CN219987209U - Semiconductor chip burnishing device - Google Patents
Semiconductor chip burnishing device Download PDFInfo
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- CN219987209U CN219987209U CN202321056391.XU CN202321056391U CN219987209U CN 219987209 U CN219987209 U CN 219987209U CN 202321056391 U CN202321056391 U CN 202321056391U CN 219987209 U CN219987209 U CN 219987209U
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- semiconductor chip
- polishing
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 56
- 238000005498 polishing Methods 0.000 claims abstract description 75
- 239000007788 liquid Substances 0.000 claims abstract description 72
- 230000001681 protective effect Effects 0.000 claims abstract description 13
- 238000003756 stirring Methods 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 abstract description 11
- 230000000903 blocking effect Effects 0.000 abstract description 10
- 230000001276 controlling effect Effects 0.000 abstract description 5
- 230000000630 rising effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A semiconductor chip polishing apparatus includes a work box. Compared with the prior art, the utility model has the advantages that: the semiconductor chip is placed on the fixed sucker, the vacuum pump is utilized to vacuumize between the semiconductor chip and the fixed sucker, the semiconductor chip is fixed on the fixed sucker, the air cylinder pushes the protective box to move downwards, the polishing head is contacted with the semiconductor chip, the output shaft of the polishing motor drives the polishing head to rotate through the connecting plate to polish, the working efficiency is high, when polishing, the output shaft of the speed regulating motor can drive the cam to rotate, the fixed plate can drive the lifting rod to reciprocate up and down when the cam rotates, the lifting rod can drive the blocking plate to lift when rising, polishing liquid in the liquid storage tank enters the liquid filling pipeline to drop onto the semiconductor chip, when the lifting rod descends, the blocking plate can block the lower end of the liquid storage tank, the polishing liquid can not enter the liquid filling pipeline, the liquid filling amount of the polishing liquid is controllable by controlling the rotating speed of the speed regulating motor, and the working efficiency is further improved.
Description
Technical Field
The utility model relates to the technical field of semiconductor chip processing, in particular to a semiconductor chip polishing device.
Background
The semiconductor material is an electronic material which has semiconductor performance (the conductivity is between a conductor and an insulator, and the resistivity is about 1mΩ -cm to 1gΩ -cm), can be used for manufacturing semiconductor devices and integrated circuits, and is an important process after the semiconductor material is manufactured into chips.
The Chinese patent with the publication number of CN205310072U is searched, a semiconductor chip polishing machine is disclosed, the semiconductor chip polishing machine comprises a fixing frame, a motor is installed at the bottom of the fixing frame, an adjusting switch for controlling the rotating speed of the motor is installed on the fixing frame, an upper platen is arranged at the top of the fixing frame, a semicircular hole is formed in the upper platen, the motor is a hollow shaft motor, a hollow shaft is arranged on a motor transmission shaft, one end of the hollow shaft penetrates through the upper platen and is exposed at the top end of the upper platen, the other end of the hollow shaft penetrates through the fixing frame and is exposed at the bottom end of the fixing frame, a universal joint is arranged at the bottom of the hollow shaft, an exhaust pipe is arranged at the bottom end of the universal joint, and an air extractor is arranged at one end of the exhaust pipe.
The prior art scheme has the following defects: the polishing cloth is used for polishing manually, so that the working efficiency is low, and the quantity of polishing liquid is not accurate when the polishing liquid is added.
Disclosure of Invention
In view of the above-mentioned shortcomings in the prior art, the present utility model provides a semiconductor chip polishing apparatus to solve the problems set forth in the background art.
In order to achieve the above purpose, the technical scheme adopted by the utility model is that the semiconductor chip polishing device comprises a working box, wherein a fixed sucker is arranged on the upper side wall of the working box, a vacuum pump is arranged on the inner wall of the rear side of the working box, the fixed sucker is communicated with the vacuum pump through a vacuum pipeline, a stand column is fixedly connected to the rear side on the upper side wall of the working box, a supporting plate is fixedly connected to the upper side on the front side wall of the stand column, a cylinder is arranged on the supporting plate, a telescopic end of the cylinder penetrates through the supporting plate and is fixedly connected with a protective box, a polishing motor is arranged in the protective box, the output shaft end of the polishing motor penetrates through the lower side wall of the protective box and is fixedly connected with a connecting plate, the connecting plate is detachably connected with a polishing head through a connecting component, and a liquid filling component is arranged on the supporting plate.
As an improvement: the connecting assembly comprises two symmetrically distributed inserting grooves and an L-shaped containing groove communicated with the inserting grooves, wherein a limiting block is slidably connected in the L-shaped containing groove, a stirring plate is fixedly connected to one side wall of the limiting block, far away from the inserting grooves, of the stirring plate, and a reset spring is abutted between one side wall of the stirring plate, far away from the limiting block, and the L-shaped containing groove.
As an improvement: the utility model provides a liquid filling assembly, including seting up the logical groove in the backup pad, logical inslot sliding connection has the liquid storage pot, the lower extreme intercommunication of liquid storage pot has the liquid filling pipeline, the spout has been seted up on the last lateral wall of backup pad, sliding connection has the movable plate on the spout, install speed governing motor on the movable plate, speed governing motor's output axle head fixedly connected with cam, the upper end center sliding connection of liquid storage pot has the lifter, the lower extreme of lifter extends to the inside of liquid storage pot and fixedly connected with jam board, the upper end fixedly connected with of lifter and cam matched with fixed plate, the outside cover of lifter is equipped with the spring, the one end and the fixed plate fixed connection of spring and the upper end fixed connection of other end and liquid storage pot, the upper end of liquid storage pot is equipped with the liquid filling hole.
As an improvement: two symmetrically distributed inserting buckles are fixedly connected to the upper side wall of the polishing head.
As an improvement: the protruding end of the cam is provided with a rotating wheel.
As an improvement: the front side wall of the movable plate is fixedly connected with a linkage rod, the other end of the linkage rod is fixedly connected with the liquid storage tank, and the movable plate is provided with a locking bolt.
Compared with the prior art, the utility model has the following beneficial effects:
1. the semiconductor chip is placed on the fixed sucker, the vacuum pump is utilized to vacuumize between the semiconductor chip and the fixed sucker, the semiconductor chip is fixed on the fixed sucker, the air cylinder pushes the protective box to move downwards, the polishing head is contacted with the semiconductor chip, the output shaft of the polishing motor drives the polishing head to rotate through the connecting plate to polish, the working efficiency is high, when polishing, the output shaft of the speed regulating motor can drive the cam to rotate, the fixed plate can drive the lifting rod to reciprocate up and down when the cam rotates, the lifting rod can drive the blocking plate to lift when rising, polishing liquid in the liquid storage tank enters the liquid filling pipeline to drop onto the semiconductor chip, when the lifting rod descends, the blocking plate can block the lower end of the liquid storage tank, the polishing liquid can not enter the liquid filling pipeline, the liquid filling amount of the polishing liquid is controllable by controlling the rotating speed of the speed regulating motor, and the working efficiency is further improved.
Drawings
FIG. 1 is a schematic view showing the overall structure of a semiconductor chip polishing apparatus according to the present utility model;
FIG. 2 is a schematic view showing the internal structure of a working chamber of a semiconductor chip polishing apparatus according to the present utility model;
FIG. 3 is a schematic view showing a structure of a support plate of a semiconductor chip polishing apparatus according to the present utility model;
FIG. 4 is a schematic view showing a structure of a connection assembly of a semiconductor chip polishing apparatus according to the present utility model;
FIG. 5 is a schematic diagram showing a liquid filling assembly of a semiconductor chip polishing apparatus according to the present utility model;
FIG. 6 is a schematic view showing the internal structure of a liquid storage tank of a semiconductor chip polishing apparatus according to the present utility model;
as shown in the figure:
1. a working box; 1.1, fixing a sucker; 1.11, a vacuum pump; 1.12, vacuum pipes; 1.2, stand columns; 1.3, a supporting plate; 1.4, an air cylinder; 1.5, a protective box; 1.6, connecting the plates; 2. a connection assembly; 1.7, a polishing head; 3. a liquid filling component; 2.1, a plug-in groove; 2.2, L-shaped accommodating grooves; 2.3, limiting blocks; 2.4, poking the board; 2.5, a return spring; 3.1, through grooves; 3.2, a liquid storage tank; 3.3, filling liquid pipeline; 3.4, sliding grooves; 3.5, moving the plate; 3.51, a speed regulating motor; 3.52, cam; 3.21, lifting rod; 3.24, a blocking plate; 3.22, fixing plate; 3.23, springs; 3.25, filling liquid holes; 2.6, inserting and buckling; 3.53, rotating wheels; 3.6, a linkage rod; and 3.54, locking bolts.
