CN219981327U - Moistureproof electronic circuit board - Google Patents
Moistureproof electronic circuit board Download PDFInfo
- Publication number
- CN219981327U CN219981327U CN202320992333.1U CN202320992333U CN219981327U CN 219981327 U CN219981327 U CN 219981327U CN 202320992333 U CN202320992333 U CN 202320992333U CN 219981327 U CN219981327 U CN 219981327U
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- China
- Prior art keywords
- circuit board
- heat
- moisture
- heat conduction
- board main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000010521 absorption reaction Methods 0.000 claims abstract description 19
- 239000000292 calcium oxide Substances 0.000 claims abstract description 18
- 235000012255 calcium oxide Nutrition 0.000 claims abstract description 18
- 239000002274 desiccant Substances 0.000 claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 210000001503 joint Anatomy 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000000741 silica gel Substances 0.000 claims description 16
- 229910002027 silica gel Inorganic materials 0.000 claims description 16
- 206010066054 Dysmorphism Diseases 0.000 claims description 6
- 238000003032 molecular docking Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 8
- 238000001035 drying Methods 0.000 abstract description 5
- 230000009471 action Effects 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
The utility model discloses a moistureproof electronic circuit board which comprises a circuit board main body, wherein a butt joint mechanism is uniformly arranged at the bottom end of the circuit board main body, a heat-conducting moistureproof box is arranged at the bottom end of the butt joint mechanism, and quicklime drying agents are uniformly filled in the heat-conducting moistureproof box. According to the circuit board main body, the special-shaped plug-in blocks are pinched, the special-shaped plug-in blocks have certain elasticity and can be compressed, the two sides of the special-shaped plug-in blocks are close to the middle, then the special-shaped plug-in blocks are inserted into the plug-in grooves, under the elastic action of the special-shaped plug-in blocks, the hooks on the two sides of the special-shaped plug-in blocks are clamped by the clamping barbs, so that the heat-conducting damp-proof box is arranged below the circuit board main body, quicklime drying agents are filled in the heat-conducting damp-proof box, and the heat-conducting damp-proof box is matched with the moisture absorption holes, so that the circuit board main body is dried and absorbed, the drying effect is achieved, and the protection of the circuit board main body is enhanced.
Description
Technical Field
The utility model relates to the technical field of electronic circuit boards, in particular to a moistureproof electronic circuit board.
Background
The electronic circuit board is also called a circuit board, and is provided with a ceramic circuit board, an alumina ceramic circuit board and the like, so that the circuit board can lead the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimizing the layout of electric appliances;
when the electronic circuit board is used, moisture gas in the air is accumulated for a long time to form water drops which can invade the electronic circuit board, so that the short circuit fault of the electronic circuit board can be caused, the service life of the circuit board can be influenced, and corresponding improvement is needed.
Disclosure of Invention
The utility model aims to provide a moistureproof electronic circuit board, which solves the problem that the existing electronic circuit board provided in the background art is poor in moistureproof effect during use.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a dampproofing type electronic circuit board, includes the circuit board main part, the bottom of circuit board main part evenly is provided with docking mechanism, and docking mechanism's bottom installs the dampproofing box of heat conduction, the inside of the dampproofing box of heat conduction evenly fills there is quick lime drier, evenly be provided with the moisture absorption hole on the dampproofing box of heat conduction, the conducting strip is all installed to the top of circuit board main part and the bottom of the dampproofing box of heat conduction, the heat conduction silica gel piece is evenly installed on the top of circuit board main part, the heat pipe is installed to the periphery of circuit board main part, the connecting block is all installed to the both sides of circuit board main part.
When the moisture-proof electronic circuit board adopting the technical scheme is used, the heat-conducting moisture-proof box is arranged on the circuit board main body through the butt joint mechanism, and quicklime drying agent filled in the heat-conducting moisture-proof box is used for carrying out moisture absorption and drying, so that the circuit board main body has newspaper dryness.
Preferably, the docking mechanism comprises a plugging groove, the plugging groove is arranged at the bottom end of the circuit board main body, clamping barbs are arranged at two sides of the interior of the plugging groove, a special-shaped plugging block is arranged in the interior of the plugging groove, and the bottom end of the special-shaped plugging block is connected with the top end of the heat conduction dampproof box.
Preferably, the special-shaped plug-in blocks are made of rubber materials, and both sides of the special-shaped plug-in blocks are hooked.
Preferably, the cross section of the moisture absorption hole is circular, and the inner diameter of the moisture absorption hole is smaller than the particle diameter of the quicklime drying agent.
Preferably, the section of the heat conduction silica gel sheet is square, and two groups of heat conduction silica gel sheets are arranged on the circuit board main body, and three groups of heat conduction silica gel sheets are arranged in each group.
Preferably, the heat conducting strips are distributed on the top end of the circuit board main body and the bottom end of the heat conducting moisture-proof box, the heat conducting strips on the top end of the circuit board main body are rectangular long strips, the heat conducting strips on the bottom end of the heat conducting moisture-proof box are rectangular panel-shaped, and the heat conducting strips are silver strips.
Preferably, the heat conducting pipe is arranged on the outer side of the circuit board main body in a surrounding mode, the heat conducting pipe is of a hollow structure, and a plurality of heat conducting holes are formed in the heat conducting pipe.
Compared with the prior art, the utility model has the beneficial effects that: the moistureproof electronic circuit board has good moistureproof effect and good heat dissipation and conduction effect;
the special-shaped plug blocks are pinched to be compressed, so that the two sides of the special-shaped plug blocks are close to each other towards the middle, then the special-shaped plug blocks are inserted into the plug grooves, under the elastic action of the special-shaped plug blocks, hooks on the two sides of the special-shaped plug blocks are clamped by the clamping barbs so as to install the heat-conducting dampproof box below the circuit board main body, quicklime drying agents are filled in the heat-conducting dampproof box, and the heat-conducting dampproof box is matched with the moisture absorption holes so as to dry and absorb moisture to achieve the drying effect of the circuit board main body, so that protection of the circuit board main body is enhanced, and the quicklime drying agents in the heat-conducting dampproof box are replaced in the later period through the reverse operation so as to ensure the high efficiency of moisture absorption and drying;
the circuit board is characterized in that the circuit board body is uniformly adhered with a plurality of groups of heat-conducting silica gel sheets, so that heat in the circuit board body is conducted out through the heat-conducting silica gel sheets and the circuit board body, and corresponding heat-conducting sheets are arranged on the circuit board body so as to conduct further heat, so that heat is prevented from being accumulated on the circuit board body, heat on the circuit board body is conducted onto the heat-conducting tubes through the heat-conducting tubes, the heat is conducted into the heat-conducting tubes through the heat-conducting holes on the heat-conducting tubes, the effect of further heat dissipation is achieved, the protection of the circuit board body is enhanced, and the service life of the circuit board body is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a front view of the present utility model;
FIG. 2 is a schematic top view of the present utility model;
FIG. 3 is a schematic view of the structure of FIG. 1A according to the present utility model;
FIG. 4 is a schematic side view of the present utility model;
fig. 5 is a schematic perspective view of a special-shaped plug block according to the present utility model.
Reference numerals in the drawings illustrate: 1. a circuit board main body; 2. a docking mechanism; 201. a plug-in groove; 202. the clamping barbs; 203. a special-shaped plug-in block; 3. a heat-conducting moisture-proof box; 4. quicklime drying agent; 5. a moisture absorption hole; 6. a heat conductive sheet; 7. a thermally conductive silicone sheet; 8. a heat conduction pipe; 9. and (5) connecting a block.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by one of ordinary skill in the art without inventive faculty, are intended to be within the scope of the present utility model, based on the embodiments of the present utility model.
