CN220075166U - Wafer scribing device with double blades - Google Patents
Wafer scribing device with double blades Download PDFInfo
- Publication number
- CN220075166U CN220075166U CN202321578424.7U CN202321578424U CN220075166U CN 220075166 U CN220075166 U CN 220075166U CN 202321578424 U CN202321578424 U CN 202321578424U CN 220075166 U CN220075166 U CN 220075166U
- Authority
- CN
- China
- Prior art keywords
- workbench
- operation panel
- workstation
- plate
- machine base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000001681 protective effect Effects 0.000 claims abstract description 19
- 230000000087 stabilizing effect Effects 0.000 claims description 10
- 230000009977 dual effect Effects 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 description 33
- 238000005520 cutting process Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a wafer scribing device with double blades, which comprises a workbench, an operating disc, a self-rotating disc, a protective cover plate, a machine base, side hanging plates, scribing machines, small baffles and large baffles, wherein the workbench is -shaped, a concave table is formed in the middle of the workbench, the operating disc is arranged above the surface of the concave table in the middle of the workbench, the self-rotating disc is arranged between the operating disc and the surface of the concave table, the protective cover plate is arranged above the surface of the operating disc, the machine base is arranged above the concave table of the workbench, the side hanging plates are arranged on two sides of the outer part of the machine base, the four side hanging plates are arranged, the top ends of the side hanging plates are fixedly connected with the top of the concave table of the workbench, the scribing machines are arranged on one side below the machine base, the small baffles are arranged on one side of the scribing machines, and the large baffles are arranged on one side of the outer wall of the workbench. The wafer scribing device with the double blades has the characteristics of double blade use and working time saving.
Description
Technical Field
The utility model relates to the technical field of wafers, in particular to a wafer dicing device with double blades.
Background
A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape; various circuit element structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface is useful with inexhaustible silicon dioxide.
The conventional wafer dicing apparatus does not have a dual blade operation function in dicing, such as a wafer dicing machine disclosed in application number CN 202220740249.6. The wafer dicing operation makes the dicing machine used in the prior art have no dual-blade operation function in order to slot or divide the surface of the wafer dicing machine, thereby reducing the operation efficiency of the device and prolonging the operation time of the device.
Therefore, it is necessary to invent a dual blade wafer dicing apparatus to solve the above problems.
Disclosure of Invention
The utility model aims to provide a double-blade wafer dicing device, which solves the problem that the dicing has no double-blade operation function in the prior art, and the operation of wafer dicing is to make the surface of the wafer dicing device grooved or split so as to facilitate subsequent manufacturing or functional testing.
In order to achieve the above object, the present utility model provides the following technical solutions: the utility model provides a wafer scribing device of two blades, includes workstation, operation panel, from carousel, protective cover board, frame, side link plate, scribing machine, little baffle and big baffle, the workstation is font, and the middle part forms the concave station, the surface top of workstation middle part concave station is provided with the operation panel, be provided with from the carousel between the surface of operation panel and concave station, the surface top of operation panel is provided with protective cover board, the top of workstation concave station is provided with the frame, the outside both sides of frame all are provided with the side link plate, the scribing machine is installed to the below one side of frame, little baffle is installed to one side of scribing machine, big baffle is installed to outer wall one side of workstation.
Preferably, clamping plates are arranged on two sides of the outer wall of the operation plate, the length of each clamping plate is larger than that of the operation plate, and a first sliding groove is formed in the upper portion of the outer wall of each clamping plate.
Preferably, the stabilizing block is installed to bottom surface one side of operating panel, the stabilizing block is the cylindricality setting, and the subsidence groove that corresponds clamp size matching has been seted up to the below of stabilizing block, four have been seted up to the subsidence groove, and evenly distributed is in workstation concave station surface four corners.
Preferably, the protective cover plate is rectangular, through grooves are respectively formed in two sides of the surface of the protective cover plate, the through grooves are in a bar shape, sliding pieces matched with the sliding size of the first sliding groove are mounted on two sides of the outer wall of the protective cover plate, and gaskets are arranged at the bottom of the protective cover plate.
Preferably, the machine base is connected with an air cylinder at one end, the connecting plate is installed on the bottom surface of the machine base, the top end of the machine base is provided with a sliding block, the sliding block is located in a second sliding groove, and the second sliding groove is formed in the middle of the top end of the workbench concave table.
Preferably, the side link plate is provided with four, and top all is connected with workstation concave station top fixed connection, two the side link plate is a set of, every group the mid-mounting of side link plate has the slide bar, the surface mounting of slide bar has the link, and one side of link is connected with the base frame.
