CN220043987U

CN220043987U - Electronic equipment

Info

Publication number: CN220043987U
Application number: CN202320223052.XU
Authority: CN
Inventors: 续政轩
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2023-01-31
Filing date: 2023-01-31
Publication date: 2023-11-17
Anticipated expiration: 2033-01-31

Abstract

The utility model provides electronic equipment, relates to the technical field of electronic equipment, and aims to solve the problem of low cooling efficiency of a vapor chamber. The electronic equipment comprises a heating device and a soaking plate, wherein the soaking plate comprises a shell, a capillary structure and a steam channel, the shell is provided with a first end and a second end which are opposite, the first end is in contact with the heating device and conducts heat, and the shell comprises a containing cavity. The capillary structure is arranged in the accommodating cavity, the two ends of the capillary structure in the length direction are a third end part and a fourth end part, the third end part is positioned in the first end part of the shell, the fourth end part is positioned in the second end part of the shell, and the cross-sectional area of the fourth end part is larger than that of the third end part. The steam channel is positioned at one side of the capillary structure and is contacted with the capillary structure, and the length direction of the steam channel is parallel to the length direction of the capillary structure. The back suction of the liquid cooling working medium is improved, the soaking efficiency of the soaking plate is improved, and the integral temperature of the electronic equipment is uniform, so that the service life of the electronic equipment is prolonged.

Description

Electronic equipment

Technical Field

The utility model relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

The electronic equipment can produce heat when the work, if these heat are not in time distributed away, accumulate in the inside of electronic equipment, can lead to the rising of electronic equipment temperature to can influence the performance of electronic product, can lead to the electronic product to break down and damage if serious. Therefore, the temperature of the electronic equipment is equalized by providing the vapor chamber (VaporChamber, VC).

However, as the electronic devices are becoming thinner, the thickness of the electronic devices is becoming thinner and the accommodating chambers of the electronic devices are becoming smaller. Therefore, the thickness of the soaking plate is correspondingly reduced, and the accommodating cavity of the soaking plate is also smaller and smaller. The vapor channel in the vapor chamber is also narrower and narrower, and when the cooling working medium is condensed in the vapor chamber, liquid cooling working medium forms effusion in the vapor channel, occupies the space of the vapor channel, and causes the increase of the flow resistance of vapor, thereby reducing the cooling efficiency of the vapor chamber.

And, the cooling medium that accumulates in holding the intracavity easily forms one deck liquid film at the shells inner wall, makes the thermal resistance of vapor chamber rise simultaneously to lead to vapor chamber's samming performance and heat transfer performance to worsen. Therefore, it is necessary to improve the cooling efficiency of the soaking plate.

Disclosure of Invention

The embodiment of the utility model provides electronic equipment which is used for solving the problem of low cooling efficiency of a soaking plate.

In order to achieve the above purpose, the embodiment of the present utility model adopts the following technical scheme:

the utility model provides an electronic equipment, including heating device and vapor chamber, vapor chamber includes casing, capillary structure and steam channel, and the casing has relative first tip and second tip, and first tip and heating device contact and heat conduction are led to, and the casing includes the accommodation chamber. The capillary structure is arranged in the accommodating cavity, the two ends of the capillary structure in the length direction are a third end part and a fourth end part, the third end part is positioned in the first end part of the shell, the fourth end part is positioned in the second end part of the shell, and the cross-sectional area of the fourth end part is larger than that of the third end part. The steam channel is positioned at one side of the capillary structure and is contacted with the capillary structure, and the length direction of the steam channel is parallel to the length direction of the capillary structure.

When the electronic equipment operates, heat generated by the heating device enters the accommodating cavity through the first end part, after the third end part of the capillary structure contacts the heat, the cooling working medium positioned at the third end part is vaporized to generate steam, and the steam is liquefied into liquid after contacting the inner wall of the accommodating cavity with lower temperature. The liquid cooling medium accumulates under the influence of gravity in the receiving space at the second end. The capillary structure at the fourth end part returns the liquid cooling working medium, and the liquid cooling working medium is sucked back to the third end part of the capillary structure. The section of the fourth end part is set to be a larger area, and the fourth end part can provide larger back suction force for the liquid cooling working medium in the containing cavity. The liquid cooling medium can be conveyed to the third end portion more rapidly, liquid cooling working medium is prevented from accumulating in the accommodating cavity, the steam channel is prevented from becoming narrower and narrower due to the liquid cooling working medium, the space of the steam channel is further ensured, the increase of flow resistance of steam is avoided, the thickness of a liquid film is further reduced, the soaking efficiency of the soaking plate is improved, the overall temperature of the electronic equipment is uniform, and the service life of the electronic equipment is prolonged.

In one possible implementation, the third end and the fourth end are columnar structures, and the axial direction of the columnar structures is consistent with the length direction of the capillary structure. The water absorption and transportation path of the capillary structure of the columnar structure is smoother, and the liquid cooling working medium can be quickly absorbed back to the third end part of the capillary structure, so that the heat exchange efficiency of the vapor chamber is further improved. And the overall temperature of the electronic equipment is balanced, the performance of the electronic equipment is improved, and the service life of the electronic equipment is prolonged.

