CN220030780U

CN220030780U - Slicing machine

Info

Publication number: CN220030780U
Application number: CN202321372464.6U
Authority: CN
Inventors: 仇健; 张宏翔; 张善保; 吴仁标; 王兆蕊; 王海超
Original assignee: Qingdao Gaoce Technology Co Ltd
Current assignee: Qingdao Gaoce Technology Co Ltd
Priority date: 2023-05-31
Filing date: 2023-05-31
Publication date: 2023-11-17
Anticipated expiration: 2033-05-31

Abstract

An embodiment of the present utility model provides a slicer, including: a cutting device; the cutting device comprises at least two cutting rollers which are arranged side by side, wherein a space for a workpiece to be cut to pass through is reserved between the two cutting rollers; and the vibration device is used for applying ultrasonic vibration to the workpiece to be cut. The slicing machine provided by the embodiment of the utility model can improve the cutting efficiency and the cutting quality.

Description

Slicing machine

Technical Field

The utility model relates to a wire cutting technology, in particular to a slicing machine.

Background

The wire cutting apparatus is an apparatus for cutting a workpiece using a rapidly moving cutting wire, such as cutting off, squaring, slicing, or the like, a silicon rod. The skilled person found in the study that applying ultrasonic vibrations to the cutting line can improve the cutting efficiency and can improve the cutting quality. However, in the conventional scheme, vibration is applied to a single cutting wire through an ultrasonic vibration device, and the cutting wire vibrates when passing through the ultrasonic vibration device in the wire-laying process. When cutting a plurality of cutting lines, a plurality of ultrasonic vibration devices are needed to correspondingly apply vibration to the cutting lines, so that the structure of the linear cutting equipment is particularly complex, the failure rate is higher, the difficulty of maintaining and replacing the cutting lines is higher, and the production efficiency is also influenced.

In addition, the technical staff find that the ultrasonic vibration device is contacted with the cutting line to apply ultrasonic vibration, so that the abrasion of the cutting line is increased, the probability of broken line is increased, the service life is shortened, the cutting line needs to be replaced frequently, the process of replacing the cutting line is complex, the time is long, and the production efficiency is reduced; and the cutting line breakage also causes a reduction in cutting quality. In addition, since the deformability of the cutting wire is large, when vibration acts on the cutting wire, the cutting wire itself generates resonance of a large amplitude, which results in a large vibration loss.

Disclosure of Invention

In order to solve one of the technical defects, a slicer is provided in an embodiment of the present utility model.

According to a first aspect of an embodiment of the present utility model, there is provided a microtome comprising:

a cutting device; the cutting device comprises at least two cutting rollers which are arranged side by side, wherein a space for a workpiece to be cut to pass through is reserved between the two cutting rollers;

and the vibration device is used for applying ultrasonic vibration to the workpiece to be cut.

According to the technical scheme provided by the embodiment of the utility model, the cutting device comprises at least two cutting rollers which are arranged side by side, wherein a space for a workpiece to be cut to pass through is reserved between the two cutting rollers; the vibration device is used for applying ultrasonic vibration to the workpiece to be cut, so that the workpiece to be cut generates high-frequency ultrasonic vibration and micromachining while the cutting line is cut, the cutting efficiency can be greatly improved, the consistency of the cutting surface of the workpiece to be cut can be improved, the cutting quality is improved, and the yield is improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:

fig. 1 is a schematic structural diagram of a cutting device and a vibrating device in a slicer according to an embodiment of the present utility model;

FIG. 2 is a front view of the cutting device and vibration device of FIG. 1;

FIG. 3 is a top view of the cutting device and vibration device of FIG. 1;

FIG. 4 is a left side view of the cutting device and vibration device of FIG. 1;

FIG. 5 is a schematic view of the vibration device shown in FIG. 1;

FIG. 6 is a front view of the vibration device of FIG. 5;

FIG. 7 is a left side view of the vibration device of FIG. 5;

FIG. 8 is a schematic view of a cutting device and a vibrating device in another microtome according to an embodiment of the present utility model;

FIG. 9 is a front view of the cutting device and vibration device of FIG. 8;

FIG. 10 is a left side view of the cutting device and vibration device of FIG. 8;

FIG. 11 is a schematic view of the vibration device of FIG. 8;

FIG. 12 is a front view of the vibration device of FIG. 11;

FIG. 13 is a left side view of the vibration device of FIG. 11;

FIG. 14 is a schematic view of a cutting device and a vibrating device in a further dicing machine according to an embodiment of the present utility model;

FIG. 15 is a left side view of the cutting device and vibration device of FIG. 14;

FIG. 16 is a schematic view of a cutting device and a vibrating device in a further dicing machine according to an embodiment of the present utility model;

fig. 17 is a left side view of the cutting device and vibration device of fig. 16.

Reference numerals:

11-a cutting roller;

2-a vibration device;

3-silicon rod;

4-cutting lines;

a 5-wafer support assembly; 51-a crystal supporting plate; 52-resin plate.

Detailed Description

In order to make the technical solutions and advantages of the embodiments of the present utility model more apparent, the following detailed description of exemplary embodiments of the present utility model is provided in conjunction with the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present utility model and not exhaustive of all embodiments. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

The embodiment provides a slicing machine for cutting a workpiece to be cut. The workpiece to be cut can be a workpiece made of hard and brittle materials such as photovoltaic silicon (single crystal silicon rod and polycrystalline silicon ingot), quartz crystal, silicon carbide, semiconductor, silicon nitride, sapphire, magnetic material, ceramic, hard alloy and the like. The slicing machine cuts the workpiece to be cut through a cutting line, and slices the square rod with the rectangular cross section. The cut line may be a thin wire coated with diamond abrasive particles.

The present embodiment will be described by taking a silicon rod as an example of a workpiece to be cut. Those skilled in the art can directly apply the solution provided in this embodiment to cutting other types of workpieces; the method can also be applied to cutting other types of workpieces after equivalent modification or replacement of the related technical features of the technical scheme provided by the embodiment, and the technical scheme after modification or replacement falls into the protection scope of the utility model.

As shown in fig. 1 to 4, the slicer provided in this embodiment includes: cutting device and vibrating device. Wherein, cutting device includes: at least two cutting rolls 11 are arranged side by side, wherein a space for a workpiece to be cut to pass through is reserved between the two cutting rolls 11. In this embodiment, the workpiece to be cut is specifically a silicon rod 3.

The cutting wire 4 is wound in sequence into a wire web on each cutting roller 11. The cutting line 4 moves along the wiring direction to cut the silicon rod 3, so as to obtain a thin silicon wafer.

The silicon rod 3 and the cutting roller 11 relatively move along the feeding direction, and the silicon rod 3 can be fixed, and the cutting roller 11 moves and feeds; or the cutting roller 11 is stationary and the silicon rod 3 is fed in moving. As the silicon rod 3 is fed in moving, the silicon rod 3 gradually enters the space between the two cutting rollers 11, and the silicon rod 3 is cut by the cutting line.

The vibration device 2 is used to apply ultrasonic vibration to the silicon rod 3 so that the silicon rod 3 generates high-frequency micron-sized vibration. When the cutting line is used for cutting the silicon rod 3, micro-scale vibration energy of the cutting line enables the silicon rod 3 to generate micro-machining, macroscopic acting force of the cutting line on a workpiece to be cut in the cutting process is reduced, and further remarkable line marks of a cutting surface of the silicon rod 3 can be reduced, so that surface consistency is higher, and cutting efficiency and cutting quality are improved.

According to the technical scheme provided by the embodiment, the cutting device comprises at least two cutting rollers which are arranged side by side, wherein a space for a workpiece to be cut to pass through is reserved between the two cutting rollers; the vibration device is used for applying vibration to the workpiece to be cut, so that the workpiece to be cut generates high-frequency vibration and micromachining while macroscopic cutting is performed, the cutting efficiency can be greatly improved, the consistency of the cutting surface of the workpiece to be cut can be improved, the cutting quality is improved, and the yield is improved.

The frequency of the ultrasonic vibration is generally 20000Hz or more, and the frequency of the ultrasonic vibration provided by the present embodiment is 20000Hz or more, called high-frequency ultrasonic vibration, the amplitude of which is in the order of micrometers.

The microtome further includes a cutting frame on which the components are disposed. In this embodiment, taking the moving feeding of the silicon rod 3 as an example, two ends of the cutting roller 11 are arranged on the cutting frame through bearings, and the cutting roller 11 is driven to rotate by adopting a motor so as to drive the cutting line 4 to run.

The vibration device 2 and the silicon rod 3 can be in direct contact or indirect contact.

In this embodiment, the microtome includes a wafer support assembly for holding a workpiece to be cut. For example: the crystal support assembly 5 is used for fixing the silicon rod 3 and driving the silicon rod 3 to move along the feeding direction. The crystal support assembly 5 is arranged on the cutting frame through a feeding driving mechanism. The vibration device 2 is in contact with the susceptor assembly 5 to apply ultrasonic vibration to the susceptor assembly 5 and transmit the ultrasonic vibration to the silicon rod 3 through the susceptor assembly 5, so that the silicon rod 3 generates high-frequency vibration.

In the present embodiment, the feeding direction of the silicon rod 3 is vertical, and the moving feeding of the silicon rod 3 is described as an example.

In this embodiment, the vibration device 2 is located on the side of the susceptor assembly 5 facing away from the cutting roll 11. When the cutting roller 11 is positioned above the silicon rod 3, the silicon rod 3 moves upward to cut, and the vibration device 2 is positioned below the silicon rod 3.

When the cutting roller 11 is positioned below the silicon rod 3, the silicon rod 3 moves downward to cut, and the vibration device 2 is positioned above the silicon rod 3, specifically, at the top of the crystal support assembly 5. Specifically, the silicon rod 3 is fixed on the lower surface of the susceptor assembly 5, and the vibration device 2 is in contact with the upper surface of the susceptor assembly 5.

One embodiment is: the susceptor assembly 5 includes: the wafer pallet 51 and the resin plate 52 are sequentially arranged in the direction toward the dicing apparatus, and the resin plate 52 is fixed to the surface of the wafer pallet 51, and may be attached to the surface of the wafer pallet 51 by, for example, adhesive bonding. The silicon rod 3 is adhered to the surface of the resin plate 52 facing away from the wafer support plate 51 by means of adhesive. The vibration device 2 is disposed on a surface of the wafer support plate 51 facing away from the resin plate 52. In the drawings of the present embodiment, a resin plate 52 is bonded to the lower surface of the wafer pallet 51, and the silicon rods 3 are bonded to the lower surface of the resin plate 52. The vibrator 2 is provided on the upper surface of the wafer carrier 51.

The crystal support assembly 5 is divided into the crystal support plate 51 and the resin plate 52, so that the components can be processed quickly and simply, the single component can be replaced easily, and the cost is reduced.

As shown in fig. 5 to 7, a plurality of vibration devices 2 are employed, and the plurality of vibration devices 2 are arranged in M rows and N columns on the surface of the susceptor assembly 5, M being greater than or equal to 1, N being greater than or equal to 2. Wherein the direction of the rows is the same as the axial direction of the cutting roller 11. So as to transfer vibration to the silicon rod 3 everywhere, so that the vibration of the silicon rod 3 is more uniform, and the uniformity of the quality of each silicon wafer is improved.

Further, the plurality of vibration devices 2 are arranged in an axisymmetric manner by the center line of the crystal support assembly 5 in the length direction, so that the consistency of vibration on two sides of the center line of the silicon rod 3 is higher.

In addition, at least one vibration device 2 is provided at a position corresponding to one end portion of the silicon rod 3, for example; the two ends of the silicon rod 3 are provided with vibrating devices 2, which can be one or two or more. So that the end part of the silicon rod 3 also generates vibration, which is beneficial to improving the consistency of the vibration of the silicon rod.

Further, the vibration devices 2 are arranged at equal intervals along the central line direction of the length direction of the crystal support assembly 5, and uniformly vibrate each part of the silicon rod 3.

In fig. 11 to 13 of the present embodiment, the vibration devices are arranged in 2 rows and 5 columns, and are equally spaced on the upper surface of the susceptor assembly 5.

The present example provides another implementation: as shown in fig. 8 to 13, the susceptor assembly 5 includes only a susceptor plate to which the silicon rods 3 are bonded. The vibration device 2 is arranged on the top of the crystal supporting plate and is contacted with the top surface of the crystal supporting plate. The rest of the schemes are the same as described above.

The vibration device 2 may be an ultrasonic vibration device, for example, including a transducer and a horn. The energy converter converts the electric energy into mechanical vibration, and the amplitude transformer is connected with the energy converter. The horn is in contact with the susceptor assembly 5 to impart vibration to the silicon rod.

On the basis of the scheme, the number of the cutting rollers 11 is two, as shown in fig. 14 and 15, the two cutting rollers 11 are arranged at intervals in the horizontal direction, a cutting wire is wound on the two cutting rollers 11 to form a wire net, and the silicon rod 3 passes through the space between the two cutting rollers 11 and is cut by the cutting wire.

Alternatively, the number of the cutting rolls 11 is three, and the three cutting rolls are arranged in a regular triangle. As shown in fig. 16 and 17, two cutting rolls 11 are arranged at intervals in the horizontal direction, and the other cutting roll 11 may be located above or below the two cutting rolls 11. In this embodiment, one cutting roller 11 is located below two cutting rollers 11. The cutting wire is wound on the three cutting rolls 11 to form a wire net, and the silicon rod 3 passes through the space between the two cutting rolls 11 above and is cut by the cutting wire. The vibration device 2 is disposed above the silicon rod 3, specifically above the crystal support assembly 5, applies ultrasonic vibration to the crystal support assembly 5, and transmits the ultrasonic vibration to the silicon rod 3. For the case where one cutting roller 11 is located above two cutting rollers 11, the silicon rod 3 is located below the cutting rollers 11, and the vibration device 2 is located below the silicon rod 3, and ultrasonic vibration is applied in direct or indirect contact with the silicon rod 3.

Or, the number of the cutting rollers is four, and the four cutting rollers are arranged in a rectangle. As shown in fig. 1 to 4 and fig. 8 to 10. Two cutting rolls 11 are arranged above and spaced apart in the horizontal direction, and the other two cutting rolls 11 are arranged below and spaced apart in the horizontal direction. The cutting wire is wound on the four cutting rollers 11 to form a wire net, and the silicon rod 3 passes through the space between the two cutting rollers 11 above and is cut by the cutting wire.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may communicate with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

While preferred embodiments of the present utility model have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the utility model.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims

1. A slicer, comprising:

2. The microtome according to claim 1, wherein the microtome includes a crystal-support assembly for holding a workpiece to be cut, the vibration device being in contact with the crystal-support assembly to apply ultrasonic vibration to the crystal-support assembly and to transmit ultrasonic vibration through the crystal-support assembly to the workpiece to be cut.

3. A microtome according to claim 1 or claim 2, wherein the vibration means is located on a side of the crystal holder assembly facing away from the cutting roller.

4. A microtome according to claim 3, wherein the workpiece to be cut is vertically movable relative to the cutting roller, and the vibration means is located on top of the workpiece to be cut.

5. The microtome according to claim 2, wherein the plurality of vibration devices are arranged in M rows and N columns on the surface of the crystal support assembly, M being greater than or equal to 1 and N being greater than or equal to 2; wherein the direction of the rows is the same as the axis direction of the cutting roll.

6. The microtome according to claim 5 wherein the plurality of vibration means are arranged axisymmetrically about a centerline of the crystal support assembly along its length.

7. The microtome according to claim 2 wherein the wafer support assembly comprises: the crystal supporting plate and the resin plate are sequentially arranged along the direction facing the cutting device, and the resin plate is fixed on the surface of the crystal supporting plate and is used for pasting a workpiece to be cut; the vibration device is arranged on the surface of the crystal supporting plate, which is away from the resin plate.

8. The microtome according to claim 2, wherein the wafer support assembly comprises a wafer support plate for adhering a workpiece to be cut; the vibration device is arranged on the surface of the crystal supporting plate, which is away from the workpiece to be cut.

9. The microtome according to any one of claims 2, 5, 6, 7, 8, wherein at least one vibration device is provided at a position corresponding to one end of the workpiece to be cut.

10. The microtome according to claim 9 wherein the vibration means are equally spaced along a centerline of the length of the wafer support assembly.

11. The microtome according to claim 1 wherein the vibration device comprises a transducer and horn; the energy converter is used for converting electric energy into mechanical vibration, and the amplitude transformer is connected with the energy converter; the horn is in direct or indirect contact with the workpiece to be cut.

12. A microtome according to claim 3, wherein the number of cutting rollers is two, the two cutting rollers being spaced apart in a horizontal direction;

or the number of the cutting rollers is three, and the three cutting rollers are arranged into a regular triangle;

or, the number of the cutting rollers is four, and the four cutting rollers are arranged in a rectangle.

13. The slicer of claim 12, wherein when the number of cutting rollers is three, two of the cutting rollers are spaced apart in a horizontal direction;

the other cutting roller is positioned below the two horizontally arranged cutting rollers; the workpiece to be cut is positioned above the cutting device, and the vibration device is positioned above the workpiece to be cut and applies ultrasonic vibration to the workpiece to be cut; alternatively, the other cutting roll is located above two cutting rolls arranged horizontally; the workpiece to be cut is positioned below the cutting device, and the vibration device is positioned below the workpiece to be cut and applies ultrasonic vibration to the workpiece to be cut.