Detailed Description
In order to make the technical means, the creation characteristics and the effect of achieving the object of the present utility model easy to understand, the present utility model is further described below with reference to the specific embodiments.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both sides", "one side", "the other side", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1 to 3, a semiconductor chip polishing device comprises a working box 1, a fixed suction cup 1.1 is installed on the upper side wall of the working box 1, a vacuum pump 1.11 is installed on the inner wall of the rear side of the working box 1, the fixed suction cup 1.1 is communicated with the vacuum pump 1.11 through a vacuum pipeline 1.12, a stand column 1.2 is fixedly connected to the rear side on the upper side wall of the working box 1, a supporting plate 1.3 is fixedly connected to the upper side on the front side wall of the stand column 1.2, a cylinder 1.4 is installed on the supporting plate 1.3, the telescopic end of the cylinder 1.4 passes through the supporting plate 1.3 and is fixedly connected with a protective box 1.5, a polishing motor is installed in the protective box 1.5, the output shaft end of the polishing motor passes through the lower side wall of the protective box 1.5 and is fixedly connected with a connecting plate 1.6, the connecting plate 1.6 is detachably connected with a polishing head 1.7 through a connecting component 2, a liquid filling component 3 is arranged on the supporting plate 1.3, a semiconductor chip is placed on the fixed suction cup 1.1, the semiconductor chip is pushed by the vacuum pump 1.11 to be manually polished, the semiconductor chip is driven by the vacuum pump 1.12, the labor intensity is reduced by the semiconductor chip is driven by the vacuum pump 1.1.12, and then the semiconductor chip is manually polished by the vacuum pump 1.1, and the semiconductor chip is driven by the vacuum pump 1.1.
Specifically, as shown in fig. 4, a semiconductor chip polishing device, the connecting component 2 includes two symmetrically distributed plug grooves 2.1 formed in the lower side wall of the connecting plate 1.6 and an L-shaped containing groove 2.2 communicated with the plug grooves 2.1, a limiting block 2.3 is slidably connected in the L-shaped containing groove 2.2, a stirring plate 2.4 is fixedly connected to one side wall of the limiting block 2.3 far away from the plug grooves 2.1, a reset spring 2.5 is abutted between one side wall of the stirring plate 2.4 far away from the limiting block 2.3 and the L-shaped containing groove 2.2, when the polishing head 1.7 needs to be replaced, the stirring plate 2.4 drives the limiting block 2.3 to retract into the L-shaped containing groove 2.2, the plug buckles 2.6 lose the limiting position of the limiting block 2.3, and can detach the polishing head 1.7, when the polishing head 1.7 is installed, the plug buckles 2.6 are inserted in the plug grooves 2.1.1, the limiting block 2.3 is pushed by the plug buckles 2.6 to be pushed by the plug buckles 2.4, and the polishing head 2.6 can be pushed by the tapered plug buckles, the plug buckles can not be pushed by the reducing springs 2.5, and the plug buckles can not be pushed by the plug buckles 2.2.6 to be completely and can be replaced in the plug 1.1.6, and the plug buckles can not be conveniently replaced by the plug 1.1.6, and the plug connector 1 is convenient to be replaced by the plug 1 1.6, and the plug connector 1, and the semiconductor chip is not convenient to be replaced by the plug 1.