In one possible implementation, the cross section of the third end and the cross section of the fourth end are circular, rectangular, triangular, pentagonal or hexagonal. When the section of the third end part and the section of the fourth end part are rectangular, the capillary structure has better processability, and can be processed more conveniently, so that the processing and manufacturing efficiency of the vapor chamber is improved. The outer surface of the capillary structure is rectangular, when the steam in the steam channel contacts with the capillary structure, the capillary structure can not block the flow of the steam, the flow of the steam is smoother, and the heat exchange efficiency of the vapor chamber is improved. And the overall temperature of the electronic equipment is balanced, the performance of the electronic equipment is improved, and the service life of the electronic equipment is prolonged.

In one possible implementation, the third end and the fourth end meet in the length direction of the capillary structure. When the liquid cooling working medium is conveyed along the length direction of the capillary structure, the conveying of the cooling working medium is more convenient, so that the heat exchange efficiency of the vapor chamber is improved.

In one possible implementation, the ratio of the length of the third end to the length of the fourth end is greater than or equal to 0.05 and less than or equal to 0.18. When the ratio of the length of the third end part to the length of the fourth end part is in the range, the water storage effect of the fourth end part of the capillary structure can be balanced better, and the space for accommodating the steam channel in the cavity can be balanced. So as to improve the return ability of the capillary structure and the transmission speed of the steam in the steam channel. And further, the heat exchange efficiency of the vapor chamber is improved, the performance of the electronic equipment is improved, and the service life of the electronic equipment is prolonged.

In one possible implementation, the third end is an integral structural member with the fourth end. The manufacturing and processing of the capillary structure are more convenient, and an assembling process is not needed, so that the processing and manufacturing efficiency of the vapor chamber is improved.

In one possible implementation, the portion of the steam channel in contact with the fourth end has a cross-sectional maximum width that is the first maximum width and the fourth end has a cross-sectional maximum width that is the second maximum width. The ratio of the first maximum width to the second maximum width is greater than or equal to 1.05 and less than or equal to 1.13. When the ratio of the length of the third end portion to the length of the fourth end portion is within this range, the space of the accommodation chamber can be utilized better. The width of the capillary structure is slightly larger than the width of the vapor channel in the width direction of the accommodating chamber, i.e., in the X-axis direction in the drawing. The water storage effect of the capillary structure at the fourth end part can be balanced better, and the space for accommodating the steam channel in the cavity can be balanced. So as to improve the return ability of the capillary structure and the transmission speed of the steam in the steam channel. And further, the heat exchange efficiency of the vapor chamber is improved, the performance of the electronic equipment is improved, and the service life of the electronic equipment is prolonged.

In one possible implementation, the ratio of the cross-sectional area of the fourth end to the cross-sectional area of the third end is greater than or equal to 1.05 and less than or equal to 1.13. In this way, the cross-sectional area of the fourth end is larger than that of the third end, and when the bottom of the accommodating cavity forms the accumulated liquid of the cooling medium, the fourth end has a larger water storage capacity and the capacity of conveying the liquid cooling medium from the fourth end to the third end. So that the cooling working medium can be quickly absorbed back to the third end, and the heat exchange efficiency of the vapor chamber is improved. Further improving the performance of the electronic equipment and prolonging the service life of the electronic equipment.

In one possible implementation, the housing includes a first substrate and a second substrate, the first substrate and the second substrate being opposite and spaced apart, the receiving cavity being located between the first substrate and the second substrate. The first substrate and the second substrate are parallel to the length direction of the capillary structure, and the capillary structure is contacted with the inner surface of the first substrate and the inner surface of the second substrate. The capillary structure can also be used for supporting the first substrate and the second substrate so as to increase the structural strength of the shell and avoid the problem that the shell inside is sunken and damaged when the electronic equipment is impacted. And moreover, the capillary structure has a supporting function, the inner wall of the supporting column supporting shell can be omitted, and the space in the accommodating cavity can be utilized more efficiently.

In one possible implementation, the housing comprises a first housing part and a second housing part, which enclose the receiving space, the first base plate belonging to the first housing part and the second base plate belonging to the second housing part. The shell can be made of copper, aluminum or stainless steel, can be processed in the direction of stamping forming, and can also be processed by adopting a precise milling method. The shell of this embodiment may be made of a copper alloy material having good thermal conductivity, hardness and tensile strength.

In one possible implementation, the number of capillary structures is at least one. The direction perpendicular to the length direction of the capillary structures and parallel to the first substrate 5131 is a first direction, at least one capillary structure is arranged at intervals along the first direction, and a steam channel is formed between two adjacent capillary structures. At least one capillary structure participates in the heat dissipation process of the vapor chamber together. So as to quickly transmit the liquid cooling working medium to the third end part and improve the heat dissipation efficiency of the vapor chamber. Further improving the performance of the electronic equipment and prolonging the service life of the electronic equipment.

