CN220021054U - Wafer material taking module - Google Patents
Wafer material taking module Download PDFInfo
- Publication number
- CN220021054U CN220021054U CN202321306631.7U CN202321306631U CN220021054U CN 220021054 U CN220021054 U CN 220021054U CN 202321306631 U CN202321306631 U CN 202321306631U CN 220021054 U CN220021054 U CN 220021054U
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- CN
- China
- Prior art keywords
- air
- wafer
- cavity
- heating
- base
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 title claims description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 59
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 239000000428 dust Substances 0.000 claims description 8
- 239000013078 crystal Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000002950 deficient Effects 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of wafer production, in particular to a wafer taking module, which comprises a base and a connecting plate arranged on the base, wherein the connecting plate is arranged on the base; the bottom of the base is provided with a plurality of suction nozzles; the connecting plate is provided with a heating seat; the heating seat is provided with an air inlet and an air outlet; a heating component is arranged in the heating seat; the heating component is arranged between the air inlet and the air outlet; an air nozzle is arranged at the bottom of the heating seat; the base is provided with a through hole in a penetrating way; the air nozzle penetrates through the perforation; the bottom of the air nozzle is provided with a first guide plate arranged towards the direction of the suction nozzle. According to the utility model, cold air is blown in from the air inlet, then hot air is formed after the cold air passes through the heating component, and is blown out from the air outlet and the air nozzle, and the hot air is guided to the lower part of the suction nozzle through the action of the first guide plate, so that the ink of crystal grains below the suction nozzle is dried, and then the wafer is adsorbed through the suction nozzle, so that the ink can be prevented from adhering to the suction nozzle.
Description
Technical Field
The utility model relates to the technical field of wafer production, in particular to a wafer taking module.
Background
After the wafer is manufactured, wafer testing is an indispensable and important process; because of the design of the process or the characteristics of the material, some defective products are more or less generated and need to be removed, in order to avoid the situation that the next packaging link is subjected to error packaging, the common practice in the industry is to mark the defective product grains of the wafer with ink dots.
At present, after the defective crystal grain of the wafer is subjected to ink-dripping treatment, a vacuum suction nozzle is required to be used for taking and transferring the wafer, and in the adsorption process, if the ink of the crystal grain is not completely dried, the ink is easy to adhere to the vacuum suction nozzle, and then when the vacuum suction nozzle is used for taking the next wafer, the vacuum suction nozzle adheres the ink to the defective crystal grain, so that misjudgment is caused.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provide a wafer taking module.
The aim of the utility model is achieved by the following technical scheme: a wafer material taking module comprises a base and a connecting plate arranged on the base; the bottom of the base is provided with a plurality of suction nozzles; the connecting plate is provided with a heating seat; the heating seat is provided with an air inlet and an air outlet; a heating component is arranged in the heating seat; the heating component is arranged between the air inlet and the air outlet; an air nozzle is arranged at the bottom of the heating seat; the base is provided with a through hole in a penetrating way; the air nozzle penetrates through the perforation; the bottom of the air nozzle is provided with a first guide plate arranged towards the direction of the suction nozzle.
The utility model is further arranged that the heating seat is provided with a first cavity and a second cavity; the air inlet is communicated with the first cavity; the air outlet is communicated with the second cavity; the heating component is arranged between the first cavity and the second cavity.
The utility model is further arranged that the heating component comprises a heating cylinder arranged between the first cavity and the second cavity and a heating piece arranged in the heating cylinder; an air inlet hole communicated with the first cavity is formed in the top of the heating cylinder; the bottom of the heating cylinder is provided with an air outlet communicated with the second cavity.
The utility model is further arranged that the bottom of the second cavity is provided with a circular groove; the air outlet is arranged on the inner wall of the circular groove.
The utility model is further arranged that the two sides of the base are provided with extension plates; the bottom of the extension plate is provided with a dust removal air tap.
The utility model is further provided with a second guide plate arranged at the bottom of the dust removal air tap towards the direction of the base.
The utility model further provides that the heating seat is detachably connected with the connecting plate through a screw.
The utility model further provides that the wafer taking module further comprises a buffer plate; the connecting plate is arranged on the buffer plate in a lifting and sliding mode.
The utility model further provides that the wafer taking module further comprises a lifting mechanism for driving the buffer plate to lift.
The utility model has the beneficial effects that: according to the utility model, cold air is blown in from the air inlet, then hot air is formed after the cold air passes through the heating component, and is blown out from the air outlet and the air nozzle, and the hot air is guided to the lower part of the suction nozzle through the action of the first guide plate, so that the ink of crystal grains below the suction nozzle is dried, and then the wafer is adsorbed through the suction nozzle, so that the ink can be prevented from adhering to the suction nozzle.
Drawings
The utility model will be further described with reference to the accompanying drawings, in which embodiments do not constitute any limitation of the utility model, and other drawings can be obtained by one of ordinary skill in the art without inventive effort from the following drawings.
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the structure of the present utility model after hiding the buffer plate and the lifting mechanism;
FIG. 3 is a schematic view of the structure of the utility model from another view behind the blind buffer plate and the lifting mechanism;
FIG. 4 is a cross-sectional view of the base of the present utility model mated with a heater base;
wherein: 1. a base; 11. perforating; 12. a suction nozzle; 2. a connecting plate; 3. a heating seat; 31. an air inlet; 32. an air outlet; 4. an air nozzle; 41. a first deflector; 51. a first cavity; 52. a second cavity; 53. a circular groove; 6. a heating cylinder; 61. an air inlet hole; 62. an air outlet hole; 7. an extension plate; 71. dust removal air cock; 72. a second deflector; 8. a buffer plate; 9. and a lifting mechanism.
Detailed Description
The utility model will be further described with reference to the following examples.
As can be seen from fig. 1 to fig. 4, a wafer taking module according to the present embodiment includes a base 1 and a connecting plate 2 disposed on the base 1; the bottom of the base 1 is provided with a plurality of suction nozzles 12; the connecting plate 2 is provided with a heating seat 3; the heating seat 3 is provided with an air inlet 31 and an air outlet 32; a heating component is arranged in the heating seat 3; the heating component is arranged between the air inlet 31 and the air outlet 32; an air nozzle 4 is arranged at the bottom of the heating seat 3; the base 1 is provided with a through hole 11 in a penetrating way; the air nozzle 4 is arranged through the perforation 11; the bottom of the air nozzle 4 is provided with a first deflector 41 arranged towards the suction nozzle 12. Wherein the air inlet 31 is externally connected with a blowing component, and the suction nozzle 12 is externally connected with a vacuumizing component;
specifically, in the wafer taking module according to the present embodiment, after the wafer is inked, the wafer taking module moves to the upper side of the wafer, then the external blowing component blows cold air from the air inlet 31, then the cold air forms hot air after passing through the heating component, and blows out from the air outlet 32 and the air nozzle 4, and the hot air is guided to the lower side of the suction nozzle 12 through the action of the first guide plate 41, so that the wafer below the suction nozzle 12 is subjected to hot air blowing treatment, the ink of the crystal grains below the suction nozzle 12 can be blown dry, and the wafer is adsorbed through the suction nozzle 12, so that the ink can be prevented from adhering to the suction nozzle 12.
In the wafer reclaiming module of the present embodiment, the heating seat 3 is provided with a first cavity 51 and a second cavity 52; the air inlet 31 is communicated with the first cavity 51; the air outlet 32 is communicated with the second cavity 52; the heating element is arranged between the first cavity 51 and the second cavity 52. Specifically, by the above arrangement, the cold air blown in from the air inlet 31 can be sufficiently heated, so that the hot air is blown out from the air outlet 32.
The wafer material taking module of the present embodiment, the heating assembly includes a heating cylinder 6 disposed between the first cavity 51 and the second cavity 52, and a heating element disposed in the heating cylinder 6; the top of the heating cylinder 6 is provided with an air inlet hole 61 communicated with the first cavity 51; the bottom of the heating cylinder 6 is provided with an air outlet hole 62 communicated with the second cavity 52. Specifically, the heating cylinder 6 is disposed between the first cavity 51 and the second cavity 52, so that the first cavity 51 is isolated from the second cavity 52, and cold air blown in by the air inlet 31 enters the heating element in the heating cylinder 6 through the air inlet hole 61, and is fully heated and then blown out from the air outlet hole 62 into the second cavity 52.
In the wafer taking module of the present embodiment, a circular groove 53 is disposed at the bottom of the second cavity 52; the air outlet 32 is provided on the inner wall of the circular groove 53. Through the arrangement, the hot air can be blown out uniformly.
In the wafer taking module of the embodiment, extension plates 7 are arranged on two sides of the base 1; the bottom of the extension plate 7 is provided with a dust removal air tap 71. Through the arrangement, dust on the surface of the wafer can be blown away when the wafer is adsorbed.
In the wafer reclaiming module of the present embodiment, a second deflector 72 is disposed at the bottom of the dust-removing air nozzle 71 toward the base 1. Through the arrangement, dust on the surface of the wafer can be effectively blown away.
In the wafer taking module of this embodiment, the heating seat 3 is detachably connected with the connecting plate 2 through a screw. The disassembly and assembly are convenient through the arrangement.
The wafer taking module according to the embodiment further includes a buffer plate 8; the connecting plate 2 is arranged on the buffer plate 8 in a lifting and sliding manner. Through the arrangement, the suction nozzle 12 is prevented from being in hard contact with the wafer, so that the wafer is protected by buffering.
The wafer taking module according to this embodiment further includes a lifting mechanism 9 for driving the buffer plate 8 to lift. The lifting of the base 1 and the connecting plate 2 is realized through the arrangement.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the scope of the present utility model, and although the present utility model has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present utility model without departing from the spirit and scope of the technical solution of the present utility model.
Claims (9)
1. The utility model provides a wafer gets material module which characterized in that: comprises a base (1) and a connecting plate (2) arranged on the base (1); the bottom of the base (1) is provided with a plurality of suction nozzles (12); the connecting plate (2) is provided with a heating seat (3); the heating seat (3) is provided with an air inlet (31) and an air outlet (32); a heating component is arranged in the heating seat (3); the heating component is arranged between the air inlet (31) and the air outlet (32); an air nozzle (4) is arranged at the bottom of the heating seat (3); the base (1) is provided with a through hole (11) in a penetrating way; the air nozzle (4) is penetrated through the perforation (11); the bottom of the air nozzle (4) is provided with a first guide plate (41) arranged towards the suction nozzle (12).
2. The wafer reclaiming module of claim 1, wherein: the heating seat (3) is provided with a first cavity (51) and a second cavity (52); the air inlet (31) is communicated with the first cavity (51); the air outlet (32) is communicated with the second cavity (52); the heating component is arranged between the first cavity (51) and the second cavity (52).
3. The wafer reclaiming module of claim 2, wherein: the heating assembly comprises a heating cylinder (6) arranged between the first cavity (51) and the second cavity (52) and a heating piece arranged in the heating cylinder (6); an air inlet hole (61) communicated with the first cavity (51) is formed in the top of the heating cylinder (6); the bottom of the heating cylinder (6) is provided with an air outlet hole (62) communicated with the second cavity (52).
4. The wafer reclaiming module of claim 2, wherein: a circular groove (53) is formed in the bottom of the second cavity (52); the air outlet (32) is arranged on the inner wall of the circular groove (53).
5. The wafer reclaiming module of claim 1, wherein: extension plates (7) are arranged on two sides of the base (1); the bottom of the extension plate (7) is provided with a dust removal air tap (71).
6. The wafer reclaiming module of claim 5, wherein: the bottom of the dust removal air tap (71) is provided with a second guide plate (72) towards the direction of the base (1).
7. The wafer reclaiming module of claim 1, wherein: the heating seat (3) is detachably connected with the connecting plate (2) through screws.
8. The wafer reclaiming module of claim 1, wherein: the wafer taking module further comprises a buffer plate (8); the connecting plate (2) is arranged on the buffer plate (8) in a lifting and sliding mode.
9. The wafer reclaiming module of claim 8, wherein: the wafer taking module further comprises a lifting mechanism (9) for driving the buffer plate (8) to lift.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321306631.7U CN220021054U (en) | 2023-05-26 | 2023-05-26 | Wafer material taking module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321306631.7U CN220021054U (en) | 2023-05-26 | 2023-05-26 | Wafer material taking module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220021054U true CN220021054U (en) | 2023-11-14 |
Family
ID=88688881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321306631.7U Active CN220021054U (en) | 2023-05-26 | 2023-05-26 | Wafer material taking module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220021054U (en) |
-
2023
- 2023-05-26 CN CN202321306631.7U patent/CN220021054U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |