CN220064266U - High-voltage cable buffer layer ablation simulation device under air gap discharge condition - Google Patents
High-voltage cable buffer layer ablation simulation device under air gap discharge condition Download PDFInfo
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- CN220064266U CN220064266U CN202320296906.7U CN202320296906U CN220064266U CN 220064266 U CN220064266 U CN 220064266U CN 202320296906 U CN202320296906 U CN 202320296906U CN 220064266 U CN220064266 U CN 220064266U
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- air gap
- lower electrode
- discharge condition
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- 238000002679 ablation Methods 0.000 title claims abstract description 47
- 238000004088 simulation Methods 0.000 title claims abstract description 33
- 238000009413 insulation Methods 0.000 claims description 33
- 239000010949 copper Substances 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 230000002093 peripheral effect Effects 0.000 claims description 18
- 230000007246 mechanism Effects 0.000 abstract description 7
- 238000011160 research Methods 0.000 abstract description 6
- 238000002474 experimental method Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
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Abstract
The utility model belongs to the technical field of high-voltage power cable experiments, and discloses a high-voltage cable buffer layer ablation simulation device under an air gap discharge condition. The device has the advantages of simple structure, convenient use, high experimental efficiency and close to the actual working condition, can be widely applied to the simulation research of the ablation fault of the high-voltage cable buffer layer, and provides good and beneficial experimental platform support for the research of the ablation mechanism of the high-voltage cable buffer layer under the air gap discharge condition.
Description
Technical Field
The utility model belongs to the technical field of high-voltage power cable experiments, and relates to a high-voltage cable buffer layer ablation simulation device under an air gap discharge condition, which is used for simulating the ablation process of a buffer layer under the air gap discharge condition by constructing poor contact between an aluminum sheath of a high-voltage cable and the buffer layer so as to study the performance change of the buffer layer after ablation under the discharge condition.
Background
In the actual manufacturing, transportation, installation and operation process of the high-voltage power cable, the high-voltage power cable is inevitably subjected to conditions such as external extrusion, torsion and even excessive bending, so that an aluminum sheath in the power cable is in poor contact with a buffer layer. In the process of the operation of the cable, the poor contact can lead to uneven leakage current flowing in the buffer layer, so that air gap discharge occurs at the poor contact position, the ablation degradation of the buffer layer is caused, the normal operation of the cable is seriously endangered, the power cable is extremely easy to fail, and a large amount of economic loss is caused. Therefore, research on the change rule of the performance of the buffer layer before and after ablation under the air gap discharge condition is needed, and the degradation mechanism of the performance of the buffer layer under the air gap discharge condition is mastered, so that a theoretical basis is provided for solving the ablation fault of the buffer layer. However, the simulation method of the buffer layer ablation under the air gap discharge condition is lacking at present, and the buffer layer ablation simulation experiment under the air gap discharge condition is difficult to develop. Therefore, development of a related simulation device is needed, which provides a basis for developing related experimental study.
Disclosure of Invention
In order to overcome the defects in the prior art, the utility model aims to provide a high-voltage cable buffer layer ablation simulation device under the air gap discharge condition, so as to solve the technical problem that the buffer layer ablation performance fault condition of a power cable cannot be judged and simulated in the prior art, and potential safety hazards exist when the power cable is extruded, twisted or even excessively bent.
The utility model is realized by the following technical scheme:
a high-voltage cable buffer layer ablation simulation device under the air gap discharge condition comprises a supporting frame, an electrode rod unit, a buffer layer sample and a lower electrode; the lower electrode is arranged at the bottom end of the supporting frame and is connected with the peripheral circuit; the buffer layer sample is placed on the lower electrode, the electrode rod unit vertically penetrates through the top end of the supporting frame and points to the buffer layer sample, and the end part of the electrode rod unit is connected with the peripheral circuit.
Preferably, the electrode rod unit comprises a copper electrode rod and an electrode tip, wherein the copper electrode rod vertically penetrates through the top end of the supporting frame and stretches into the supporting frame to point to the buffer layer sample, the electrode tip is assembled on the end part of the copper electrode rod close to the buffer layer sample side, and the end part of the copper electrode rod far away from the buffer layer sample side is connected with the peripheral circuit.
Further, an air gap distance exists between the electrode head and the buffer layer sample, wherein the distance range is 1-10 mm.
Further, the radius of curvature of the electrode tip is in the range of 1 to 8. Mu.m.
