CN220023165U - FPC with auxiliary wiring layer - Google Patents

Abstract

The utility model discloses an FPC with an auxiliary wiring layer, which comprises a first wiring layer and a second wiring layer which are arranged in parallel, wherein an auxiliary wiring layer is arranged between the first wiring layer and the second wiring layer, the auxiliary wiring layer is used for re-etching a corresponding line on the first wiring layer or the second wiring layer, the re-etched line on the auxiliary wiring layer is electrically connected with the corresponding line of the first wiring layer or the second wiring layer through a perforation, and insulating layers are arranged between two sides of the auxiliary wiring layer and the first wiring layer and the second wiring layer. The utility model can reduce the circuit impedance through the design, avoid the affected circuit area, improve the circuit stability and reliability, reduce the overall design difficulty, avoid the mutual interference of the circuits, and have the advantages of simple manufacturing process, low cost, easy realization of mass production, important application value and economic value, and wide market prospect and popularization value.

Description

FPC with auxiliary wiring layer

Technical Field

The utility model relates to the technical field of FPC design, in particular to an FPC with an auxiliary wiring layer.

Background

The FPC (Flexible Printed Circuit Board) is a flexible printed circuit board made of polyimide or polyester film as a base material, has high reliability, is excellent in flexible printed circuit, and is favored in excellent characteristics such as light weight, thin thickness, free bending and folding, and so on, and thus is widely used in electronic products. The circuit impedance of the FPC board is generally high due to its process limitations and is easily disturbed during wiring, thereby degrading circuit performance.

For example, chinese patent (CN 201721780267.2) discloses an FPC and a connection device for a connector. The FPC for the connector comprises a wiring area and a connection area which are connected, wherein the wiring area adopts a single-layer wiring structure comprising a first body layer, and the connection area adopts a double-layer wiring structure comprising a first body layer and a second body layer; one surface of the connecting area is provided with a bonding pad for welding the connector, and the other surface is provided with a reinforcing plate; and at the joint between the routing area and the connecting area, the edge of the reinforcing plate is staggered inwards from the edge of the second body layer. The wiring in the first body layer on the connection area of the FPC for the connector is not easy to break, and the stability is good.

However, when the present inventors embodied this device, the following drawbacks were found to exist: through setting up the FPC board that the bilayer was walked, in the in-service use, circuit impedance is higher generally to in the circuit overall arrangement, certain circuit area receives the interference easily, needs the adjustment circuit position, leads to the overall design degree of difficulty great, the circuit is interfered each other and is difficult to handle.

Disclosure of Invention

Based on the above, it is necessary to provide an FPC with an auxiliary wiring layer, which can reduce circuit impedance, avoid affected circuit areas, improve circuit stability and reliability, reduce overall design difficulty, avoid interference between circuits, and have the advantages of simple manufacturing process, low cost, easy realization of mass production, important application value and economic value, and wide market prospect and good popularization value.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the utility model provides a FPC with supplementary wiring layer, its includes, two-layer parallel arrangement's wiring layer one and wiring layer two, be provided with supplementary wiring layer between wiring layer one and the wiring layer two, supplementary wiring layer is used for the resculpting the corresponding circuit on wiring layer one or the wiring layer two, and the circuit of resculpting on the supplementary wiring layer is through perforating and wiring layer one or wiring layer two's corresponding circuit electricity connection, all be provided with the insulating layer between supplementary wiring layer two sides and wiring layer one and the wiring layer two.

As a preferred embodiment of the FPC with an auxiliary wiring layer provided by the present utility model, the auxiliary wiring layer is provided with a GND line.

As a preferred implementation mode of the FPC with the auxiliary wiring layer, the first wiring layer and the second wiring layer are respectively provided with an insulating layer.

As a preferred embodiment of the FPC with an auxiliary wiring layer provided by the present utility model, the insulating layer, the first wiring layer, the second wiring layer and the auxiliary wiring layer are synthesized by hot pressing.

As a preferred embodiment of the FPC with an auxiliary wiring layer provided by the present utility model, the perforation is filled with silver paste.

As a preferred embodiment of the FPC with an auxiliary wiring layer provided by the present utility model, the perforation is realized by laser processing or machining.

As a preferred embodiment of the FPC with an auxiliary wiring layer provided by the present utility model, the auxiliary wiring layer is etched with one or more wiring layers one or two.

As a preferred implementation mode of the FPC with the auxiliary wiring layer, the insulating layers are arranged on the outer sides of the first wiring layer and the second wiring layer, radiating fins are arranged on the insulating layers on the outer sides of the first wiring layer and the second wiring layer, and radiating fins are arranged on the outer sides of the radiating fins.

