CN220108401U - Missile-borne cold guide machine case with buffering shock-absorbing function - Google Patents
Missile-borne cold guide machine case with buffering shock-absorbing function Download PDFInfo
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- CN220108401U CN220108401U CN202321425791.3U CN202321425791U CN220108401U CN 220108401 U CN220108401 U CN 220108401U CN 202321425791 U CN202321425791 U CN 202321425791U CN 220108401 U CN220108401 U CN 220108401U
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- main body
- cover plate
- case main
- lower cover
- missile
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- 230000003139 buffering effect Effects 0.000 title claims abstract description 13
- 238000013016 damping Methods 0.000 claims abstract description 33
- 230000035939 shock Effects 0.000 claims abstract description 19
- 238000010521 absorption reaction Methods 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 11
- 230000006835 compression Effects 0.000 abstract description 7
- 238000007906 compression Methods 0.000 abstract description 7
- 239000012782 phase change material Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004146 energy storage Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Casings For Electric Apparatus (AREA)
Abstract
The utility model relates to a missile-borne cold-conducting chassis with buffering and damping functions, which comprises a chassis main body; a lower cover plate; a shock absorbing assembly; the damping components are distributed between the case main body and the lower cover plate, and the damping components are fixed on the outer wall of the case main body, which is close to the bottom opening. In the utility model, the lower cover plate is matched with the case main body through the shock absorption component, when external load is transmitted to the shock absorption component through the lower cover plate, the external load is buffered after the compression of the shock absorption component is deformed, so that the vibration and impact born by the case main body are ensured to be within a specified range, and the internal components are not damaged. When the lower cover plate transmits vibration to the case main body, the damping rubber pad is impacted, and the external load is buffered after compression deformation, so that the vibration and impact born by the case main body are ensured to be within a specified range.
Description
Technical Field
The utility model relates to the technical field of cases, in particular to a missile-borne cold-conducting case with buffering and damping functions.
Background
A missile-borne chassis is a special chassis that can protect computer equipment during transport. The computer equipment is generally made of materials with the properties of earthquake resistance, water resistance, dust resistance and the like, and can effectively isolate various substances and vibration outside, so that the computer equipment can not be damaged in the transportation process.
Because the working environment of the missile-borne box is complex, the current fixing mode of the box screw connection cannot meet the damping requirement of the missile-borne box during normal working. And external vibration and impact can influence the transmission of electronic signals in the case.
Based on the above, it is necessary to design a missile-borne cold-conducting chassis with a buffering and damping function.
Disclosure of Invention
Aiming at the defects existing in the prior art, the utility model provides a missile-borne cold-conducting chassis with buffering and damping functions, and the specific technical scheme is as follows:
missile-borne cold conducting machine case with buffering shock-absorbing function includes:
a case main body;
a lower cover plate; and
a shock absorbing assembly;
the damping components are distributed between the case main body and the lower cover plate, and the damping components are fixed on the outer wall of the case main body, which is close to the bottom opening.
When external load is transmitted to the shock absorption component through the lower cover plate, the shock absorption component is compressed to buffer external load after deformation, so that vibration and impact born by the case main body are ensured to be within a specified range, and the internal components cannot be damaged.
As an improvement of the above technical solution, the shock absorbing assembly includes:
damping rubber pad and metal bracket;
the damping rubber pad is fixed on the outer wall of the case body through the metal support, and the bottom end of the damping rubber pad is attached to the top surface of the lower cover plate.
The damping rubber pad is fixed on the metal support, the metal support is fixed on the outer wall of the case main body in a welding or bolt connection mode, when the lower cover plate is matched with the case main body, one end of the damping rubber pad is propped against the lower cover plate, when the lower cover plate vibrates on the case main body in a transmission mode, the damping rubber pad is impacted, external load is buffered after compression deformation, and accordingly vibration and impact born by the case main body are guaranteed to be within a specified range. In the process that the lower cover plate is impacted, it is preferable that the lower cover plate is not in contact with the cabinet body to reduce collision noise.
As an improvement of the technical scheme, one side of the case body is provided with a detachable mounting plate, the mounting plate is provided with an adapter plate, and the adapter plate is connected with a functional sub-card arranged on the guide groove in the case body through a printed board arranged on the inner side of the case body.
The detachable installation of mounting panel is fixed on the lateral wall of quick-witted case main part, and the inner wall side with fixed the keysets, the function sub-card is placed in the guide slot in the quick-witted case main part, ensures the function sub-card is placed firmly, and with the socket on the printed plate is interconnected fixedly, the printed plate is connected with the connector that corresponds on the keysets again, thereby realizes the transmission of the inside signal of quick-witted case main part and external signal.
