveying belt 16 is arranged on the transmission equipment frame 14.
A scraping member 17 is fixedly connected to the transmission equipment rack 14, and the scraping member 17 is flush with the conveyor belt 16.
The through holes 7 are provided with several groups.
When the device is used, a user installs and fixes the device, then adds solder paste from a charging hopper 10, stores the solder paste in a material preparation tank 8, pumps raw materials into a material storage cylinder 9 for adding through a pump 11, a material discharge hose 13 is communicated with the material storage cylinder 9 and a printing box 4, when the device is used, a lifting cylinder 3 controls the printing box 4 to lift, coating of a circuit board processing patch is performed at a proper height, along with pushing of the raw materials by a pushing member 6 back and forth by a pushing cylinder 5, the raw materials are added from a through hole 7, after the raw materials in the material storage cylinder 9 are used up, the pump 11 adds the raw materials from the material preparation tank 8 into the material storage cylinder 9 through a material inlet pipe 12 for use; the driving motor 15 drives the conveyer belt 16 to convey after working, the circuit board is placed on the conveyer belt 16 to realize automatic feeding, after coating is completed, the other side is manually taken for discharging, the raw materials remained on the conveyer belt 16 can be scraped and collected by the scraping member 17 along with the movement of the conveyer belt 16, and the recovery is convenient, so that the use flow of the chip mounter debugging chip mounter platform for processing the whole circuit board is realized.
The utility model and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the utility model as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present utility model.
Claims (7)
1. Chip mounter debugging paster platform is used in circuit board processing, including fixed base, its characterized in that: the fixed base is fixedly connected with a mounting frame, a lifting cylinder penetrates through the mounting frame, a coating unit is fixedly connected to the execution output end of the lifting cylinder, and a feeding unit is fixedly connected to the mounting frame.
2. The chip mounter debugging and mounting platform for circuit board processing according to claim 1, wherein: the coating unit comprises a printing box, a pushing cylinder penetrates through the printing box, a pushing component is fixedly connected to the output end of the pushing cylinder, and through holes are formed in the printing box in a distributed mode.
3. The chip mounter debugging and mounting platform for circuit board processing according to claim 2, wherein: the charging unit comprises a material preparation tank, a material storage cylinder is fixedly connected to the mounting frame, a charging hopper is arranged on the material preparation tank, a pump is fixedly connected to the material preparation tank, and a material feeding pipe communicated with the material preparation tank and the material storage cylinder is arranged on the pump in a penetrating mode.
4. The chip mounter debugging and mounting platform for circuit board processing according to claim 3, wherein: and the material storage cylinder and the printing box are fixedly connected with a material discharging hose.
5. The chip mounter debugging and mounting platform for circuit board processing according to claim 4, wherein: the fixed base is fixedly connected with a transmission equipment frame, a driving motor is arranged on the transmission equipment frame, and a conveying belt is arranged on the transmission equipment frame.
6. The chip mounter debugging and mounting platform for circuit board processing according to claim 5, wherein: the transmission equipment frame is fixedly connected with a scraping component which is flush with the conveyor belt.
7. The chip mounter debugging and mounting platform for circuit board processing according to claim 6, wherein: the through holes are provided with a plurality of groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321368434.8U CN220108610U (en) | 2023-06-01 | 2023-06-01 | Chip mounter debugging chip mounting platform for circuit board processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321368434.8U CN220108610U (en) | 2023-06-01 | 2023-06-01 | Chip mounter debugging chip mounting platform for circuit board processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220108610U true CN220108610U (en) | 2023-11-28 |
Family
ID=88866821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321368434.8U Active CN220108610U (en) | 2023-06-01 | 2023-06-01 | Chip mounter debugging chip mounting platform for circuit board processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220108610U (en) |
-
2023
- 2023-06-01 CN CN202321368434.8U patent/CN220108610U/en active Active
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