CN209804683U

CN209804683U - Photovoltaic cell assembly

Info

Publication number: CN209804683U
Application number: CN201920340227.9U
Authority: CN
Inventors: 王红卫; 陈宗洋
Original assignee: Beijing Hanneng Photovoltaic Technology Co Ltd
Current assignee: Beijing Hanneng Photovoltaic Technology Co Ltd
Priority date: 2019-03-18
Filing date: 2019-03-18
Publication date: 2019-12-17
Anticipated expiration: 2029-03-18

Abstract

The utility model relates to a photovoltaic cell assembly, include: the panel and the substrate are oppositely arranged; at least two photovoltaic chips are clamped and fixed between the panel and the substrate, the at least two photovoltaic chips are electrically connected, and gaps are formed at intervals; and the at least two photovoltaic chips are respectively bonded and fixed with the panel and the substrate through the bonding layer, and the bonding layer fills the gap. The utility model discloses can improve photovoltaic cell module's generating efficiency, security and can satisfy variety application demand.

Description

photovoltaic cell assembly

Technical Field

The utility model relates to a photovoltaic technology field especially relates to a photovoltaic cell subassembly.

Background

With the increasing trend of global energy demand, solar energy is seen as one of the most promising, available, renewable energy sources. With the global requirement for environmental protection becoming higher and higher, the power generation mode gradually shifts from traditional thermal power generation and the like to clean energy power generation, and solar power generation is not affected by areas and is widely adopted. Adopt photovoltaic cell as the curtain wall construction of integration still has the effect that the high efficiency provided the electric energy when realizing traditional curtain wall function.

In order to meet the design requirement of the output performance of the photovoltaic cell module, the photovoltaic cell module is produced in a splicing mode and is a feasible method.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned problem that exists among the related art, the embodiment of the utility model provides a photovoltaic cell subassembly. The technical scheme is as follows:

According to the utility model discloses photovoltaic cell subassembly, include:

The panel and the substrate are oppositely arranged; at least two photovoltaic chips are clamped and fixed between the panel and the substrate, the at least two photovoltaic chips are electrically connected, and gaps are formed at intervals; and the at least two photovoltaic chips are respectively bonded and fixed with the panel and the substrate through the bonding layer, and the bonding layer fills the gap.

according to the utility model discloses photovoltaic cell subassembly, through relative panel and the at least two photovoltaic chip of base plate centre gripping that set up, the electricity is connected between two at least photovoltaic chips and the interval is provided with gappedly, and two at least photovoltaic chips pass through the tie coat and bond fixedly with panel and base plate respectively, and the tie coat is filled the clearance. The splicing strength of the photovoltaic chips can be improved, splicing gaps generated during packaging of the photovoltaic cell assembly can be eliminated, and the appearance of the photovoltaic cell assembly is beautified; the photovoltaic cell module can increase the generating efficiency and the safety of the photovoltaic cell module and meet the application requirements of diversity by splicing and using the photovoltaic chips.

Optionally, the bonding layer includes a first bonding layer and a second bonding layer, the at least two photovoltaic chips are bonded and fixed to the panel through the first bonding layer, and the at least two photovoltaic chips are bonded and fixed to the substrate through the second bonding layer.

Optionally, the adhesive layer further includes a filling layer, and the filling layer fills the gap and is respectively connected to the first adhesive layer and the second adhesive layer.

Optionally, the gap is 1mm to 10 mm.

Optionally, the material of the adhesive layer is one of polyvinyl butyral, an ethylene-vinyl acetate copolymer, and an ionic intermediate film.

Optionally, the panel is a light-transmitting panel, and a side of the panel facing the substrate has a glaze layer completely covering the gap.

Optionally, the photovoltaic chip is a copper indium gallium selenide cell.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic structural diagram of a photovoltaic cell module according to an embodiment of the present invention.

Detailed Description

reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features, or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

The embodiment of the utility model provides a technical scheme relates to a photovoltaic cell subassembly, as shown in figure 1, include: the panel 10 and the substrate 50, wherein the panel 10 and the substrate 50 are oppositely arranged; at least two photovoltaic chips 20 fixed between the panel 10 and the substrate 50 are clamped, the at least two photovoltaic chips 20 are electrically connected, and gaps 21 are formed at intervals; and the bonding layer 30 is used for bonding and fixing at least two photovoltaic chips 20 with the panel 10 and the substrate 50 through the bonding layer 30, and the bonding layer 30 fills the gap 21.

In the present embodiment, the panel 10 and the substrate 50 are made of light-transmitting materials so that the photovoltaic cell module 100 can sufficiently receive sunlight. Further, the panel 10 and the substrate 50 are glass. Of course, in some embodiments, only the panel 10 is made of a light-transmitting material, and the substrate 50 may be made of other materials as needed.

In the present embodiment, the at least two photovoltaic chips 20 are electrically connected in series, in parallel, or a combination thereof. For the case of two photovoltaic chips, the two photovoltaic chips may be connected in series, or the two photovoltaic chips may also be connected in parallel; for the case of multiple photovoltaic chips, the multiple photovoltaic chips may be connected in series or in parallel, or the multiple photovoltaic chips may be connected in parallel and then in series, or the multiple photovoltaic chips may be connected in series and then in parallel. The number of photovoltaic chips and the series-parallel connection mode between the photovoltaic chips are selected according to the requirements of the output electrical parameters of the photovoltaic cell assembly 100. According to different situations, the photovoltaic chips with corresponding quantity are selected to be connected in series and in parallel according to the application requirements of the photovoltaic cell assembly, so that corresponding electrical parameters are output, and the diversity application requirements of the photovoltaic cell assembly can be met.