Preferably, the support frame comprises an upper electrode insulation support plate, a lower electrode insulation support plate and a plurality of electrode insulation support plate connecting rods; the connecting rods of the electrode insulating support plates are arranged between the upper electrode insulating support plate and the lower electrode insulating support plate to form a hollow frame structure, the lower electrode is placed on the lower electrode insulating support plate, and the electrode rod units vertically penetrate through the upper electrode insulating support plate and extend into the support frame to point to the buffer layer sample.
Further, the upper electrode insulating support plate and the electrode insulating support plate connecting rods are correspondingly fixed through a plurality of screws.
Further, electrode supporting feet are respectively arranged at the bottom ends of the lower electrode insulating supporting plates.
Further, a screw rod is arranged at the bottom side of the lower electrode, and penetrates through the lower electrode insulation supporting plate to be connected with a peripheral circuit.
Further, the connecting rods of the electrode insulating support plates are identical in length and are arranged in parallel between the upper electrode insulating support plate and the lower electrode insulating support plate.
Preferably, the area of the plate surface of the lower electrode is larger than the area of the buffer layer sample.
Compared with the prior art, the utility model has the following beneficial technical effects:
the utility model provides a high-voltage cable buffer layer ablation simulation device under an air gap discharge condition, which is characterized in that an electrode rod unit and a lower electrode are arranged in a supporting frame and are respectively connected with a peripheral circuit, a discharge condition is provided for an experiment, a buffer layer sample is placed on the lower electrode, and the buffer layer is subjected to discharge cauterization ablation simulation, so that the ablation process of the buffer layer under the air gap discharge condition can be simulated, the change rule of the performance of the buffer layer before and after ablation is obtained, the degradation mechanism of the performance of the buffer layer under the air gap discharge condition is conveniently mastered, and a theoretical basis is provided for reducing the potential safety hazard of a power cable. The device has the advantages of clear and simple structure, convenient use, high experimental efficiency, close to practical working conditions, and the like, can be widely applied to simulation research of ablation faults of the high-voltage cable buffer layer, and provides good and beneficial experimental platform support for research of the ablation mechanism of the high-voltage cable buffer layer under the air gap discharge condition.
Further, the electrode rod unit comprises a copper electrode rod and an electrode head, the copper electrode rod vertically penetrates through the top end of the supporting frame and stretches into the supporting frame to point to the buffer layer sample, the electrode head is assembled on the end part of the copper electrode rod close to the buffer layer sample side, the end part of the copper electrode rod far away from the buffer layer sample side is connected with a peripheral circuit, discharge conditions are conveniently provided for the buffer layer sample, and ablation simulation of the buffer layer under the air gap discharge conditions is conveniently carried out.
Furthermore, an air gap distance exists between the electrode head and the buffer layer sample, wherein the distance range is 1-10 mm, and the ablation simulation of the buffer layer under the air gap discharge condition is facilitated.
Further, the support frame comprises an upper electrode insulation support plate, a lower electrode insulation support plate and a plurality of electrode insulation support plate connecting rods, plays a role in supporting the electrode rod unit, the buffer layer sample and the lower electrode, and is convenient for ablation simulation of the buffer layer under the air gap discharge condition.
Further, electrode supporting feet are respectively arranged at the bottom ends of the lower electrode insulating supporting plates, so that the lower electrode insulating supporting plates are convenient to connect with peripheral circuits, and discharge conditions are provided.
Furthermore, the bottom side of the lower electrode is provided with a screw rod, and the screw rod penetrates through the lower electrode insulating support plate to be connected with a peripheral circuit, so that the discharge condition can be conveniently improved, and the ablation simulation of the buffer layer under the air gap discharge condition can be conveniently carried out.
Furthermore, the connecting rods of the electrode insulating support plates are identical in length and are arranged in parallel between the upper electrode insulating support plate and the lower electrode insulating support plate, so that the electrode rod units can be aligned to the buffer layer samples, and the buffer layer ablation simulation under the air gap discharge condition can be conveniently carried out.
Drawings
FIG. 1 is a schematic diagram of a high voltage cable buffer layer ablation simulation device according to the present utility model.
In the figure: 1-an upper electrode insulating support plate; 2-electrode insulating support plate connecting rods; 3-a lower electrode insulating support plate; 4-copper electrode rods; 5-electrode head; 6-buffer layer sample; 7-a lower electrode; 8-a screw; 9-electrode support feet; 10-screw.
Detailed Description
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the utility model described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The utility model is described in further detail below with reference to the attached drawing figures:
the utility model aims to provide a high-voltage cable buffer layer ablation simulation device under an air gap discharge condition, which is used for solving the technical problem that the buffer layer ablation performance fault condition of a power cable cannot be judged and simulated in the prior art, so that potential safety hazards exist when the power cable is extruded, twisted or even excessively bent.
