CN220065715U - Novel packaging structure of component and component - Google Patents
Novel packaging structure of component and component Download PDFInfo
- Publication number
- CN220065715U CN220065715U CN202321420279.XU CN202321420279U CN220065715U CN 220065715 U CN220065715 U CN 220065715U CN 202321420279 U CN202321420279 U CN 202321420279U CN 220065715 U CN220065715 U CN 220065715U
- Authority
- CN
- China
- Prior art keywords
- glass
- hot melt
- adhesive film
- melt adhesive
- packaging
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 62
- 239000011521 glass Substances 0.000 claims abstract description 86
- 239000004831 Hot glue Substances 0.000 claims abstract description 46
- 239000000853 adhesive Substances 0.000 claims abstract description 33
- 230000001070 adhesive effect Effects 0.000 claims abstract description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 29
- 239000010703 silicon Substances 0.000 claims abstract description 29
- 210000001503 joint Anatomy 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000010248 power generation Methods 0.000 abstract description 7
- 238000013461 design Methods 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 10
- 238000012797 qualification Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a packaging structure of a novel component and the component, which comprises upper glass, an upper hot melt adhesive film, a silicon wafer group, a lower hot melt adhesive film, lower glass and glass packaging adhesive. The structure design is scientific and reasonable, the silicon chip is fixed firmly, the glass is bonded firmly, the qualified product is processed highly, and the double-packaging structure design ensures the power generation efficiency of the product, prolongs the service life of the product, meets the use requirement of the market, and is beneficial to the popularization of the product.
Description
Technical Field
The utility model belongs to the technical field of photovoltaic power generation, and particularly relates to a novel packaging structure of a component and the component.
Background
At present, the existing photovoltaic module is easy to cause problems of displacement of a silicon wafer, glue overflow and the like in processing, so that a large amount of labor is required for repairing the module in processing, or the module is scrapped, the qualification rate of module production is reduced, and the cost of module production is increased.
Meanwhile, when the conventional assembly is used, rainwater, air and the like can easily enter, so that the silicon wafer fixing adhesive is yellowing, the light transmittance is reduced, the power generation efficiency of the silicon wafer is affected, and the service life of the assembly is greatly reduced.
Therefore, there is a need in the art for an assembly that reduces manual rework during processing, improves product yield, and provides for subsequent use with a life guard.
Disclosure of Invention
The utility model aims to provide a novel packaging structure of a component and the component, which have scientific and reasonable structural design, firm fixation of silicon chips, firm adhesion of glass, qualified high product processing, and double packaging structural design, ensure the power generation efficiency of the product, improve the service life of the product, meet the use requirements of the market and facilitate the popularization of the product.
In order to achieve the above design purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides a novel packaging structure of subassembly, includes upper glass, goes up hot melt adhesive film, silicon chip group, lower hot melt adhesive film, lower floor glass, glass packaging adhesive, and lower hot melt adhesive film is laid to lower floor glass upside, and lower hot melt adhesive film upside is equipped with the silicon chip group, and upper hot melt adhesive film is laid to the silicon chip group upside, and upper hot melt adhesive film upside is equipped with upper glass, border position sets up glass packaging adhesive between upper glass, the lower floor glass, seals upper glass, lower floor glass with upper hot melt adhesive film, silicon chip group, lower hot melt adhesive film through glass packaging adhesive.
During processing, the upper hot melt adhesive film and the lower hot melt adhesive film are melted and adhered by heating, so that the silicon wafer group is fixed between the upper glass layer and the lower glass layer, and the upper glass layer and the lower glass layer are firmly adhered.
The glass packaging adhesive is arranged along the upper inner side of the peripheral edge of the lower glass layer, and the lower hot melt adhesive film is paved on the lower glass layer and is arranged on the inner side of the glass packaging adhesive.
The upper hot melt adhesive film is arranged on the inner side of the glass packaging adhesive, and the upper hot melt adhesive film, the silicon chip group and the lower hot melt adhesive film are sealed between the upper glass layer and the lower glass layer through the glass packaging adhesive.