Preferably, the dicing saw is provided with two blades, two the middle part of blade runs through and installs the rotation connecting rod, spacing jack has all been seted up to the pole body surface both sides of rotation connecting rod and the top middle part of blade, it has spacing inserted bar to alternate in the spacing jack, and spacing inserted bar installs two.
In the technical scheme, the utility model has the technical effects and advantages that:
this wafer scribing device of double blade can improve efficiency through setting up double blade to wafer cutting work, and two blades can cut out two lines at the surface of wafer simultaneously through the change of distance, just so avoided cutting in the cutting operation process of cutting once more, saved the time of operation.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the structure of the operation panel of the present utility model;
FIG. 3 is a schematic side plan view of the operation panel of the present utility model;
FIG. 4 is a schematic view of the bottom view of the stand according to the present utility model;
fig. 5 is a schematic view of the mounting structure of the blade and the rotary connecting rod according to the present utility model.
Reference numerals illustrate:
1. a work table; 2. an operation panel; 201. a clamping plate; 202. a first sliding groove; 203. a stabilizing block; 204. an invagination groove; 3. a self-rotating disc; 4. a protective cover plate; 401. a through groove; 402. a slider; 403. a gasket; 5. a base; 501. a cylinder; 502. a connecting plate; 503. a second sliding groove; 6. a side hanging plate; 601. a slide bar; 602. hanging rings; 7. dicing saw; 701. a blade; 702. a connecting rod; 703. limiting jack; 704. a limit inserted link; 8. a small baffle; 9. a large baffle.
Detailed Description
In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.
The utility model provides a double-blade wafer dicing device as shown in fig. 1-5, which comprises a workbench 1, an operation panel 2, a rotating disc 3, a protective cover plate 4, a machine base 5, side hanging plates 6, a dicing saw 7, a small baffle plate 8 and a large baffle plate 9, wherein the workbench 1 is -shaped, a concave table is formed in the middle of the workbench 1, the operation panel 2 is arranged above the surface of the concave table in the middle of the workbench 1, the self-rotating disc 3 is arranged between the operation panel 2 and the surface of the concave table, the protective cover plate 4 is arranged above the surface of the operation panel 2, the protective cover plate 4 is rectangular, the machine base 5 is arranged above the concave table of the workbench 1, the side hanging plates 6 are arranged on two sides outside the machine base 5, the four side hanging plates 6 are fixedly connected with the top of the concave table of the workbench 1, the two side hanging plates 6 are in a group, the dicing saw 7 is arranged on one side below the machine base 5, the small baffle plate 8 is arranged on one side of the dicing saw 7, and the large baffle plate 9 is arranged on one side of the outer wall of the workbench 1.
Embodiment one: after the device is started, the rotating disc 3 is rotated through the operation controller at the front end of the workbench 1, the through grooves 401 on the surface of the protective cover plate 4 correspond to the positions of wafer cutting when the wafer is matched, the stabilizing blocks 203 below the rotating disc 3 are simultaneously inserted into the inner line grooves 204 corresponding to the lower parts, the wafer is required to be placed on the surface of the operating disc 2 when the wafer is cut, the protective cover plate 4 can be covered above the operating disc 2, the two sides of the protective cover plate 4 can be moved through the length of scribing, and the lengths corresponding to the through grooves 401 in the cutting process are changed.
The working principle of the utility model is as follows:
referring to fig. 1-5 of the specification, for such a dual-blade wafer dicing apparatus, when in use, a wafer to be diced is first placed on the surface of the operation panel 2, then when the protective cover 4 is covered over the operation panel 2, the protective cover 4 is correspondingly moved according to the dicing length requirement of the wafer, when moving gradually to one side, the shorter the length gap formed by the through groove 401 and the surface of the operation panel 2, the longer the length gap formed by the through groove 401 and the surface of the operation panel 2 when approaching to the middle of the operation panel 2, so that the wafer needs to be moved according to the dicing condition during operation, then the automatic rotation of the self-rotating disc 3 is realized by a controller provided at one end of the table top of the operation table 1 from the rotating disc 3, the stabilizing block 203 is separated from the invagination groove 204 during rotation, and rotates to a proper position from the rotating disc 3, the stabilizing block 203 is dropped and inserted into the corresponding inward recess groove 204 below, so as to keep the stability of the wafer cutting operation disc 2, the dicing saw 7 and the machine base 5 are installed with a lifting function, the wafer cutting operation disc can be lifted and separated from the through groove 401 after dicing, meanwhile, the air cylinder 501 at one end of the machine base 5 is pushed and matched in the moving process of the cutting position, the sliding block connected with the top of the machine base 5 slides in the second sliding groove 503, the side hanging plates 6, the sliding bars 601 and the hanging rings 602 adopted at two sides can strengthen the supporting force of the sliding at two sides, if the distance between the two blades 701 of the two dicing saw 7 needs to be changed, the two blades 701 need to be closed towards two sides or the inner side, the limiting jack 703 on the blade 701 corresponds to the limiting jack 703 on the connecting rod 702, the limiting jack 703 is inserted and fixed, the distance adjustment operation between the two blades 701 can be realized, and then the device is started, this is the method of operation of this type of dual blade wafer dicing apparatus.