Specifically, as shown in fig. 3, 5 and 6, the semiconductor chip polishing device comprises a liquid filling component 3, which comprises a through groove 3.1 arranged on a supporting plate 1.3, a liquid storage tank 3.2 is connected in a sliding manner in the through groove 3.1, the lower end of the liquid storage tank 3.2 is communicated with a liquid filling pipeline 3.3, a chute 3.4 is arranged on the upper side wall of the supporting plate 1.3, a movable plate 3.5 is connected in a sliding manner on the chute 3.4, a speed regulating motor 3.51 is arranged on the movable plate 3.5, the output shaft end of the speed regulating motor 3.51 is fixedly connected with a cam 3.52, the center of the upper end of the liquid storage tank 3.2 is connected with a lifting rod 3.21 in a sliding manner, the lower end of the lifting rod 3.21 extends into the liquid storage tank 3.2 and is fixedly connected with a blocking plate 3.24, the upper end of the lifting rod 3.21 is fixedly connected with a fixed plate 3.22 matched with the cam 3.52, the outer side of the lifting rod 3.21 is sleeved with a spring 3.23, one end of the spring 3.23 is fixedly connected with the fixed plate 3.22, the other end of the spring is fixedly connected with the upper end of the liquid storage tank 3.2, a liquid filling hole 3.25 is formed in the upper end of the liquid storage tank 3.2, an output shaft of the speed regulating motor 3.51 can drive the cam 3.52 to rotate, the fixed plate 3.22 can drive the lifting rod 3.21 to reciprocate up and down when the cam 3.52 rotates, the lifting rod 3.21 can drive the blocking plate 3.24 to lift when lifting, polishing liquid in the liquid storage tank 3.2 enters the liquid filling pipeline 3.3 and drops onto a semiconductor chip, the blocking plate 3.24 can block the lower end of the liquid storage tank 3.2 when the lifting rod 3.21 descends, the polishing liquid cannot enter the liquid filling pipeline 3.3, the liquid filling amount of the polishing liquid is controllable by controlling the rotating speed of the speed regulating motor 3.51, and the working efficiency is further improved.
Specifically, as shown in fig. 4, in the semiconductor chip polishing device, two symmetrically-distributed plugging buckles 2.6 are fixedly connected to the upper side wall of the polishing head 1.7, and the plugging buckles 2.6 are matched with the limiting blocks 2.3 to complete the disassembly and the assembly of the polishing head 1.7.
Specifically, as shown in fig. 5, in the semiconductor chip polishing device, the protruding end of the cam 3.52 is provided with the rotating wheel 3.53, so that friction between the cam 3.52 and the fixed plate 3.22 is reduced, and the service life is prolonged.
Specifically, as shown in fig. 5, in the semiconductor chip polishing device, a linkage rod 3.6 is fixedly connected to the front side wall of a moving plate 3.5, the other end of the linkage rod 3.6 is fixedly connected with a liquid storage tank 3.2, a locking bolt 3.54 is arranged on the moving plate 3.5, the moving plate 3.5 can be moved by unscrewing the locking bolt 3.54, and the liquid storage tank 3.2 can be synchronously moved under the driving of the linkage rod 3.6, so that the position of a liquid filling pipeline 3.3 can be adjusted, and the flexibility is higher.
In the utility model, firstly, a semiconductor chip is placed on a fixed sucker 1.1, a vacuum pump 1.11 is utilized to vacuumize between the semiconductor chip and the fixed sucker 1.1 through a vacuum pipeline 1.12, the semiconductor chip is fixed on the fixed sucker 1.1, then a cylinder 1.4 is started, the cylinder 1.4 pushes a protective box 1.5 to move downwards, a polishing head 1.7 is contacted with the semiconductor chip, an output shaft of a polishing motor drives the polishing head 1.7 to rotate through a connecting plate 1.6, the semiconductor chip is polished, during polishing, an output shaft of a speed regulating motor 3.51 can drive a cam 3.52 to rotate, a fixed plate 3.22 can drive a lifting rod 3.21 to reciprocate upwards and downwards when the cam 3.52 rotates, a blocking plate 3.24 can be driven to ascend when the lifting rod 3.21 ascends, polishing liquid in a liquid storage tank 3.2 enters a liquid filling pipeline 3.3 to drop onto the semiconductor chip, and when the lifting rod 3.24 descends, the blocking plate 3.2 can block the lower end of the liquid storage tank 3.2, the polishing solution can not enter the liquid filling pipeline 3.3, the liquid filling amount of the polishing solution can be controlled by controlling the rotating speed of the speed regulating motor 3.51, the working efficiency is further improved, the locking bolt 3.54 is screwed and loosened to move the movable plate 3.5, the liquid storage tank 3.2 can synchronously move under the driving of the linkage rod 3.6, the liquid filling pipeline 3.3 can be subjected to position adjustment, the flexibility is higher, when the polishing head 1.7 needs to be replaced, the stirring plate 2.4 is stirred to drive the limiting block 2.3 to retract into the L-shaped containing groove 2.2, the limiting block 2.3 is lost by the plugging buckle 2.6, the polishing head 1.7 can be detached, when the polishing head 1.7 is installed, the plugging buckle 2.6 on the polishing head 1.7 is inserted against the plugging groove 2.1, the limiting block 2.3 is pushed and gradually tapers like the L-shaped containing groove 2.2 and compresses the reset spring 2.5, when the plugging buckle 2.6 is completely inserted into the plugging groove 2.1, the limiting block 2.3 loses the pushing force, the polishing head 1.7 is mounted and dismounted very conveniently by fixing the inserting buckle 2.6 in the inserting groove 2.1 under the pushing of the reset spring 2.5, so that different polishing heads 1.7 can be replaced conveniently to adapt to different semiconductor chips, and the applicability is higher.