Specifically, according to fig. 1, the high-voltage cable buffer layer ablation simulation device comprises a support frame, an electrode rod unit, a buffer layer sample 6 and a lower electrode 7; the lower electrode 7 is arranged at the bottom end of the supporting frame, and the lower electrode 7 is connected with a peripheral circuit; the buffer layer sample 6 is placed on the lower electrode 7, the electrode rod unit vertically penetrates through the top end of the supporting frame and is arranged in a direction of the buffer layer sample 6, and the end part of the electrode rod unit is connected with a peripheral circuit.
Specifically, the electrode rod unit comprises a copper electrode rod 4 and an electrode tip 5, wherein the copper electrode rod 4 vertically penetrates through the top end of the supporting frame and stretches into the supporting frame to point to the buffer layer sample 6, the electrode tip 5 is assembled on the end part of the copper electrode rod 4 close to the buffer layer sample 6, and the end part of the copper electrode rod 4 far away from the copper electrode rod 4 of the buffer layer sample 6 is connected with a peripheral circuit.
Wherein, an air gap distance exists between the electrode tip 5 and the buffer layer sample 6, the distance range is 1-10 mm, and the radius of curvature of the electrode tip 5 is 1-8 mu m.
Specifically, the support frame comprises an upper electrode insulation support plate 1, a lower electrode insulation support plate 3 and a plurality of electrode insulation support plate connecting rods 2; the electrode rod units vertically penetrate through the upper electrode insulating support plate 1 and extend into the support frame to point to the buffer layer sample 6.
Wherein, the upper electrode insulation support plate 1 and the electrode insulation support plate connecting rods 2 are correspondingly fixed by a plurality of screws 10.
Wherein, the bottom of the lower electrode insulation supporting plate 3 is respectively provided with an electrode supporting foot 9.
The bottom side of the lower electrode 7 is provided with a screw rod 8, and the screw rod 8 penetrates through the lower electrode insulation supporting plate 3 to be connected with a peripheral circuit.
Wherein, the lengths of a plurality of electrode insulating support plate connecting rods 2 are the same, and are all arranged in parallel between the upper electrode insulating support plate 1 and the lower electrode insulating support plate 3.
Specifically, the plate surface area of the lower electrode 7 is larger than the area of the buffer layer sample 6.
Examples
In this embodiment, the high voltage cable buffer layer ablation simulation device under the air gap discharge condition is shown in fig. 1, and includes a lower electrode insulation support plate 3, an upper electrode insulation support plate 1, and a plurality of electrode insulation support plate connecting rods. The upper electrode insulating support plate 1 and the lower electrode insulating support plate 3 are rectangular with the thickness of 1cm and the thickness of 20cm multiplied by 15cm, and the material is epoxy resin. The diameter of the connecting rods 2 of the electrode insulating support plates is 0.6mm, the length is 15cm, and the materials are polytetrafluoroethylene.
The copper electrode rod 4 is inserted into the upper electrode insulating support plate 1 and can be adjusted up and down through threads, and the lower electrode 7 is fixed on the lower electrode insulating support plate 3. The lower electrode 7 has a size corresponding to that of the lower electrode insulating support plate 3, and the lower electrode insulating support plate 3 is provided with a screw 8 extending in the middle for peripheral circuit connection. The copper electrode rod 4 had a diameter of 0.8cm and a length of 5cm. The distance between the copper electrode rod 4 and the upper surface of the buffer layer sample 6 was 2mm. The copper electrode rod 4 and the lower electrode 7 are made of brass, the electrode head 5 is made of electrical aluminum, and the curvature radius of the electrode head 5 is 3 mu m.
According to the high-voltage cable buffer layer ablation simulation device under the air gap discharge condition, when the high-voltage cable buffer layer ablation simulation device is used, the peripheral circuits are used for respectively discharging the electrode rod unit and the lower electrode insulation support plate 3, the discharge condition is provided for experiments, the buffer layer sample is placed on the lower electrode, an air gap distance exists between the electrode rod unit and the buffer layer sample 6, the ablation process of the buffer layer under the air gap discharge condition can be simulated by performing discharge ablation simulation on the buffer layer, the change rule of the performance of the buffer layer before and after ablation can be effectively observed, the degradation mechanism of the performance of the buffer layer under the air gap discharge condition is convenient to master, and potential safety hazards to a power cable can be reduced through the mechanism.
In summary, the high-voltage cable buffer layer ablation simulation device under the air gap discharge condition provided by the utility model can simulate the bad contact condition of the corrugated aluminum sheath and the buffer layer in an actual cable, is used for analyzing the change rule of the performance of the buffer layer after ablation under the air gap discharge condition, and provides a research platform and technical support for researching the high-voltage cable buffer layer ablation failure mechanism under the air gap discharge condition.
Finally, it should be noted that: the above embodiments are only for illustrating the technical aspects of the present utility model and not for limiting the same, and although the present utility model has been described in detail with reference to the above embodiments, it should be understood by those of ordinary skill in the art that: modifications and equivalents may be made to the specific embodiments of the utility model without departing from the spirit and scope of the utility model, which is intended to be covered by the claims.
Claims (7)
1. The high-voltage cable buffer layer ablation simulation device under the air gap discharge condition is characterized by comprising a supporting frame, an electrode rod unit, a buffer layer sample (6) and a lower electrode (7); the lower electrode (7) is arranged at the bottom end of the supporting frame, and the lower electrode (7) is connected with a peripheral circuit; the buffer layer sample (6) is placed on the lower electrode (7), the electrode rod unit vertically penetrates through the top end of the supporting frame and is arranged in a direction of the buffer layer sample (6), and the end part of the electrode rod unit is connected with a peripheral circuit;
the electrode rod unit comprises a copper electrode rod (4) and an electrode tip (5), wherein the copper electrode rod (4) vertically penetrates through the top end of the supporting frame and stretches into the supporting frame to point to the buffer layer sample (6), the electrode tip (5) is assembled on the end part of the copper electrode rod (4) close to the buffer layer sample (6), and the end part of the copper electrode rod (4) far away from the copper electrode rod (4) at the buffer layer sample (6) is connected with a peripheral circuit;
an air gap distance is reserved between the electrode head (5) and the buffer layer sample (6), wherein the distance range is 1-10 mm;
the radius of curvature of the electrode tip (5) is in the range of 1-8 mu m.
2. The high-voltage cable buffer layer ablation simulation device under the air gap discharge condition according to claim 1, wherein the supporting frame comprises an upper electrode insulation supporting plate (1), a lower electrode insulation supporting plate (3) and a plurality of electrode insulation supporting plate connecting rods (2); a plurality of electrode insulation support plate connecting rods (2) are arranged between an upper electrode insulation support plate (1) and a lower electrode insulation support plate (3) to form a hollow frame structure, the lower electrode (7) is placed on the lower electrode insulation support plate (3), and the electrode rod unit vertically penetrates through the upper electrode insulation support plate (1) and stretches into the support frame to point to a buffer layer sample (6).
3. The high-voltage cable buffer layer ablation simulation device under the air gap discharge condition according to claim 2, wherein the upper electrode insulation support plate (1) and the electrode insulation support plate connecting rods (2) are correspondingly fixed through a plurality of screws (10).
4. The high-voltage cable buffer layer ablation simulation device under the air gap discharge condition according to claim 2, wherein the bottom ends of the lower electrode insulation supporting plates (3) are respectively provided with electrode supporting feet (9).
5. The high-voltage cable buffer layer ablation simulation device under the air gap discharge condition according to claim 2, wherein a screw rod (8) is arranged at the bottom side of the lower electrode (7), and the screw rod (8) penetrates through the lower electrode insulation supporting plate (3) to be connected with a peripheral circuit.
6. The high-voltage cable buffer layer ablation simulation device under the air gap discharge condition according to claim 2, wherein the lengths of the electrode insulation support plate connecting rods (2) are the same, and the electrode insulation support plates (1) and the electrode insulation support plates (3) are arranged in parallel.
7. The high-voltage cable buffer layer ablation simulation device under the air gap discharge condition according to claim 1, wherein the plate surface area of the lower electrode (7) is larger than the area of the buffer layer sample (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320296906.7U CN220064266U (en) | 2023-02-10 | 2023-02-10 | High-voltage cable buffer layer ablation simulation device under air gap discharge condition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320296906.7U CN220064266U (en) | 2023-02-10 | 2023-02-10 | High-voltage cable buffer layer ablation simulation device under air gap discharge condition |
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| Publication Number | Publication Date |
|---|---|
| CN220064266U true CN220064266U (en) | 2023-11-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320296906.7U Active CN220064266U (en) | 2023-02-10 | 2023-02-10 | High-voltage cable buffer layer ablation simulation device under air gap discharge condition |
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| Country | Link |
|---|---|
| CN (1) | CN220064266U (en) |
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2023
- 2023-02-10 CN CN202320296906.7U patent/CN220064266U/en active Active
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