In a preferred embodiment of the FPC with an auxiliary wiring layer provided by the utility model, heat conducting plates are arranged at two ends of the heat sink, and the heat conducting plates are connected with the insulating layer.

As a preferred implementation mode of the FPC with the auxiliary wiring layer, the heat conducting plates at two ends of the radiating fin are respectively connected with the insulating layers at two sides of the corresponding first wiring layer and the corresponding second wiring layer.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the FPC with the auxiliary wiring layer, the FPC board with the auxiliary wiring layer is arranged, the auxiliary wiring layer is arranged between the first wiring layer and the second wiring layer, so that when the first wiring layer and the second wiring layer are subjected to wiring, the auxiliary wiring layer between the first wiring layer and the second wiring layer can be conveniently used for wiring, the lines on the first wiring layer and the second wiring layer, which need to be re-carved, are connected with the re-carved lines on the corresponding auxiliary wiring layer through the arranged perforations, and the re-carved lines on the auxiliary wiring layer are connected with the corresponding lines on the first wiring layer or the second wiring layer in parallel.

2. According to the FPC with the auxiliary wiring layer, the first wiring layer, the second wiring layer and the auxiliary wiring layer are led into the heat radiating fins through the insulating layers, heat conducting materials can be arranged in the insulating layers, the heat conducting plates at the two ends of the heat radiating fins are connected with the insulating layers, heat is better led out, the heat conducting plates at the two ends of the heat radiating fins are distributed to be connected with the insulating layers of the inner layer and the outer layer, the insulating layers of the inner layer and the outer layer form an annular loop through connection of the heat radiating fins, heat difference is formed, heat can be circularly dissipated, passive heat dissipation efficiency is improved, and active heat dissipation can be conducted by blowing the heat radiating fins and the heat radiating fins through the installation of the fan, so that heat dissipation efficiency is improved.

Drawings

In order to more clearly illustrate the solution of the present utility model, a brief description will be given below of the drawings required for the description of the embodiments, it being obvious that the drawings in the following description are some embodiments of the present utility model, and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a first wiring layer, a second wiring layer and an auxiliary wiring layer according to the present utility model;

FIG. 2 is a schematic view of the overall structure provided by the present utility model;

fig. 3 is a schematic view of an insulating layer and a heat sink according to the present utility model.

The labels in the figures are illustrated below:

1. an auxiliary wiring layer; 2. a first wiring layer; 3. an insulating layer; 4. a heat sink; 5. radiating fins; 6. a heat conductive plate; 7. and a wiring layer II.

Detailed Description

In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

As described in the background art, in practical use, circuit impedance is generally high, and in the circuit layout, some circuit areas are easily disturbed, and the circuit positions need to be adjusted, so that the overall design difficulty is high, and the mutual interference of the circuits is difficult to handle.

In order to solve the technical problem, the utility model provides an FPC with an auxiliary wiring layer, which is applied to FPC design.

Specifically, please refer to fig. 1, an FPC with an auxiliary wiring layer includes two parallel wiring layers, namely, a first wiring layer 2 and a second wiring layer 7, an auxiliary wiring layer 1 is disposed between the first wiring layer 2 and the second wiring layer 7, the auxiliary wiring layer 1 is used for re-etching a corresponding line on the first wiring layer 2 or the second wiring layer 7, the re-etched line on the auxiliary wiring layer 1 is electrically connected with the corresponding line of the first wiring layer 2 or the second wiring layer 7 through a through hole, and an insulating layer 3 is disposed between two sides of the auxiliary wiring layer 1 and the first wiring layer 2 and the second wiring layer 7.

According to the FPC with the auxiliary wiring layer, the FPC board with the auxiliary wiring layer 1 is arranged, the auxiliary wiring layer 1 is arranged between the two wiring layers I2 and II 7, so that when the wiring is carried out on the wiring layer I2 and II 7, the auxiliary wiring layer 1 between the two can be used for wiring at the same time, the wiring needing to be re-carved on the wiring layer I2 and the wiring layer II 7 is connected with the re-carved wiring on the corresponding auxiliary wiring layer 1 through the arranged perforation, and the re-carved wiring on the auxiliary wiring layer 1 is connected with the corresponding wiring of the wiring layer I2 or the wiring layer II 7 in parallel, the circuit impedance can be reduced through the design, the affected wiring area can be avoided, the circuit stability and reliability are improved, meanwhile, the manufacturing process is simple, the cost is low, the implementation of the FPC with the auxiliary wiring layer I2 and the wiring layer II is easy to realize mass production, and the FPC with the important application value and economic value has wide market prospect and popularization value;

and through setting up insulating layer 3, can avoid adjacent wiring layer one 2, walk line layer two 7 and supplementary wiring layer 1 mutual influence, and in order to avoid being located the degree of difficulty that wiring set up on wiring layer one 2 and the wiring layer two 7, and avoid the condition of mutual interference between the circuit, the circuit accessible perforation on accessible wiring layer one 2 and the wiring layer two 7 is walked line intercommunication with supplementary wiring layer 1, thereby realize the normal intercommunication of circuit, and can avoid the circuit region that receives the influence, reduce the overall design degree of difficulty, avoid the circuit to interfere with each other.

In order to make the person skilled in the art better understand the solution of the present utility model, the technical solution of the embodiment of the present utility model will be clearly and completely described below with reference to the accompanying drawings.

It should be noted that, under the condition of no conflict, the embodiments of the present utility model and the features and technical solutions in the embodiments may be combined with each other.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

Example 1

Referring to fig. 1, an FPC with an auxiliary wiring layer is disclosed, wherein two layers of parallel wiring layers 1 and 7 are provided, an auxiliary wiring layer 1 is provided between the first wiring layer 2 and the second wiring layer 7, the FPC board with the auxiliary wiring layer 1 is provided, the auxiliary wiring layer 1 is provided between the first wiring layer 2 and the second wiring layer 7, when the first wiring layer 2 and the second wiring layer 7 are conveniently routed, the auxiliary wiring layer 1 between the first wiring layer 2 and the second wiring layer 7 can be simultaneously utilized, the lines to be etched on the first wiring layer 2 and the second wiring layer 7 are connected with the corresponding auxiliary wiring layer 1 through the arranged perforations, and the parallel connection is realized between the repeated etching lines on the auxiliary wiring layer 1 and the corresponding lines of the first wiring layer 2 or the second wiring layer 7.

The auxiliary wiring layer 1 is used for repeatedly etching corresponding lines on the first wiring layer 2 or the second wiring layer 7, the repeatedly etched lines on the auxiliary wiring layer 1 are electrically connected with the corresponding lines of the first wiring layer 2 or the second wiring layer 7 through holes, insulating layers 3 are arranged between two sides of the auxiliary wiring layer 1 and the first wiring layer 2 and the second wiring layer 7, through the insulating layers 3, the mutual influence of the adjacent first wiring layer 2, the adjacent second wiring layer 7 and the auxiliary wiring layer 1 can be avoided, in order to avoid the difficulty of line arrangement on the first wiring layer 2 and the second wiring layer 7 and the mutual interference between the lines, the insulating layers 3 are arranged on the outer sides of the first wiring layer 2 and the second wiring layer 7, the insulating layers 3, the first wiring layer 2, the second wiring layer 7 and the auxiliary wiring layer 1 are synthesized through hot pressing, the circuit stability and the reliability are improved through hot pressing synthesis, meanwhile, the manufacturing process is simple, the cost is low, mass production is easy to realize, important application value and economic value is wide, and the market prospect is high.

Example 2

For further optimization of the FPC with the auxiliary trace layer provided in embodiment 1, specifically, as shown in fig. 1, the perforation is performed by silver paste pouring, the perforation is performed by laser processing or machining, and the auxiliary trace layer 1 rewrites one or more traces of the trace layer one 2 or the trace layer two 7.

Through the structural design, the high conductivity of silver paste is utilized, the circuit impedance is reduced, the machining precision is improved by laser machining or mechanical machining, one or more lines of the first wiring layer 2 or the second wiring layer 7 are etched again in the auxiliary wiring layer 1, a plurality of lines for serving the first wiring layer 2 or the second wiring layer 7 can be etched again in the auxiliary wiring layer 1, the difficulty of line arrangement on the first wiring layer 2 and the second wiring layer 7 can be avoided, and the condition of mutual interference between the lines is avoided.

Because the wiring layer I2 and the wiring layer II 7 of the double-layer PCB are arranged, heat is easy to accumulate and is not easy to lose in the use process, and the following embodiments are provided for solving the technical problems:

example 3

For further optimization of the FPC with auxiliary wiring layers provided in embodiment 1 or 2, as shown in fig. 2-3, the outer sides of the first wiring layer 2 and the second wiring layer 7 are both provided with an insulating layer 3, the outer insulating layers 3 located at the first wiring layer 2 and the second wiring layer 7 are provided with cooling fins 4, the outer sides of the cooling fins 4 are provided with cooling fins 5, two ends of the cooling fins 4 are provided with heat conducting plates 6, the heat generated by the first wiring layer 2, the second wiring layer 7 and the auxiliary wiring layer 1 is led into the cooling fins 4 through the insulating layer 3, heat conducting materials can be arranged in the insulating layer 3, and the heat conducting plates 6 at two ends of the cooling fins 4 are connected with the insulating layer 3, so that the heat is better led out.

The heat conducting plate 6 is connected with the insulating layer 3, the heat conducting plate 6 at two ends of the radiating fin 4 is respectively connected with the insulating layer 3 at two sides of the corresponding first wiring layer 2 and the corresponding second wiring layer 7, the heat conducting plates 6 at two ends of the radiating fin 4 are respectively connected with the insulating layer 3 at the inner layer and the insulating layer at the outer layer, the insulating layer 3 at the inner layer and the insulating layer form an annular loop through the connection of the radiating fin 4, and the heat of the insulating layer 3 at the outer layer is fast, the heat of the insulating layer 3 at the inner layer is high, the heat quantity difference is formed, the heat can be circularly dissipated, the passive radiating efficiency is improved, and the active radiating can be carried out by blowing the radiating fin 4 and the radiating fin 5 through the installation fan, so that the radiating efficiency is improved.

The FPC with the auxiliary wiring layer provided by the utility model has the following using process: the auxiliary wiring layer 1 is arranged between the first wiring layer 2 and the second wiring layer 7, the auxiliary wiring layer 1 between the first wiring layer 2 and the second wiring layer 7 is utilized for wiring, the lines needing to be re-carved on the first wiring layer 2 and the second wiring layer 7 are connected with the re-carved lines on the corresponding auxiliary wiring layer 1 through the arranged perforation, the re-carved lines on the auxiliary wiring layer 1 are connected with the corresponding lines of the first wiring layer 2 or the second wiring layer 7 in parallel, the circuit impedance is reduced, the affected line area is avoided, the insulating layer 3 can avoid the mutual influence of the adjacent first wiring layer 2, the adjacent second wiring layer 7 and the auxiliary wiring layer 1, the lines on the first wiring layer 2 and the second wiring layer 7 can be communicated with the auxiliary wiring layer 1 through the perforation, so that the normal communication of the lines is realized, the overall design difficulty is reduced, and the mutual interference of the lines is avoided.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

It is apparent that the above-described embodiments are only some embodiments of the present utility model, but not all embodiments, and the preferred embodiments of the present utility model are shown in the drawings, which do not limit the scope of the patent claims. This utility model may be embodied in many different forms, but rather, embodiments are provided in order to provide a thorough and complete understanding of the present disclosure. Although the utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing description, or equivalents may be substituted for elements thereof. All equivalent structures made by the content of the specification and the drawings of the utility model are directly or indirectly applied to other related technical fields, and are also within the scope of the utility model.

Claims (10)

1. The FPC with the auxiliary wiring layer is characterized by comprising a first wiring layer (2) and a second wiring layer (7) which are arranged in parallel, wherein an auxiliary wiring layer (1) is arranged between the first wiring layer (2) and the second wiring layer (7), the auxiliary wiring layer (1) is used for re-etching a corresponding line on the first wiring layer (2) or the second wiring layer (7), the re-etched line on the auxiliary wiring layer (1) is electrically connected with the corresponding line of the first wiring layer (2) or the second wiring layer (7) through a perforation, and an insulating layer (3) is arranged between two sides of the auxiliary wiring layer (1) and the first wiring layer (2) and the second wiring layer (7).

2. FPC with auxiliary routing layer according to claim 1, characterized in that the auxiliary routing layer (1) is provided with GND lines.

3. The FPC with auxiliary routing layer according to claim 1, characterized in that the outer sides of the first routing layer (2) and the second routing layer (7) are both provided with an insulating layer (3).

4. A FPC with auxiliary trace layer according to claim 3, characterized in that the insulating layer (3), trace layer one (2), trace layer two (7) and auxiliary trace layer (1) are synthesized by thermo-compression.

5. An FPC with auxiliary routing layer according to claim 1, characterized in that the perforations are impregnated with silver paste.

6. An FPC with auxiliary routing layer according to claim 5, characterized in that the perforation is achieved by laser machining or machining.

7. The FPC with auxiliary routing layer according to claim 1, characterized in that the auxiliary routing layer (1) is re-routed with one or more routing layer one (2) or routing layer two (7).

8. The FPC with auxiliary wiring layers according to claim 1, wherein the outer sides of the first wiring layer (2) and the second wiring layer (7) are provided with insulating layers (3), the outer insulating layers (3) located on the first wiring layer (2) and the second wiring layer (7) are provided with cooling fins (4), and the outer sides of the cooling fins (4) are provided with cooling fins (5).

9. The FPC with auxiliary wiring layer according to claim 8, wherein heat conducting plates (6) are provided at both ends of the heat sink (4), and the heat conducting plates (6) are connected with the insulating layer (3).

10. The FPC with auxiliary wiring layers according to claim 9, wherein the heat conducting plates (6) at both ends of the heat sink (4) are respectively connected with the insulating layers (3) at both sides of the corresponding first wiring layer (2) and second wiring layer (7).