CN219998157U - Automatic single-chip wet photoresist remover - Google Patents

Abstract

The utility model discloses an automatic single-chip wet photoresist remover, which comprises a device body, wherein the device body comprises a mounting table, a protective cover, a cleaning station, a mechanical arm station and a centering station, wherein the cleaning station, the mechanical arm station and the centering station are all arranged on the mounting table, the cleaning station is positioned at the left end of the mechanical arm station, the centering station is positioned at the right end of the mechanical arm station, and the protective cover is arranged at the top of the mounting table and is positioned above the cleaning station, the mechanical arm station and the centering station; the cleaning station comprises a tank body, a liquid spraying rocker arm, an ultrasonic nozzle, a vacuum chuck and a nitrogen rocker arm, wherein the liquid spraying rocker arm is positioned on the left side of the tank body, the ultrasonic nozzle is installed on the liquid spraying rocker arm, the nitrogen rocker arm is positioned on the right side of the tank body, the vacuum chuck is installed at the top of the tank body, and two groups of wafer buckles distributed in an annular equidistant mode are arranged on the outer side of the vacuum chuck. The device can effectively remove the photoresist on the wafer, has high photoresist removing efficiency and comprehensive cleaning, and can improve the working efficiency of workers.

Description

Automatic single-chip wet photoresist remover

Technical Field

The utility model relates to the technical field of semiconductor chip manufacturing, in particular to an automatic single-chip wet photoresist remover.

Background

The photoresist stripping process is an indispensable process flow in the semiconductor industry, and the purpose of photoresist stripping is to remove photoresist rapidly and effectively without affecting the underlying materials of each layer. The existing photoresist removing equipment has the disadvantages of lag technology, huge volume, waste of cleaning agent and incomplete cleaning, and uneven spraying in the cleaning process can damage other parts.

The existing wafer photoresist remover has the following defects:

the existing photoresist remover has low photoresist removing efficiency and comprehensively insufficient photoresist removing for wafers, and the photoresist remover also needs to be reworked for multiple times, so that the working efficiency of workers is further influenced.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides an automatic single-chip wet photoresist remover, which solves the problems that the photoresist removing efficiency is low and the photoresist removing comprehensiveness is insufficient when the traditional photoresist remover is used for wafers, and the photoresist removing is needed to be reworked for multiple times, so that the working efficiency of workers is further influenced.

(II) technical scheme

In order to achieve the above purpose, the utility model is realized by the following technical scheme: the automatic single-chip wet photoresist remover comprises a device body, wherein the device body comprises an installation table, a protective cover, a cleaning station, a mechanical arm station and a centering station, the cleaning station, the mechanical arm station and the centering station are all installed on the installation table, the cleaning station is positioned at the left end of the mechanical arm station, the centering station is positioned at the right end of the mechanical arm station, and the protective cover is installed at the top of the installation table and is positioned above the cleaning station, the mechanical arm station and the centering station;

preferably, the cleaning station comprises a tank body, a liquid spraying rocker arm, an ultrasonic nozzle, a vacuum chuck and a nitrogen rocker arm, wherein the liquid spraying rocker arm is positioned on the left side of the tank body, the ultrasonic nozzle is arranged on the liquid spraying rocker arm, the nitrogen rocker arm is positioned on the right side of the tank body, the vacuum chuck is arranged at the top of the tank body, and two groups of wafer buckles distributed in an annular equidistant mode are arranged on the outer side of the vacuum chuck.

Preferably, the mechanical arm station comprises a movable wafer mechanical arm and a wafer box, the wafer box is positioned at the front end of the movable wafer mechanical arm, a gripping ring is arranged at the gripping end of the movable wafer mechanical arm, and the gripping ring is of a circular ring structure.

Preferably, the centering station comprises a clamping block and a clamping cylinder, wherein the clamping block is provided with a group of clamping blocks and is symmetrically distributed, the clamping block is of an arc-shaped structure, and the clamping cylinder is arranged at the bottom of the clamping block.