As an improvement of the above technical solution, the top of the case body is opened, and the top is opened with an upper cover plate that covers the opening.
The mechanism design of the opening at the top of the case body can facilitate the installation and the disassembly of the functional daughter card. Preferably, the upper cover plate is fastened to the top of the chassis main body, so that the upper cover plate can be completely removed.
As an improvement of the technical scheme, the side wall of the case main body adjacent to the mounting plate is provided with a heat dissipation notch, and the position of the heat dissipation notch corresponds to the functional sub-card.
A plurality of heat dissipation notches are formed in the side wall of the case main body and used for air cooling heat dissipation, a temperature-equalizing energy storage part filled with phase-change materials is located between the functional sub-cards, heat generated when the functional sub-card inner chip works is transferred to the case main body, the phase-change materials absorb heat and change from solid to liquid, heat is transferred, the phenomenon that the functional sub-card inner chip works abnormally due to the accumulated temperature can be greatly avoided, and the steady-state temperature of the case main body is reduced. And the heat dissipation can be faster by matching with air cooling, so that the whole temperature of the functional daughter card is lower and more uniform.
The utility model has the beneficial effects that:
1. in the utility model, the lower cover plate is matched with the case main body through the shock absorption component, when external load is transmitted to the shock absorption component through the lower cover plate, the external load is buffered after the compression of the shock absorption component is deformed, so that the vibration and impact born by the case main body are ensured to be within a specified range, and the internal components are not damaged.
2. In the utility model, when the lower cover plate transmits vibration to the case main body, the damping rubber pad is impacted, and external load is buffered after compression deformation, so that the vibration and impact born by the case main body are ensured to be within a specified range.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of a damping rubber pad in the overall structure of the present utility model;
fig. 3 is a schematic diagram of a functional daughter card in the overall structure of the present utility model.
Reference numerals: 10. a case main body; 11. a mounting plate; 12. an adapter plate; 13. a printed board; 14. a functional daughter card; 15. a heat dissipation notch; 20. a lower cover plate; 30. a shock absorbing assembly; 31. damping rubber pad; 32. a metal bracket; 40. and an upper cover plate.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Referring to fig. 1-3, fig. 1 is a schematic view of the overall structure of the present utility model; FIG. 2 is a schematic view of a damping rubber pad in the overall structure of the present utility model; fig. 3 is a schematic diagram of a functional daughter card in the overall structure of the present utility model.
Missile-borne cold conducting machine case with buffering shock-absorbing function includes:
a case main body 10;
a lower cover plate 20; and
a damper assembly 30;
wherein, the shock absorbing assembly 30 is distributed between the case body 10 and the lower cover plate 20, and the shock absorbing assembly 30 is fixed on the outer wall of the case body 10 near the bottom opening.
Specifically, when the external load is transferred to the shock-absorbing assembly 30 through the lower cover plate 20 by the shock-absorbing assembly 30 in cooperation between the lower cover plate 20 and the chassis main body 10, the external load is buffered after the compression of the shock-absorbing assembly 30 is deformed, so that the vibration and impact born by the chassis main body 10 are ensured to be within a specified range, and the internal components are not damaged.
Referring to fig. 1 and 2, in one embodiment, shock assembly 30 includes:
damping rubber pad 31 and metal bracket 32;
the damping rubber pad 31 is fixed on the outer wall of the case body 10 through the metal bracket 32, and the bottom end of the damping rubber pad 31 is attached to the top surface of the lower cover plate 20.
Specifically, the damping rubber pad 31 is fixed on the metal bracket 32, the metal bracket 32 is fixed on the outer wall of the chassis main body 10 by welding or bolting, when the lower cover plate 20 is matched with the chassis main body 10, one end of the damping rubber pad 31 abuts against the lower cover plate 20, when the lower cover plate 20 transmits vibration to the chassis main body 10, the damping rubber pad 31 is impacted, and after compression deformation, external load is buffered, so that vibration and impact borne by the chassis main body 10 are ensured to be within a specified range. During the impact of the lower cover 20, the lower cover 20 is preferably not in contact with the cabinet body 10 to reduce collision noise.
