CN220006311U - BT plate furnace passing carrier - Google Patents

BT plate furnace passing carrier Download PDF

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Publication number
CN220006311U
CN220006311U CN202320950990.XU CN202320950990U CN220006311U CN 220006311 U CN220006311 U CN 220006311U CN 202320950990 U CN202320950990 U CN 202320950990U CN 220006311 U CN220006311 U CN 220006311U
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CN
China
Prior art keywords
base
plate
hole
furnace
board
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Active
Application number
CN202320950990.XU
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Chinese (zh)
Inventor
高宝贵
周恒�
孟浩
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Jiangxi Zhaochi Photoelectric Co ltd
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Jiangxi Zhaochi Photoelectric Co ltd
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Priority to CN202320950990.XU priority Critical patent/CN220006311U/en
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Abstract

The utility model provides a BT plate furnace-passing carrier, which is characterized in that a cover plate is rotationally connected to a base, a BT plate is stored in a cavity groove, a plurality of cavity grooves are designed, a plurality of BT plates pass through a furnace simultaneously, furnace-passing efficiency is improved, first arc grooves are formed in a plurality of end corners of the cavity grooves, clamping columns are arranged in the first arc grooves and are clamped in preset clamping holes on the BT plate, the BT plate is stable to store, chip deviation and inclination before reflow soldering are avoided, a first heat dissipation hole and a second heat dissipation hole are formed, the design of a plurality of heat dissipation holes is realized, the BT plate is heated faster after the furnace is cooled, the temperature rise and the temperature reduction are more uniform when the plate passes through the furnace, solder paste melting consistency is better, the rotation opening and closing design is matched with a first magnet and a second magnet, the taking is convenient, and the reflow soldering effect is improved.

Description

BT plate furnace passing carrier
Technical Field
The utility model relates to the field of BT plate furnace passing carriers, in particular to a BT plate furnace passing carrier.
Background
With the development of the technology of flip-chip Mini-LED, the Mini-LED packaging device is more and more widely applied to backlight and display fields, and the requirements on the Mini-LED packaging technology and quality are gradually improved.
In the prior art, a BT board passing carrier of a Mini-LED is generally a tray with a storage groove, and in the passing operation process, before a Mini-LED chip is not completely fixed on the BT board, the chip is easy to deviate and incline before reflow soldering, the reflow soldering effect is affected, the carrier is poor in heat dissipation, the temperature difference between the edge part and the middle part of a board is large, and the melting abnormality of edge solder paste is easy to cause.
Disclosure of Invention
The utility model aims to overcome the defects and shortcomings of the prior art, provides a BT plate furnace passing carrier, and aims to solve the problems in the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a BT plate furnace carrier comprises a base and a cover plate rotationally connected with the base; the base is provided with a plurality of cavity grooves for storing the BT plate, clamping columns are arranged at the corners of the cavity grooves, the clamping columns are clamped and inserted into preset clamping holes on the BT plate, the bottom surface of the cavity groove is provided with first through holes, and a plurality of first heat dissipation holes are uniformly arranged on the base around the cavity grooves; a plurality of first magnets are uniformly arranged on the non-rotating connecting end of the base; the cover plate is provided with a second through hole corresponding to the first through hole, a plurality of second heat dissipation holes are uniformly formed in the cover plate around the second through hole, and a plurality of second magnets attracted with the first magnets are arranged on the cover plate.
The beneficial effects of the utility model are as follows: the upper rotating connection of base is equipped with the apron, deposit the BT board in holding the chamber inslot, design a plurality of holds the chamber inslot, the stove is crossed simultaneously to multi-disc BT board, improve and cross stove efficiency, hold first arc recess on a plurality of terminal angles in chamber inslot, be equipped with the card post in the first arc recess, the card post card is inserted in the card downthehole of presetting on the BT board, the BT board is deposited stably, avoid causing chip skew before the reflow soldering, the slope, be equipped with first louvre and second louvre, many louvre designs, the BT board passes stove heating faster, the heat dissipation after the stove is faster, the board heats up when crossing the stove and cools down more evenly, the solder paste melts the uniformity better, rotate and open design cooperation first magnet and second magnet, it is convenient to take, improve the reflow soldering effect.
Further, a plurality of end corners of the cavity groove are provided with first arc-shaped grooves, and the clamping columns are arranged in the first arc-shaped grooves.
Further, a second arc-shaped groove corresponding to the first arc-shaped groove is arranged at the end corner of the second through hole.
Further, at least one first through hole is arranged on the outer side of each cavity groove.
Further, the first through hole comprises a plurality of identical first rectangular holes arranged side by side, and the second through hole comprises a plurality of identical second rectangular holes with the first rectangular holes.
Further, the cover plate is connected with the base through a connecting strip and a hinge, the connecting strip is fixed on the base through screws, and two ends of the hinge are respectively connected with the connecting strip and the cover plate through screws.
Further, the thickness of the connecting strip is the same as that of the cover plate so that the cover plate can be attached to the base.
Further, a second through hole is formed in the edge of one side of the base.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of a base structure of the present utility model.
Fig. 2 is a schematic diagram of a cover plate structure of the present utility model.
Fig. 3 is a schematic view of a structure of a furnace carrier according to the present utility model.
Fig. 4 is a schematic view of a BT board of the present utility model.
Wherein 1 is a base, 11 is a cavity groove, 111 is a first rectangular hole, 112 is a first through hole, 113 is a first arc-shaped groove, 12 is a first heat dissipation hole, 13 is a clamping column, 14 is a first magnet, 15 is a first through hole, 16 is a second through hole, 2 is a cover plate, 21 is a second through hole, 211 is a second rectangular hole, 212 is a second arc-shaped groove, 22 is a second magnet, 23 is a second heat dissipation hole, 3 is a connecting strip, 4 is a hinge, 5 is a BT plate, and 51 is a clamping hole.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and intended to illustrate embodiments of the utility model and should not be construed as limiting the utility model.
In the description of the embodiments of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the embodiments of the present utility model and simplify description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more, unless explicitly defined otherwise.
In the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.
The present utility model will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1-4, an embodiment of the present utility model, shown in fig. 1-4, is a BT board passing through a furnace carrier, avoiding chip offset and tilting before reflow soldering, and improving reflow soldering effect, and includes a base 1 and a cover plate 2 rotatably connected to the base 1;
specifically, the cover plate 2 is connected with the base 1 through a connecting strip 3 and a hinge 4, the connecting strip 3 is fixed on the base 1 by adopting a screw, and two ends of the hinge 4 are respectively connected with the connecting strip 3 and the cover plate 2 by adopting screws.
Specifically, the thickness of the connecting strip 3 is the same as that of the cover plate 2 so that the cover plate 2 can be attached to the base 1.
The base 1 is provided with a plurality of cavity grooves 11 for storing the BT plates 5, the cavity grooves 11 and the BT plates 5 are identical in shape and rectangular, in this embodiment, the base 1 is provided with 8 cavity grooves 11, the 8 cavity grooves 11 are arranged in a 2×4 manner, 8 cavity grooves 11 and 8 BT plates 5 are designed to pass through the furnace simultaneously, and furnace passing efficiency is improved.
First arc-shaped grooves 113 are arranged on a plurality of end corners of the cavity groove 11,
in this embodiment, the first arc-shaped grooves 113 are formed in 3 end corners of the cavity groove 11, the clamping columns 13 are disposed in the first arc-shaped grooves 113, the second arc-shaped grooves 212 corresponding to the first arc-shaped grooves 113 are disposed at end corners of the second through holes 21, the clamping columns 13 are clamped and inserted in the preset clamping holes 51 on the BT board 5, the BT board 5 is stable in storage, and chip offset and inclination before reflow soldering are avoided.
A first through hole 112 is formed in the bottom surface of the cavity groove 11, and a plurality of first heat dissipation holes 12 are uniformly formed in the base 1 around the cavity groove 11; a plurality of first magnets 14 are uniformly arranged on the non-rotating connecting end of the base 1; the cover plate 2 is provided with a second through hole 21 corresponding to the first through hole 112,
specifically, the first through hole 112 includes a plurality of identical first rectangular holes 111 arranged side by side, and the second through hole 21 includes a plurality of identical second rectangular holes 211 as the first rectangular holes 111.
The cover plate 2 is evenly provided with a plurality of second radiating holes 23 around the second through holes 21, the design of a plurality of radiating holes with the first radiating holes 12 and the second radiating holes 23 is provided, the BT plate 5 is heated faster through the furnace, the heat dissipation after the furnace is faster, the temperature rise and the temperature drop are more even when the BT plate 5 is heated through the furnace, and the solder paste melting consistency is better.
The cover plate 2 is provided with a plurality of second magnets 22 magnetically attracted to the first magnets 14.
It should be noted that the rotary opening and closing design is matched with the first magnet 14 and the second magnet 22, so that the pick-up is convenient, and the reflow soldering effect is improved.
Specifically, at least one first through hole 15 is disposed at the outer side of each cavity groove 11, and it should be noted that an operator may reach the lower surface of the base 1 from the first through hole 15, so as to facilitate the BT board 5 to be taken out from the cavity groove 11.
Specifically, the edge of one side of the base 1 is provided with a second through hole 16, and it should be noted that when the cover plate 2 is attached to the base 1, an operator can reach the lower surface of the base 1 from the second through hole 16, so as to facilitate the separation and opening of the cover plate 2 and the base 1.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (8)

1. The BT plate furnace passing carrier is characterized by comprising a base and a cover plate which is rotationally connected with the base; the base is provided with a plurality of cavity grooves for storing the BT plate, clamping columns are arranged at the corners of the cavity grooves, the clamping columns are clamped and inserted into preset clamping holes on the BT plate, the bottom surface of the cavity groove is provided with first through holes, and a plurality of first heat dissipation holes are uniformly arranged on the base around the cavity grooves; a plurality of first magnets are uniformly arranged on the non-rotating connecting end of the base; the cover plate is provided with a second through hole corresponding to the first through hole, a plurality of second heat dissipation holes are uniformly formed in the cover plate around the second through hole, and a plurality of second magnets attracted with the first magnets are arranged on the cover plate.
2. The BT board passing vehicle of claim 1, wherein said cavity groove has a plurality of end corners provided with first arcuate grooves, said clip posts being disposed in said first arcuate grooves.
3. The BT board passing vehicle of claim 2, wherein a second arcuate recess corresponding to the first arcuate recess is provided at an end corner of the second through hole.
4. The BT board passing vehicle of claim 1, wherein at least one first through hole is provided on an outer side of each cavity pocket.
5. The BT board pass furnace carrier of claim 1, wherein said first through hole comprises a plurality of identical and side-by-side disposed first rectangular holes and said second through hole comprises a plurality of identical second rectangular holes.
6. The BT board furnace carrier of claim 1, wherein said cover board and said base are connected to said base by means of a connecting bar and a hinge, said connecting bar is fastened to said base by means of screws, and said hinge is connected to said connecting bar and said cover board by means of screws, respectively.
7. The BT board passing vehicle of claim 6, wherein said connecting bar has a thickness that is the same as said cover plate thickness to enable said cover plate to fit over said base.
8. The BT board passing vehicle of claim 1, wherein a second through hole is provided on an edge of one side of the base.
CN202320950990.XU 2023-04-24 2023-04-24 BT plate furnace passing carrier Active CN220006311U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320950990.XU CN220006311U (en) 2023-04-24 2023-04-24 BT plate furnace passing carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320950990.XU CN220006311U (en) 2023-04-24 2023-04-24 BT plate furnace passing carrier

Publications (1)

Publication Number Publication Date
CN220006311U true CN220006311U (en) 2023-11-14

Family

ID=88688965

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320950990.XU Active CN220006311U (en) 2023-04-24 2023-04-24 BT plate furnace passing carrier

Country Status (1)

Country Link
CN (1) CN220006311U (en)

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