(III) beneficial effects

The utility model provides an automatic single-chip wet photoresist remover. The beneficial effects are as follows:

this automatic monolithic wet process photoresist remover can carry out the photoresist stripping work to the wafer effectively, and to wafer photoresist stripping efficient, clearance is comprehensive, can improve staff's work efficiency, when using, the wafer can be fixed on vacuum chuck to the sucking disc adsorbs it, and the side is fixed in addition to the buckle, guarantees the fixed stability of wafer, can rotate the wafer during the clearance, thereby can combine water and gas to clear up the photoresist stripping work to the wafer.

Drawings

FIG. 1 is a schematic view of the overall structure of the present utility model;

FIG. 2 is a schematic view of the overall internal structure of the present utility model;

FIG. 3 is a schematic view of the cleaning station of the present utility model;

FIG. 4 is a schematic view of a robotic arm station of the present utility model;

FIG. 5 is a schematic view of the centering station of the present utility model.

In the figure, 1, a device body; 2. a mounting table; 3. a protective cover; 4. a cleaning station; 5. a robotic arm station; 6. a centering station; 7. a tank body; 8. a liquid spraying rocker arm; 9. an ultrasonic nozzle; 10. a vacuum chuck; 11. wafer clamping buckle; 12. a wafer mechanical arm is moved; 13. a grip ring; 14. a cassette; 15. a clamping block; 16. a clamping cylinder; 17. nitrogen rocker arm.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, the embodiment of the present utility model provides a technical solution: the automatic single-chip wet photoresist remover comprises a device body 1, wherein the device body 1 comprises a mounting table 2, a protective cover 3, a cleaning station 4, a mechanical arm station 5 and a centering station 6, the cleaning station 4, the mechanical arm station 5 and the centering station 6 are all arranged on the mounting table 2, the cleaning station 4 is positioned at the left end of the mechanical arm station 5, the centering station 6 is positioned at the right end of the mechanical arm station 5, and the protective cover 3 is arranged at the top of the mounting table 2 and is positioned above the cleaning station 4, the mechanical arm station 5 and the centering station 6;

the cleaning station 4 comprises a tank body 7, a liquid spraying rocker arm 8, an ultrasonic spray head 9, a vacuum chuck 10 and a nitrogen rocker arm 17, wherein the liquid spraying rocker arm 8 is positioned on the left side of the tank body 7, the ultrasonic spray head 9 is arranged on the liquid spraying rocker arm 8, the nitrogen rocker arm 17 is positioned on the right side of the tank body 7, the vacuum chuck 10 is arranged at the top of the tank body 7, two groups of wafer buckles 11 distributed in an annular equidistant mode are arranged on the outer side of the vacuum chuck 10, when a wafer is cleaned, the vacuum chuck 10 can absorb and fix the wafer, a worker buckles the wafer buckles 11 on the wafer, so that the wafer is locked and fixed, the worker starts a motor in the tank body 7, the motor 7 can drive the whole to rotate, the ultrasonic spray head 9 on the liquid spraying rocker arm 8 can spray water to clean the wafer, and the nitrogen 17 can spray gas to clean the wafer through the gas when the wafer rotates.

The mechanical arm station 5 comprises a movable wafer mechanical arm 12 and a wafer box 14, the wafer box 14 is located at the front end of the movable wafer mechanical arm 12, a gripping ring 13 is arranged at the gripping end of the movable wafer mechanical arm 12, the gripping ring 13 is of a ring-shaped structure, when the wafer cleaning device is used, a wafer can be prevented from being stored in the wafer box 14, a worker starts the movable wafer mechanical arm 12, and the movable wafer mechanical arm 12 takes out the wafer in the wafer box 14 through the gripping ring 13 so as to be conveyed to the vacuum chuck 10 for cleaning.

The centering station 6 comprises clamping blocks 15 and clamping cylinders 16, the clamping blocks 15 are arranged in a group and symmetrically distributed, the clamping blocks 15 are of an arc-shaped structure, the clamping cylinders 16 are arranged at the bottoms of the clamping blocks 15, when a cleaned wafer is centered, the wafer is placed between the clamping blocks 15 by moving the wafer mechanical arm 12, the clamping cylinders 16 are started by workers, the clamping cylinders 16 drive the clamping blocks 15 to clamp, and centering and clamping work is further carried out on the wafer.