Referring to fig. 1, in one embodiment, a detachable mounting board 11 is provided on one side of a chassis body 10, an adapter board 12 is provided on the mounting board 11, and the adapter board 12 is interconnected with a functional daughter card 14 mounted on a guide groove inside the chassis body 10 through a printed board 13 mounted on the inner side of the chassis body 10.
The mounting plate 11 is detachably mounted and fixed on the side wall of the case body 10, the adapter plate 12 is fixed on the inner wall side, the functional daughter card 14 is placed in a guide groove in the case body 10, the functional daughter card 14 is ensured to be placed stably, the functional daughter card is fixedly connected with a socket on the printed board 13, and the printed board 13 is connected with a corresponding connector on the adapter plate 12, so that transmission of signals inside the case body 10 and external signals is realized.
Referring to fig. 1, in one embodiment, the case body 10 is opened at the top, and an upper cover 40 is provided to cover the opening.
The mechanism design of the top opening of the case body 10 can facilitate the installation and the removal of the functional daughter card 14. Preferably, the upper cover 40 is fastened to the top of the casing body 10, so that the upper cover 40 can be completely removed.
Referring to fig. 1 and 3, in one embodiment, a heat dissipation slot 15 is formed on a side wall of the chassis body 10 adjacent to the mounting board 11, and a position of the heat dissipation slot 15 corresponds to the functional daughter card 14.
A plurality of heat dissipation notches 15 are formed in the side wall of the case main body 10 and used for air cooling and heat dissipation, and the temperature-equalizing energy storage part filled with the phase-change material is positioned between the functional daughter cards 14, and heat generated when the chips inside the functional daughter cards 14 work is transferred to the case main body 10, the phase-change material absorbs heat and changes from solid to liquid, and then heat is transferred, so that abnormal work of the chips inside the functional daughter cards 14 due to accumulated problems can be greatly avoided, and the steady-state temperature of the case main body 10 is reduced. And the heat dissipation can be faster by matching with air cooling, so that the overall temperature of the functional daughter card 14 is lower and more uniform.
The use of the phase-change material as the homogeneous temperature energy storage portion is a conventional technical means for heat dissipation and temperature reduction, and is not a key point to be protected in the scheme, so that a specific structure thereof is not described in detail.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (5)
1. Missile-borne cold conducting machine case with buffering shock-absorbing function, characterized by comprising:
a case body (10);
a lower cover plate (20); and
a shock absorbing assembly (30);
the shock absorption components (30) are distributed between the case main body (10) and the lower cover plate (20), and the shock absorption components (30) are fixed on the outer wall of the case main body (10) close to the bottom opening.
2. The missile-borne cold conducting chassis with buffering and damping functions according to claim 1, wherein the cold conducting chassis is characterized by:
the shock absorbing assembly (30) comprises:
a damping rubber pad (31) and a metal bracket (32);
the damping rubber pad (31) is fixed on the outer wall of the case body (10) through the metal bracket (32), and the bottom end of the damping rubber pad (31) is attached to the top surface of the lower cover plate (20).
3. The missile-borne cold conducting chassis with buffering and damping functions according to claim 1, wherein the cold conducting chassis is characterized by:
one side of the case main body (10) is provided with a detachable mounting plate (11), the mounting plate (11) is provided with an adapter plate (12), and the adapter plate (12) is connected with a functional daughter card (14) arranged on an inner guide groove of the case main body (10) through a printed board (13) arranged on the inner side of the case main body (10).
4. A missile-borne cold conducting chassis with buffering and damping functions according to any one of claims 1-3, wherein:
the top of the case body (10) is opened, and an upper cover plate (40) which is covered with the opening hole is arranged at the top of the case body.
5. The missile-borne cold conducting chassis with buffering and damping functions according to claim 3, wherein:
and a heat dissipation notch (15) is formed in the side wall of the case body (10) adjacent to the mounting plate (11), and the position of the heat dissipation notch (15) corresponds to the functional daughter card (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321425791.3U CN220108401U (en) | 2023-06-06 | 2023-06-06 | Missile-borne cold guide machine case with buffering shock-absorbing function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321425791.3U CN220108401U (en) | 2023-06-06 | 2023-06-06 | Missile-borne cold guide machine case with buffering shock-absorbing function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220108401U true CN220108401U (en) | 2023-11-28 |
Family
ID=88845370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321425791.3U Active CN220108401U (en) | 2023-06-06 | 2023-06-06 | Missile-borne cold guide machine case with buffering shock-absorbing function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220108401U (en) |
-
2023
- 2023-06-06 CN CN202321425791.3U patent/CN220108401U/en active Active
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