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. Semiconductor chip burnishing device, including work box (1), its characterized in that: install fixed sucking disc (1.1) on the last lateral wall of work box (1), install vacuum pump (1.11) on the rear side inner wall of work box (1), be linked together through being equipped with vacuum pipe (1.12) between fixed sucking disc (1.1) and vacuum pump (1.11), rear side fixedly connected with stand (1.2) on the last lateral wall of work box (1), upper side fixedly connected with backup pad (1.3) on the preceding lateral wall of stand (1.2), install cylinder (1.4) on backup pad (1.3), the flexible end of cylinder (1.4) passes backup pad (1.3) and fixedly connected with protective housing (1.5), install polishing motor in protective housing (1.5), polishing motor's output axle head passes the lower lateral wall of protective housing (1.5) and fixedly connected with (1.6), connecting plate (1.6) can dismantle through being equipped with coupling assembling (2) and be connected with polishing head (1.7), be equipped with connecting plate (3) on backup pad (3).
2. The semiconductor chip polishing apparatus according to claim 1, wherein: the connecting assembly (2) comprises two symmetrically distributed inserting grooves (2.1) formed in the lower side wall of the connecting plate (1.6) and L-shaped containing grooves (2.2) communicated with the inserting grooves (2.1), limiting blocks (2.3) are slidably connected in the L-shaped containing grooves (2.2), stirring plates (2.4) are fixedly connected to one side wall, away from the inserting grooves (2.1), of the limiting blocks (2.3), and reset springs (2.5) are abutted between one side wall, away from the limiting blocks (2.3), of the stirring plates (2.4) and the L-shaped containing grooves (2.2).
3. The semiconductor chip polishing apparatus according to claim 1, wherein: the utility model provides a liquid filling assembly (3), is including seting up logical groove (3.1) on backup pad (1.3), logical inslot (3.1) sliding connection has liquid storage pot (3.2), the lower extreme intercommunication of liquid storage pot (3.2) has liquid filling pipeline (3.3), spout (3.4) have been seted up on the upper side wall of backup pad (1.3), sliding connection has movable plate (3.5) on spout (3.4), install speed motor (3.51) on movable plate (3.5), the output axle head fixedly connected with cam (3.52) of speed motor (3.51), the upper end center sliding connection of liquid storage pot (3.2) has lifter (3.21), the lower extreme of lifter (3.21) extends to the inside of liquid storage pot (3.2) and fixedly connected with jam board (3.24), the upper end fixedly connected with and cam (3.52) matched with fixed plate (3.22) on fixed plate (3.2), the other end fixed plate (3.23) is filled with liquid storage pot (3.2), other end (3.23) and fixed plate (3.23) are equipped with on the fixed plate (3.23).
4. A semiconductor chip polishing apparatus according to claim 2, wherein: two symmetrically distributed inserting buckles (2.6) are fixedly connected to the upper side wall of the polishing head (1.7).
5. A semiconductor chip polishing apparatus according to claim 3, wherein: the protruding end of the cam (3.52) is provided with a rotating wheel (3.53).
6. A semiconductor chip polishing apparatus according to claim 3, wherein: the front side wall of the moving plate (3.5) is fixedly connected with a linkage rod (3.6), the other end of the linkage rod (3.6) is fixedly connected with the liquid storage tank (3.2), and the moving plate (3.5) is provided with a locking bolt (3.54).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321056391.XU CN219987209U (en) | 2023-05-06 | 2023-05-06 | Semiconductor chip burnishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321056391.XU CN219987209U (en) | 2023-05-06 | 2023-05-06 | Semiconductor chip burnishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219987209U true CN219987209U (en) | 2023-11-10 |
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ID=88605492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321056391.XU Active CN219987209U (en) | 2023-05-06 | 2023-05-06 | Semiconductor chip burnishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219987209U (en) |
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2023
- 2023-05-06 CN CN202321056391.XU patent/CN219987209U/en active Active
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