Working principle: during operation, the wafer can be prevented from being stored in the wafer box 14, the worker starts the wafer moving mechanical arm 12, the wafer moving mechanical arm 12 takes out the wafer in the wafer box 14 through the gripping ring 13, and then the wafer is conveyed to the vacuum chuck 10 for cleaning, when the wafer is cleaned, the vacuum chuck 10 can absorb and fix the wafer, the worker buckles the wafer buckle 11 on the wafer, and then locks and fixes the wafer, the worker starts the motor in the groove body 7, the motor 7 can drive the whole body to rotate, the wafer is further driven to rotate, when the wafer rotates, the ultrasonic spray head 9 on the spray arm 8 can spray water to clean the wafer, the nitrogen rocker arm 17 can spray gas, and therefore the wafer is cleaned through the gas, after the cleaning is completed, the wafer moving mechanical arm 12 can be used for carrying the wafer into the centering station 6, the wafer is put between the group of clamping blocks 15, the worker starts the clamping cylinder 16, and the clamping cylinder 16 drives the clamping blocks 15 to clamp the wafer, and further centering and clamping work is carried out.

The utility model relates to a device body, in particular to a device body; 2. a mounting table; 3. a protective cover; 4. a cleaning station; 5. a robotic arm station; 6. a centering station; 7. a tank body; 8. a liquid spraying rocker arm; 9. an ultrasonic nozzle; 10. a vacuum chuck; 11. wafer clamping buckle; 12. a wafer mechanical arm is moved; 13. a grip ring; 14. a cassette; 15. a clamping block; 16. a clamping cylinder; 17. the nitrogen rocker arm and the parts are universal standard parts or parts known by the skilled person, the structure and the principle of the nitrogen rocker arm and the parts are known by the skilled person through technical manuals or known through conventional experimental methods, the problems that the existing photoresist remover is low in photoresist removing efficiency and insufficient in photoresist removing comprehensiveness when used for removing the wafers, and the working efficiency of the working personnel is further influenced due to the fact that the photoresist remover needs to be reworked for multiple times are solved.

While the fundamental and principal features of the utility model and advantages of the utility model have been shown and described, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (1)

1. Automatic monolithic wet process photoresist remover, its characterized in that: the device comprises a device body (1), wherein the device body (1) comprises an installation table (2), a protective cover (3), a cleaning station (4), a mechanical arm station (5) and a centering station (6), the cleaning station (4), the mechanical arm station (5) and the centering station (6) are all installed on the installation table (2), the cleaning station (4) is located at the left end of the mechanical arm station (5), the centering station (6) is located at the right end of the mechanical arm station (5), and the protective cover (3) is installed at the top of the installation table (2) and located above the cleaning station (4), the mechanical arm station (5) and the centering station (6);

the cleaning station (4) comprises a tank body (7), a liquid spraying rocker arm (8), an ultrasonic nozzle (9), a vacuum chuck (10) and a nitrogen rocker arm (17), wherein the liquid spraying rocker arm (8) is positioned on the left side of the tank body (7), the ultrasonic nozzle (9) is installed on the liquid spraying rocker arm (8), the nitrogen rocker arm (17) is positioned on the right side of the tank body (7), the vacuum chuck (10) is installed at the top of the tank body (7), and two groups of wafer buckles (11) distributed in an annular equidistant mode are arranged on the outer side of the vacuum chuck (10);

the mechanical arm station (5) comprises a movable wafer mechanical arm (12) and a wafer box (14), wherein the wafer box (14) is positioned at the front end of the movable wafer mechanical arm (12), a gripping ring (13) is arranged at the gripping end of the movable wafer mechanical arm (12), and the gripping ring (13) is in a circular ring structure;

the centering station (6) comprises clamping blocks (15) and clamping air cylinders (16), wherein the clamping blocks (15) are arranged in a group and are symmetrically distributed, the clamping blocks (15) are of arc-shaped structures, and the clamping air cylinders (16) are arranged at the bottoms of the clamping blocks (15).