Referring to fig. 1-5, an embodiment of the present utility model is provided: a moistureproof electronic circuit board comprises a circuit board main body 1, wherein a butt joint mechanism 2 is uniformly arranged at the bottom end of the circuit board main body 1;
the docking mechanism 2 comprises a plugging groove 201, wherein the plugging groove 201 is arranged at the bottom end of the circuit board main body 1, clamping barbs 202 are arranged on two sides of the interior of the plugging groove 201, a special-shaped plugging block 203 is arranged in the interior of the plugging groove 201, and the bottom end of the special-shaped plugging block 203 is connected with the top end of the heat-conducting dampproof box 3;
the special-shaped plug-in block 203 is made of rubber, and both sides of the special-shaped plug-in block 203 are hook-shaped;
specifically, as shown in fig. 1, 3 and 5, when in use, the special-shaped plug-in block 203 is inserted into the plug-in groove 201, and the special-shaped plug-in block 203 can be clamped in the plug-in groove 201 by the mutual matching of the clamping barb 202 and the special-shaped plug-in block 203, so that the heat conduction dampproof box 3 is arranged below the circuit board main body 1, the quicklime desiccant 4 is filled in the heat conduction dampproof box 3, and the circuit board main body 1 is subjected to moisture absorption drying by the quicklime desiccant 4;
the bottom end of the butt joint mechanism 2 is provided with a heat-conducting and moisture-proof box 3, the inside of the heat-conducting and moisture-proof box 3 is uniformly filled with quicklime drying agents 4, and moisture absorption holes 5 are uniformly formed in the heat-conducting and moisture-proof box 3;
the section of the moisture absorption hole 5 is circular, and the inner diameter of the moisture absorption hole 5 is smaller than the particle diameter of the quicklime desiccant 4;
specifically, as shown in fig. 1, when in use, the heat-conducting moisture-proof box 3 is filled with quicklime drying agent 4, and the air on the circuit board main body 1 and the periphery of the circuit board main body 1 can be comprehensively dried and absorbed through a plurality of groups of moisture absorption holes 5, so that the moisture-proof effect is achieved, the protection of the circuit board main body 1 is enhanced, the inner diameter of the moisture absorption holes 5 is smaller than the particle diameter of the quicklime drying agent 4, and the quicklime drying agent 4 can be prevented from falling from the moisture absorption holes 5;
the top end of the circuit board main body 1 and the bottom end of the heat-conducting moistureproof box 3 are both provided with heat-conducting sheets 6;
the heat conducting strips 6 are distributed on the top end of the circuit board main body 1 and the bottom end of the heat conducting and moisture-proof box 3, the heat conducting strips 6 on the top end of the circuit board main body 1 are rectangular long strips, the heat conducting strips 6 on the bottom end of the heat conducting and moisture-proof box 3 are rectangular panel-shaped, and the heat conducting strips 6 are silver sheets;
specifically, as shown in fig. 1 and 2, when in use, the heat conducting sheet 6 is silver sheet, so that the circuit board main body 1 can conduct heat efficiently, and the corresponding heat conducting sheet 6 is also arranged on the heat conducting moisture-proof box 3, so as to ensure the overall high efficiency of heat conduction;
the top end of the circuit board main body 1 is uniformly provided with a heat-conducting silica gel sheet 7;
the section of the heat conduction silica gel sheet 7 is square, two groups of heat conduction silica gel sheets 7 are arranged on the circuit board main body 1, and three groups of heat conduction silica gel sheets are arranged in each group;
specifically, as shown in fig. 2, when in use, multiple groups of heat-conducting silica gel sheets 7 are adhered to the circuit board main body 1, so that the circuit board main body 1 can conduct heat further, heat is prevented from being accumulated on the circuit board main body 1, and protection of the circuit board main body 1 is enhanced;
the periphery of the circuit board main body 1 is provided with a heat conduction pipe 8, and both sides of the circuit board main body 1 are provided with connecting blocks 9;
the heat conducting pipe 8 surrounds the outer side of the circuit board main body 1, the heat conducting pipe 8 is of a hollow structure, and a plurality of heat conducting holes are formed in the heat conducting pipe 8;
specifically, as shown in fig. 1 and 2, when in use, the heat conducting pipe 8 surrounds the periphery of the circuit board main body 1, so that when in use, the circuit board main body 1 can conduct heat comprehensively, and the heat on the circuit board main body 1 can be led out by matching with the design of the heat conducting holes and the hollow structure on the heat conducting pipe 8, so as to strengthen the protection of the circuit board main body 1.
