CN220103572U

CN220103572U - Wafer drying device

Info

Publication number: CN220103572U
Application number: CN202321457787.5U
Authority: CN
Inventors: 仇旭东; 陈林锋; 周雅惠; 王苏成
Original assignee: Zhejiang Tianji Integrated Circuit Technology Co ltd
Current assignee: Zhejiang Tianji Integrated Circuit Technology Co ltd
Priority date: 2023-06-09
Filing date: 2023-06-09
Publication date: 2023-11-28
Anticipated expiration: 2033-06-09

Abstract

The utility model discloses a wafer drying device, which relates to the technical field of wafer drying and comprises a heating mechanism and a drying mechanism; the heating mechanism comprises a nitrogen tank, and the top of the nitrogen tank is fixedly communicated with a vent pipe; according to the utility model, the first motor is fixedly arranged at the bottom of the vent pipe, the output end of the first motor is fixedly connected with the fan wheel, the fan wheel is driven to rotate by the first motor, the nitrogen valve is opened, nitrogen in the nitrogen tank is introduced into the vent pipe, the heating pipe is used for heating the nitrogen, and then the nitrogen in the vent pipe is introduced into the drying box, so that the wafer placed in the wafer placing tray is dried, and the wafer placing tray is prevented from being damaged by direct rotation; through installing the second motor at the top of drying cabinet, at the output fixed mounting agitator of second motor, utilize the second motor to rotate and drive the agitator rotation, accelerate the drying rate of wafer, make the wafer reach even dry purpose.

Description

Wafer drying device

Technical Field

The utility model relates to the technical field of wafer drying, in particular to a wafer drying device.

Background

The raw materials of the wafer are derived from sand, silicon in the sand is extracted through deoxidation, and generally the deoxidized sand exists in the form of silicon dioxide, which is the most original wafer material, the raw materials are melted and purified, the purity of the raw materials is improved, the raw materials are cooled, cut into cylindrical slices after molding, repeatedly cleaned, and finally dried.

In the prior art, most of the heating modes or motors are used for driving the wafer placing plates to rotate fast so that the wafers can achieve the drying effect, but the direct heating and drying speed is low, the efficiency is low, the motors are used for driving the wafer placing plates to rotate, water drops are thrown out by utilizing the centrifugal force, the situation that the wafers are damaged is easily caused, the later use is not facilitated, and the processing cost is increased.

Disclosure of Invention

The utility model aims to solve the problems that in the prior art, most of the problems that a heating mode is used or a motor drives a wafer placing plate to rotate quickly so that a wafer can be dried, but the direct heating and drying speed is low, the efficiency is low, the motor drives the wafer placing plate to rotate, water drops are thrown out by utilizing the action of centrifugal force, the wafer is easy to damage, the later use is not facilitated, and the processing cost is increased.

In order to achieve the above purpose, the present utility model adopts the following technical scheme: a wafer drying device comprises a heating mechanism and a drying mechanism; the heating mechanism comprises a nitrogen tank, the top of the nitrogen tank is fixedly communicated with a vent pipe, the outer surface wall of the vent pipe is fixedly provided with a nitrogen valve, the inner wall of the vent pipe is fixedly provided with a heating pipe, the air outlet end of the vent pipe is fixedly provided with a support plate, one end of the support plate is fixedly provided with a first motor, and the output end of the first motor is fixedly connected with a fan wheel; the drying mechanism comprises a drying box, a screw is inserted into the drying box, the outer surface wall of the screw is in threaded connection with a connecting block, a wafer placing disc is fixedly arranged at the top of the connecting block, a sliding groove is formed in the drying box, a sliding block is connected inside the sliding groove in a sliding mode, and one end of the sliding block is fixedly connected with the outer surface wall of the drying box.

Preferably, a round hole is formed in the top of the drying box in a penetrating mode, a second motor is fixedly installed in the round hole, and the output end of the second motor is fixedly connected with a stirring wheel.

Preferably, a protective shell is sleeved on the outer surface wall of the second motor, and one end of the drying box is hinged with a material taking door.

Preferably, the outer surface wall of the material taking door is fixedly provided with a handle, the outer surface wall of the material taking door is provided with a square hole, and the inside of the square hole is fixedly provided with a glass window.

Preferably, the outer surface wall of the drying box is fixedly communicated with a liquid discharge pipe, a third motor is fixedly arranged on the outer surface wall of the drying box, and the output end of the third motor is fixedly connected with one end of the screw rod.

Preferably, one end of the vent pipe is fixedly inserted into the top of the drying box, and the installation height of the stirring wheel is higher than that of the wafer placing tray.

Compared with the prior art, the utility model has the advantages and positive effects that:

1. according to the utility model, one end of the vent pipe is fixedly connected with the support plate, one end of the support plate is fixedly connected with the first motor, the output end of the first motor is fixedly connected with the fan wheel, the fan wheel is driven by the first motor to rotate, the nitrogen valve is opened, nitrogen in the nitrogen tank is introduced into the vent pipe, the heating pipe is used for heating the nitrogen, the nitrogen in the vent pipe is introduced into the drying box, and the wafer placed in the wafer placing tray is dried, so that the wafer placing tray is prevented from being damaged by direct rotation.

2. According to the utility model, the second motor is arranged at the top of the drying box, the stirring wheel is fixedly arranged at the output end of the second motor, and the stirring wheel is driven to rotate by the rotation of the second motor, so that the drying speed of the wafer is accelerated, and the wafer is uniformly dried.

Drawings

Fig. 1 is a schematic perspective view of a wafer drying apparatus according to the present utility model;

FIG. 2 is a schematic perspective view of a heating mechanism of a wafer drying apparatus according to the present utility model;

FIG. 3 is a schematic perspective view of a drying mechanism in a wafer drying apparatus according to the present utility model;

fig. 4 is a perspective sectional view showing a drying mechanism in a wafer drying apparatus according to the present utility model.

Legend description: 1. a heating mechanism; 101. a nitrogen tank; 102. a vent pipe; 103. a nitrogen valve; 104. heating pipes; 105. a support plate; 106. a first motor; 107. a fan wheel; 2. a drying mechanism; 201. a drying box; 202. a screw; 203. a connecting block; 204. a wafer placement tray; 205. a chute; 206. a slide block; 207. a protective shell; 208. a second motor; 209. a stirring wheel; 210. a material taking door; 211. a third motor; 212. a glazing; 213. a handle; 214. and a liquid discharge pipe.

Detailed Description

In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.

As shown in fig. 1 to 4, the present utility model provides a wafer drying apparatus, which comprises a heating mechanism 1 and a drying mechanism 2; the heating mechanism 1 comprises a nitrogen tank 101, a vent pipe 102 is fixedly communicated with the top of the nitrogen tank 101, a nitrogen valve 103 is fixedly arranged on the outer surface wall of the vent pipe 102, a heating pipe 104 is fixedly arranged on the inner wall of the vent pipe 102, a support plate 105 is fixedly arranged at the air outlet end of the vent pipe 102, a first motor 106 is fixedly arranged at one end of the support plate 105, and a fan wheel 107 is fixedly connected with the output end of the first motor 106; the drying mechanism 2 comprises a drying box 201, a screw 202 is inserted into the drying box 201, a connecting block 203 is connected to the outer surface wall of the screw 202 in a threaded manner, a wafer placing disc 204 is fixedly arranged at the top of the connecting block 203, a sliding groove 205 is formed in the drying box 201, a sliding block 206 is connected to the sliding groove 205 in a sliding manner, and one end of the sliding block 206 is fixedly connected with the outer surface wall of the drying box 201; firstly, placing a wafer in a wafer placing tray 204, opening a nitrogen valve 103, driving a fan wheel 107 to rotate by using a first motor 106 to pump nitrogen into a vent pipe 102 from a nitrogen tank 101, heating the nitrogen by using a heating pipe 104 fixedly installed on the inner wall of the vent pipe 102, and drying the wafer by inserting one end of the vent pipe 102 into the top of a drying box 201 and communicating with the drying box 201, wherein the heated nitrogen enters the drying box 201; then through the fixed connection stirring wheel 209 of the output of second motor 208, the rotation of drive stirring wheel 209 by the rotation of second motor 208 rotates, stir the gas in the drying cabinet 201, accelerate the drying progress of wafer, make the wafer reach even dry effect, the steam deposit that leaves after the drying treatment is in the bottom of drying cabinet 201, discharge from the drying cabinet 201 by fluid-discharge tube 214, finally drive the wafer by third motor 211 and place the dish 204 and remove, make the slider 206 of wafer place the both sides fixed mounting of dish 204 remove in the inside of spout 205, inject the angle that wafer place the dish 204 and remove.

As shown in fig. 4, a round hole is formed through the top of the drying oven 201, a second motor 208 is fixedly installed in the round hole, and the output end of the second motor 208 is fixedly connected with a stirring wheel 209; through installing second motor 208 at the top of drying cabinet 201, fixed mounting agitation wheel 209 at the output of second motor 208, utilize second motor 208 rotation to drive agitation wheel 209 rotation, accelerate the drying rate of wafer, make the wafer reach even dry purpose.

As shown in fig. 4, a protective shell 207 is sleeved on the outer surface wall of the second motor 208, and a material taking door 210 is hinged to one end of the drying oven 201; through the cover of the outer surface wall of the second motor 208 is provided with the protective shell 207, a certain protection effect is played for the second motor 208, and then the material taking door 210 is hinged to one end of the drying oven 201, so that the dried wafer can be taken out conveniently.

