CN220099166U

CN220099166U - Magnetron sputtering double-sided coating system

Info

Publication number: CN220099166U
Application number: CN202321635628.XU
Authority: CN
Inventors: 刘建波
Original assignee: Kunshan Dongwei Technology Co Ltd
Current assignee: Kunshan Dongwei Technology Co Ltd
Priority date: 2023-06-26
Filing date: 2023-06-26
Publication date: 2023-11-28
Anticipated expiration: 2033-06-26

Abstract

The utility model relates to the technical field of coating, and provides a magnetron sputtering double-sided coating system, which comprises: a housing having a cavity; the driving device comprises a first driving component and a second driving component; the film coating roller structure is rotatably arranged on the first driving component; and a sputtering magnetic pole structure mounted on the second drive assembly. The system has a working state for coating and a stopping state for stopping coating, when the system is in the working state, the first driving component and the second driving component respectively drive the coating roller structure and the sputtering magnetic pole structure to enter the cavity of the shell so as to carry out coating operation, when the system is in the stopping state for stopping coating, the first driving component is used for driving the sputtering magnetic pole structure to exit the cavity so as to replace the cathode target on the sputtering magnetic pole structure, and the second driving component is used for driving the coating roller structure to exit the cavity so as to take and load the film.

Description

Magnetron sputtering double-sided coating system

Technical Field

The utility model relates to the technical field of coating, in particular to a magnetron sputtering double-sided coating system.

Background

The rapid development of the new energy automobile industry has become a main motive force for promoting the increase of the copper foil market demand of the Chinese lithium battery. The development direction and purpose of the lithium electric copper foil are light, thin and low-cost, and the PET (polyethylene terephthalate) copper foil is one of important development directions, and is an interlayer power battery current collector material which uses PET as a conductive film and copper films as plating layers on two sides respectively, so that the purpose of light battery can be achieved. The plating process of the lithium battery copper foil generally conveys the PET substrate into a closed plating cavity to perform a plating process in the plating cavity.

In the prior art, in the magnetron sputtering process, the target material and the reaction gas are subjected to the action of high energy of electric power to form plasma, so that the plasma is deposited on a substrate along the sputtering direction to perform ion sputtering coating, in a double-sided coating system, a sputtering magnetic pole structure and a coating roller structure are arranged in a coating cavity, after the consumption of the cathode target material or the winding is finished, the cathode target material is required to be replaced after a door body of the equipment is opened, or the film material on the coating roller is taken down, but in the operation process, the components are compactly arranged, the operation space is narrow, the cathode target material is inconvenient to replace, the coating efficiency is reduced, and meanwhile, the film material is possibly damaged in the process of taking the film material, the coating efficiency is also low, and the defective product rate is high.

Disclosure of Invention

Therefore, the technical problem to be solved by the utility model is to overcome the defects that in the prior art, in the magnetron sputtering process, the target and the reaction gas are subjected to the action of high energy to form plasma so as to enable the plasma to be deposited on the substrate along the sputtering direction to perform ion sputtering coating, in a double-sided coating system, a sputtering magnetic pole structure and a coating roller structure are arranged in a coating cavity, after the consumption of the cathode target or the winding is finished, the door body of the equipment is required to be opened, the cathode target is replaced, or the film on the coating roller is taken down, but in the operation, due to compact arrangement of each part, the operation space is narrow, the cathode target is inconvenient to replace, the coating efficiency is reduced, and meanwhile, the film is possibly damaged in the process of taking the film, the coating efficiency is low, and the defective rate is high.

A magnetron sputtering double-sided coating system, comprising: a housing having a cavity; the driving device comprises a first driving component and a second driving component; the film coating roller structure is rotatably arranged on the first driving assembly; a sputtering magnetic pole structure mounted on the second drive assembly; the magnetron sputtering double-sided coating system is provided with a working state for coating and a stopping state for stopping coating, and in the working state, the first driving assembly and the second driving assembly respectively drive the sputtering magnetic pole structure and the coating roller structure to enter the cavity so that the sputtering end of the sputtering magnetic pole structure faces the coating roller structure; in the shutdown state, the first driving assembly drives the sputtering magnetic pole structure to exit the cavity, and/or the second driving assembly drives the coating roller structure to exit the cavity.

Optionally, in the magnetron sputtering double-sided film plating system, the magnetron sputtering double-sided film plating system further comprises a mounting assembly, the sputtering magnetic pole structure is mounted on the second driving assembly through the mounting assembly, the mounting assembly comprises an anode mounting piece and a cathode mounting piece, the cathode mounting piece is mounted on the second driving assembly, the anode mounting piece is mounted on the cathode mounting piece, any one of the sputtering magnetic pole structure comprises an anode unit and a cathode unit which are arranged at intervals, wherein the anode unit is mounted on the anode mounting piece, and the cathode unit is mounted on the cathode mounting piece.

Optionally, in the magnetron sputtering double-sided film plating system, the cathode mounting member includes a cathode mounting substrate and a cathode mounting frame, the cathode unit is disposed on the cathode mounting frame, one end of the anode mounting member is mounted on the cathode mounting substrate, and two sides of the anode mounting member are symmetrically provided with one cathode mounting frame.

Optionally, in the magnetron sputtering double-sided film plating system, the cathode mounting substrate is in an arc mounting substrate structure, and all cathode units are distributed in an arc along the central line of the arc mounting substrate.

Optionally, in the magnetron sputtering double-sided coating system, the cathode unit is configured to be adjustably disposed relative to the cathode mounting frame, so as to adjust a distance between the cathode unit and the coating roller.

Optionally, in the magnetron sputtering double-sided film plating system, a shielding plate is further arranged between any two adjacent sputtering magnetic pole structures.

Optionally, in the magnetron sputtering double-sided film plating system, the second driving assembly includes a second driving body, the film plating roller structure includes a front film plating roller and a back film plating roller, the front film plating roller and the back film plating roller are disposed on the second driving body at intervals, and any film plating roller is correspondingly configured with at least six pairs of sputtering magnetic pole structures.

Optionally, in the magnetron sputtering double-sided film plating system, the second driving component further includes a second driving member, and the second driving member is disposed corresponding to the front film plating roller and the back film plating roller, so as to drive the film plating roller to rotate.

Optionally, in the magnetron sputtering double-sided film plating system, a cross section of the shell is in an elliptical structure.

Optionally, in the magnetron sputtering double-sided film plating system, a partition plate is further arranged in the shell, the partition plate divides the shell into a film plating cavity and a winding cavity, the film plating roller structure further comprises an unreeling roller and a guide roller which are symmetrically arranged, part of the front film plating roller and part of the back film plating roller are arranged in the film plating cavity, the other part of the front film plating roller and the back film plating roller are positioned in the winding cavity, and all the unreeling roller and the guide roller are arranged in the winding cavity.

Optionally, in the magnetron sputtering double-sided film plating system, the magnetron sputtering double-sided film plating system further comprises a heating component, and the heating component is arranged in the winding cavity corresponding to the unreeling roller.

Optionally, in the magnetron sputtering double-sided film plating system, the heating component includes a heating element and a connector, and a power supply is connected with the heating element through the connector so as to heat the heating element.

The technical scheme of the utility model has the following advantages:

1. the utility model provides a magnetron sputtering double-sided coating system, which comprises: a housing having a cavity; the driving device comprises a first driving component and a second driving component; the film coating roller structure is rotatably arranged on the first driving component; a sputtering magnetic pole structure mounted on the second drive assembly; the magnetron sputtering double-sided coating system is provided with a working state for coating and a stopping state for stopping coating, and in the working state, the first driving assembly and the second driving assembly respectively drive the sputtering magnetic pole structure and the coating roller structure to enter the cavity so that the sputtering end of the sputtering magnetic pole structure faces the coating roller structure; in the shutdown state, the first driving assembly drives the sputtering magnetic pole structure to exit the cavity, and/or the second driving assembly drives the coating roller structure to exit the cavity.

In the magnetron sputtering double-sided coating system with the structure, the first driving component and the second driving component of the driving device respectively drive the coating roller structure and the sputtering magnetic pole structure to move, the magnetron sputtering double-sided coating system has a working state for coating and a stopping state for stopping coating, when the system is in the working state, the first driving component and the second driving component respectively drive the coating roller structure and the sputtering magnetic pole structure to enter the cavity of the shell, the sputtering end of the sputtering magnetic pole structure is arranged towards the coating roller structure, and the cavity is sealed to perform coating operation, when the system is in the stopping state for stopping coating, which requires replacing a cathode target or taking the film, the first driving component is utilized to drive the sputtering magnetic pole structure to withdraw from the cavity, so as to replace the cathode target on the sputtering magnetic pole structure, of course, the second driving component can also be used for driving the film coating roller structure to exit the cavity so as to take and load the film material, thereby ensuring the normal use of the magnetron sputtering double-sided film coating system, when the film coating roller structure exits the cavity so as to take and load the film material or the sputtering magnetic pole structure exits the cavity so as to replace the cathode target material, the external space is larger than the cavity space of the shell, thereby facilitating the replacement or taking and loading operation of staff, ensuring higher flexibility, ensuring the normal performance of film coating, further improving the production efficiency, overcoming the defects that in the prior art, in the magnetron sputtering process, the target material and the reaction gas are subjected to the high-energy action of electric power to form plasma so as to enable the plasma to be deposited on the substrate along the sputtering direction for ion sputtering film coating, in the double-sided film coating system, the sputtering magnetic pole structure and the film coating roller structure are arranged in the film coating cavity, after the consumption of the cathode target material is finished or the winding is finished, the door body of the equipment is required to be opened, the cathode target is replaced or the film on the film coating roller is taken down, but in operation, due to the compact arrangement of the components, the operation space is narrow, the cathode target is inconvenient to replace, the film coating efficiency is reduced, meanwhile, the film is possibly damaged in the process of taking the film, and the defects of low film coating efficiency and high defective rate are also caused.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of a connection structure between a mounting assembly and a second driving body according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of the position structure of the second driving assembly and the cathode mounting base plate and the water cooling plate;

FIG. 3 is a schematic diagram of a first driving assembly;

FIG. 4 is a schematic diagram of the position structures of the first driving body and the first driving member;

FIG. 5 is a schematic illustration of the sputtering pole structure and the position of the coating roller and heating assembly;

FIG. 6 is a schematic view of a flattened structure installation;

FIG. 7 is a schematic diagram of the position structure of the flattening roller and the coating roller;

FIG. 8 is a schematic view of a heating assembly;

FIG. 9 is a schematic diagram of a force analysis of a nip roll;

FIG. 10 is a schematic view of the angular variation of a flattening roller;

FIG. 11 is a schematic diagram of the overall structure of a magnetron sputtering double-sided coating system;

reference numerals illustrate:

100. a housing; 101. a cavity; 102. a partition plate;

200. a first drive assembly; 201. a first driving body; 202. a first driving member; 203. a first drive shaft;

300. a second drive assembly; 301. a second driving body; 302. a third driving member; 303. a second drive shaft;

400. a coating roller structure; 401. a front surface film coating roller; 402. a reverse side film coating roller; 403. an unreeling roller; 404. a guide roller;

500. sputtering a magnetic pole structure; 501. an anode unit; 502. a cathode unit;

600. a mounting assembly;

601. an anode mounting member;

602. a cathode mount; 6021. a cathode mounting substrate; 6022. a cathode mounting rack;

603. a shielding plate; 604. a water cooling plate;

700. a heating assembly; 701. a heating member; 702. a joint;

800. a flattened structure; 801. a flattening roller; 802. flattening the driving member; 803. and (5) supporting frames.

Detailed Description

The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In addition, the technical features of the different embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.

Example 1

This embodiment describes a magnetron sputtering double-sided coating system, see fig. 11, comprising a housing 100, a driving device, a coating roller structure 400 and a sputtering magnetic pole structure 500, wherein the housing 100 has a cavity 101, the driving device comprises a first driving assembly 200 and a second driving assembly 300, the coating roller structure 400 is rotatably mounted on the first driving assembly 200, and the sputtering magnetic pole structure 500 is mounted on the second driving assembly 300.

The magnetron sputtering double-sided coating system in this embodiment has a working state for coating and a stop state for stopping coating, and in the working state, the first driving assembly 200 and the second driving assembly 300 respectively drive the sputtering magnetic pole structure 500 and the coating roller structure 400 to enter the cavity 101, so that the sputtering end of the sputtering magnetic pole structure 500 is set towards the coating roller structure 400; in the shutdown state, the first driving assembly 200 drives the sputtering magnetic pole structure 500 to exit the cavity 101, and the second driving assembly 300 may also drive the coating roller structure 400 to exit the cavity 101.

