CN219982263U - Shock-absorbing insole - Google Patents
Shock-absorbing insole Download PDFInfo
- Publication number
- CN219982263U CN219982263U CN202321605583.1U CN202321605583U CN219982263U CN 219982263 U CN219982263 U CN 219982263U CN 202321605583 U CN202321605583 U CN 202321605583U CN 219982263 U CN219982263 U CN 219982263U
- Authority
- CN
- China
- Prior art keywords
- pad
- vesicles
- insole
- layer
- buffer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 230000035939 shock Effects 0.000 claims abstract description 10
- 239000013013 elastic material Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 238000004880 explosion Methods 0.000 abstract description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 230000008093 supporting effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 208000017667 Chronic Disease Diseases 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 206010073713 Musculoskeletal injury Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
Abstract
The utility model relates to the field of insoles, in particular to a shock absorption insole which comprises an insole main body, a bottom cushion and a buffer layer. The buffer layer comprises a layer pad, vesicles and communicating pipes, wherein a plurality of vesicles are arranged on the layer pad, the vesicles are communicated through the communicating pipes, and liquid is filled in the vesicles and the communicating pipes. When the buffer layer is assembled on the bottom pad, the vesicle is placed in the connecting hole of the bottom pad, the bottom pad is placed in the mounting groove on the bottom surface of the insole main body, and the buffer layer is arranged between the bottom pad and the insole main body. When the shoe pad is used, the shoe pad is placed in the shoe, the front sole and the rear sole of the foot can sequentially apply pressure to the shoe pad main body in the walking process of people, the pressure can be sequentially transmitted to a plurality of vesicles at the moment, the vesicles are extruded, liquid in the vesicles in the process circulates among the vesicles through the communicating pipe to buffer and unload force, the risk of treading explosion caused by overlarge stress of the vesicles is reduced on one hand, and a buffer effect can be achieved in the treading process of the sole, so that the vibration of the foot of people during walking is reduced.
Description
Technical Field
The utility model relates to the field of insoles, in particular to a shock-absorbing insole.
Background
Along with the rapid development of society, the life rhythm of people is faster and faster, and the working intensity is increased, so that the time for training the body is shorter and shorter, and various chronic diseases are easy to be caused due to accumulation of the life cycle. The impact force of the foot and the ground can reach 3 to 8 times of the weight when people walk or exercise, the musculoskeletal injury of the foot is easily caused by long-time walking, and how to reduce the foot impact during walking is the direction of people. People often place the shoe-pad inside shoes and between people's foot and sole, and its effect is in order to increase the travelling comfort of people's foot when trampling, along with people's quality of life's continuous improvement, people also have higher and higher shock attenuation requirement to shoes and shoe-pad.
The prior insoles have poor elasticity, poor damping capacity and poor buffering and supporting effects when in use, and cannot meet the daily demands of people.
Disclosure of Invention
Aiming at the defects of the background technology, the utility model provides a shock absorption insole.
The utility model adopts the following technical scheme:
a shock absorbing insole, comprising:
the insole comprises an insole body, wherein an installation groove is formed in the bottom surface of the insole body, and the insole body is made of flexible materials;
the bottom pad is provided with a plurality of connecting holes in a penetrating mode, and is made of elastic materials;
the buffer layer comprises a layer pad, vesicles and communicating pipes, wherein the layer pad is provided with a plurality of vesicles, the vesicles are communicated through the communicating pipes, liquid is filled in the vesicles and the communicating pipes, and the layer pad, the vesicles and the communicating pipes are made of elastic materials;
when the buffer layer is assembled on the bottom pad, the vesicle is placed in the connecting hole, the layer pad and the communicating pipe are covered on the bottom pad, the bottom pad is placed in the mounting groove, and the buffer layer is arranged between the bottom pad and the insole main body.
As a further improvement, the base pad is provided with a connecting groove, and when the buffer layer is assembled on the base pad, the communicating pipe is arranged in the connecting groove after the vesicle is arranged in the connecting hole.
As a further improvement, the vesicle and the liquid filled in the communicating pipe are oil.
As a further improvement, the base pad has a hardness greater than the insole body, the layer pad, the vesicles, and the communicating tubes.
As can be seen from the above description of the structure of the present utility model, compared with the prior art, the present utility model has the following advantages: when the shoe pad is used, the shoe pad is placed in the shoe, the front sole and the rear sole of the foot can sequentially apply pressure to the shoe pad main body in the walking process of people, the pressure can be sequentially transmitted to a plurality of vesicles at the moment, the vesicles are extruded, liquid in the vesicles in the process circulates among the vesicles through the communicating pipe to buffer and unload force, the risk of treading explosion caused by overlarge stress of the vesicles is reduced on one hand, and a buffer effect can be achieved in the treading process of the sole, so that the vibration of the foot of people during walking is reduced.
Drawings
Fig. 1 is a schematic perspective view of the present utility model.
Fig. 2 is a schematic perspective view of another view of the present utility model.
Fig. 3 is a schematic perspective view of the insole body.
Fig. 4 is a schematic perspective view of a base pad.
Fig. 5 is a schematic perspective view of a buffer layer.
FIG. 6 is a schematic perspective view of the cushion layer assembled to the base pad.
FIG. 7 is a schematic perspective view of another view of the buffer layer and the base pad.
Detailed Description
Specific embodiments of the present utility model will be described below with reference to the accompanying drawings.
As shown in fig. 1 and 2, a shock-absorbing insole includes an insole body 1, a base 2, and a cushioning layer 3.
As shown in fig. 4, 5, 6 and 7, the base pad 2 is perforated with a plurality of connecting holes 21, the buffer layer 3 comprises a layer pad 31, vesicles 32 and a communicating pipe 33, the layer pad 31 is provided with a plurality of vesicles 32, the vesicles 32 are communicated through the communicating pipe 33, and the vesicles 32 and the communicating pipe 33 are filled with liquid. After the buffer layer 3 is assembled on the bottom pad 2, the vesicle 32 is placed in the connecting hole 21, the layer pad 31 and the communicating pipe 33 are covered on the bottom pad 2, wherein the layer pad 31 and the bottom pad 2 are adhered and fixed by adhesive such as glue, and the connecting hole 21 inner wall is utilized to limit the side wall of the vesicle 32, so that the connection stability between the bottom pad 2 and the vesicle 32 can be enhanced, and the risk of deflection and rotation of the vesicle 32 in the use process is reduced. And the arrangement of the connecting hole 21 can play a yielding role on the expansion deformation of the vesicle 32 in the subsequent use process, so as to avoid rupture caused by overlarge pressure on the upper surface and the lower surface of the vesicle 32.
As shown in fig. 1, 3 and 7, the bottom surface of the insole body 1 is provided with a mounting groove 11, and after the base cushion 2 is placed in the mounting groove 11, the buffer layer 3 is arranged between the base cushion 2 and the insole body 1. When the shoe pad is used, the shoe pad is placed in the shoe, pressure can be sequentially applied to the shoe pad main body 1 by the front sole and the rear sole of the foot in the walking process of people, the pressure can be sequentially transmitted to the plurality of vesicles 32 at the moment, the vesicles 32 are extruded, liquid in the vesicles 32 in the process circulates among the plurality of vesicles 32 through the communicating pipe 33 to buffer and unload force, the risk of treading explosion caused by overlarge stress of the vesicles 32 is reduced on one hand, and a buffer effect can be achieved in the treading process of the sole, so that the vibration of the foot of people in walking is reduced. And the surface of the vesicle 32 can generate fluctuation in the process of liquid circulation, the fluctuation can also play a certain role in massaging feet, and meanwhile, the buffering and the deformation are finished through the outflow of liquid, so that the back shock cannot be generated.
In addition, as shown in fig. 4 and 5, the base pad 2 is provided with a connection groove 22, and when the buffer layer 3 is assembled to the base pad 2, the communicating tube 33 is placed in the connection groove 22 after the bubble 32 is placed in the connection hole 21. By utilizing the limiting effect of the inner wall of the connecting groove 22 on the communicating pipe 33, the connection stability of the communicating pipe 33 and the bottom pad 2 can be enhanced, and the risks of deviation and rotation of the communicating pipe 33 and the communicating pipe 33 in the using process are reduced. And the arrangement of the connecting groove 22 can play a yielding role for the expansion deformation of the communicating pipe 33 in the subsequent use process, so that the rupture caused by the overlarge pressure on the upper surface and the lower surface of the communicating pipe 33 is avoided. The liquid filled in the vesicle 32 and the communicating tube 33 is oil.