In one possible implementation, the electronic device further includes a heat sink fin located outside of the housing and in thermal communication with the housing. The heat radiating fin may be disposed at the second end of the case. The heat dissipation efficiency of the electronic equipment is improved through the heat dissipation fins, and the heat of the vapor chamber is dissipated through the heat dissipation fins. And further, the heat dissipation efficiency of the electronic equipment is improved, and the performance of the electronic equipment is improved.

In one possible implementation, the heat generating device is a chip.

Drawings

Fig. 1 is a perspective view of an electronic device provided in some embodiments of the present utility model;

FIG. 2 is an exploded view of the electronic device shown in FIG. 1;

FIG. 3 is a schematic structural diagram of a vapor chamber according to some embodiments of the present utility model;

FIG. 4 is a schematic structural diagram of a vapor chamber according to still other embodiments of the present utility model;

FIG. 5 is a schematic structural view of a vapor chamber according to still other embodiments of the present utility model;

FIG. 6 is a schematic diagram of a capillary structure according to some embodiments of the present utility model;

FIG. 7 is a schematic view of the capillary structure from the perspective F in FIG. 6;

FIG. 8 is a schematic view of another configuration of the capillary structure from the perspective F in FIG. 6;

FIG. 9 is a schematic diagram of a driving assembly according to some embodiments of the present utility model;

FIG. 10 is a schematic diagram of a driving assembly according to still other embodiments of the present utility model;

fig. 11 is a schematic structural diagram of a vapor chamber according to still other embodiments of the present utility model.

Detailed Description

In embodiments of the present utility model, the terms "first," "second," "third," "fourth," "fifth," "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "first", "second", "third", "fourth", "fifth" and "sixth" may explicitly or implicitly include one or more such feature.

In embodiments of the present utility model, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

It is to be understood that the above orientation or positional relationship as indicated by the terms "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description and to simplify the description, and are not indicative or implying that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present utility model; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

In the embodiment of the present utility model, it should be noted that the description of "substantially parallel" means parallel within a range allowing an error, which may be a range in which an angle of deviation from absolute parallel is less than or equal to 5 °.

The utility model provides an electronic device, which is a type of electronic device with a heating device. The electronic device may be a User Equipment (UE) or a terminal device (terminal) or the like. For example, the electronic device may be a Personal Digital Assistant (PDA), a handheld device with wireless communication function, a computing device, an in-vehicle device, a wearable device, a Virtual Reality (VR) terminal device, an Augmented Reality (AR) terminal device, a terminal in industrial control (industrial control), a terminal in unmanned (self driving), a terminal in remote medical (remote), a terminal in smart grid (smart grid), a terminal in transportation security (transportation security), a terminal in smart city (smart city), a terminal in smart home (smart home). The large-screen display terminal includes, but is not limited to, devices such as a smart screen, a tablet Pc (PAD), a notebook computer, a desktop computer, a television, and a projector.

Referring to fig. 1, fig. 1 is a perspective view of an electronic device 100 according to some embodiments of the present utility model. The present embodiment and the following embodiments are exemplary illustrations using the electronic device 100 as a mobile phone. The electronic device 100 is approximately rectangular plate-like. On this basis, in order to facilitate the description of the embodiments below, an XYZ coordinate system is established, the width direction of the electronic apparatus 100 is defined as the X-axis direction, the length direction of the electronic apparatus 100 is defined as the Y-axis direction, and the thickness direction of the electronic apparatus 100 is defined as the Z-axis direction. It is to be understood that the coordinate system of the electronic device 100 may be flexibly set according to actual needs, which is not specifically limited herein. In other embodiments, the shape of the electronic device 100 may be a square flat plate, a round flat plate, an oval flat plate, or the like, which is not particularly limited herein.

Referring to fig. 1 and fig. 2 together, fig. 2 is an exploded view of the electronic device 100 shown in fig. 1. In the present embodiment, the electronic device 100 includes a display screen 10 and a back case 20.

It is to be understood that fig. 1 and 2 only schematically illustrate some components included in the electronic device 100, and the actual shape, actual size, actual position, and actual configuration of these components are not limited by fig. 1 and 2.

Referring to fig. 2, a display screen 10 is used for displaying images, videos, and the like. The display screen 10 includes a light-transmitting cover plate 12 and a display module 11. The light-transmitting cover plate 12 is laminated with the display module 11. The light-transmitting cover plate 12 is mainly used for protecting and preventing dust of the display module 11. The material of the transparent cover plate 12 includes, but is not limited to, glass. The light-transmissive cover plate 12 faces the user when the user uses the electronic device 100. The light-transmitting cover plate 12 has the functions of impact resistance, scratch resistance, oil stain resistance, fingerprint resistance, light transmittance enhancement and the like.

The display module 11 may be a flexible display module or a rigid display module. For example, the display module 11 includes a display panel, which may be an organic light-emitting diode (OLED) display panel, an active-matrixorganic light-emitting diode (AMOLED) display panel, a mini-light-emitting diode (mini-emitting diode) display panel, a micro-organic light-emitting diode (QLED) display panel, a quantum dot light-emitting diode (QLED) display panel, and a liquid crystal display panel (liquidcrystal display, LCD).