And the silicon wafer groups are connected in series through a series welding belt.
The assembly manufactured by adopting the packaging structure mainly comprises a frame and the packaging structure, wherein the frames are respectively embedded and fixed around the packaging structure, 45-degree corners are respectively arranged on the inner sides of two ends of the frame, and the adjacent frames are in butt joint through the 45-degree corners.
The packaging structure is provided with a frame packaging adhesive at the embedded position of the frame, and the edge of the packaging structure is sealed with the inner edge of the frame through the frame packaging adhesive.
The packaging structure of the novel component and the component have the beneficial effects that: the design of the upper hot melt adhesive film and the lower hot melt adhesive film ensures that the silicon wafer group is firmly fixed and is not easy to displace, the qualification rate of product processing is improved, the upper hot melt adhesive film and the lower hot melt adhesive film are prevented from melting and overflowing from the edges of the upper glass and the lower glass in the processing process through the glass packaging adhesive, and the qualification rate of product processing is improved; meanwhile, when the structure of the glass packaging adhesive is adopted to prevent the rainwater and the like from penetrating from the edges of the upper glass layer and the lower glass layer in the subsequent use, the power generation efficiency of the silicon wafer group is further reduced, and the service life of the silicon wafer group is shortened.
Can prevent that rainwater etc. from getting into the packaging structure inboard through the frame encapsulation glue, and then influence packaging structure's generating efficiency, reduce packaging structure's life.
Drawings
FIG. 1 is a schematic illustration of the packaging structure of the novel assembly of the present utility model;
FIG. 2 is an enlarged view of view A-A of FIG. 1;
FIG. 3 is a schematic view of the position of the lower hot melt adhesive film, lower glass, glass encapsulant of the package structure of the novel assembly of the present utility model;
FIG. 4 is a dispersion schematic of the package structure of the novel assembly of the present utility model;
FIG. 5 is a schematic illustration of a component fabricated from the package structure of the novel component of the present utility model;
FIG. 6 is an enlarged cross-sectional view of FIG. 5;
FIG. 7 is a top view of an assembly made of the package structure of the novel assembly of the present utility model;
fig. 8 is a dispersion schematic diagram of a component fabricated by the package structure of the novel component according to the present utility model.
Detailed Description
As shown in fig. 1-4, in the embodiment of the utility model, the packaging structure of the novel assembly comprises an upper layer glass 1, an upper hot melt adhesive film 2, a silicon wafer group 3, a lower hot melt adhesive film 4, a lower layer glass 5 and a glass packaging adhesive 6, wherein the silicon wafer group 3 which is uniformly distributed is paved on the upper side of the lower hot melt adhesive film 4 of the lower layer glass 5, the upper hot melt adhesive film 2 is paved on the upper side of the silicon wafer group 3, the upper layer glass 1 is arranged on the upper side of the upper hot melt adhesive film 2, the glass packaging adhesive 6 is arranged at the edge position between the upper layer glass 1 and the lower layer glass 5, the upper hot melt adhesive film 2, the silicon wafer group 3 and the lower hot melt adhesive film 4 are packaged between the upper layer glass 1 and the lower layer glass 5 through the glass packaging adhesive 6, and the upper hot melt adhesive film 2 and the lower hot melt adhesive film 4 are melted and adhered by heating during processing, the upper layer glass 1 and the lower layer glass 5 are firmly adhered, the upper layer glass 1 and the lower layer glass 5 are not easily displaced, the qualification rate of the upper layer glass 1 and lower layer glass 5 is prevented from overflowing during processing; meanwhile, when the structure of the glass packaging adhesive 6 is adopted to prevent rainwater and the like from penetrating from the edges of the upper glass layer 1 and the lower glass layer 5 in the subsequent use, the power generation efficiency of the silicon wafer group 3 is further reduced, and the service life of the silicon wafer group 3 is shortened.
In a further implementation, as shown in fig. 4, the glass packaging adhesive 6 is preferably disposed along the upper inner side of the peripheral edge of the lower glass layer 5, and the lower hot melt adhesive film 4 is laid on the upper surface of the lower glass layer 5 and disposed on the inner side of the glass packaging adhesive 6.
In further implementation, it is preferable that the upper hot melt adhesive film 2 is disposed inside the glass packaging adhesive 6, the upper glass layer 1 covers the lower glass layer 5, and the upper hot melt adhesive film 2, the silicon wafer group 3 and the lower hot melt adhesive film 4 are sealed between the upper glass layer 1 and the lower glass layer 5 through the glass packaging adhesive 6.
In a further implementation, the silicon wafer groups 3 are preferably connected in series through a series welding belt 7.
As shown in fig. 5-8, the assembly 100 manufactured by adopting the packaging structure of the novel assembly mainly comprises a frame 101 and a packaging structure 102, wherein the frame 101 is respectively embedded and fixed around the packaging structure 102, 45-degree corners are respectively arranged on the inner sides of two ends of the frame 101, and the adjacent frames 101 are in butt joint through the 45-degree corners.
In a further implementation, preferably, a frame encapsulating adhesive 8 is disposed at a position where the encapsulating structure 102 is embedded with the frame 101, and the edge of the encapsulating structure 102 is sealed with the inner edge of the frame 101 through the frame encapsulating adhesive 8. The frame packaging adhesive 8 can prevent rainwater and the like from entering the inner side of the packaging structure 102, so that the power generation efficiency of the packaging structure 102 is affected, and the service life of the packaging structure 102 is shortened.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. The utility model provides a novel packaging structure of subassembly which characterized in that: the glass packaging device comprises upper glass, an upper hot melt adhesive film, a silicon wafer group, a lower hot melt adhesive film, lower glass and glass packaging adhesive, wherein the lower hot melt adhesive film is paved on the upper side of the lower glass, the silicon wafer group is arranged on the upper side of the lower hot melt adhesive film, the upper hot melt adhesive film is paved on the upper side of the silicon wafer group, the upper glass is arranged on the upper side of the upper hot melt adhesive film, the glass packaging adhesive is arranged at the edge position between the upper glass and the lower glass, and the upper hot melt adhesive film, the silicon wafer group and the lower hot melt adhesive film are sealed between the upper glass and the lower glass through the glass packaging adhesive.
2. The package structure of the novel assembly according to claim 1, wherein: the glass packaging adhesive is arranged along the upper inner side of the peripheral edge of the lower glass layer, and the lower hot melt adhesive film is paved on the lower glass layer and is arranged on the inner side of the glass packaging adhesive.
3. The package structure of the novel assembly according to claim 2, wherein: the upper hot melt adhesive film is arranged on the inner side of the glass packaging adhesive, and the upper hot melt adhesive film, the silicon chip group and the lower hot melt adhesive film are sealed between the upper glass layer and the lower glass layer through the glass packaging adhesive.
4. A package structure of a novel assembly according to claim 3, wherein: and the silicon wafer groups are connected in series through a series welding belt.
5. A component fabricated using the package structure of the novel component of claim 1, wherein: the novel packaging structure mainly comprises a frame and a packaging structure, wherein the frames are respectively embedded and fixed around the packaging structure, 45-degree corners are respectively arranged on the inner sides of two ends of the frame, and adjacent frames are in butt joint through the 45-degree corners.
6. An assembly as claimed in claim 5, wherein: the packaging structure is provided with a frame packaging adhesive at the embedded position of the frame, and the edge of the packaging structure is sealed with the inner edge of the frame through the frame packaging adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321420279.XU CN220065715U (en) | 2023-06-06 | 2023-06-06 | Novel packaging structure of component and component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321420279.XU CN220065715U (en) | 2023-06-06 | 2023-06-06 | Novel packaging structure of component and component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220065715U true CN220065715U (en) | 2023-11-21 |
Family
ID=88767716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321420279.XU Active CN220065715U (en) | 2023-06-06 | 2023-06-06 | Novel packaging structure of component and component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220065715U (en) |
-
2023
- 2023-06-06 CN CN202321420279.XU patent/CN220065715U/en active Active
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