In the present embodiment, the photovoltaic chip 20 is bonded and fixed to the panel 10 and the substrate 50 via the adhesive layer 30. At least two photovoltaic chips 20 interval settings are formed with clearance 21, and tie coat 30 fills clearance 21 completely and can increase photovoltaic chip 20's concatenation intensity, and simultaneously, panel 10 and base plate 50 all bond fixedly through tie coat 30 and photovoltaic chip 20 for the holistic intensity of battery pack 100 obtains improving, has higher security and life.

According to the utility model discloses photovoltaic cell subassembly 100, through relative panel 10 and the at least two photovoltaic chip 20 of base plate 50 centre gripping that set up, the electricity is connected between at least two photovoltaic chip 20 and the interval is provided with and is formed with clearance 21, and at least two photovoltaic chip 20 bond fixedly with panel 10 and base plate 50 respectively through tie coat 30, and tie coat 30 packing clearance 21. The splicing strength of the photovoltaic chips can be improved, splicing gaps generated during packaging of the photovoltaic cell assembly can be eliminated, and the appearance of the photovoltaic cell assembly is beautified; the photovoltaic cell module can increase the generating efficiency and the safety of the photovoltaic cell module and meet the application requirements of diversity by splicing and using the photovoltaic chips.

In some embodiments, the adhesive layer 30 includes a first adhesive layer 31 and a second adhesive layer 32. The at least two photovoltaic chips 20 are fixedly bonded to the panel 10 through the first bonding layer 31, and the at least two photovoltaic chips 20 are fixedly bonded to the substrate 50 through the second bonding layer 32. The adhesive layer 30 further includes a filling layer 33, and the filling layer 33 fills the gap 21 and connects the first adhesive layer 31 and the second adhesive layer 32, respectively. The filling layer 33 completely filling the gap 21 may increase the strength of the at least two photovoltaic chips 20, and the filling layer 33 together with the first adhesive layer 31 and the second adhesive layer 32 may increase the overall strength of the photovoltaic cell assembly 100.

In some embodiments, the gap is 1mm to 10 mm. According to the application area of the photovoltaic cell module 100, the size of the reserved gap can be configured according to the local temperature and air volume conditions, and the range of the gap can be 1mm-10mm, for example, for an area with small temperature change and small air volume, the deformation amount generated by the photovoltaic chip is small, the gap can be configured to be 1mm, and for an area with large temperature difference and large air volume, the deformation amount generated by the photovoltaic chip is large, and the gap can be configured to be 10 mm.

in some embodiments, the material of the tie layer 30 is one of polyvinyl butyral, ethylene vinyl acetate, and an ionic interlayer. The material can well adhere the photovoltaic chips 20, the panel 10 and the substrate 50, so that the connection strength of at least two photovoltaic chips 20 is increased, and the vacancy and the bubbles of the material are avoided. The polyvinyl butyral, the ethylene-vinyl acetate copolymer and the ionic intermediate film are used as bonding materials which have high light transmission and certain ductility, and can completely fill gaps among the panel, the photovoltaic chip and the substrate, so that the photovoltaic cell assembly is ensured to absorb sunlight, and the strength of the photovoltaic cell assembly is improved. Of course, other adhesive materials may be used.

In some embodiments, the panel 10 is a light-transmitting panel, and the side of the panel 10 facing the substrate 50 has a glaze layer that completely covers the gap 21. The panel 10 is a light-transmitting panel, in order to improve the attractiveness of the photovoltaic cell module 100, a glaze layer is arranged on one side of the panel 10 corresponding to the gap 21 at the splicing position of at least two photovoltaic cells, and the color and the pattern of the glaze layer are set to be consistent with those of the photovoltaic cells, so that the consistency of the appearance of the photovoltaic cell module can be ensured, and the attractiveness is improved.

In an embodiment, the photovoltaic chip 20 is a Copper Indium Gallium Selenide (CIGS) cell, a material of a power generation layer of the photovoltaic chip is copper indium gallium selenide, and the Copper Indium Gallium Selenide (CIGS) photovoltaic cell has the advantages of strong light absorption capability, good power generation stability and high conversion efficiency. Of course, in other embodiments, the power generation layer material may be selected from any one of copper indium selenide, copper indium gallium selenide sulfide, copper zinc tin sulfide, and cadmium telluride.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A photovoltaic cell assembly, comprising:

The panel and the substrate are oppositely arranged;

At least two photovoltaic chips are clamped and fixed between the panel and the substrate, the at least two photovoltaic chips are electrically connected, and gaps are formed at intervals;

And the at least two photovoltaic chips are respectively bonded and fixed with the panel and the substrate through the bonding layer, and the bonding layer fills the gap.

2. The assembly according to claim 1, wherein the adhesive layer comprises a first adhesive layer and a second adhesive layer, the at least two photovoltaic chips are adhered and fixed to the panel through the first adhesive layer, and the at least two photovoltaic chips are adhered and fixed to the substrate through the second adhesive layer.

3. The assembly according to claim 2, wherein the adhesive layer further comprises a filling layer filling the gap and connecting the first adhesive layer and the second adhesive layer, respectively.

4. The assembly defined in claim 1 wherein the gap is between 1mm and 10 mm.

5. The assembly according to claim 1, wherein the material of the tie layer is one of polyvinyl butyral, ethylene vinyl acetate, and an ionic interlayer.

6. The assembly according to claim 1, wherein the panel is a light-transmitting panel, the panel having a glaze layer on a side facing the substrate, the glaze layer completely covering the gap.

7. The assembly according to claim 1, wherein the photovoltaic chip is a copper indium gallium selenide cell.