With continued reference to fig. 2, the back shell 20 forms a housing of the electronic device 100 for protecting the internal electronics of the electronic device 100. The back shell 20 may include a back cover 21 and a bezel 22. The back cover 21 is located at one side of the display module 11 far away from the transparent cover plate 12, and is stacked with the transparent cover plate 12 and the display module 11 at intervals. The frame 22 is located between the back cover 21 and the light-transmitting cover plate 12. The frame 22 is fixed on the back cover 21, and the frame 22 may be fixedly connected to the back cover 21 by an adhesive, or the frame 22 and the back cover 21 may be integrally formed, i.e. the frame 22 and the back cover 21 are integrally formed. The light-transmitting cover plate 12 is fixed to the rim 22 by gluing. The light-transmitting cover plate 12, the back cover 21 and the frame 22 enclose a housing cavity 23 of the electronic device 100.

With continued reference to fig. 2, in some embodiments, the back shell 20 further includes a midplane 24. The middle plate 24 is disposed in the accommodating cavity 23, and the middle plate 24 is located at a side of the display module 11 away from the transparent cover plate 12. The edge of the middle plate 24 is fixed to the rim 22. In some embodiments, the edge of the middle plate 24 is fixed to the frame 22 by gluing, and the middle plate 24 and the frame 22 may be integrally formed, i.e. the middle plate 24 and the frame 22 are integrally formed. The middle plate 24 divides the accommodating cavity 23 into a first accommodating groove and a second accommodating groove, the first accommodating groove is formed by enclosing the middle plate 24 and the frame 22, and the second accommodating groove is formed by enclosing the back cover 21 and the frame 22. The display module 11 is disposed in the first accommodating groove, and other electronic components, such as a battery 30, a circuit board assembly 40, etc., are disposed in the second accommodating groove.

With continued reference to fig. 2, the circuit board assembly 40 includes a circuit board body 41 and an electronic component 42, wherein the electronic component 42 is disposed on a surface of the circuit board body 41. The circuit board body 41 is used for realizing electrical connection among various electronic components 42, and the circuit board body 41 is used for performing operations such as signal control, data signal processing, data signal storage and the like on the electronic components 42.

In some embodiments, electronic components 42 are used to implement one or more functions of electronic device 100. Electronic components 42 include, but are not limited to, chips, resistors, capacitors, inductors, potentiometers, tubes, heat sinks, electromechanical elements, connectors, semiconductor discrete devices, sensors, power supplies, switches, micro-motors, electronic transformers, relays, and the like. It should be noted that, the number and arrangement of the electronic components 42 in the embodiment of the present utility model may be set according to actual needs, and the embodiment of the present utility model does not limit the number and arrangement of the electronic components 42.

The circuit board body 41 includes, but is not limited to, a Printed Circuit Board (PCB) and a Flexible Printed Circuit (FPC) board. The present embodiment and the following embodiments are exemplified by using the circuit board body 41 as a PCB board. The shape of the circuit board body 41 includes, but is not limited to, rectangular, square, polygonal, circular, etc., and in the embodiment shown in fig. 2, the shape of the circuit board body 41 is rectangular.

Some of the electronic components 42 may generate heat during operation, for example, the electronic components 42 may be any one or more of a power amplifier, an application processor (CPU), a power management chip (PMIC), a Universal Flash Storage (UFS), a charging chip, an external baseband, and an image processing chip (ImageSignal Processor; ISP). Here, the power amplifiers may be 4GPA and 5GPA.

When the electronic component 42 includes the above-described several heat generating devices 421, the electronic apparatus 100 can realize more functions. At this time, the heat generating devices 421 are provided in plurality, and the plurality of heat generating devices 421 may be disposed on the first surface of the circuit board body 41, or the plurality of heat generating devices 421 may be disposed on the first surface and the second surface of the circuit board body 41, respectively. Here, the first surface refers to a surface of the circuit board body 41 facing the display screen 10, and the second surface refers to a surface of the circuit board body 41 facing away from the display screen 10.

Illustratively, the electronic device 100 may have three heat generating devices 421, a CPU, a PMIC, and a 5GPA. At this time, the layout of the three heat generating devices 421 includes, but is not limited to, the following possible cases: in the first case, the CPU, PMIC, and 5GPA are all disposed on the first face of the circuit board body 41; in the second case, the CPU and PMIC are provided on the first face of the circuit board body 41, and the 5GPA is provided on the second face of the circuit board body 41; in the third case, the CPU is provided on the first face of the circuit board body 41, and the PMIC and 5GPA are provided on the second face of the circuit board body 41. It can be seen that when the heat generating devices 421 are provided in plurality, one or more heat generating devices 421 may be mounted on the first face of the circuit board body 41.

When the electronic device 100 is running, the heating device 421 will affect the performance of the electronic device 100 after heating, thereby reducing the use experience of the user using the electronic device 100. With continued reference to fig. 2, in order to solve the problem, the electronic device 100 further includes a soaking plate 50, where the soaking plate 50 is disposed between the display screen 10 and the circuit board assembly 40, and the soaking plate 50 is used for assisting the electronic device 100 in heat dissipation. Specifically, the middle plate 23 may be provided with a groove 25, and the soaking plate 50 is installed in the groove 25. It will be appreciated that when the soaking plate 50 is installed in the recess 25, the soaking plate 50 is bonded to the inner wall of the middle plate 24 at the recess 25.

An exemplary heat dissipation principle of the electronic device 100 provided in the present embodiment is: when the electronic device 100 works, heat generated by the heating device 421 is transferred to the middle plate 24, and the middle plate 24 transfers the heat to the soaking plate 50 arranged on the middle plate 24, so that the heat is emitted in the accommodating space instead of being concentrated on the heating device 421, overheating of the heating device 421 due to incapability of emitting the heat is avoided, and further the problem that performance and service life of the heating device 421 are reduced due to overhigh temperature rise is solved.

In some embodiments, in order to improve the heat transfer efficiency of the heat generating device 421, a heat conducting member may be further included in the electronic apparatus 100. The heat conductive member may be a heat conductive gel through which the heat generating device 421 transfers heat to the middle plate 24. Specifically, for the heat generating device 421 located on the first surface, the heat generating device 421 is connected to the middle plate 24 through the heat conducting gel, so that part of heat generated by the heat generating device 421 can be conducted to the middle plate 24 through the heat conducting gel. When the circuit board body 41 is provided with a plurality of heating devices 421, a heat conducting gel is disposed between each heating device 421 and the middle plate 24.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a vapor chamber 50 according to some embodiments of the utility model. The structure of the soaking plate 50 and the heat dissipation principle of the soaking plate 50 will be described below. The vapor chamber 50 comprises a housing 5050, a capillary structure 52, a vapor channel 53 and a cooling medium, wherein the housing 50 comprises a containing cavity 54, the capillary structure 52, the vapor channel 53 and the cooling medium are arranged in the containing cavity 54, the vapor channel 53 is positioned on one side of the capillary structure 52 and is in contact with the capillary structure 52, and the length direction of the vapor channel 53 is parallel to the length direction of the capillary structure 52.

The housing 50 has opposite first and second ends 511 and 512, the first end 511 being in contact with and thermally conductive with the heat generating device 421. The heat generating device 421 may be located in the vicinity of the first end 511, where the vicinity means that the distance between the heat generating device 421 and the first end 511 is less than 10mm. That is, the heat generating device 421 may be in direct contact with the first end 511 or may have a certain distance from the first end 511, in which case, heat of the heat generating device 421 may be transferred to the first end 511 through air; a heat conductive member may be provided between the heat generating device 421 and the first end portion 511, and heat of the heat generating device 421 may be transferred through the heat conductive member. The capillary structure 52 has a third end 521 and a fourth end 522 at both ends in the longitudinal direction, the third end 521 is located in the first end 511 of the housing 50, and the fourth end 522 is located in the second end 512 of the housing 50. A cooling medium is also provided in the receiving chamber 54 for thermal circulation of the soaking plate 50.

The working principle of the vapor chamber 50 comprises four main steps of conduction, evaporation, convection and condensation: the heat is conducted into the accommodating cavity 54 from the external high-temperature area through the first end 511, and the cooling medium in the accommodating cavity 54, which is close to the periphery of the heating device 421, absorbs the heat and then is quickly vaporized, and a large amount of heat is taken away; by utilizing the latent heat of the steam, when the steam in the soaking plate 50 is diffused from a high pressure area (high temperature area) to a low pressure area (i.e. low temperature area), that is, from the first end 511 to the second end 512 of the shell 50, the steam contacts the inner wall with lower temperature of the second end 512, the steam is quickly condensed into a liquid state and releases heat; the cooling medium condensed into a liquid state is returned to the first end 511 by capillary force of the capillary structure 52, thereby completing one heat conduction cycle.

The cooling working medium can be deionized water, methanol, acetone and the like, and the heat dissipation of the vapor-liquid two-phase heat dissipation plate 50 can be realized through the gas-liquid two-phase change of the cooling working medium. The specific heat dissipation principle and the heat dissipation path are as described above. Capillary structure 52 is typically a copper-based porous medium such as copper mesh, copper powder sintering, foam copper, and may be formed by copper mesh braiding, wire drawing, etching, electroplating, electroless deposition, and the like.

In the embodiment of fig. 3, the first end 511 and the second end 512 of the soaking plate 50 are disposed opposite to each other along the length direction of the soaking plate 50, that is, the heat transfer direction, the vapor and liquid flow direction of the soaking plate 50 are transferred along the length direction of the soaking plate 50. With this embodiment, heat can be transferred over a longer distance and excellent soaking performance can be maintained. Referring to fig. 4, fig. 4 is a schematic structural diagram of a vapor chamber 50 according to still another embodiment of the present utility model. In other embodiments, the first end 511 and the second end 512 of the soaking plate 50 may also be disposed opposite in the thickness direction. At this time, the heat transfer direction of the soaking plate 50 and the vapor and liquid flow directions are transferred in the thickness direction of the soaking plate 50. With this embodiment, more heat can be taken away by the large area soaking plate 50.

As the electronic apparatus 100 is thinned, the thickness of the electronic apparatus 100 is thinner and the accommodating chamber 54 of the electronic apparatus 100 is smaller. Accordingly, the thickness of the soaking plate 50 is correspondingly reduced, and the accommodating chamber 54 of the soaking plate 50 is also smaller and smaller. The vapor channel 53 in the accommodating cavity 54 is also narrower, and when the cooling medium condenses at the second end 512, the liquid cooling medium forms a liquid product in the vapor channel 53, which occupies the space of the vapor channel 53, and causes the flow resistance of the vapor to increase, thereby reducing the cooling efficiency of the vapor chamber 50.

The capillary structure 52 of the ultra-thin vapor chamber 50 is mainly a wire mesh structure and a groove structure, and due to the hydrophilicity of the capillary structure 52, a layer of liquid film is easily formed on the surface of the capillary structure 52 by the cooling working medium, so that the rate of generation and falling of internal bubbles is reduced when the cooling working medium exchanges heat, and meanwhile, the radial thermal resistance of the vapor chamber 50 is increased, the superheat degree of the heat exchange wall surface is increased, and the vapor chamber 50 has poor vapor chamber performance and heat transfer performance.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a vapor chamber 50 according to still other embodiments of the present utility model. In order to solve the above-described problem, the cooling efficiency of the soaking plate 50 is improved. The utility model also provides an electronic device 100, the vapor chamber 50 of the electronic device 100 comprises a shell 50, a capillary structure 52 and a vapor channel 53, the shell 50 is provided with a first end 511 and a second end 512 which are opposite, the first end 511 is in contact with a heat generating device 421 and conducts heat, the shell 50 comprises a containing cavity 54, and the capillary structure 52 is arranged in the containing cavity 54. Referring to fig. 6, fig. 6 is a schematic structural diagram of a capillary structure 52 according to some embodiments of the present utility model. The capillary structure 52 has a third end 521 and a fourth end 522 at both ends in the longitudinal direction, the third end 521 is located in the first end 511 of the housing 50, and the fourth end 522 is located in the second end 512 of the housing 50. Referring to fig. 7, fig. 7 is a schematic structural view of the capillary structure 52 from the angle F in fig. 6. The cross-sectional area of the fourth end 522 is greater than the cross-sectional area of the third end 521. The cross section of the third end 521 and the cross section of the fourth end 522 refer to the cross sections of the third end 521 and the fourth end 522 in the direction perpendicular to the length direction of the capillary structure 52, that is, the Y-axis direction in the drawing. It is also believed that the cross-section of the third end 521 refers to the cross-section of the third end 521 taken along A1-A1, and the cross-section of the fourth end 522 refers to the cross-section of the fourth end 522 taken along A2-A2.

When the electronic device 100 is in operation, heat generated by the heat generating device 421 enters the accommodating cavity 54 through the first end 511, and after the third end 521 of the capillary structure 52 contacts the heat, the cooling medium located at the third end 521 is vaporized to generate steam, and the steam contacts the inner wall of the accommodating cavity 54 with a lower temperature and is liquefied into liquid. The liquid cooling medium accumulates under the influence of gravity in the receiving chamber 54 at the second end 512. The capillary structure 52 of the fourth end 522 returns the liquid cooling medium to the third end 521 of the capillary structure 52. The fourth end 522 is configured to have a larger cross-section, and the fourth end 522 provides a greater back suction force for the liquid cooling medium within the receiving chamber 54. The liquid cooling medium can be more quickly conveyed to the third end 521, so that the accumulation of the liquid cooling medium in the accommodating cavity 54 is avoided, and the increase of the flow resistance of steam is avoided. The fourth end 522 is used for sucking back the liquid cooling working medium so as to improve the soaking efficiency of the soaking plate 50 and even the whole temperature of the electronic equipment 100, so that the service life of the electronic equipment 100 is prolonged.

Please continue to refer to fig. 6. The third end 521 and the fourth end 522 have columnar structures, and the axial direction of the columnar structures matches the longitudinal direction of the capillary structure 52. The water absorption and transportation path of the capillary structure 52 with the columnar structure is smoother, and the liquid cooling working medium can be more quickly absorbed back to the third end 521 of the capillary structure 52, so that the heat exchange efficiency of the vapor chamber 50 is further improved. And further, the overall temperature of the electronic equipment 100 is balanced, the performance of the electronic equipment 100 is improved, and the service life of the electronic equipment 100 is prolonged.

Referring to fig. 8, fig. 8 is a schematic diagram of another structure of the capillary structure 52 from the angle F in fig. 6. The cross-section of the third end 521 and the cross-section of the fourth end 522 may be circular, rectangular, triangular, pentagonal or hexagonal. When the cross section of the third end 521 and the cross section of the fourth end 522 are rectangular, the capillary structure 52 has better workability, and is more convenient to process, so as to improve the processing and manufacturing efficiency of the soaking plate 50. The outer surface of the capillary structure 52 is rectangular, when the steam in the steam channel 53 contacts with the capillary structure 52, the capillary structure 52 can not block the flow of the steam, and the flow of the steam is smoother, so that the heat exchange efficiency of the vapor chamber 50 is improved. And further, the overall temperature of the electronic equipment 100 is balanced, the performance of the electronic equipment 100 is improved, and the service life of the electronic equipment 100 is prolonged.

Referring back to fig. 6, the third end 521 and the fourth end 522 meet in the length direction of the capillary structure 52, i.e., in the Y-axis in the illustration. When the liquid cooling medium is conveyed along the length direction of the capillary structure 52, the conveying of the cooling medium is more convenient, so that the heat exchange efficiency of the vapor chamber 50 is improved.

With continued reference to fig. 6, in some embodiments, the ratio of the length L1 of the third end 521 to the length L2 of the fourth end 522 is greater than or equal to 0.05 and less than or equal to 0.18. When the ratio of the length of the third end 521 to the length of the fourth end 522 is within this range, the water storage effect of the fourth end 522 of the capillary structure 52 can be better balanced, and the space for accommodating the steam channel 53 in the cavity 54 can be balanced. So as to increase the return ability of the capillary structure 52 and the transport speed of the vapor in the vapor channel 53. Further, the heat exchange efficiency of the vapor chamber 50 is improved, the performance of the electronic device 100 is improved, and the service life of the electronic device 100 is prolonged.

Referring back to fig. 5, in some embodiments, the portion of the steam channel 53 that contacts the fourth end 522 has a cross-sectional maximum width that is the first maximum width L4, and the fourth end 522 has a cross-sectional maximum width that is the second maximum width L3. The ratio of the first maximum width L4 to the second maximum width L3 is greater than or equal to 1.05 and less than or equal to 1.13. When the ratio of the length of the third end 521 to the length of the fourth end 522 is within this range, the space of the accommodating chamber 54 can be better utilized. The width of the capillary structure 52 is slightly larger than the width of the vapor channel 53 in the width direction of the accommodating chamber 54, that is, in the X-axis direction in the drawing. The water storage effect of the capillary structure 52 at the fourth end 522 can be balanced better, and the space of the steam channel 53 in the accommodating cavity 54 can be balanced. So as to increase the return ability of the capillary structure 52 and the transport speed of the vapor in the vapor channel 53. Further, the heat exchange efficiency of the vapor chamber 50 is improved, the performance of the electronic device 100 is improved, and the service life of the electronic device 100 is prolonged.

Referring to fig. 6 and 7 together, in some embodiments, the ratio of the cross-sectional area of the fourth end 522 to the cross-sectional area of the third end 521 is greater than or equal to 1.05 and less than or equal to 1.13. The cross-sectional area of the fourth end 522 and the cross-sectional area of the third end 521 refer to the cross-sectional area of the fourth end 522 and the cross-sectional area of the third end 521 in a direction perpendicular to the length direction of the capillary structure 52, that is, in the X-axis direction in the drawing. In other words, the cross section of the third end 521 means a cross section taken along A1-A1 in fig. 6 after the third end 521 is cut; the cross section of the fourth end 522 is a cross section taken along A2-A2 in fig. 6 and the third end 521. In this way, the cross-sectional area of the fourth end 522 is greater than the cross-sectional area of the third end 521, and the fourth end 522 has a greater water storage capacity and the capacity of delivering liquid cooling medium from the fourth end 522 to the third end 521 when a liquid product of cooling medium is formed at the bottom of the receiving chamber 54. So that the cooling medium is quickly sucked back to the third end 521, and the heat exchange efficiency of the vapor chamber 50 is improved. Further, the performance of the electronic device 100 is improved, and the service life of the electronic device 100 is prolonged.

Referring to fig. 9, fig. 9 is a schematic structural diagram of a housing 50 according to some embodiments of the utility model. In some embodiments, housing 50 includes a first housing portion 513 and a second housing portion 514, with first housing portion 513 and second housing portion 514 enclosing receiving chamber 54. The housing 50 may be made of copper, aluminum or stainless steel, and may be formed by stamping or precision milling. The housing 50 of the present embodiment may be made of a copper alloy material having good thermal conductivity, hardness and tensile strength.

With continued reference to fig. 9, the first housing portion 513 may include a first substrate 5131 and a bezel 5132, and the second housing portion 514 may include a second substrate. The first substrate 5131 is opposite to the second substrate with a space therebetween, and the accommodating chamber 54 is located between the first substrate 5131 and the second substrate. The frame 5132 is disposed around the first substrate 5131, and after the first housing portion 513 and the second housing portion 514 enclose the accommodating cavity 54, the frame 5132 can serve as a sidewall of the housing 50 to increase the space of the accommodating cavity 54.

The first and second substrates 5131 and 52 are parallel to the longitudinal direction of the capillary structure 52, and the capillary structure 52 is in contact with the inner surfaces of the first and second substrates 5131 and 5131. In this way, the capillary structure 52 can also be used to support the first substrate 5131 and the second substrate, so as to increase the structural strength of the housing 50, and avoid the problem that the housing 50 is damaged due to the recess when the electronic device 100 is impacted. In addition, the capillary structure 52 has a supporting function, the vapor chamber 50 can omit the inner wall of the supporting column supporting housing 50, and the space in the accommodating cavity 54 can be utilized more efficiently.

When the cross section of the capillary structure 52 is rectangular, the contact area between the capillary structure 52 and the inner surfaces of the first substrate 5131 and the second substrate is larger, so that a larger support can be provided for the housing 50, and the structural strength of the housing 50 is higher.

In some embodiments, third end 521 is an integral structural member with fourth end 522. The manufacturing process of the capillary structure 52 is more convenient, and an assembling process is not needed, so that the manufacturing efficiency of the vapor chamber 50 is improved.

Referring to fig. 10, fig. 10 is a schematic structural diagram of a vapor chamber 50 according to still other embodiments of the present utility model. In some embodiments, the number of capillary structures 52 is at least one. The number of capillary structures 52 is 3 in fig. 10 as an example. The direction perpendicular to the length direction of the capillary structures 52 and parallel to the first substrate 5131 is a first direction, at least one capillary structure 52 is disposed at intervals along the first direction, and a vapor channel 53 is formed between two adjacent capillary structures 52. At least one capillary structure 52 participates in the heat dissipation process of the vapor chamber 50 in common. So as to quickly transfer the liquid cooling medium to the third end 521, and improve the heat dissipation efficiency of the vapor chamber 50. Further, the performance of the electronic device 100 is improved, and the service life of the electronic device 100 is prolonged.

Referring to fig. 11, fig. 11 is a schematic structural diagram of a vapor chamber 50 according to still other embodiments of the present utility model. In some embodiments, the electronic device 100 further includes a heat sink fin 60, the heat sink fin 60 being located outside of the housing 50 and in thermal communication with the housing 50. When the electronic device 100 is a relatively large-sized device, such as a notebook computer, the heat dissipation fins 60 may be disposed on the heat spreader 50, and in fig. 11, the heat dissipation fins 60 may be disposed at the second end 512 of the housing 50. The heat dissipation efficiency of the electronic device 100 is improved by the heat dissipation fins 60, and the heat of the vapor chamber 50 is dissipated through the heat dissipation fins 60. Further, the heat dissipation efficiency of the electronic device 100 is improved, and the performance of the electronic device 100 is improved.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. An electronic device, comprising:

a heat generating device;

a soaking plate, the soaking plate comprising:

a housing having opposed first and second ends, the first end in contact with the heat-generating device and thermally conductive, the housing including a receiving cavity;

the capillary structure is arranged in the accommodating cavity, two ends of the capillary structure in the length direction are a third end part and a fourth end part, the third end part is positioned in the first end part of the shell, the fourth end part is positioned in the second end part of the shell, and the cross-sectional area of the fourth end part is larger than that of the third end part;

the steam channel is positioned at one side of the capillary structure and is in contact with the capillary structure, and the length direction of the steam channel is parallel to the length direction of the capillary structure.

2. The electronic device of claim 1, wherein the third end and the fourth end are columnar structures, and an axial direction of the columnar structures coincides with a length direction of the capillary structure.

3. The electronic device of claim 2, wherein a cross-section of the third end portion and a cross-section of the fourth end portion are circular, rectangular, triangular, pentagonal, or hexagonal.

4. An electronic device according to claim 2 or 3, characterized in that,

the third end portion and the fourth end portion are connected in the length direction of the capillary structure.

5. The electronic device of claim 2 or 3, wherein a ratio of a length of the third end to a length of the fourth end is greater than or equal to 0.05 and less than or equal to 0.18.

6. An electronic device as claimed in claim 2 or 3, wherein the third end is of unitary construction with the fourth end.

7. The electronic device according to any one of claim 1 to 3, wherein,

the maximum width of the cross section of the part of the steam channel contacted with the fourth end part is the first maximum width, and the maximum width of the cross section of the fourth end part is the second maximum width;

the ratio of the first maximum width to the second maximum width is greater than or equal to 1.05 and less than or equal to 1.13.

8. The electronic device of any of claims 1-3, wherein a ratio of a cross-sectional area of the fourth end to a cross-sectional area of the third end is greater than or equal to 1.05 and less than or equal to 1.13.

9. The electronic device according to any one of claim 1 to 3, wherein,

the shell comprises a first substrate and a second substrate, the first substrate is opposite to the second substrate and is arranged at intervals, and the accommodating cavity is positioned between the first substrate and the second substrate;

the first substrate and the second substrate are parallel to the length direction of the capillary structure, and the capillary structure is in contact with the inner surface of the first substrate and the inner surface of the second substrate.

10. The electronic device of claim 9, wherein the housing comprises a first housing portion and a second housing portion, the first housing portion and the second housing portion enclosing the receiving cavity, the first substrate belonging to the first housing portion, the second substrate belonging to the second housing portion.

11. The electronic device of claim 9, wherein the electronic device comprises a memory device,

the number of the capillary structures is at least one;

the direction perpendicular to the length direction of the capillary structures and parallel to the first substrate is a first direction, at least one capillary structure is arranged at intervals along the first direction, and a steam channel is formed between two adjacent capillary structures.

12. The electronic device of any of claims 1-3, further comprising a heat sink fin located outside of the housing and in thermal communication with the housing.

13. An electronic device according to any one of claims 1-3, characterized in that the heat generating device is a chip.