CN220079262U - Semiconductor seed crystal bonding flattening device - Google Patents
Semiconductor seed crystal bonding flattening device Download PDFInfo
- Publication number
- CN220079262U CN220079262U CN202321687992.0U CN202321687992U CN220079262U CN 220079262 U CN220079262 U CN 220079262U CN 202321687992 U CN202321687992 U CN 202321687992U CN 220079262 U CN220079262 U CN 220079262U
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- bonding
- fixedly connected
- oven
- seed crystal
- plate
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- 239000013078 crystal Substances 0.000 title claims abstract description 50
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 238000007789 sealing Methods 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 abstract description 11
- 238000007711 solidification Methods 0.000 abstract description 2
- 230000008023 solidification Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model provides a semiconductor seed crystal bonding and leveling device, which relates to the technical field of semiconductor seed crystal processing, and comprises a bonding assembly, wherein the upper surface of the bonding assembly is fixedly connected with a leveling assembly; the leveling assembly comprises a rectangular block, the upper surface of the rectangular block is fixedly connected with an oven, the right surface of the oven is fixedly connected with a controller, and the outer surface of the oven is hinged with a sealing door. According to the utility model, the seed crystal body, the bonding medium and the substrate can be bonded in a pressing way through the cooperation of the hydraulic rod, the pressing plate, the support, the heating plate, the base and the top plate, then the bonded seed crystal body is placed into the oven, the temperature and time are controlled by the controller, the bonding medium is leveled, the solidification and hardening of the bonding medium are guaranteed to reach the optimal state, the quality of the bonding medium is guaranteed, and the flatness of the seed crystal body and the substrate is improved.
Description
Technical Field
The utility model relates to the technical field of semiconductor seed crystal processing, in particular to a semiconductor seed crystal bonding and leveling device.
Background
Semiconductor seed is one of the key materials in semiconductor fabrication, also known as grains or wafers, which are formed during growth of semiconductor materials with high purity and structural integrity. Semiconductor seed crystals are typically formed by melting a semiconductor material at an elevated temperature, followed by slow cooling to crystallize the semiconductor material.
In the process of growing pure silicon crystals, seed crystals are required to be adhered in a seed crystal support through three layers of carbon paper, each layer of carbon paper is adhered together through glue, the seed crystals can be adhered in the seed crystal support only through three times of manual scraping, then the seed crystals are pressed in the seed crystal support through a pressing device, finally the seed crystals, the seed crystal support and the pressing device are placed in a heating furnace together for sintering and curing, so that the seed crystals are firmly adhered on the seed crystal support, and after the sintering and curing are finished, the seed crystal adhesion is completed.
However, during the bonding process, impurities and residues, such as solvents, bubbles, etc., may remain, which may affect the strength and stability of the bonding medium, even cause failure, and reduce the quality and performance of the bonding medium.
Disclosure of Invention
In order to solve the problems, the utility model adopts the following technical scheme:
the semiconductor seed crystal bonding and leveling device comprises a bonding assembly, wherein the upper surface of the bonding assembly is fixedly connected with a leveling assembly;
the leveling assembly comprises a rectangular block, the upper surface of the rectangular block is fixedly connected with an oven, the right surface of the oven is fixedly connected with a controller, the outer surface of the oven is hinged with a sealing door, the front surface of the sealing door is fixedly connected with a first handle, the inner surface of the oven is provided with a placing plate, and the controller is electrically connected with the oven.
Preferably, the bonding assembly comprises a base, a plurality of support rods are fixedly connected to the upper surface of the base close to four corners, a top plate is fixedly connected between the upper end faces of the support rods, a hydraulic rod is arranged on the upper surface of the top plate, a pressing plate is fixedly connected to the driving end of the hydraulic rod, and the left surface of the rectangular block is fixedly connected with the right surface of the base.
Preferably, the upper surface of base is close to the even fixedly connected with a plurality of supports of central point, and is a plurality of the up end fixedly connected with hot plate of support, the upper surface of hot plate is provided with the base plate, the upper surface of base plate is provided with bonding medium, bonding medium's upper surface is provided with the seed crystal body.
Preferably, the position of the heating plate is matched with the position of the pressing plate.
Preferably, the inner walls of two sides of the oven are fixedly connected with sliding rails, sliding grooves are symmetrically formed in the front surface of the placing plate, the inner surfaces of the two sliding grooves are slidably arranged on the outer surfaces of the two sliding rails, and a second handle is fixedly connected to the front surface of the placing plate close to the center.
Compared with the prior art, the utility model has the advantages and positive effects that,
1. through hydraulic stem, clamp plate, support, hot plate, base and roof cooperation use, can carry out pressfitting bonding with seed crystal body, bonding medium and base plate, then put into the oven with the seed crystal body after the bonding is accomplished, through controller control temperature and time, carry out the flattening to the bonding medium, guarantee that the solidification and the hardening of bonding medium reach the best state, guarantee the quality of bonding medium and improved the roughness of seed crystal body and base plate.
2. Through the cooperation of second handle, slide rail, spout and placement plate, conveniently take out the seed crystal body, the practicality is high.
Drawings
Fig. 1 is a perspective view showing a semiconductor seed crystal bonding and leveling device according to the present utility model;
FIG. 2 is a schematic illustration showing an adhesive assembly of a semiconductor seed bonding planarization apparatus in accordance with the present utility model;
FIG. 3 is an enlarged view of FIG. 2 at A;
FIG. 4 is a schematic view showing a structure of a leveling component of a semiconductor seed crystal bonding leveling device according to the present utility model;
FIG. 5 is a schematic view of a semiconductor seed bonding planarization apparatus according to the present utility model;
fig. 6 is a schematic view of a placement plate structure of a semiconductor seed crystal bonding and leveling device according to the present utility model.
Legend description: 1. an adhesive assembly; 101. a support rod; 102. a bracket; 103. a heating plate; 104. a hydraulic rod; 105. a top plate; 106. a base; 107. a pressing plate; 108. seed crystal; 109. an adhesive medium; 110. a substrate; 2. a leveling assembly; 201. an oven; 202. a controller; 203. sealing the door; 204. a first handle; 205. placing a plate; 206. a chute; 207. a second handle; 208. a slide rail; 209. rectangular blocks.
Detailed Description
In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.
Example 1:
as shown in fig. 1 to 6, the utility model provides a semiconductor seed crystal bonding and leveling device, which comprises a bonding assembly 1, wherein a leveling assembly 2 is fixedly connected to the upper surface of the bonding assembly 1.
The leveling component 2 comprises a rectangular block 209, the upper surface of the rectangular block 209 is fixedly connected with a baking oven 201, the right surface of the baking oven 201 is fixedly connected with a controller 202, the outer surface of the baking oven 201 is hinged with a sealing door 203, the front surface of the sealing door 203 is fixedly connected with a first handle 204, the inner surface of the baking oven 201 is provided with a placing plate 205, and the controller 202 is electrically connected with the baking oven 201.
The bonding assembly 1 comprises a base 106, a plurality of supporting rods 101 are fixedly connected to the upper surface of the base 106 near four corners, a top plate 105 is fixedly connected between the upper end faces of the plurality of supporting rods 101, a hydraulic rod 104 is arranged on the upper surface of the top plate 105, a pressing plate 107 is fixedly connected to the driving end of the hydraulic rod 104, a plurality of supports 102 are uniformly and fixedly connected to the upper surface of the base 106 near the center, a heating plate 103 is fixedly connected to the upper end faces of the plurality of supports 102, a base plate 110 is arranged on the upper surface of the heating plate 103, bonding media 109 are arranged on the upper surface of the base plate 110, seed crystal bodies 108 are arranged on the upper surface of the bonding media 109, and the positions of the heating plate 103 are matched with the positions of the pressing plate 107.
The effects achieved in the whole embodiment 1 are as follows: when the seed crystal body 108 needs to be bonded, the substrate 110 is placed on the heating plate 103, then the bonding medium 109 is placed on the heating plate 103, then the seed crystal body 108 is placed above the bonding medium 109, then the hydraulic rod 104 is started to drive the pressing plate 107 to move downwards, so that the seed crystal body 108 and the substrate 110 are compacted through the pressing plate 107, meanwhile, the substrate 110 is heated through the heating plate 103, the flow of the bonding medium 109 is promoted, and the seed crystal body 108 and the substrate 110 are bonded together.
When the bonding is completed, the bonded seed crystal body 108 may be removed from the heating plate 103, then the sealing door 203 is pulled open by the first handle 204, then the seed crystal body 108 is placed on the placing plate 205, then the sealing door 203 is closed, and then the temperature and the heating time of the oven 201 are controlled by the controller 202, so that the curing and hardening of the bonding medium can be ensured to reach the optimal state, impurities and residues such as solvents, bubbles and the like which may be left are removed, the bonding medium 109 is leveled by the oven 201, and the quality and the flatness of the bonding medium 109 are improved.
Example 2:
as shown in fig. 1-6, the inner walls of two sides of the oven 201 are fixedly connected with sliding rails 208, the front surface of the placement plate 205 is symmetrically provided with sliding grooves 206, the inner surfaces of the two sliding grooves 206 are slidably arranged on the outer surfaces of the two sliding rails 208, the front surface of the placement plate 205 is fixedly connected with a second handle 207 near the center, and the left surface of the rectangular block 209 is fixedly connected with the right surface of the base 106.