The first driving component 200 and the second driving component 300 of the driving device respectively drive the coating roller structure 400 and the sputtering magnetic pole structure 500 to move, the magnetron sputtering double-sided coating system has a working state for coating and a shutdown state for stopping coating, when the system is in the working state, the first driving component 200 and the second driving component respectively drive the coating roller structure 400 and the sputtering magnetic pole structure 500 to enter the cavity 101 of the shell 100, the sputtering end of the sputtering magnetic pole structure 500 is arranged towards the coating roller structure 400, and the cavity 101 is sealed to carry out coating operation, when the system is in the shutdown state for stopping coating, which requires replacing a cathode target or taking a film, the first driving component 200 is used for driving the sputtering magnetic pole structure 500 to withdraw the cavity 101 so as to replace the cathode target on the sputtering magnetic pole structure 500, or the second driving component 300 is used for driving the coating roller structure 400 to withdraw the cavity 101 so as to take the film, and the normal use of the magnetron sputtering double-sided coating system is ensured, when the sputtering roller structure 400 withdraws from the cavity 101 so as to take the film or the sputtering magnetic pole structure 500 to withdraw the cavity so as to ensure the relative replacement of the cathode target, the cathode target is more flexible than the shell 101, the working space is more convenient to replace the cathode target, and the production space is more convenient to replace the cathode target is replaced, and the production space is more normal.

The magnetron sputtering double-sided coating system in this embodiment further includes a mounting assembly 600, the sputtering magnetic pole structure 500 is mounted on the second driving assembly 300 through the mounting assembly 600, the mounting assembly 600 includes an anode mounting member 601 and a cathode mounting member 602, wherein the cathode mounting member 602 is mounted on the second driving assembly 300, the anode mounting member 601 is mounted on the cathode mounting member 602, any one of the sputtering magnetic pole structures 500 includes an anode unit 501 and a cathode unit 502 which are disposed at intervals, the anode unit 501 is mounted on the anode mounting member 601, the anode unit 501 and the cathode unit 502 are disposed in one-to-one correspondence, and the cathode unit 502 is mounted on the cathode mounting member 602.

In the magnetron sputtering double-sided coating system, the cathode mounting member 602 includes a cathode mounting substrate 6021 and a cathode mounting frame 6022, the cathode mounting plate is connected to the first driving assembly 200, the cathode unit 502 is disposed on the cathode mounting frame 6022, one end of the anode mounting member 601 is mounted on the cathode mounting substrate 6021, and two sides of the anode mounting member 601 are symmetrically provided with a cathode mounting frame 6022, the cathode unit 502 in this embodiment adopts a cylindrical target, an end of the cylindrical target is mounted on the cathode mounting frame 6022, after the mounting is completed, the end of the cylindrical target is connected to the rotating motor to drive the cylindrical target to rotate, in other embodiments, the cylindrical targets of the cathode unit 502 in the adjacent sputtering magnetic pole structure 500 can be configured as different target materials, when the coating roller structure 400 drives the active film materials to move, a continuous coating process can be performed on any single side of the film materials, so that the surface of the coating substrate can cover different film layers.

In the magnetron sputtering double-sided coating system in this embodiment, the cathode mounting substrate 6021 may be configured as an arc mounting substrate, and all the cathode units 502 are configured in an arc distribution along the center line of the arc mounting substrate, which can promote uniformity of plasma distribution during coating, and is beneficial to improving coating quality.

In this embodiment, in order to select different sputtering distances according to different coating processes, any one of the cathode units 502 is configured to be adjustable relative to the cathode mounting frame 6022, so as to adjust the distance between the cathode unit 502 and the coating roller, in practical use, the cathode unit 502 adopts a cylindrical target, the cathode mounting frame 6022 has a mounting portion, an end portion of the cylindrical target is sleeved and clamped on the mounting portion, when the sputtering distance needs to be adjusted, the distance between the cylindrical target and the coating roller can be adjusted only by sliding the cylindrical target relative to the cathode mounting frame 6022 or removing the cylindrical target to readjust the position of the cylindrical target on the cathode mounting frame 6022, so that the requirements of different sputtering distances are met, in practical use, the mounting portion of the cathode mounting frame 6022 is matched with the end portion of the cylindrical target, for example, the mounting frame 6022 is circular, and the other end of the cathode mounting frame 6022 can be rectangular.

In this embodiment, a shielding plate 603 is further disposed between any two adjacent sputtering magnetic pole structures 500, the shielding plate 603 can avoid mutual interference between the adjacent six pairs of sputtering magnetic pole structures 500 during sputtering, avoid reaction during coating of dissimilar metals, improve coating quality, and the shielding plate 603 and the cathode mounting substrate 6021 are integrally formed.

In the present embodiment, five shielding plates 603 are provided corresponding to each of the front side plating roller 401 and the back side plating roller 402 to form six pairs of positions correspondingly, so that six pairs of sputtering magnetic pole structures 500 are mounted correspondingly.

In this embodiment, a water cooling plate 604 may be correspondingly installed on the cathode installation substrate 6021, and a communication cavity is formed between the shielding plate 603 and the water cooling plates 604, so as to connect with a cooling liquid, and heat generated during sputtering is taken away through water cooling heat exchange, so that the temperature of the whole equipment during film plating is reduced.

The shielding plate 603 is further provided with a shielding plate, the shielding plate 603 and the shielding plate 603 can be detachably structured, replacement is facilitated, and when in actual use, the shielding plate can be arranged on the inner wall surfaces of two adjacent shielding plates 603, and the shielding plate can be a shielding plate common in the prior art.

The anode mount 601 in the present embodiment may employ an anode mount, mount the anode mount on the cathode mount base 6021 and then mount the anode unit 501 on the anode mount.

The second driving assembly 300 in this embodiment includes a second driving body 301 and a second driving member, where the film roll structure includes a front film plating roll 401 and a back film plating roll 402, the front film plating roll 401 and the back film plating roll 402 are disposed on the second driving body 301 at intervals, at least six (twelve) pairs of sputtering magnetic pole structures 500 are correspondingly configured on any film plating roll, the second driving member is disposed in the cavity 101 on the other side of the second driving body 301 opposite to the film plating roll, and a second driving member is disposed corresponding to the front film plating roll 401 and the back film plating roll 402 to drive the film plating roll to rotate, where in practical use, the second driving member may adopt a rotating motor.

The second driving assembly 300 in this embodiment further includes a third driving member 302, a first driving shaft 203 and a driving wheel, where the third driving member 302 adopts a gear motor, the first driving shaft 203 is disposed on the second driving body 301, two ends of the first driving shaft 203 are both provided with a driving wheel, and the driving shaft is driven to rotate by the gear motor to drive the driving wheel to move, so that the second driving body 301 drives the film coating roller structure 400 to enter or exit the cavity 101 of the housing 100.

The first driving assembly 200 in this embodiment further includes a first driving body 201, a first driving member 202, a second driving shaft 303, and a driving wheel, where the cathode mounting substrate 6021 is mounted on the first driving body 201, the first driving member 202 may employ a gear motor, the second driving shaft 303 is disposed on the first driving body 201, two ends of the first driving shaft 203 are both provided with a driving wheel, and the driving wheel is driven to rotate by using the gear motor to drive the driving shaft to move, so as to achieve the effect that the first driving body 201 drives the sputtering magnetic pole structure 500 to enter or exit from the cavity 101 of the housing 100.

The cross section of the housing 100 in this embodiment has an elliptical structure.

In the magnetron sputtering double-sided coating system of this embodiment, a partition board 102 may be further disposed in the casing 100, the casing 100 is separated into a coating cavity and a winding cavity by using the partition board 102, the coating roller structure 400 further includes an unreeling roller 403 and a guide roller 404 which are symmetrically disposed, part of the front coating roller 401 and the back coating roller 402 are disposed in the coating cavity, the other part is disposed in the winding cavity, and all of the unreeling roller 403 and the guide roller 404 are disposed in the winding cavity.

In the magnetron sputtering double-sided coating system in this embodiment, the magnetron sputtering double-sided coating system further includes a heating assembly 700, which is disposed in the winding cavity corresponding to the unreeling roller 403, and the film can be preheated by using the heating assembly 700, and in actual use, the heating assembly 700 includes a heating element 701 and a connector 702, and a power supply is connected with the heating element 701 through the connector 702 so as to heat the heating element 701, and after the heating element 701 heats, the film is heated by the heat released by the power supply.

The heating element 701 may be a heating resistance wire, a thermocouple is provided on the heating resistance wire, and the heating temperature is measured and controlled by the thermocouple.

In this embodiment, referring to fig. 9 and 10, a flattening structure 800 may be further disposed in the winding cavity, where the flattening structure 800 is correspondingly disposed at the inlet and outlet ends of the film inlet and outlet ends of the front film plating roller 401 and the back film plating roller 402, so as to ensure that the film is attached and leveled with the film plating roller, the flattening structure 800 includes a flattening driving member 802 and a flattening roller 801, the driving end of the flattening driving member 802 is connected with the flattening roller 801, and the flattening roller 801 rotates under the driving of the flattening driving member 802, so that the flattening roller 801 adjusts the bow height and radian, and performs transverse and instant flattening on the film, so that the winding film plating develops towards a softer and thinner strip direction.

Specifically, the flattening driving member 802 may be a spring member, one end of the spring member is mounted on the second driving body 301 through the supporting frame 803, and in the flattened state of the film, the film is suitable for applying a tensile force along a transverse direction to the flattening roller 801, and under the action of the tensile force, the flattening roller 801 drives the spring member to move relative to the frame, so as to adjust the initial included angle to a balanced included angle.

Specifically, after the flattening roller 801 receives the tensile force, the tensile force also acts on the spring member, so that the flattening roller 801 can automatically and synchronously move with the flattening roller 801, that is, the spring member cannot limit the flattening roller 801 to move relative to the film, the self-balancing effect of the flattening structure 800 is achieved, and the flattening roller 801 can be matched with a balanced included angle.

When the film is in a flattened state, the film is suitable for applying a tensile force to the inner side of the film along the transverse direction X to the flattening roller 801, and under the action of the tensile force, the flattening roller 801 drives the spring element to move relative to the frame so as to adjust the angle of the initial included angle A to the balanced included angle B.

With the flattening of the belt materials, under the condition that the belt materials cannot be flattened again, the flattening wheels can automatically swing in the transverse opposite direction, so that the included angle between the flattening wheels and the belt materials is automatically in a balanced state, and the transverse force is maintained.

Referring to the figure, when the film needs to be flattened, the spring member receives the pulling force applied by the flattening roller 801, so that the spring member is in a tensioning state, the initial included angle A is not reduced, that is, the position between the flattening roller 801 and the film is relatively stable, the flattening roller 801 cannot move relative to the film, at this time, the transverse component Fx of the friction force between the flattening roller 801 and the film in the transverse direction X of the initial included angle A also causes the transverse pulling force to be outwards, and further has flattening effect on the film.

In the magnetron sputtering double-sided coating system in this embodiment, the magnetron sputtering double-sided coating system further includes an air extraction structure, the air extraction structure is disposed on the housing 100, the air in the cavity 101 of the housing 100 is vacuumized, after the vacuumization is completed, a reaction gas, which may be argon, is introduced into the coating cavity to form a good working gas atmosphere, so that the coating cavity is filled with high-purity argon to form a sufficient amount of plasma in cooperation with the magnetron sputtering reaction.

The magnetron sputtering double-sided coating system provided in this embodiment further includes a power supply piece, the power supply piece is electrically connected with the sputtering magnetic pole structure 500, the power supply piece can adopt a direct current pulse power supply, the direct current pulse power supply can make the coating process more stable, the direct current pulse power supply has good arc extinguishing capability, the risk of discharging, striking and arcing in the coating process can be promoted to be reduced, the formation of knots on the film material is reduced, and it is to be noted that the sputtering angle of the sputtering magnetic pole structure 500 is 42 °, the magnetic field strength is configured to be 1000Gs, and the length of the connecting line of the maximum point of the magnetic field of the first cathode and the maximum point of the magnetic field of the second cathode is 170mm.

It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the utility model.

Claims

1. A magnetron sputtering double-sided coating system, comprising:

a housing (100), the housing (100) having a cavity (101);

a drive arrangement comprising a first drive assembly (200) and a second drive assembly (300);

a coating roller structure (400) rotatably mounted on the first drive assembly (200);

a sputter pole structure (500) mounted on the second drive assembly (300);

the magnetron sputtering double-sided coating system is provided with a working state for coating and a stopping state for stopping coating, and in the working state, the first driving assembly (200) and the second driving assembly (300) respectively drive the sputtering magnetic pole structure (500) and the coating roller structure (400) to enter the cavity (101) so that the sputtering end of the sputtering magnetic pole structure (500) is arranged towards the coating roller structure (400); in the shutdown state, the first driving assembly (200) drives the sputtering magnetic pole structure (500) to exit the cavity (101), and/or the second driving assembly (300) drives the coating roller structure (400) to exit the cavity (101).

2. The magnetron sputtering double-sided coating system according to claim 1, further comprising a mounting assembly (600), the sputtering pole structure (500) being mounted on the second drive assembly (300) by the mounting assembly (600), the mounting assembly (600) comprising an anode mount (601) and a cathode mount (602), the cathode mount (602) being mounted on the second drive assembly (300), the anode mount (601) being mounted on the cathode mount (602);

any one of the sputtering magnetic pole structures (500) comprises an anode unit (501) and a cathode unit (502) which are arranged at intervals, wherein the anode unit (501) is installed on the anode installation piece (601), and the cathode unit (502) is installed on the cathode installation piece (602).

3. The magnetron sputtering double-sided coating system according to claim 2, wherein the cathode mounting member (602) comprises a cathode mounting substrate (6021) and a cathode mounting frame (6022), the cathode unit (502) is disposed on the cathode mounting frame (6022), one end of the anode mounting member (601) is mounted on the cathode mounting substrate (6021), and the cathode mounting frame (6022) is symmetrically disposed on both sides of the anode mounting member (601).

4. A magnetron sputtering double-sided coating system according to claim 3, wherein the cathode mounting substrate (6021) is an arc-shaped mounting substrate structure, and all the cathode units (502) are arranged in an arc-shaped distribution along the center line of the arc-shaped mounting substrate.

5. The magnetron sputtering double-sided coating system according to claim 4, wherein the cathode unit (502) is configured to be adjustably positioned relative to the cathode mount (6022) to adjust the distance between the cathode unit (502) relative to the coating roller.

6. Magnetron sputtering double-sided coating system according to any of claims 1-5, characterized in that a shielding plate (603) is also provided between any two adjacent sputtering pole structures (500).

7. The magnetron sputtering double-sided coating system according to claim 6, wherein the second driving assembly (300) comprises a second driving body (301), the coating roller structure (400) comprises a front coating roller (401) and a back coating roller (402), the front coating roller (401) and the back coating roller (402) are arranged on the second driving body (301) at intervals, and at least six pairs of sputtering magnetic pole structures (500) are correspondingly configured on any coating roller.

8. The magnetron sputtering dual-sided coating system according to claim 7, wherein the second driving assembly (300) further comprises a second driving member, and the second driving member is disposed corresponding to the front coating roller (401) and the back coating roller (402) so as to drive the coating roller to rotate.

9. Magnetron sputtering double-sided coating system according to claim 8, characterized in that the cross section of the housing (100) is of elliptical structure.

10. The magnetron sputtering double-sided coating system according to claim 9, wherein a partition plate (102) is further arranged in the housing (100), the partition plate (102) divides the housing (100) into a coating cavity and a winding cavity, the coating roller structure (400) further comprises an unreeling roller (403) and a guide roller (404) which are symmetrically arranged, part of the front coating roller (401) and the back coating roller (402) are arranged in the coating cavity, the other part is arranged in the winding cavity, and all the unreeling roller (403) and the guide roller (404) are arranged in the winding cavity.

11. The magnetron sputtering double-sided coating system according to claim 10, further comprising a heating assembly (700) disposed in the winding chamber in correspondence of the unwind roller (403).

12. The magnetron sputtering double-sided coating system according to claim 11, wherein the heating assembly (700) comprises a heating member (701) and a connector (702), and a power supply is connected to the heating member (701) through the connector (702) to heat the heating member (701).