CN219998176U

CN219998176U - Manual sheet taking mechanical claw

Info

Publication number: CN219998176U
Application number: CN202321251340.2U
Authority: CN
Inventors: 潘卿峰
Original assignee: Shanghai Huali Microelectronics Corp
Current assignee: Shanghai Huali Microelectronics Corp
Priority date: 2023-05-22
Filing date: 2023-05-22
Publication date: 2023-11-10
Anticipated expiration: 2033-05-22

Abstract

The utility model relates to the technical field of semiconductor equipment, and discloses a manual slice taking mechanical claw, which comprises a base, a limiting piece and a supporting piece; the base is provided with a transverse rod and two longitudinal rods, the longitudinal rods are arranged on two sides of the transverse rod, the limiting parts are four, the four limiting parts are rotatably arranged on two sides of each longitudinal rod, a containing space for containing a wafer is arranged between the four limiting parts, and the supporting parts are arranged on each longitudinal rod and used for supporting the wafer. Compared with the operation that a person directly takes the wafer, the wafer can be contacted by the limiting piece and the supporting piece made of elastic materials, and the intervention of external pollution can be effectively avoided. The wafer in the machine table can be effectively grabbed by utilizing the scalability of the base and the rotatability of the limiting piece, fingers are replaced to contact the wafer in the whole manual wafer taking process, unnecessary manual contact with the wafer is avoided, and the interference of external pollution sources is reduced.

Description

Manual sheet taking mechanical claw

Technical Field

The utility model relates to the technical field of semiconductor equipment, in particular to a manual sheet taking mechanical claw.

Background

A wafer is a wafer for manufacturing a semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape. The chip can be processed into various circuit element structures to form IC products with specific electrical functions, and the yield is an important condition in the process of producing wafers, so that the wafer needs to be protected during picking and placing.

When the semiconductor machine is down, because the pick-and-place device of the machine is invalid, operators often directly clamp the side edge of the wafer by fingers or hold the back of the wafer by fingers to pick up the wafer from the machine, and the operation inevitably touches the wafer by fingers (or fingers with gloves). However, once the wafer is touched by fingers or gloves, dirt is likely to remain on the side edge or the back of the wafer, which is likely to cause the influence of subsequent processes on the yield of the wafer, and even result in rejection.

Therefore, the utility model needs a manual wafer taking mechanical claw to improve the operation of taking the wafer by personnel directly after the downtime of the semiconductor machine, and to improve the scrapping phenomenon of the wafer caused by the adhesion of pollutants to the wafer.

Disclosure of Invention

In order to achieve the above purpose, the utility model provides a manual sheet taking mechanical claw: comprising the following steps: the device comprises a base, a limiting piece and a supporting piece;

the base comprises a transverse rod and two longitudinal rods, wherein the transverse rod extends along a first direction, the longitudinal rods extend along a second direction, the two longitudinal rods are arranged along the first direction and connected with the transverse rod, the first direction is parallel to the transverse rod, and the second direction is perpendicular to the first direction;

two ends of each longitudinal rod are respectively connected with a limiting piece, and four limiting pieces are surrounded to form a containing space for containing wafers;

and each longitudinal rod is provided with at least one supporting piece for supporting the wafer in the accommodating space.

Optionally, the limiting part is rotatably arranged on the longitudinal rod, and the rotation central axis of the limiting part is perpendicular to the first direction and the second direction.

Optionally, the transverse rod is telescopically arranged along the first direction; and/or; the longitudinal rod is telescopically arranged along the second direction.

Optionally, the projection of the base along a third direction is in a U shape, and the third direction is perpendicular to the first direction and the second direction.

Optionally, the limiting part is provided with a contact surface, and the contact surface is used for being attached to the edge of the wafer.

Optionally, the projection of the contact surface along a third direction is arc-shaped, and the third direction is perpendicular to the first direction and the second direction.

Optionally, the rotation angle of the limiting piece is located in a set range.

Optionally, the limiting piece is made of elastic material; and/or the material of the bearing piece is elastic material.

Optionally, at least two supporting pieces are arranged on each longitudinal rod at intervals along the second direction, each supporting piece is arranged on the same side of the longitudinal rod along a third direction, and the third direction is perpendicular to the first direction and the second direction.

Optionally, the manual sheet taking mechanical claw further comprises a handle, the handle is arranged on the transverse rod, and the handle and the longitudinal rod are respectively arranged on two sides of the transverse rod along the second direction.

According to the utility model, through the matching arrangement of the base, the limiting piece and the supporting piece, compared with the operation that a person directly takes the wafer, the wafer can be contacted by the limiting piece and the supporting piece made of elastic materials, the working environment inside the machine can be simulated to a certain extent, the intervention of external pollution can be effectively avoided, and the phenomenon that the wafer is scrapped due to the adhesion of pollutants is reduced. The wafer in the machine can be effectively grabbed by utilizing the scalability of the base and the rotatability of the limiting piece, and the wafer is contacted with the mechanical claw instead of fingers in the whole manual wafer taking process, so that unnecessary manual contact with the wafer is avoided, and the interference of external pollution sources is reduced.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic top view of a manual sheet take-out gripper of the present utility model;

fig. 2 is a schematic diagram of a test structure of the manual sheet-taking gripper of the present utility model.

In fig. 1 and 2, 1-base, 11-transverse bar, 12-longitudinal bar, 2-stop, 21-contact surface, 3-support, 4-receiving space, 5-handle, 6-wafer, a-first direction, b-second direction, c-third direction.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the utility model, the outer diameter and the inner diameter correspond to the diameter size for a circular structure, the inner diameter refers to the diameter of an inscribed circle of the circular structure for a non-circular structure, and the outer diameter refers to the diameter of an circumscribed circle of the circular structure; the axial direction corresponds to the direction in which the axis is located for a cylindrical rod-like structure, and corresponds to the length direction of the rod-like structure for a non-cylindrical channel;

in the present utility model, the terms "upper", "lower", "top", "bottom", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings. These terms are only used to better describe the present utility model and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.

In this embodiment, the first direction a is parallel to the transverse bar 11, the second direction b is perpendicular to the first direction a, and the third direction c is perpendicular to the first direction a and the second direction b.

Referring to fig. 1 and 2, in this embodiment, a manual sheet taking gripper is provided, which includes: the device comprises a base 1, a limiting piece 2 and a supporting piece 3; the base 1 serves as a frame of the whole gripper, and is also used for adjusting the area of the accommodating space 4. The base 1 comprises a transverse rod 11 and two longitudinal rods 12, wherein the transverse rod 11 extends along a first direction a, the longitudinal rod 12 extends along a second direction b, and the two longitudinal rods 11 are arranged along the first direction a and are connected with the transverse rod 12. Specifically, the transverse rods 11 may be disposed in a telescopic manner along the first direction a, the longitudinal rods 12 may also be disposed in a telescopic manner along the second direction b, and the transverse rods 11 may drive the two longitudinal rods 12 to perform telescopic movement along the first direction a, so that the lengths of the transverse rods 11 and the longitudinal rods 12 may be adjusted according to the specific shape of the wafer 6 to adapt to the wafers 6 with different sizes; or alternatively; one of the transverse rod 11 and the longitudinal rod 12 may be set in a telescopic manner, and the other is set in a fixed length, and the fixed length is adapted to the diameter of the wafer 6, so that the length of the transverse rod 11 or the longitudinal rod 12 is only required to be adjusted once during use, thereby improving the efficiency of grabbing the wafer 6. It should be noted that the transverse rod 11 and the longitudinal rod 12 provide the telescopic function because the positions of the components contacting the back of the wafer 6 are inconsistent inside different machine stations, specifically, some contact points are in the middle and some are at the edges, so that when a person operates, the opening of the base 1 needs to be adjusted differently to adapt to various conditions, the wafer 6 in the machine station can be effectively grabbed by using the scalability of the base 1, fingers are replaced to contact the wafer 6 in the whole manual wafer taking process, unnecessary manual contact of the wafer is avoided, and the interference of external pollution sources is reduced. The longitudinal rods 12 are perpendicular to two sides of the transverse rods 11 in the same direction, so that the base 1 is U-shaped in projection along the third direction c.

In an alternative embodiment, the transverse rods 11 and the longitudinal rods 12 may be any structure having a telescopic function, for adjusting the area of the accommodating space 4 for accommodating the wafer. The transverse rod 11 and the longitudinal rod 12 may be mechanical telescopic rods, which are provided with a fixed part and a movable part, the movable part is provided with an inner part torque, the fixed part is provided with an outer part torque, specifically, when the two parts are contacted together, the fixed part applies a force to the movable part through the torque, and the movable part adjusts the position of the movable part according to the direction of the applied force so as to realize the telescopic purpose; the transverse rod 11 and the longitudinal rod 12 may be electric telescopic rods, and the telescopic hollow cylindrical rods formed by rolling metal strips or plastic sheets are characterized in that the metal strips or plastic sheets are pre-shaped into elastic curled layers with memory functions and smaller than the outer diameter of the rod body, so that the self-tightening function is achieved, the curled layers always have elastic potential energy for applying pressure to the telescopic rods to convert electric energy into mechanical energy, or the transverse rod 11 and the longitudinal rod 12 may also be hydraulic telescopic rods, and redundant description is omitted.

Referring to fig. 1, in this embodiment, four limiting members 2 are provided, two ends of each longitudinal rod 12 are respectively connected with a limiting member 2, and four containing spaces 4 for containing wafers 6 are formed between the four limiting members 2 in an encircling manner, and the sizes of the containing spaces 4 are affected by the positions of the limiting members 2, as shown in fig. 1, in this embodiment, four limiting members 2 are arranged in four corners, then the projection of the containing spaces 4 along the third direction c is square, because the shape of the wafers 6 is circular, the center of the square containing spaces 4 is consistent with the circle center of the wafers 6, so as to improve the stability of grabbing the wafers 6. The contact surface 21 is used for being attached to the edge of the wafer 6, the limiting part 2 is provided with the contact surface 21, the projection of the contact surface 21 along the third direction c is arc-shaped, alternatively, the contact surface 21 faces to the center of the projection of the base 1 along the third direction c in a normal state, and the contact surface 21 with radian can be attached to the edge of the wafer 6 with radian more due to the fact that the shape of the wafer 6 is circular, so that the stability of grabbing the wafer 6 is improved. Each limiting piece 2 is rotatably arranged on the longitudinal rod 12, and the rotation central axis of the limiting piece 2 is perpendicular to the first direction a and the second direction b. The rotation angle of the limiting member 2 is located in a set range, the set range can be adjusted adaptively according to working conditions, in this embodiment, the set range of the limiting member 2 in an initial state is ±5 degrees, and the initial state is a state that the contact surfaces 21 of the limiting members 2 are located in the same cylindrical surface as shown in fig. 1. The setting of the setting range can enable the base 1 to be attached to the edge of the wafer 6 under different opening and closing sizes, and meanwhile, the contact surface 21 can be enabled to always face the wafer 6, so that the side surface or the back surface of the limiting piece 2 is prevented from being contacted with the wafer 6 due to overlarge rotation amplitude of the limiting piece 2, and the invisible risk of scratching the wafer 6 is avoided. The wafer 6 in the machine table can be effectively grabbed by utilizing the rotatability of the limiting piece 2, and the wafer 6 is contacted with the whole manual wafer taking process by replacing fingers through the limiting piece 2, so that unnecessary manual contact with the wafer is avoided, and the interference of external pollution sources is reduced.

In an alternative embodiment, the limiting member 2 is connected to the longitudinal rod 12 through a limiting shaft, the limiting shaft has a limiting position with a rotation angle, specifically, the limiting shaft is a movable shaft, and has a first connecting seat and a second connecting seat, and the limiting shaft passes through a limiting hole of the second connecting seat and a limiting shaft connecting hole of the first connecting seat to limit and fix the relative positions of the second connecting seat and the first connecting seat, which is not described in detail herein.

Referring to fig. 1 and 2, the supporting member 3 is configured to support the wafer 6 in the accommodating space, the supporting member 3 is disposed on each of the longitudinal rods 12, and at least one supporting member 3 is disposed on each of the longitudinal rods 12. When the accommodating space 4 accommodates the wafer 6, the supporting member 3 faces the wafer 6, so as to prevent the base 1 from directly contacting with the wafer 6, and prevent the base 1 made of metal or plastic from scratching the wafer 6.

It should be noted that, at least two supporting members 3 are arranged on each of the longitudinal rods 12 at intervals along the second direction b, each supporting member 3 is disposed on the same side of the longitudinal rod 12 along the third direction c, so as to prevent the base 1 from directly contacting the wafer 6, and when the number of supporting members 3 is greater than four, each supporting member 3 is disposed on the longitudinal rod 12 at intervals symmetrically.

In an alternative embodiment, the material of the limiting member 2 and the supporting member 3 may be elastic material, such as teflon plastic or rubber, because the limiting member 2 and the supporting member 3 are in direct contact with the wafer 6, and the material of the wafer 6 contacting part inside the machine is usually teflon plastic or rubber, so that the object contacting the wafer 6 is changed from a finger or a glove to teflon plastic or rubber which is the same as or similar to the material of the wafer 6 contacting part inside the machine, so as to simulate the working environment inside the machine to a certain extent, and effectively avoid the intervention of external pollution. The whole manual wafer taking process is kept similar to the internal environment of a machine table as much as possible, interference of external pollution sources is reduced, meanwhile, teflon plastic or rubber has good deformation and flexibility, large deformation can be generated under the action of small external force, and the Teflon plastic or rubber can be restored after the external force is removed, so that when the Teflon plastic or rubber is contacted with a wafer 6, the limiting piece 2 and the supporting piece 3 deform, the outer surface gradually clings to the inner surface of the wafer 6 until the wafer is completely contacted, the probability of leaving scratches on the surface of the wafer 6 is reduced, and compared with the operation of directly taking the wafer 6 by personnel, the personnel can be in soft contact with the wafer 6 through the limiting piece 2 and the supporting piece 3 of elastic materials, the yield of the wafer 6 is improved, and the phenomenon that the wafer is scrapped due to the adhesion of pollutants is reduced.

In this embodiment, the manual sheet taking gripper further includes a handle 5, where the handle 5 is used for a person to hold and control the apparatus. The handle 5 is arranged on the transverse rod 11, the handle 5 and the longitudinal rod 12 are respectively arranged on two sides of the transverse rod 11 along the second direction b, the handle 5 can be a cylinder, and anti-skid patterns can be formed on the surface of the handle 5, so that the handle is convenient for a person to hold.

In summary, the manual sheet taking mechanical claw provided by the utility model has the following advantages: through the cooperation setting of base 1, locating part 2 and bearing 3, compare in the operation that the wafer 6 was got to personnel's direct hand, personnel can be through elastic material's locating part 2 and bearing 3 contact wafer 6, simulate the inside operational environment of board to a certain extent, can effectually avoid the intervention of external pollution, reduce the pollutant and adhere to the wafer and lead to the phenomenon of scrapping. The wafer 6 in the machine can be effectively grabbed by utilizing the scalability of the base 1 and the rotatability of the limiting piece 2, and the wafer 6 is contacted with the whole manual wafer taking process by the mechanical claw instead of fingers, so that unnecessary manual contact with the wafer is avoided, and the interference of external pollution sources is reduced.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. A manual sheet-taking gripper, comprising: the device comprises a base, a limiting piece and a supporting piece;

2. The manual sheet taking gripper according to claim 1, wherein: the limiting piece is rotatably arranged on the longitudinal rod, and the rotation central axis of the limiting piece is perpendicular to the first direction and the second direction.

3. The manual sheet taking gripper according to claim 1, wherein: the transverse rod is arranged in a telescopic way along the first direction; and/or; the longitudinal rod is telescopically arranged along the second direction.

4. The manual sheet taking gripper according to claim 1, wherein: the projection of the base along a third direction is U-shaped, and the third direction is perpendicular to the first direction and the second direction.

5. The manual sheet taking gripper according to claim 1, wherein: the limiting piece is provided with a contact surface, and the contact surface is used for being attached to the edge of the wafer.

6. The manual sheet taking gripper according to claim 5, wherein: the projection of the contact surface along a third direction is arc-shaped, and the third direction is perpendicular to the first direction and the second direction.

7. The manual sheet taking gripper according to claim 2, wherein: the rotation angle of the limiting piece is located in a set range.

8. The manual sheet taking gripper according to claim 1, wherein: the limiting piece is made of elastic materials; and/or the material of the bearing piece is elastic material.

9. The manual sheet taking gripper according to claim 1, wherein: at least two supporting pieces are arranged on each longitudinal rod at intervals along the second direction, each supporting piece is arranged on the same side of the longitudinal rod along a third direction, and the third direction is perpendicular to the first direction and the second direction.

10. The manual sheet taking gripper according to claim 1, wherein: the manual sheet taking mechanical claw further comprises a handle, the handle is arranged on the transverse rod, and the handle and the longitudinal rod are respectively arranged on two sides of the transverse rod along the second direction.