The effects achieved in the whole embodiment 2 are as follows: after the leveling is finished, the sealing door 203 is opened through the first handle 204, then the second handle 207 is pulled, and the placing plate 205 can be taken out of the oven 201 through the cooperation of the sliding groove 206 and the sliding rail 208, so that the seed crystal body 108 can be taken out conveniently, and the practicability is higher.
The working principle of the utility model is as follows:
when the seed crystal body 108 needs to be bonded, firstly, the substrate 110 is placed on the heating plate 103, then the bonding medium 109 is placed on the heating plate 103, then the seed crystal body 108 is placed above the bonding medium 109, the hydraulic rod 104 is started, the pressing plate 107 is driven to move downwards, and the seed crystal body 108 and the substrate 110 are compacted through the pressing plate 107; at the same time, the substrate 110 is heated by the heating plate 103 to promote the flow of the bonding medium 109, and the seed crystal body 108 and the substrate 110 are bonded together.
After bonding is completed, removing the bonded seed crystal body 108 from the heating plate 103, then pulling the sealing door 203 open by the first handle 204, placing the seed crystal body 108 on the placing plate 205, and then closing the sealing door 203; the temperature of oven 201 and the time of heating are then controlled by controller 202 to ensure optimal curing and hardening of the bonding medium, removing impurities and residues that may remain, such as solvents, air bubbles, etc.
Leveling the bonding medium 109 through the oven 201, and improving the quality and flatness of the bonding medium 109; after the leveling is finished, the sealing door 203 is opened through the first handle 204, then the second handle 207 is pulled, and the placing plate 205 can be taken out of the oven 201 through the cooperation of the sliding groove 206 and the sliding rail 208, so that the seed crystal body 108 can be taken out conveniently, and the practicability is higher.
The present utility model is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present utility model will still fall within the protection scope of the technical solution of the present utility model.
Claims (5)
1. The utility model provides a semiconductor seed crystal bonding leveling device which characterized in that: the adhesive comprises an adhesive component (1), wherein the upper surface of the adhesive component (1) is fixedly connected with a leveling component (2);
leveling component (2) include rectangle piece (209), the last fixed surface of rectangle piece (209) is connected with oven (201), the right side fixed surface of oven (201) is connected with controller (202), the surface hinged joint of oven (201) has sealing door (203), the preceding fixed surface of sealing door (203) is connected with first handle (204), the internal surface of oven (201) is provided with places board (205), controller (202) and oven (201) electric connection.
2. The semiconductor seed bonding planarization device of claim 1, wherein: the bonding assembly (1) comprises a base (106), a plurality of supporting rods (101) are fixedly connected to the upper surface of the base (106) close to four corners, a plurality of top plates (105) are fixedly connected between the upper end faces of the supporting rods (101), hydraulic rods (104) are arranged on the upper surface of the top plates (105), pressing plates (107) are fixedly connected to the driving ends of the hydraulic rods (104), and the left surface of each rectangular block (209) is fixedly connected with the right surface of the base (106).
3. The semiconductor seed bonding flattening apparatus of claim 2, wherein: the upper surface of base (106) is close to even fixedly connected with a plurality of supports (102) in central point, and is a plurality of up end fixedly connected with hot plate (103) of support (102), the upper surface of hot plate (103) is provided with base plate (110), the upper surface of base plate (110) is provided with bonding medium (109), the upper surface of bonding medium (109) is provided with seed crystal body (108).
4. A semiconductor seed bonding planarization apparatus as set forth in claim 3, wherein: the position of the heating plate (103) is matched with the position of the pressing plate (107).
5. The semiconductor seed bonding planarization device of claim 1, wherein: slide rails (208) are fixedly connected to the inner walls of the two sides of the oven (201), sliding grooves (206) are symmetrically formed in the front surface of the placing plate (205), the inner surfaces of the two sliding grooves (206) and the outer surfaces of the two slide rails (208) are in sliding arrangement, and a second handle (207) is fixedly connected to the front surface of the placing plate (205) close to the center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321687992.0U CN220079262U (en) | 2023-06-29 | 2023-06-29 | Semiconductor seed crystal bonding flattening device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321687992.0U CN220079262U (en) | 2023-06-29 | 2023-06-29 | Semiconductor seed crystal bonding flattening device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220079262U true CN220079262U (en) | 2023-11-24 |
Family
ID=88823217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321687992.0U Active CN220079262U (en) | 2023-06-29 | 2023-06-29 | Semiconductor seed crystal bonding flattening device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220079262U (en) |
-
2023
- 2023-06-29 CN CN202321687992.0U patent/CN220079262U/en active Active
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