Claims (7)
1. The utility model provides a wafer scribing device of two blades, includes workstation (1), operation panel (2), rotation dish (3), protective cover board (4), frame (5), side link plate (6), scribing machine (7), little baffle (8) and big baffle (9), a serial communication port, workstation (1) are font, and the middle part forms the concave station, the surface top of the concave station in the middle part of workstation (1) is provided with operation panel (2), be provided with from carousel (3) between the surface of operation panel (2) and concave station, the surface top of operation panel (2) is provided with protective cover board (4), the top of workstation (1) concave station is provided with frame (5), the outside both sides of frame (5) all are provided with side link plate (6), scribing machine (7) are installed to one side of below of frame (5), little baffle (8) are installed to one side of scribing machine (7), big baffle (9) are installed to one side of the outer wall of workstation (1).
2. The dual blade wafer dicing apparatus of claim 1, wherein: the two sides of the outer wall of the operation panel (2) are provided with clamping plates (201), the length of each clamping plate (201) is larger than that of the operation panel (2), and a first sliding groove (202) is formed in the upper portion of the outer wall of each clamping plate (201).
3. The dual blade wafer dicing apparatus of claim 2, wherein: the stabilizing block (203) is installed on one side of the bottom surface of the operating panel (2), the stabilizing block (203) is in a cylindrical shape, an inward sinking groove (204) matched with the corresponding clamp in size is formed in the lower portion of the stabilizing block (203), and the inward sinking grooves (204) are formed in four corners of the concave surface of the workbench (1) and are evenly distributed.
4. The dual blade wafer dicing apparatus of claim 2, wherein: the protection cover plate (4) is rectangular, through grooves (401) are respectively formed in two sides of the surface of the protection cover plate (4), the through grooves (401) are in a strip shape, sliding pieces (402) matched with the sliding size of the first sliding groove (202) are mounted on two sides of the outer wall of the protection cover plate (4), and gaskets (403) are arranged at the bottom of the protection cover plate (4).
5. The dual blade wafer dicing apparatus of claim 1, wherein: the novel workbench comprises a machine base (5), and is characterized in that an air cylinder (501) is connected with one end of the machine base (5), a connecting plate (502) is arranged on the bottom surface of the machine base (5), a sliding block is arranged at the top end of the machine base (5) and is located in a second sliding groove (503), and the second sliding groove (503) is formed in the middle of the top end of a concave table of the workbench (1).
6. The dual blade wafer dicing apparatus of claim 1, wherein: the side link plate (6) is provided with four, and top all is connected with workstation (1) concave station top fixed connection, two side link plate (6) are a set of, every group side link plate (6) mid-mounting has slide bar (601), the surface mounting of slide bar (601) has link (602), and one side of link (602) is connected with base (5).
7. The dual blade wafer dicing apparatus of claim 1, wherein: the scribing machine (7) is provided with two blades (701), two the middle part of blade (701) runs through and installs rotation connecting rod (702), spacing jack (703) have all been seted up on the pole body surface both sides of rotation connecting rod (702) and the top middle part of blade (701), it has spacing inserted bar (704) to alternate in spacing jack (703), and spacing inserted bar (704) installs two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321578424.7U CN220075166U (en) | 2023-06-20 | 2023-06-20 | Wafer scribing device with double blades |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321578424.7U CN220075166U (en) | 2023-06-20 | 2023-06-20 | Wafer scribing device with double blades |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220075166U true CN220075166U (en) | 2023-11-24 |
Family
ID=88827644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321578424.7U Active CN220075166U (en) | 2023-06-20 | 2023-06-20 | Wafer scribing device with double blades |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220075166U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117484703A (en) * | 2024-01-02 | 2024-02-02 | 江苏中科智芯集成科技有限公司 | Wafer high-efficiency dicing device and dicing process thereof |
-
2023
- 2023-06-20 CN CN202321578424.7U patent/CN220075166U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117484703A (en) * | 2024-01-02 | 2024-02-02 | 江苏中科智芯集成科技有限公司 | Wafer high-efficiency dicing device and dicing process thereof |
| CN117484703B (en) * | 2024-01-02 | 2024-03-15 | 江苏中科智芯集成科技有限公司 | Wafer high-efficiency dicing device and dicing process thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |