CN220068149U - 1U frame is chip heat radiation structure for shell - Google Patents
1U frame is chip heat radiation structure for shell Download PDFInfo
- Publication number
- CN220068149U CN220068149U CN202321676970.4U CN202321676970U CN220068149U CN 220068149 U CN220068149 U CN 220068149U CN 202321676970 U CN202321676970 U CN 202321676970U CN 220068149 U CN220068149 U CN 220068149U
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- Prior art keywords
- chip
- heat dissipation
- top cover
- block
- rack
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000005855 radiation Effects 0.000 title description 20
- 230000017525 heat dissipation Effects 0.000 claims abstract description 107
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000000741 silica gel Substances 0.000 claims abstract description 18
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 18
- 229920002379 silicone rubber Polymers 0.000 claims description 8
- 239000004945 silicone rubber Substances 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 abstract description 2
- IUYHQGMDSZOPDZ-UHFFFAOYSA-N 2,3,4-trichlorobiphenyl Chemical compound ClC1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 IUYHQGMDSZOPDZ-UHFFFAOYSA-N 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 241000208818 Helianthus Species 0.000 description 2
- 235000003222 Helianthus annuus Nutrition 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a chip heat dissipation structure for a 1U rack-mounted shell, which comprises a rack-mounted shell body, a PCB (printed circuit board) and a chip, wherein the rack-mounted shell body is provided with an assembly cavity, and the assembly cavity is communicated to one side of the rack-mounted shell body; the PCB is arranged in the assembly cavity; the chip is welded on the PCB and is electrically connected with the PCB; the heat-conducting assembly comprises a frame type shell body, and is characterized by further comprising a top cover, a heat dissipation block, heat-conducting silica gel and a stud, wherein the top cover is detachably arranged on the frame type shell body and covers the assembly cavity. The heat conduction silica gel can be with the heat transfer that the chip produced for the radiating block and through the radiating block in order to carry out the heat dissipation to the chip, during the heat dissipation, radiating block and double-screw bolt threaded connection, its weight does not act on the chip to reduce the influence of radiating block to the chip, the chip can be stabilized in the pressfitting of radiating block simultaneously, prevents that the chip from accidentally breaking away from the PCB board, has increased the stability in use of chip, facilitates the use.
Description
Technical Field
The utility model relates to the technical field of 1U rack-type shells, in particular to a chip heat dissipation structure for a 1U rack-type shell.
Background
The 1U frame type shell is widely applied to the fields of Internet of things, servers, switches, routers and the like, chips are loaded in the 1U frame type shell, and a heat dissipation structure is required to be arranged to dissipate heat of the chips located in the 1U frame type shell in order not to influence the service life of products and the stability and reliability of operation.
In the in-service use of 1U frame shell, often because the height of 1U frame shell, inner space is narrow and small, the chip adopts the mode of laminating fin to dispel the heat, but because the chip calorific capacity is big, the radiating effect often is not good, and long-time operation is wantonly led to the inside local high temperature of shell, and influences product operational reliability.
The utility model with the publication number of CN215222807U provides a novel fan-free industrial exchanger heat radiation structure, and the novel fan-free industrial exchanger heat radiation structure is characterized in that a chip module and a heat radiation block are arranged in a heat radiation shell, one side of the heat radiation block is abutted to the chip module through silicone grease, the other side of the heat radiation block is abutted to the inner wall of the heat radiation shell through silica gel, and the novel fan-free industrial exchanger heat radiation structure aims at the technical problems that an existing chassis airtight heat radiation fin radiates heat through air convection and is low in efficiency, and the heat radiation structure is used for replacing the air convection heat radiation in a solid heat conduction mode, so that the heat radiation efficiency is improved, and the heat radiation effect is guaranteed. But the radiating block in this heat radiation structure bonds with the chip module through high coefficient viscidity heat conduction silicone grease, in the implementation, the weight of radiating block directly acts on the chip, in addition the chip is fragile and adopt SMT paster welding in general again, if under long-time transportation and high strength vibrations etc. circumstances, the radiating block can make the vibration force of fore-and-aft left and right directions act on the welded part between chip and the circuit board in a large number, cause the circumstances that the chip is desolventized rosin joint and radiating block vibrations drive the whole circuit board that drops of chip, and influence the normal use of chip, therefore this scheme especially provides a 1U frame is chip heat radiation structure for shell to solve above-mentioned problem.
Disclosure of Invention
In view of this, the utility model provides a chip heat dissipation structure for a 1U rack housing, in which heat generated by a chip can be transferred to a heat dissipation block by heat-conducting silica gel and is subjected to heat dissipation treatment by the heat dissipation block, during heat dissipation, the heat dissipation block is in threaded connection with a stud, the weight of the heat dissipation block does not act on the chip, so that the influence of the heat dissipation block on the chip is reduced, meanwhile, the heat dissipation block can press-fit and stabilize the chip, the chip is prevented from being accidentally separated from a PCB, the use stability of the chip is increased, and the use is convenient.
The technical scheme of the utility model is realized as follows: the utility model provides a chip heat dissipation structure for a 1U rack-type shell, which comprises a rack-type shell body, a PCB board and a chip, wherein,
the rack type shell body is provided with an assembly cavity, and the assembly cavity is communicated to one side of the rack type shell body;
the PCB is arranged in the assembly cavity;
the chip is welded on the PCB and is electrically connected with the PCB;
also comprises a top cover, a heat dissipation block, heat conduction silica gel and a stud, wherein,
the top cover is detachably arranged on the rack type shell body and covers the assembly cavity;
the stud is arranged on one side of the top cover, which is close to the chip;
a first threaded hole is formed in one end of the heat dissipation block, the stud is in threaded connection with the first threaded hole, and one end, far away from the top cover, of the heat dissipation block is attached to the chip;
and the heat conduction silica gel is coated between the heat dissipation block and the chip and is used for conducting heat.
On the basis of the technical scheme, preferably, the radiating block is an aluminum alloy block, and the rack type shell body is an aluminum alloy shell.
On the basis of the above technical scheme, preferably, the periphery of the heat dissipation block is provided with a plurality of first heat dissipation grooves, and the plurality of first heat dissipation grooves are distributed at equal intervals along the periphery of the heat dissipation block.
On the basis of the technical proposal, the adhesive silicone rubber is also preferably included, wherein,
and the viscous silicone rubber is coated between the heat dissipation block and the top cover and is used for bonding the heat dissipation block and the top cover.
On the basis of the technical proposal, the utility model preferably further comprises a supporting plate, wherein,
and the supporting plate is arranged in the assembly cavity and is used for supporting the top cover in the vertical direction, and the top cover is detachably connected with the supporting plate.
On the basis of the above technical scheme, preferably, the supporting plate is provided with a second threaded hole, the top cover is provided with a first assembly hole opposite to the second threaded hole, and the first assembly hole is used for a bolt to pass through.
On the basis of the above technical scheme, preferably, one side of the top cover, which is far away from the heat dissipation block, is provided with a plurality of second heat dissipation grooves, and the plurality of second heat dissipation grooves are distributed at equal intervals along the width direction of the top cover.
On the basis of the technical proposal, the utility model preferably further comprises a nut post, wherein,
the number of the nut columns is multiple, the nut columns are all arranged at the bottom wall of the assembly cavity, and the PCB and the nut columns are arranged at one end, away from the bottom wall of the assembly cavity, of the nut columns in a separable mode.
On the basis of the above technical scheme, preferably, a third threaded hole is formed in one end, far away from the bottom wall of the assembly cavity, of the nut column, a second assembly hole opposite to the third threaded hole is formed in the PCB, and the second assembly hole is used for a bolt to pass through.
On the basis of the technical scheme, preferably, the periphery of the rack-type shell body is provided with the radiating holes.
Compared with the prior art, the chip heat dissipation structure for the 1U rack type shell has the following beneficial effects:
(1) Through setting up the double-screw bolt, top cap and frame shell body separation when using can be in advance with double-screw bolt threaded connection in the inboard of first screw hole to connect radiating block and top cap, then with the top cap lid close in assembly chamber department and with frame shell body connection, with the automatic chip of registering of radiating block of double-screw bolt threaded connection and laminating mutually with the chip, can scribble on radiating block or chip and establish heat conduction silica gel in this, heat conduction silica gel can give the radiating block with the heat transfer that the chip produced and carry out the heat dissipation processing through the radiating block to the chip. During heat dissipation, the heat dissipation block is in threaded connection with the stud, the weight of the heat dissipation block does not act on the chip, so that the influence of the heat dissipation block on the chip is reduced, meanwhile, the heat dissipation block can press the stable chip, the chip is prevented from being accidentally separated from the PCB, the use stability of the chip is improved, and the use is convenient.
(2) Through offer a plurality of first heat dissipation grooves that are circumference equidistance and distribute at the week side of heat dissipation piece, in the concrete implementation, the heat dissipation piece is sunflower shape, and the cell wall of first heat dissipation groove can increase the area of contacting with outside air, also compromise the air convection heat dissipation when keeping original solid heat conduction, when the cooling wind blows, can the large surface contact cooling wind to accelerate radiating efficiency, facilitate the use.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic perspective view of a portion of a 1U rack housing of the present utility model with a top cover detached from the top cover using a chip heat dissipating structure;
FIG. 2 is a schematic perspective view of a 1U rack housing of the present utility model with a top cover covered with a chip heat dissipating structure;
FIG. 3 is an exploded view of the connection between the top cover and the heat sink of the chip heat dissipation structure for a 1U rack housing according to the present utility model;
FIG. 4 is a schematic perspective view of a heat dissipating block of the chip heat dissipating structure for a 1U rack housing according to the present utility model;
FIG. 5 is a schematic diagram showing a connection mode between a rack-mounted housing body and a PCB of the chip heat dissipation structure for a 1U rack-mounted housing of the present utility model;
FIG. 6 is a schematic partial perspective view of a top cover of the chip heat dissipation structure for a 1U rack housing of the present utility model;
fig. 7 is a schematic diagram of a connection mode between a stud of a chip heat dissipation structure for a 1U rack housing and an assembly cavity according to the present utility model.
Detailed Description
The following description of the embodiments of the present utility model will clearly and fully describe the technical aspects of the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, are intended to fall within the scope of the present utility model.
As shown in fig. 1 to 7, the chip heat dissipation structure for a 1U rack-type housing of the present utility model includes a rack-type housing body 1, a PCB board 21, and a chip 22, wherein the rack-type housing body 1 is formed with an assembly cavity 11, and the assembly cavity 11 is connected to one side of the rack-type housing body 1; the PCB 21 is arranged inside the assembly cavity 11; the chip 22 is welded on the PCB 21 and is electrically connected with the PCB 21; also comprises a top cover 3, a heat dissipation block 41, heat conduction silica gel 42 and a stud 51, wherein the top cover 3 is detachably arranged on the frame type shell body 1, and the assembly cavity 11 is covered, and the top cover 3 completes the sealing treatment of the assembly cavity 11 by covering the assembly cavity 11; the stud 51 is arranged on one side of the top cover 3 close to the chip 22; a first threaded hole 411 is formed in one end of the heat dissipation block 41, the stud 51 is in threaded connection with the first threaded hole 411, and one end, away from the top cover 3, of the heat dissipation block 41 is attached to the chip 22; the heat conducting silica gel 42 is coated between the heat dissipating block 41 and the chip 22 for conducting heat, and the heat conducting silica gel 42 is coated on the heat dissipating block 41 or the chip 22 in advance, and the heat conducting silica gel 42 is located between the heat dissipating block 41 and the chip 22 when the heat dissipating block 41 is attached to the chip 22.
In specific implementation, the top cover 3 is separated from the rack-mounted housing body 1, the stud 51 can be screwed on the inner side of the first threaded hole 411 in advance to connect the heat dissipation block 41 and the top cover 3, then the top cover 3 is covered at the assembly cavity 11 and connected with the rack-mounted housing body 1, the heat dissipation block 41 screwed with the stud 51 automatically aligns the chip 22 and is attached to the chip 22, the heat dissipation block 41 or the chip 22 can be coated with the heat conduction silica gel 42, and the heat generated by the chip 22 can be transmitted to the heat dissipation block 41 by the heat conduction silica gel 42 and is dissipated to the chip 22 through the heat dissipation block 41. During heat dissipation, the heat dissipation block 41 is in threaded connection with the stud 51, the weight of the heat dissipation block 41 does not act on the chip 22, so that the influence of the heat dissipation block 41 on the chip 22 is reduced, meanwhile, the heat dissipation block 41 can press and stabilize the chip 22, the chip 22 is prevented from being accidentally separated from the PCB 21, the use stability of the chip 22 is improved, and the use is convenient.
As a preferred embodiment, the heat dissipation block 41 is an aluminum alloy block, and the rack housing body 1 is an aluminum alloy housing.
By such design, the heat dissipation efficiency of the heat dissipation block 41 to the chip 22 can be increased by the heat conduction property of the aluminum alloy.
As a preferred embodiment, a plurality of first heat dissipation grooves 412 are formed on the peripheral side of the heat dissipation block 41, and the plurality of first heat dissipation grooves 412 are equally distributed in the peripheral direction along the peripheral side of the heat dissipation block 41.
By means of the design, the radiating block 41 is in a sunflower shape, the contact area between the radiating block wall of the first radiating groove 412 and the outside air can be increased, the original solid heat conduction is maintained, meanwhile, the air convection radiation is also considered, and when the radiating wind blows, the radiating wind can be contacted with the radiating wind on a large surface, so that the radiating efficiency is improved, and the radiating device is convenient to use.
As a preferred embodiment, the adhesive silicone rubber 52 is further included, wherein the adhesive silicone rubber 52 is coated between the heat sink 41 and the top cover 3 for bonding the heat sink 41 and the top cover 3.
In particular, when the heat dissipating block 41 is screwed with the stud 51, the adhesive silicone rubber 52 may be coated on the heat dissipating block 41 or the stud 51 in advance, after the heat dissipating block 41 is screwed with the stud 51, the adhesive silicone rubber 52 is located between the heat dissipating block 41 and the top cover 3, and after a period of time, the heat dissipating block 41 and the top cover 3 may be adhered to prevent the heat dissipating block 41 from rotating relative to the top cover 3, so as to increase the stability of the screwed connection between the heat dissipating block 41 and the stud 51.
As a preferred embodiment, it further comprises a pallet 6, wherein the pallet 6 is provided inside the assembly cavity 11 for supporting the top cover 3 in a vertical direction, and wherein the top cover 3 is detachably connected to the pallet 6.
In specific implementation, the top cover 3 is supported on the top of the supporting plate 6, and the top cover 3 is connected with the supporting plate 6 through adjustment so as to complete the separable connection treatment of the top cover 3 and the rack-type shell body 1. During connection, the chamber walls of the fitting chamber 11 may restrict the top cover 3 from the circumferential side to increase the stability of the connection of the top cover 3.
As a preferred embodiment, the pallet 6 is provided with a second threaded hole 61, and the top cover 3 is provided with a first fitting hole 31 opposite to the second threaded hole 61, and the first fitting hole 31 is used for passing a bolt.
In particular, after the adjustment top cover 3 is supported on the top of the pallet 6, the adjustment bolt passes through the first assembly hole 31 and is screwed on the inner side of the second screw hole 61, thereby completing the detachable connection process of the top cover 3 and the pallet 6. Through setting up bolted connection, made things convenient for the dismouting processing of top cap 3.
As a preferred embodiment, the side of the top cover 3 away from the heat dissipating block 41 is provided with a plurality of second heat dissipating grooves 32, and the plurality of second heat dissipating grooves 32 are equally distributed along the width direction of the top cover 3.
By such design, the wall of the second heat dissipation groove 32 can increase the contact area between the top cover 3 and the outside air, and increase the heat dissipation efficiency of the top cover 3 after the heat of the heat dissipation block 41 is transferred to the top cover 3.
As a preferred embodiment, the assembly comprises a plurality of nut posts 7, wherein the nut posts 7 are arranged at the bottom wall of the assembly cavity 11, and the PCB 21 and the nut posts 7 are detachably arranged at one end of the nut posts 7 away from the bottom wall of the assembly cavity 11.
Because the PCB 21 is detachably connected with the nut post 7, in the implementation, the nut post 7 can raise the height of the PCB 21 and suspend the bottom of the PCB 21, and when the heat dissipation wind flows in the assembly cavity 11, the bottom contact of the heat dissipation wind and rain PCB 21 can increase the heat dissipation efficiency of the PCB 21.
As a preferred embodiment, a third threaded hole 71 is formed at an end of the nut post 7 away from the bottom wall of the assembly cavity 11, and a second assembly hole 211 is formed on the pcb 21 opposite to the third threaded hole 71, and the second assembly hole 211 is used for passing a bolt.
In particular, when the PCB 21 is adjusted to be connected with the nut post 7, the PCB 21 is abutted against the top end of the nut post 7 and the adjusting bolt passes through the second assembly hole 211 and is screwed into the third screw hole 71, thereby completing the separable connection process between the PCB 21 and the nut post 7. The PCB 21 is connected with the nut column 7 through the bolts, so that the disassembly and assembly of the PCB 21 are convenient.
As a preferred embodiment, the frame-type housing body 1 is provided with heat radiation holes 12 on the peripheral side.
In particular, external wind is blown into the rack-type housing body 1 through the heat radiation holes 12 to perform heat radiation treatment on the internal components of the rack-type housing body 1.
The working principle of the utility model is described as follows:
the adjusting top cover 3 is separated from the rack-mounted shell body 1, then the heat dissipation block 41 is in threaded connection with the stud 51 in advance, the top cover 3 is supported on the top of the supporting plate 6 and then is connected with the top cover 3 and the supporting plate 6 through bolts, the top cover 3 covers the assembly cavity 11, the heat dissipation block 41 in threaded connection with the top cover 3 automatically aligns the chip 22 and is attached to the chip 22, the heat generated by the chip 22 can be transferred to the heat dissipation block 41 through the heat dissipation block 41 by the heat conduction silica gel 42 coated between the heat dissipation block 41 and the chip 22, the heat dissipation treatment is carried out through the heat dissipation block 41, and the adhesive silica gel 52 coated between the heat dissipation block 41 and the top cover 3 can bond the heat dissipation block 41 and the top cover 3 so as to prevent the heat dissipation block 41 from rotating relative to the top cover 3, and the stability of the threaded connection of the heat dissipation block 41 is increased. During heat dissipation through the heat dissipation block 41, the plurality of first heat dissipation grooves 412 formed in the periphery of the heat dissipation block 41 can increase the contact area with the outside air, so that the heat dissipation block is capable of achieving air convection heat dissipation while maintaining the original solid heat conduction, and can be in large-surface contact with heat dissipation air when heat dissipation air blows, thereby accelerating heat dissipation efficiency and facilitating use.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (10)
1. A chip heat dissipation structure for a 1U rack-type housing comprises a rack-type housing body (1), a PCB (21) and a chip (22), wherein,
the frame type shell body (1) is provided with an assembly cavity (11), and the assembly cavity (11) is communicated to one side of the frame type shell body (1);
the PCB (21) is arranged in the assembly cavity (11);
the chip (22) is welded on the PCB (21) and is electrically connected with the PCB (21);
the method is characterized in that: also comprises a top cover (3), a heat dissipation block (41), heat conduction silica gel (42) and a stud (51), wherein,
the top cover (3) is detachably arranged on the rack type shell body (1) and covers the assembly cavity (11);
the stud (51) is arranged on one side of the top cover (3) close to the chip (22);
a first threaded hole (411) is formed in one end of the heat dissipation block (41), the stud (51) is in threaded connection with the first threaded hole (411), and one end, away from the top cover (3), of the heat dissipation block (41) is attached to the chip (22);
and the heat conducting silica gel (42) is coated between the heat radiating block (41) and the chip (22) and is used for conducting heat.
2. The chip heat dissipation structure for a 1U rack housing as defined in claim 1, wherein: the heat dissipation block (41) is an aluminum alloy block, and the rack type shell body (1) is an aluminum alloy shell.
3. The chip heat dissipation structure for a 1U rack housing as defined in claim 1, wherein: the periphery of the radiating block (41) is provided with a plurality of first radiating grooves (412), and the plurality of first radiating grooves (412) are distributed at equal intervals along the periphery of the radiating block (41).
4. The chip heat dissipation structure for a 1U rack housing as defined in claim 1, wherein: also comprises an adhesive silicone rubber (52), wherein,
and the viscous silicone rubber (52) is coated between the heat dissipation block (41) and the top cover (3) and is used for bonding the heat dissipation block (41) and the top cover (3).
5. The chip heat dissipation structure for a 1U rack housing as defined in claim 1, wherein: also comprises a supporting plate (6), wherein,
the supporting plate (6) is arranged in the assembly cavity (11) and used for supporting the top cover (3) in the vertical direction, and the top cover (3) is detachably connected with the supporting plate (6).
6. The 1U rack housing chip heat dissipating structure of claim 5, wherein: the support plate (6) is provided with a second threaded hole (61), the top cover (3) is provided with a first assembly hole (31) opposite to the second threaded hole (61), and the first assembly hole (31) is used for a bolt to pass through.
7. The chip heat dissipation structure for a 1U rack housing as defined in claim 1, wherein: the top cover (3) is far away from one side of the radiating block (41) is provided with a plurality of second radiating grooves (32), and the second radiating grooves (32) are distributed at equal intervals along the width direction of the top cover (3).
8. The chip heat dissipation structure for a 1U rack housing as defined in claim 1, wherein: also comprises a nut post (7), wherein,
the number of the nut columns (7) is multiple, the nut columns are all arranged at the bottom wall of the assembly cavity (11), and the PCB (21) and the nut columns (7) are arranged at one end, away from the bottom wall of the assembly cavity (11), of the nut columns (7) in a separable mode.
9. The 1U rack housing chip heat dissipating structure of claim 8, wherein: the nut post (7) is kept away from one end of assembly chamber (11) diapire has seted up third screw hole (71), set up on PCB board (21) with second pilot hole (211) of third screw hole (71) relative position, second pilot hole (211) are used for supplying the bolt to pass.
10. The chip heat dissipation structure for a 1U rack housing as defined in claim 1, wherein: and the periphery of the rack type shell body (1) is provided with heat dissipation holes (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321676970.4U CN220068149U (en) | 2023-06-29 | 2023-06-29 | 1U frame is chip heat radiation structure for shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321676970.4U CN220068149U (en) | 2023-06-29 | 2023-06-29 | 1U frame is chip heat radiation structure for shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220068149U true CN220068149U (en) | 2023-11-21 |
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ID=88750863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321676970.4U Active CN220068149U (en) | 2023-06-29 | 2023-06-29 | 1U frame is chip heat radiation structure for shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220068149U (en) |
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2023
- 2023-06-29 CN CN202321676970.4U patent/CN220068149U/en active Active
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