CN207099449U - SMT chip mounters - Google Patents
SMT chip mounters Download PDFInfo
- Publication number
- CN207099449U CN207099449U CN201720613322.2U CN201720613322U CN207099449U CN 207099449 U CN207099449 U CN 207099449U CN 201720613322 U CN201720613322 U CN 201720613322U CN 207099449 U CN207099449 U CN 207099449U
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- CN
- China
- Prior art keywords
- paster
- smt chip
- chip mounters
- mounting head
- feeding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a kind of SMT chip mounters.The SMT chip mounters will can be located in several feeding material components in the PCB substrate that need to carry out paster using a kind of more material, realize that multiple suction nozzles draw same material out of multiple the feeding material components simultaneously.Reduce the mounting head and travel to and fro between number between the feeding platform and the PCB substrate, improve efficiency.The number to reload is shut down at the same time it can also reduce the chip mounter, further improves the operating efficiency of the SMT chip mounters.Also, whole materials needed for the PCB substrate are equipped with each feeding platform, are realized to being mounted described in two panels while PCB substrate, further improve the operating efficiency of the SMT chip mounters.
Description
Technical field
Chip mounter is the utility model is related to, particularly a kind of SMT chip mounters.
Background technology
SMT (Surface Mount Technology, surface mounting technology) paster refers to without pin or short leg
Various surface mount devices are arranged on PCB (Printed Circuit Board, printed circuit board) substrate, then pass through fluid welding
Or the methods of immersed solder, carries out the technology of the circuit load of welding assembly.
In existing SMT chip mounters, the material on each feeding platform in each feeding material component differs, i.e., every kind of
Material is only loaded in a material disc.When same material ratio is more in the PCB substrate for needing to carry out paster, paster head group
Part needs are multiple to be travelled to and fro between the PCB substrate and the feeding material component, so as to reduce the work of SMT chip mounters effect
Rate.
Utility model content
The utility model provides a kind of SMT chip mounters, improves the paster efficiency of the SMT chip mounters.
The SMT chip mounters include guide rail, two workbenches positioned at the guide rail both sides, positioned at described two work
Platform both sides and two feeding platforms being oppositely arranged, and be arranged on each described workbench and the feeding platform it
Between moveable mounting head, multiple feeding material components, multiple feeding groups are removably housed on each feeding platform
Several feeding material components in part are built with same paster material, described in the mounting head is drawn from the feeding material component
The paster material of absorption is simultaneously affixed in the PCB substrate by paster material.
Wherein, multiple feeding material components are used to carry all paster materials needed for the PCB substrate.
Wherein, each feeding material component includes feed appliance and detachably loaded on the material disc on the feed appliance, described
Material disc draws the paster material built with the paster material, the mounting head by the feed appliance.
Wherein, the mounting head is moved to it and draws the paster material closest to the feeding platform of side.
Wherein, the guide rail includes input guide rail and output guide rail, the input guide rail and output guide rail with the work
It is connected as platform.
Wherein, each mounting head includes the multiple suction nozzles being arranged side by side, and multiple suction nozzles are simultaneously from multiple described
The paster material is drawn in feeding material component and paster is carried out to the PCB substrate.
Wherein, the SMT chip mounters include two parallel vertical beams positioned at the feeding platform both sides, vertical and removable
Dynamic two parallel crossbeams being set up on two vertical beams, every crossbeam are and described with the guide rail parallel
Mounting head slidingtype is connected on the crossbeam.
Wherein, the SMT chip mounters include drive device, and the drive device controls the movement and rotation of the mounting head
Turn.
Wherein, the drive device drives the crossbeam to be moved on the vertical beam, and drives the mounting head to exist
Moved on the crossbeam, so as to realize that the drive device controls the movement of the mounting head.
The SMT chip mounters of the present utility model, according to being actually needed, more material will be used in the PCB substrate
In several feeding material components, you can realize multiple suction nozzles while drawn out of multiple the feeding material components same
Material, reduce the mounting head and travel to and fro between number between the feeding platform and the PCB substrates, increase operating efficiency.Together
When, reduce the chip mounter and shut down the number to reload, further improve the operating efficiency of the SMT chip mounters.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the SMT chip mounters in the utility model embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Referring to Fig. 1, the utility model provides a kind of SMT chip mounters 100, for carrying out paster to PCB substrate.This implementation
In example, the SMT chip mounters 100 are bow member type chip mounter.The SMT chip mounters 100 include guide rail 10, positioned at the guide rail
Both sides and two workbench (not shown)s being connected with the guide rail, positioned at the workbench both sides and are oppositely arranged
Two feeding platform (not shown)s, and be arranged between each described workbench and the feeding platform can
Mobile mounting head 20.Multiple feeding material components 30, multiple feeding material components are removably housed on each feeding platform
Several feeding material components 30 in 30 are built with same material.Described in the mounting head 20 can be drawn from the feeding material component 30
Paster material and be affixed on the paster material of absorption is realized in the PCB substrate carries out component in the PCB substrate
Attachment.
The PCB substrate that the work table is used to treat paster carries out positioning and fixing the PCB substrate.Will institute
The fixed position that PCB substrate is fixed on the work table is stated, to carry out paster operation to the PCB substrate.
The guide rail 10 includes input guide rail 11 and output guide rail 12.It is described input guide rail 11 and output guide rail 12 with
The workbench is connected, and it is enterprising for the PCB substrate to be delivered into the workbench that guide rail 11 is inputted described in PCB substrate
Row paster operates, and the PCB substrate output workbench that the output guide rail 12 is used to complete after paster operates is simultaneously
Operated into next step.In the present embodiment, the guide rail 10 includes delivery track and is located at the delivery track by belt pulley
The belt line (not shown) at edge.The PCB substrate is located in the belt line, is driven by the rolling of the belt pulley
The PCB substrate in the belt line is transmitted.
Each mounting head 20 includes multiple suction nozzles 21 for carrying out dismounting and change, and the multiple suction nozzle 21 is set side by side
Put.According to the difference for the size shape for drawing and being placed with element, the suction nozzle 21 has different species.Each suction nozzle 21 wraps
A vavuum pump is included, when opening the vavuum pump, the absorbing material of suction nozzle 21；When being opened and closed the vavuum pump, the suction nozzle 21
The material of absorption is put down, completes to carry out paster operation to the PCB substrate.In the present embodiment, each mounting head 20 wraps
Include 10 suction nozzles 21.Each mounting head 20 can with its immediate described workbench and feeding platform it
Between move, be moved to from the feeding platform absorbing material and by obtained material is drawn on the workbench, and for positioned at
The PCB substrate on the workbench carries out paster.
Each feeding platform includes multiple screens, and the screens is used for detachable installation and fixes the feeding
Component.In the present embodiment, the quantity of the screens is 50.
The feeding material component 30 includes feed appliance (not shown) and detachably loaded on the material disc on the feed appliance
(not shown).The feed appliance is detachable to be mounted in the screens of the feeding platform.The institute of banding
Paster material is stated to be wound on the material disc, it is convenient and simple that the paster material is loaded on the thing by this kind of mode
In charging tray, so as to easily carry out feeding by the feed appliance.It is understood that the material disc is only the paster thing
A kind of charge mode of material.It is different (tubular wrapping, plate-like packaging and bulk cargo etc.) according to the packaged form of the paster material, can
To use different charge modes.It is different according to the packaged form of the paster material, the different feed appliances can be selected
Species.In the present embodiment, the packaged form of the paster material is packed for banding, and the feed appliance is braid feeder.Enter one
Step, carry the PCB substrate in the present embodiment, in the feeding material component 30 on each feeding platform and pasted
Whole materials needed for piece.
During paster, the mounting head 20 is moved to and on its immediate feeding platform, the feed appliance will
The paster material in the material disc is sent out, and the suction nozzle of the mounting head 20 draws the described of the feed appliance submitting
Paster material.After completing material suction process, moving the mounting head 20 to the PCB substrate again needs to carry out the position of paster
Put and put down the paster material in the PCB substrate, that is, completing the paster process.
Specifically, the SMT chip mounters 100 also include two parallel vertical beam (figures positioned at the feeding platform both sides
Not shown in), the parallel two crossbeam (not shown) being vertically movably set up on two vertical beams.Every institute
State that crossbeam is parallel in the guide rail 10, and slidingtype is connected with a mounting head 20 on the crossbeam daily.Institute
Mounting head 20 is stated along the vertical beam and cross beam movement, and then realizes the mounting head 20 in the feeding platform and the work
Movement between platform.In the present embodiment, the vertical beam and crossbeam are screw mandrel.
The SMT chip mounters 100 also include drive device, and drive device described in the present embodiment is drive motor.Can be with
Understand, the drive device can also be cylinder, so as to promote the movement of the crossbeam and the mounting head 20.The drive
Dynamic device drives shifting of the mounting head 20 on the crossbeam to drive movement of the crossbeam on the vertical beam
It is dynamic.By movement of the mounting head 20 on the crossbeam, realize the mounting head 20 in the X-axis parallel to the guide rail 10
The motion in direction；By movement of the crossbeam on the vertical beam, the mounting head 20 is driven to be led perpendicular to described
The movement of the Y-direction of rail 10.Thus, by the driving of the drive device, so as to realize the mounting head 20 in the feed
Back and forth movement between platform and the workbench.Further, the drive device can also drive the mounting head 20
Suction nozzle 21 realize the rotation process for moving and realizing the suction nozzle 21 of the i.e. Z-direction of above-below direction, so as to realize the patch
Absorption of the dress first 20 when being moved to the labor and materials platform to the material and it is moved to the workbench and makes to the material
Attachment, and the paster angle of the material is adjusted, so as to realize the accurate placement of the material.
In the present embodiment, the workbench, the feeding platform, the mounting head 20 have two, and each described
Mounting head can independent operating, each feeding platform can meet the required material variety of the PCB substrate, i.e., described in
SMT chip mounters 100 can be that PCB substrate described in two panels carries out paster operation simultaneously, and then improve the SMT chip mounters 100
Operating efficiency.
Also, according to being actually needed, it can be set as needed on the feeding platform and multiple include same material
The feeding material component 30.When same material amounts are larger in the PCB substrate, can be installed on the feeding platform more
The individual feeding material component 30 for including this kind of material, multiple suction nozzles 21 of the mounting head 20 can be simultaneously from multiple feedings
This kind of material is drawn in component., can be with compared to the situation that every kind of material in the prior art only has a feeding material component 30
Round number of the mounting head 20 between the feeding material component 30 and the PCB substrate is reduced, so as to improve the SMT patches
The paster efficiency of piece machine 100.Further, due to having same material in multiple feeding material components 30, it is possible to reduce single
The depletion rate of material in the feeding material component 30, and then reduce the chip mounter and shut down the number to reload, further improve institute
State the operating efficiency of SMT chip mounters 100.
Above disclosed is only a kind of the utility model preferred embodiment, can not limit this practicality with this certainly
New interest field, one of ordinary skill in the art will appreciate that all or part of flow of above-described embodiment is realized, and according to
The equivalent variations that the utility model claims are made, still fall within the scope that utility model is covered.
Claims (9)
- A kind of 1. SMT chip mounters, for carrying out paster to PCB substrate, it is characterised in that the SMT chip mounters include guide rail, position Two workbenches in the guide rail both sides, positioned at described two workbench both sides and be oppositely arranged two feed it is flat Platform, and the moveable mounting head being arranged between each described workbench and the feeding platform, each confession Expect multiple feeding material components are removably housed on platform, several feeding material components in multiple feeding material components are built with same A kind of paster material, the mounting head draw the paster material from the feeding material component and by the paster materials of absorption It is affixed in the PCB substrate.
- 2. a kind of SMT chip mounters as claimed in claim 1, it is characterised in that multiple feeding material components are described for carrying All paster materials needed for PCB substrate.
- 3. a kind of SMT chip mounters as claimed in claim 1 or 2, it is characterised in that each feeding material component includes feed appliance And detachably pass through loaded on the material disc on the feed appliance, the material disc built with the paster material, the mounting head The feed appliance draws the paster material.
- 4. a kind of SMT chip mounters as claimed in claim 3, it is characterised in that the mounting head is moved to it closest to side The feeding platform draw the paster material.
- 5. a kind of SMT chip mounters as claimed in claim 1, it is characterised in that the guide rail includes input guide rail and output is led Rail, the input guide rail and output guide rail are connected with the workbench.
- 6. a kind of SMT chip mounters as claimed in claim 1, it is characterised in that each mounting head includes what is be arranged side by side Multiple suction nozzles, multiple suction nozzles draw the paster material simultaneously out of multiple the feeding material components and to the PCB substrates Carry out paster.
- 7. a kind of SMT chip mounters as claimed in claim 1, it is characterised in that the SMT chip mounters include being located at the feed Two parallel vertical beams of platform both sides, vertical and two parallel crossbeams being movably set up on two vertical beams, Every crossbeam is with the guide rail parallel, and the mounting head slidingtype is connected on the crossbeam.
- 8. a kind of SMT chip mounters as claimed in claim 7, it is characterised in that the SMT chip mounters include drive device, institute State movement and rotation that drive device controls the mounting head.
- 9. a kind of SMT chip mounters as claimed in claim 8, it is characterised in that the drive device drives the crossbeam in institute State and moved on vertical beam, and drive the mounting head to be moved on the crossbeam, to realize described in the drive device control The movement of mounting head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720613322.2U CN207099449U (en) | 2017-05-27 | 2017-05-27 | SMT chip mounters |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720613322.2U CN207099449U (en) | 2017-05-27 | 2017-05-27 | SMT chip mounters |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207099449U true CN207099449U (en) | 2018-03-13 |
Family
ID=61551319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720613322.2U Active CN207099449U (en) | 2017-05-27 | 2017-05-27 | SMT chip mounters |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207099449U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108521718A (en) * | 2018-06-21 | 2018-09-11 | 苏州工业职业技术学院 | A kind of circuit board auxiliary device for processing |
-
2017
- 2017-05-27 CN CN201720613322.2U patent/CN207099449U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108521718A (en) * | 2018-06-21 | 2018-09-11 | 苏州工业职业技术学院 | A kind of circuit board auxiliary device for processing |
| CN108521718B (en) * | 2018-06-21 | 2023-12-19 | 苏州工业职业技术学院 | Auxiliary device for circuit board processing |
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