Working principle: when the circuit board is used, firstly, a plurality of groups of heat-conducting silica gel sheets 7 are adhered to the circuit board main body 1, so that the circuit board main body 1 can conduct heat rapidly through the circuit board main body 1 when in use, and the corresponding heat-conducting sheets 6 are matched, so that the circuit board main body 1 is further radiated, heat accumulation on the circuit board main body 1 is effectively prevented, and the periphery of the circuit board main body 1 is provided with the heat-conducting tubes 8, so that the heat at the periphery of the circuit board main body 1 can be led into the heat-conducting tubes 8 and discharged through the heat-conducting tubes 8, and then, the heat can be radiated efficiently and comprehensively, and the service life of the circuit board main body 1 is prolonged;
secondly, pinch the dysmorphism inserted block 203 for dysmorphism inserted block 203 draws close in the middle, inserts the jack groove 201 with dysmorphism inserted block 203 afterwards, cooperates joint barb 202 to block dysmorphism inserted block 203, then can install on circuit board main part 1 with heat conduction dampproofing box 3, further through quick lime drier 4 of packing in the dampproofing box 3 of heat conduction, cooperation moisture absorption hole 5, thereby can adsorb the moisture on the circuit board main part 1, reach dry dampproofing effect, help strengthening the protection to circuit board main part 1.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The apparatus embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present utility model without undue burden.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (7)
1. The utility model provides a moisture-proof electronic circuit board, includes circuit board main part (1), its characterized in that: the circuit board comprises a circuit board body (1), wherein a butt joint mechanism (2) is uniformly arranged at the bottom end of the circuit board body (1), a heat conduction moisture-proof box (3) is arranged at the bottom end of the butt joint mechanism (2), quicklime drying agents (4) are uniformly filled in the heat conduction moisture-proof box (3), moisture absorption holes (5) are uniformly formed in the heat conduction moisture-proof box (3), heat conduction fins (6) are uniformly arranged at the top end of the circuit board body (1) and the bottom end of the heat conduction moisture-proof box (3), heat conduction silica gel sheets (7) are uniformly arranged at the top end of the circuit board body (1), heat conduction pipes (8) are arranged at the periphery of the circuit board body (1), and connecting blocks (9) are respectively arranged at two sides of the circuit board body (1).
2. The moisture-resistant electronic circuit board of claim 1, wherein: docking mechanism (2) are including jack groove (201), and jack groove (201) set up in the bottom of circuit board main part (1), joint barb (202) are all installed to the inside both sides of jack groove (201), internally mounted of jack groove (201) has dysmorphism grafting piece (203), and the bottom of dysmorphism grafting piece (203) is connected with the top of heat conduction dampproofing box (3).
3. A moisture-resistant electronic circuit board according to claim 2, wherein: the special-shaped plug-in block (203) is made of rubber, and both sides of the special-shaped plug-in block (203) are hook-shaped.
4. The moisture-resistant electronic circuit board of claim 1, wherein: the section of the moisture absorption hole (5) is circular, and the inner diameter of the moisture absorption hole (5) is smaller than the particle diameter of the quicklime drying agent (4).
5. The moisture-resistant electronic circuit board of claim 1, wherein: the section of the heat conduction silica gel sheet (7) is square, two groups of heat conduction silica gel sheets (7) are arranged on the circuit board main body (1), and three groups of heat conduction silica gel sheets are arranged in each group.
6. The moisture-resistant electronic circuit board of claim 1, wherein: the heat conducting strip (6) is distributed on the top end of the circuit board main body (1) and the bottom end of the heat conducting damp-proof box (3), the heat conducting strip (6) on the top end of the circuit board main body (1) is rectangular and strip-shaped, the heat conducting strip (6) on the bottom end of the heat conducting damp-proof box (3) is rectangular panel-shaped, and the heat conducting strip (6) is silver flake.
7. The moisture-resistant electronic circuit board of claim 1, wherein: the heat conduction pipe (8) surrounds the outside at circuit board main part (1), heat conduction pipe (8) are hollow structure, be provided with a plurality of heat conduction holes on heat conduction pipe (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320992333.1U CN219981327U (en) | 2023-04-27 | 2023-04-27 | Moistureproof electronic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320992333.1U CN219981327U (en) | 2023-04-27 | 2023-04-27 | Moistureproof electronic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219981327U true CN219981327U (en) | 2023-11-07 |
Family
ID=88578550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320992333.1U Active CN219981327U (en) | 2023-04-27 | 2023-04-27 | Moistureproof electronic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219981327U (en) |
-
2023
- 2023-04-27 CN CN202320992333.1U patent/CN219981327U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |