CN220034656U

CN220034656U - Temperature control disc

Info

Publication number: CN220034656U
Application number: CN202322596761.5U
Authority: CN
Inventors: 邵大立; 陆淋康; 史皓然; 齐彪; 刘子婵; 李宇晗; 刘国庆
Original assignee: Shanghai Xingyuanchi Semiconductor Co ltd
Current assignee: Shanghai Xingyuanchi Semiconductor Co ltd
Priority date: 2023-09-25
Filing date: 2023-09-25
Publication date: 2023-11-17
Anticipated expiration: 2033-09-25

Abstract

The utility model relates to a temperature control disc, which comprises a wafer tray, an integrated disc, a plurality of heating units and a heat insulation sleeve, wherein the wafer tray is used for bearing wafers to be processed; the integrated disc is connected to the wafer tray; the plurality of heating units are embedded on the end face of one side, close to the integrated disc, of the wafer tray, the plurality of heating units are arranged in an array mode, each heating unit is electrically connected with the integrated disc, and the temperature of any heating unit is adjustable; the insulating sleeve is sleeved on the at least one heating unit, the insulating sleeve is provided with an opening which extends along a first direction and can expose the heating unit, the insulating sleeve is used for preventing the heating unit from heat transfer along a second direction, the first direction is the arrangement direction of the integrated disc and the wafer tray, and the second direction is perpendicular to the first direction. Through setting up the insulating sheath, restricted the transmission of heat along the second direction to concentrate the region of heating with the heat, improved the heating effect of accuse temperature dish.

Description

Temperature control disc

Technical Field

The utility model relates to the technical field of semiconductor coating, in particular to a temperature control disc.

Background

In semiconductor coating equipment, such as chemical vapor deposition and atomic layer deposition equipment, it is often necessary to heat the reaction chamber and wafer to ensure that the temperature of the reaction chamber and wafer surface is maintained within the temperature range required for the film deposition reaction. In the related art, an annular heating belt is provided in a temperature control plate, and the temperature control plate is directly contacted with a wafer to provide heat required by a film deposition reaction for the wafer. However, the existing temperature control disk has poor heating effect, and cannot concentrate heat in a region to be heated.

Disclosure of Invention

Based on this, it is necessary to provide a temperature control plate for the problem of heating the wafer.

A temperature-controlled plate, the temperature-controlled plate comprising:

the wafer tray is used for bearing wafers to be processed;

an integrated tray connected to the wafer tray;

the plurality of heating units are embedded on the end face of the wafer tray, which is close to one side of the integrated disc, the plurality of heating units are arranged in an array manner, each heating unit is electrically connected with the integrated disc, and the temperature of any heating unit is adjustable;

the heat insulation sleeve is sleeved on at least one heating unit, the heat insulation sleeve is provided with an opening which extends along a first direction and can expose the heating unit, the heat insulation sleeve is used for blocking heat transfer of the heating unit along a second direction, the first direction is the arrangement direction of the integrated disc and the wafer tray, and the second direction is perpendicular to the first direction.

In one embodiment, a plurality of mounting grooves which are arranged in an array are formed in the end face, close to one side of the integrated disc, of the wafer tray, and at least one of the mounting grooves is internally provided with a heating unit and a heat insulation sleeve sleeved on the heating unit.

In one embodiment, the number of mounting slots, the number of heating units, and the number of insulating sleeves are equal.

In one embodiment, the heating unit includes a thermally conductive wire and an inserting piece that are electrically connected, the inserting piece is disposed on one side of the thermally conductive wire away from the wafer tray, and is inserted with the integrated disc to realize electrical connection, and the thermally conductive wire is capable of transferring heat to the wafer tray.

In one embodiment, the heating unit includes a heat-conducting pad, one end of the heat-insulating sleeve, which is close to the wafer tray, is abutted to the heat-conducting pad, and the heat-conducting wire transfers heat to the wafer tray through the heat-conducting pad.

In one embodiment, the integrated disc is provided with a plurality of mating jacks, the number of the mating jacks is equal to the number of the plurality of plug connectors of the heating units, and each plug connector is inserted into the corresponding mating jack.

In one embodiment, the wafer tray further comprises a temperature sensor arranged on one side, close to the integrated disc, of the wafer tray, a temperature sensor jack is arranged on the integrated disc, and the temperature sensor can be inserted into the temperature sensor jack.

In one embodiment, a plurality of temperature sensors are provided, and the plurality of temperature sensors are arranged around the circumference of the wafer tray;

and a plurality of temperature sensor jacks are arranged on the integrated disc, and each temperature sensor is inserted into the corresponding temperature sensor jack.

In one embodiment, the integrated tray is provided with a first through hole, the wafer tray is provided with a second through hole, the first through hole is communicated with the second through hole, the axes of the first through hole and the second through hole are coincident, and the first through hole and the second through hole are used for enabling the thimble to pass through.

In one embodiment, a limiting groove is formed in an end face of one side, away from the integrated disc, of the wafer tray, and the limiting groove is used for accommodating the wafer.

Above-mentioned temperature control dish sets up a plurality of heating units in the one side that the wafer tray is close to the integrated dish, and a plurality of heating unit arrays are arranged, and all are connected with integrated dish electricity. The temperature of each heating unit can be adjusted, namely, the heat of different positions of the wafer tray can be correspondingly adjusted, when the wafer tray is in actual use, the wafer to be processed is arranged on the wafer tray, and the heat of different positions of the wafer tray is adjusted by adjusting the temperatures of a plurality of heating units, so that the processed wafer meets the technical specification requirement. When different wafers to be processed are heated, the temperature of the heating units can be adjusted before each heating, so that the temperature requirement of the current wafers to be processed is met. And the heat insulation sleeve is sleeved on at least one heating unit, and the opening of the heat insulation sleeve extending along the first direction can expose the end part of the heating unit along the first direction, namely, the heating unit can only transfer heat to the wafer tray along the first direction, so that the heat is reduced to be transferred to the adjacent heating unit transversely along the second direction. Through setting up the insulating sheath, restricted the transmission of heat along the second direction to concentrate the region of heating with the heat, improved the heating effect of accuse temperature dish.

Drawings

Fig. 1 is a schematic structural diagram of a first view angle of a temperature control disk according to an embodiment of the present utility model.

Fig. 2 is an exploded view of a temperature control disk according to an embodiment of the present utility model.

Fig. 3 is a schematic structural diagram of a wafer tray with a heating unit according to an embodiment of the present utility model.

Fig. 4 is a schematic structural diagram of a heating unit and a heat insulation sleeve according to an embodiment of the present utility model.

Fig. 5 is a schematic structural diagram of a first view angle of an integrated disc according to an embodiment of the present utility model.

Fig. 6 is a schematic structural diagram of a second view of an integrated disc according to an embodiment of the present utility model.

Fig. 7 is a schematic structural diagram of a second view angle of a temperature control disk according to an embodiment of the present utility model.

In the figure:

100. a wafer tray; 110. a mounting groove; 120. a limit groove; 130. a second through hole;

200. an integrated disc; 210. matching with the jack; 220. a temperature sensor jack; 230. a first through hole; 240. a controller interface;

300. a heating unit; 310. a heat conducting wire; 320. a plug-in component; 330. a thermally conductive gasket;

400. a heat insulating sleeve; 410. an opening;

500. a temperature sensor.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

In the existing temperature control disc, different annular heating belts are arranged at different positions, one annular heating belt corresponds to one heating area, and the heating temperatures in the heating areas are the same. However, in the same heating zone, the annular heating zone cannot distribute different amounts of heat to different locations in the zone. The heat required by different heating areas is different, however, the temperature limit of the adjacent two annular heating belts of the conventional temperature control disc in the junction area of the adjacent two heating areas is fuzzy, and the heat cannot be concentrated in the area to be heated, so that the heating effect of the temperature control disc is poor.

To this end, the present utility model provides a temperature control tray, as shown in fig. 1 to 4, which includes a wafer tray 100, an integrated tray 200, a plurality of heating units 300, and a heat insulation sleeve 400, wherein the wafer tray 100 is used for carrying wafers to be processed; the integrated tray 200 is connected to the wafer tray 100; the plurality of heating units 300 are embedded on the end surface of the wafer tray 100, which is close to one side of the integrated disc 200, the plurality of heating units 300 are arranged in an array, each heating unit 300 is electrically connected with the integrated disc 200, and the temperature of any heating unit 300 is adjustable; the heat insulation sleeve 400 is sleeved on the at least one heating unit 300, the heat insulation sleeve 400 is provided with an opening extending along a first direction and capable of exposing the heating unit 300, the heat insulation sleeve 400 is used for preventing heat transfer of the heating unit 300 along a second direction, and the first direction is an arrangement direction of the integrated tray 200 and the wafer tray 100, and the second direction is perpendicular to the first direction.

In the above temperature control disc, a plurality of heating units 300 are disposed on one side of the wafer tray 100 near the integrated disc 200, and the plurality of heating units 300 are arranged in an array and are electrically connected to the integrated disc 200. The temperature of each heating unit 300 can be adjusted, that is, the heat of different positions of the wafer tray 100 can be correspondingly adjusted, when in actual use, the wafer to be processed is mounted on the wafer tray 100, and the heat of different positions of the wafer tray 100 is adjusted by adjusting the temperatures of a plurality of heating units 300, so that the processed wafer meets the technical specification requirement. When different wafers to be processed are heated, the temperature of the plurality of heating units 300 can be adjusted before each heating so as to meet the temperature requirement of the current wafers to be processed. Moreover, the heat insulating sleeve 400 is sleeved on at least one heating unit 300, and the opening of the heat insulating sleeve 400 extending along the first direction can expose the end of the heating unit 300 along the first direction, that is, the heating unit 300 can only transfer heat to the wafer tray 100 along the first direction, so that heat is reduced from being transferred to the adjacent heating unit 300 transversely along the second direction. Through setting up the insulating sheath 400, the transmission of heat along the second direction has been restricted to concentrate the heat in the region of needs heating, improved the heating effect of temperature control dish.

As shown in fig. 1 and 2, the first direction is the Z-axis direction, and the second direction is the X-axis direction.

In some embodiments, as shown in fig. 1-3, the temperature control disc includes a controller, the controller interface 240 of the integrated disc 200 is communicatively connected to the controller, and the controller can independently control the heating temperature of any one of the heating units 300 when the plurality of heating units 300 are electrically connected to the integrated disc 200, i.e., the plurality of heating units 300 are electrically connected to the controller through the integrated disc 200.

In some embodiments, as shown in fig. 1 to 3, a plurality of mounting slots 110 arranged in an array are provided on an end surface of the wafer tray 100 near one side of the integrated tray 200, and one heating unit 300 and a heat insulating sleeve 400 sleeved on the heating unit 300 are disposed in at least one mounting slot 110. The heating unit 300 and the heat insulating jacket 400 are accommodated by providing the mounting groove 110 on the end surface of the wafer tray 100 near the side of the integrated tray 200.

Specifically, as shown in fig. 1 to 3, the number of the installation grooves 110, the number of the heating units 300, and the number of the heat insulation jackets 400 are equal. I.e., each of the installation grooves 110 is provided therein with a heating unit 300 and a heat insulation jacket 400 sleeved on the heating unit 300.

Specifically, as shown in fig. 1 to 3, the wafer tray 100 has a hexagonal shape, the plurality of mounting grooves 110 are arranged along a length direction of any one side of the wafer tray 100, and the plurality of mounting grooves 110 are arranged along a direction perpendicular to the length direction.

In some embodiments, the wafer tray 100 has a rectangular shape, and the plurality of mounting grooves 110 are arranged along a length direction and a width direction of the wafer tray 100.

In some embodiments, as shown in fig. 1 to 4, the heating unit 300 includes a thermally conductive wire 310 and a plug 320 that are electrically connected, the plug 320 is disposed on a side of the thermally conductive wire 310 away from the wafer tray 100 and plugs into the integrated tray 200 to achieve the electrical connection, and the thermally conductive wire 310 is capable of transferring heat to the wafer tray 100. The socket 320 is inserted into the integrated tray 200 so that the integrated tray 200 is electrically connected with the heating unit 300, and an electric current can pass through the integrated tray 200 and the socket 320 to transfer the heat conductive wires 310 so that the heat conductive wires 310 transfer heat to the wafer tray 100.

It should be noted that, the controller controls the heating heat of the heating unit 300, that is, the controller controls the output power of the heating wire 310.

In some embodiments, as shown in fig. 1 to 4, the heating unit 300 includes a heat conductive pad 330, and an end of the heat insulating sleeve 400 near the wafer tray 100 abuts against the heat conductive pad 330, and the heat conductive wire 310 transfers heat to the wafer tray 100 through the heat conductive pad 330. The heat conducting gasket 330 is arranged in the mounting groove 110, the heat conducting gasket 330 is attached to the groove wall of the mounting groove 110 along the first direction, the heat insulating sleeve 400 is abutted against the heat conducting gasket 330, the heat conducting wires 310 transfer heat to the heat conducting gasket 330, and the heat conducting gasket 330 is transferred to the wafer tray 100. By providing the heat conductive pad 330, the heat transferred by the heat conductive wire 310 is more uniform.

In some embodiments, as shown in fig. 3 and 5, a plurality of mating receptacles 210 are provided on the integrated tray 200, the number of mating receptacles 210 being equal to the number of the plurality of connectors 320 of the plurality of heating units 300, each connector 320 being inserted into a corresponding mating receptacle 210. The plurality of connectors 320 are inserted into the corresponding mating receptacles 210 in a one-to-one correspondence, so that the heating units 300 are connected with the controller through the integrated board 200, thereby facilitating the independent control of the heating heat of any one heating unit 300.

In some embodiments, as shown in fig. 3, 5 and 7, the temperature control disc further includes a temperature sensor 500 disposed on a side of the wafer tray 100 near the integrated disc 200, and the integrated disc 200 is provided with a temperature sensor receptacle 220 into which the temperature sensor 500 can be inserted. By providing the temperature sensor 500, the temperature of the corresponding position of the wafer tray 100 is measured, and the temperature sensor 500 is inserted into the temperature sensor insertion hole 220, so that the temperature data measured by the temperature sensor 500 is transmitted to the controller.

In some embodiments, as shown in fig. 3, 5 and 7, the temperature sensor 500 is provided in plurality, and the plurality of temperature sensors 500 are arranged around the circumference of the wafer tray 100; the integrated tray 200 is provided with a plurality of temperature sensor insertion holes 220, and each temperature sensor 500 is inserted into a corresponding temperature sensor insertion hole 220. A plurality of temperature sensors 500 are provided to facilitate measuring temperatures at different locations of the wafer pallet 100. And each temperature sensor 500 corresponds to one temperature sensor jack 220, so that temperature data measured by each temperature sensor 500 can be conveniently transmitted to a controller.

In some embodiments, as shown in fig. 1, 3, and 5 to 7, a first through hole 230 is provided on the integrated disk 200, a second through hole 130 is provided on the wafer tray 100, the first through hole 230 and the second through hole 130 are communicated and have an axis coincident, and the first through hole 230 and the second through hole 130 are used for passing a thimble. By communicating the first through hole 230 and the second through hole 130, the ejector pin can sequentially pass through the first through hole 230 and the second through hole 130, i.e., the ejector pin can pass through the temperature control plate. The ejector pins penetrate through the temperature control disc and are abutted against the wafer conveyed by the manipulator, and then the ejector pins sequentially withdraw from the second through holes 130 and the first through holes 230, so that the wafer is placed on one side of the wafer tray 100, which is away from the integrated disc 200.

In some embodiments, as shown in fig. 1 and 7, a limiting groove 120 is provided on an end surface of a side of the wafer tray 100 facing away from the integrated tray 200, and the limiting groove 120 is used to accommodate a wafer. By providing the limit groove 120, the position of the wafer on the wafer tray 100 is defined.

The use process of the temperature control disc provided by the utility model is as follows:

s1, setting heating temperatures of a plurality of heating units 300 through a controller according to the existing process temperature, and placing a first wafer on a wafer tray 100 for performing a thin film deposition process after the temperature setting is completed;

s2, after the first wafer completes the thin film deposition process, measuring thickness data of the first wafer corresponding to the plurality of heating units 300, and transmitting the plurality of thickness data to a controller;

s3, the controller adjusts the heating temperatures of the heating units 300 according to the thickness data of the different positions fed back in the step S2;

s4, carrying out a thin film deposition process on the rest units in the same batch according to the heating temperature adjusted in the step S3.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. A temperature control disk, characterized in that the temperature control disk comprises:

a wafer tray (100) for carrying wafers to be processed;

-an integrated tray (200) connected to the wafer tray (100);

the plurality of heating units (300) are embedded on the end face of the wafer tray (100) close to one side of the integrated disc (200), the plurality of heating units (300) are arranged in an array, and each heating unit (300) is electrically connected with the integrated disc (200);

the heat insulation sleeve (400) is sleeved on at least one heating unit (300), the heat insulation sleeve (400) is provided with an opening which extends along a first direction and can expose the heating unit (300), the heat insulation sleeve (400) is used for blocking heat transfer of the heating unit (300) along a second direction, the first direction is the arrangement direction of the integrated disc (200) and the wafer tray (100), and the second direction is perpendicular to the first direction.

2. The temperature control disk according to claim 1, wherein a plurality of mounting grooves (110) arranged in an array are provided on an end surface of the wafer tray (100) near one side of the integrated disk (200), and one heating unit (300) and the heat insulating sleeve (400) sleeved on the heating unit (300) are arranged in at least one mounting groove (110).

3. The temperature-control tray according to claim 2, wherein the number of mounting slots (110), the number of heating units (300), and the number of heat jackets (400) are equal.

4. The temperature control plate according to claim 1, wherein the heating unit (300) comprises a heat conducting wire (310) and an inserting piece (320) which are electrically connected, the inserting piece (320) is arranged on one side of the heat conducting wire (310) which faces away from the wafer tray (100) and is inserted with the integrated plate (200) to realize the electrical connection, and the heat conducting wire (310) can transfer heat to the wafer tray (100).

5. The temperature control plate of claim 4, wherein the heating unit (300) comprises a thermally conductive pad (330), an end of the thermally insulating sleeve (400) adjacent to the wafer tray (100) abuts against the thermally conductive pad (330), and the thermally conductive wire (310) transfers heat to the wafer tray (100) through the thermally conductive pad (330).

6. The temperature control plate according to claim 4, wherein a plurality of mating receptacles (210) are provided on the integrated plate (200), the number of the mating receptacles (210) being equal to the number of the plurality of the plugs (320) of the plurality of the heating units (300), each plug (320) being inserted into a corresponding mating receptacle (210).

7. The temperature control plate according to claim 1, further comprising a temperature sensor (500) disposed on a side of the wafer tray (100) near the integrated plate (200), wherein a temperature sensor insertion hole (220) is disposed on the integrated plate (200), and the temperature sensor (500) can be inserted into the temperature sensor insertion hole (220).

8. The temperature control plate according to claim 7, wherein a plurality of the temperature sensors (500) are provided, and a plurality of the temperature sensors (500) are arranged around a circumference of the wafer tray (100);

a plurality of temperature sensor jacks (220) are arranged on the integrated disc (200), and each temperature sensor (500) is inserted into the corresponding temperature sensor jack (220).

9. The temperature control plate according to claim 1, wherein a first through hole (230) is provided on the integrated plate (200), a second through hole (130) is provided on the wafer tray (100), the first through hole (230) and the second through hole (130) are communicated and have an axis coincident, and the first through hole (230) and the second through hole (130) are used for a thimble to pass through.

10. The temperature control plate according to claim 1, wherein a limiting groove (120) is provided on an end surface of a side of the wafer tray (100) facing away from the integrated plate (200), and the limiting groove (120) is used for accommodating the wafer.