As shown in fig. 4, a handle 213 is fixedly installed on the outer surface wall of the material taking door 210, a square hole is formed on the outer surface wall of the material taking door 210, and a glass window 212 is fixedly installed inside the square hole; by fixedly mounting the handle 213 on the outer surface wall of the material taking door 210, the material taking door 210 is conveniently opened, and the glass window 212 is mounted on the outer surface wall of the material taking door 210, so that the condition in the drying oven 201 can be conveniently observed through the glass window 212.

As shown in fig. 3 and 4, the outer surface wall of the drying oven 201 is fixedly communicated with a liquid discharge pipe 214, the outer surface wall of the drying oven 201 is fixedly provided with a third motor 211, and the output end of the third motor 211 is fixedly connected with one end of the screw 202; the drain pipe 214 is fixedly communicated with the outer surface wall of the drying box 201, so that water in the drying box 201 is conveniently drained, and the third motor 211 is fixedly arranged on the outer surface wall of the drying box 201 and is fixedly connected with the screw 202, so that the screw 202 is conveniently driven to rotate.

As shown in fig. 2 and 4, one end of the ventilation pipe 102 is fixedly inserted into the top of the drying box 201, and the installation height of the stirring wheel 209 is higher than that of the wafer placing tray 204; by fixedly inserting the vent pipe 102 at the top of the drying box 201, nitrogen gas is conveniently introduced into the drying box 201, and the wafer is dried.

Working principle: when the device is used, a wafer is placed in a wafer placing tray 204, a nitrogen valve 103 is opened, a fan wheel 107 is driven by a first motor 106 to rotate to extract nitrogen from a nitrogen tank 101 into a vent pipe 102, the nitrogen is heated by a heating pipe 104 fixedly arranged on the inner wall of the vent pipe 102, one end of the vent pipe 102 is inserted into the top of a drying box 201 and is communicated with the drying box 201, the heated nitrogen enters the drying box 201, and the wafer is dried; then through the fixed connection stirring wheel 209 of output of second motor 208, the rotation of driving stirring wheel 209 by second motor 208 rotates, stir the gas in the drying cabinet 201, accelerate the drying progress of wafer, make the wafer reach even dry effect, the steam deposit that leaves after the drying treatment is in the bottom of drying cabinet 201, discharge from the drying cabinet 201 by fluid-discharge tube 214, finally drive the wafer by third motor 211 and place the dish 204 and remove, make the slider 206 of wafer place dish 204 both sides fixed mounting remove in the inside of spout 205, limit the angle that wafer place the dish 204 removed, pull handle 213 again, open material door 210, take out the dry wafer.

The present utility model is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present utility model without departing from the technical content of the present utility model still belong to the protection scope of the technical solution of the present utility model.

Claims

1. The wafer drying device is characterized by comprising a heating mechanism (1) and a drying mechanism (2);

the heating mechanism (1) comprises a nitrogen tank (101), a vent pipe (102) is fixedly communicated with the top of the nitrogen tank (101), a nitrogen valve (103) is fixedly arranged on the outer surface wall of the vent pipe (102), a heating pipe (104) is fixedly arranged on the inner wall of the vent pipe (102), a support plate (105) is fixedly arranged at the air outlet end of the vent pipe (102), a first motor (106) is fixedly arranged at one end of the support plate (105), and a fan wheel (107) is fixedly connected with the output end of the first motor (106);

drying mechanism (2) are including drying cabinet (201), the inside of drying cabinet (201) is inserted and is equipped with screw rod (202), the exterior wall threaded connection of screw rod (202) has connecting block (203), the top fixed mounting of connecting block (203) has wafer to place dish (204), spout (205) have been seted up to the inside of drying cabinet (201), the inside sliding connection of spout (205) has slider (206), the one end of slider (206) and the exterior wall fixed connection of drying cabinet (201).

2. A wafer drying apparatus according to claim 1, wherein: the top of drying cabinet (201) runs through and has seted up the round hole, and the inside fixed mounting of round hole has second motor (208), the output fixedly connected with stirring wheel (209) of second motor (208).

3. A wafer drying apparatus according to claim 2, wherein: the outer surface wall of the second motor (208) is sleeved with a protective shell (207), and one end of the drying oven (201) is hinged with a material taking door (210).

4. A wafer drying apparatus according to claim 3, wherein: the outer surface wall of the material taking door (210) is fixedly provided with a handle (213), the outer surface wall of the material taking door (210) is provided with a square hole, and the inside of the square hole is fixedly provided with a glass window (212).

5. A wafer drying apparatus according to claim 1, wherein: the outer surface wall of the drying box (201) is fixedly communicated with a liquid discharge pipe (214), a third motor (211) is fixedly arranged on the outer surface wall of the drying box (201), and the output end of the third motor (211) is fixedly connected with one end of the screw rod (202).

6. A wafer drying apparatus according to claim 2, wherein: one end of the ventilation pipe (102) is fixedly inserted into the top of the drying box (201), and the installation height of the stirring wheel (209) is higher than that of the wafer placing tray (204).