The hardness of the bottom pad 2 is larger than that of the insole main body 1, the layer pad 31, the vesicles 32 and the communicating pipes 33, in particular, the insole main body 1 is made of flexible materials, particularly can be made of sponge, so that the problems of sweat absorption, ventilation and shock absorption are solved, and the materials have stronger high elasticity; the bottom pad 2 is made of elastic material, and can be made of rubber, and the wear resistance and toughness of the rubber are very good, so that the rubber is very durable; the layer pad 31, the vesicle 32 and the communicating pipe 33 are made of elastic materials, specifically can be made of silica gel, have good flexibility and are not easy to break, and the bottom pad 2 has high hardness, can play a good supporting and limiting role on the insole main body 1, the layer pad 31, the vesicle 32 and the communicating pipe 33, and avoid the vesicle 32 from being stepped on and broken by being stepped on by stress in the using process, thereby ensuring the supporting and buffering roles of the vesicle 32.
In summary, when the shoe pad is used, the shoe pad is placed in the shoe, in the walking process of people, the front sole and the rear sole of feet can sequentially apply pressure to the shoe pad main body 1, at the moment, the pressure can be sequentially transmitted to the plurality of vesicles 32, the vesicles 32 are extruded, liquid in the vesicles 32 circulates among the plurality of vesicles 32 through the communicating pipe 33 to buffer and unload force in the process, on one hand, the risk of stepping explosion caused by overlarge stress of the vesicles 32 is reduced, on the other hand, a buffer effect can be achieved in the stepping process of the soles, and the vibration of the feet of people in the walking process is reduced.
The foregoing is merely illustrative of specific embodiments of the present utility model, but the design concept of the present utility model is not limited thereto, and any insubstantial modification of the present utility model by using the design concept shall fall within the scope of the present utility model.
Claims (4)
1. A shock absorbing insole, comprising:
the insole comprises an insole body, wherein an installation groove is formed in the bottom surface of the insole body, and the insole body is made of flexible materials;
the bottom pad is provided with a plurality of connecting holes in a penetrating mode, and is made of elastic materials;
the buffer layer comprises a layer pad, vesicles and communicating pipes, wherein the layer pad is provided with a plurality of vesicles, the vesicles are communicated through the communicating pipes, liquid is filled in the vesicles and the communicating pipes, and the layer pad, the vesicles and the communicating pipes are made of elastic materials;
when the buffer layer is assembled on the bottom pad, the vesicle is placed in the connecting hole, the layer pad and the communicating pipe are covered on the bottom pad, the bottom pad is placed in the mounting groove, and the buffer layer is arranged between the bottom pad and the insole main body.
2. A shock absorbing insole as claimed in claim 1, wherein: the connecting groove is formed in the base pad, and when the buffer layer is assembled on the base pad, the communicating pipe is placed in the connecting groove after the vesicle is placed in the connecting hole.
3. A shock absorbing insole as claimed in claim 1, wherein: the vesicle and the liquid filled in the communicating pipe are oil liquid.
4. A shock absorbing insole as claimed in claim 1, wherein: the hardness of the bottom pad is larger than that of the insole main body, the layer pad, the vesicle and the communicating pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321605583.1U CN219982263U (en) | 2023-06-25 | 2023-06-25 | Shock-absorbing insole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321605583.1U CN219982263U (en) | 2023-06-25 | 2023-06-25 | Shock-absorbing insole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219982263U true CN219982263U (en) | 2023-11-10 |
Family
ID=88613447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321605583.1U Active CN219982263U (en) | 2023-06-25 | 2023-06-25 | Shock-absorbing insole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219982263U (en) |
-
2023
- 2023-06-25 CN CN202321605583.1U patent/CN219982263U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |