CN219977109U - Semiconductor material crystallization furnace - Google Patents
Semiconductor material crystallization furnace Download PDFInfo
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- CN219977109U CN219977109U CN202222325564.5U CN202222325564U CN219977109U CN 219977109 U CN219977109 U CN 219977109U CN 202222325564 U CN202222325564 U CN 202222325564U CN 219977109 U CN219977109 U CN 219977109U
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- crystallization
- crystallization furnace
- cooling
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- 238000002425 crystallisation Methods 0.000 title claims abstract description 97
- 230000008025 crystallization Effects 0.000 title claims abstract description 97
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 239000000463 material Substances 0.000 title claims abstract description 36
- 238000001816 cooling Methods 0.000 claims abstract description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000000498 cooling water Substances 0.000 claims abstract description 18
- 238000010030 laminating Methods 0.000 claims description 9
- 241000883990 Flabellum Species 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 230000032683 aging Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 8
- 239000013078 crystal Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000012047 saturated solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model relates to the technical field of semiconductors and discloses a semiconductor material crystallization furnace, which comprises a crystallization furnace body, wherein the outer wall of the crystallization furnace body is fixedly connected with a cooling water pump, the output shaft of the cooling water pump is fixedly connected with a cooling pipeline, one end of the cooling pipeline is fixedly connected with a water storage tank, the bottom of the water storage tank is fixedly connected with a water delivery pipe, the outer wall of the water delivery pipe is fixedly connected with a cooling water pump, the outer wall of the cooling pipeline is fixedly connected with the crystallization furnace body, and the top of the water storage tank is fixedly provided with a water inlet pipeline. This semiconductor material crystallization stove can effectually utilize hydrologic cycle to cool off the crystallization stove body, avoids crystallization stove work end temperature too high, saves crystallization stove cooling time, and the timely cooling of each part of guarantee equipment reduces ageing, and semiconductor material crystallization propelling movement that will carry out heat treatment goes out the crystallization stove body that can be convenient for carry out follow-up centre gripping and remove this crystallization, increase safety in utilization.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a semiconductor material crystallization furnace.
Background
Semiconductor materials are a class of electronic materials that have semiconducting properties (conductivity between conductors and insulators, and resistivity in the range of about 1mΩ -cm to about 1gΩ -cm) and can be used to fabricate semiconductor devices and integrated circuits, and crystallization means the process of precipitation of solutes in crystalline form due to supersaturation of the solution as a result of reduced solubility of the hot saturated solution after cooling.
The traditional semiconductor material crystallization furnace has simple structure and single function, after long-time heating treatment, the temperature in the furnace is too high, the cooling time is longer, the time of working is prolonged again, the device is easy to age, the pot clamp is used for clamping crystalline materials when the device is put and taken, the hand scalding is easy to be caused, and the use safety is reduced.
To solve the above-mentioned problem, the patent with publication number CN214485716U discloses a semiconductor material crystallization furnace, which proposes that "the raw material is placed in the placement cavity 16, the raw material is heated by the heating chamber housing 5, and then the first knob 11 is rotated, so that the first knob 11 drives the rotation shaft 12 and the gear 13 to rotate, the first stop block 14 moves, and is separated from the bottom of the water inlet pipe 3, so that the cooling water of the water tank 2 enters the cooling cavity 15 to cool the placement cavity 16", and although the placement cavity 16 can be cooled rapidly, a large amount of water vapor is easily generated due to water contact at high temperature, so that the parts in the crystallization furnace are easy to age and corrode, and the use stability is poor.
In view of the above, intensive studies have been conducted to solve the above problems.
Disclosure of Invention
(one) solving the technical problems
The present utility model is directed to a crystallization furnace for semiconductor materials, which solves the above-mentioned problems.
(II) technical scheme
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor material crystallization furnace, includes the crystallization furnace body, the outer wall fixedly connected with cooling water pump of crystallization furnace body, cooling water pump's output shaft fixedly connected with cooling pipeline, cooling water pipeline's one end fixedly connected with storage water tank, the bottom fixedly connected with raceway of storage water tank, the outer wall fixedly connected with cooling water pump of raceway, cooling water pipeline's outer wall fixedly connected with crystallization furnace body, the top fixedly mounted of storage water tank has the inlet channel. The crystallization furnace body can be effectively cooled by water circulation, so that the working end temperature of the crystallization furnace is prevented from being too high, the cooling time of the crystallization furnace is saved, the timely cooling of all parts of the equipment is ensured, and the aging is reduced.
Preferably, the outer wall fixedly connected with nut of crystallization furnace body, the inner wall threaded connection of nut has the nut, the outer wall threaded connection of nut has bellows, the inner wall fixedly connected with micro-motor of bellows, micro-motor's output shaft passes through the axle connector fixedly connected with flabellum, the vent has been seted up to the inner wall of bellows fixedly. Can effectually carry out air exchange for cooling rate promotes cooling pipeline's cooling effect, increases availability factor.
Preferably, the inner wall fixedly connected with spout of crystallization stove body, the inner wall sliding connection of spout has the slider, the outer wall fixedly connected with chassis of slider, the outer wall fixedly connected with furnace gate of chassis. The semiconductor material crystal that will carry out heat treatment can be convenient push out the crystallization stove body, follow-up centre gripping removes this crystallization of being convenient for, increase safety in utilization.
Preferably, the outer wall of the furnace door is fixedly connected with a loop bar, the outer wall of the loop bar is slidably connected with a sleeve, and the outer wall of the sleeve is fixedly connected with a crystallization furnace body. Can support the furnace door, increase the stability of furnace door, ensure the safety in utilization.
Preferably, the telescopic top fixedly connected with fixture block structure, the fixture block structure is including the connecting block, the inner wall fixedly connected with concave type fixture block of connecting block, the inner wall laminating of concave type fixture block is connected with protruding type fixture block, the outer wall fixedly connected with spring of protruding type fixture block, the outer wall laminating of concave type fixture block is connected with the spread box, the spacing groove has been seted up to the inner wall of spread box, the inner wall laminating of spacing groove is connected with the spring, the outer wall fixedly connected with furnace gate of connecting block, the outer wall fixedly connected with sleeve of spread box. The stability of the semiconductor material crystallization furnace in the working process is guaranteed, the firm connection and the nature of the furnace door and the crystallization furnace body are improved, the use method is simple and convenient, and the practicability is improved.
Preferably, the top of the crystallization furnace body is fixedly connected with two identical clamping block structures, and the bottoms of the clamping block structures are fixedly arranged on two sides of the crystallization furnace body. The semiconductor crystal material can be conveniently taken and placed, and the way of taking and placing is prevented from being blocked.
Preferably, the outer wall fixedly connected with stopper of bellows, fixedly connected with cooling pipeline in the crack of crystallization stove body and bellows. The cooling pipeline is prevented from being aged and damaged due to the fact that the bellows presses the cooling pipeline, and the use safety is improved.
(III) beneficial effects
Compared with the prior art, the utility model provides a semiconductor material crystallization furnace, which comprises the following components
The beneficial effects are that:
1. according to the semiconductor material crystallization furnace, through the crystallization furnace body, the cooling water pump, the cooling pipeline, the water storage tank, the water delivery pipe and the water inlet pipeline, the crystallization furnace body can be effectively cooled by utilizing water circulation, so that the phenomenon that the working end temperature of the crystallization furnace is too high is avoided, the cooling time of the crystallization furnace is saved, the timely cooling of all parts of equipment is ensured, and the aging is reduced;
2. according to the semiconductor material crystallization furnace, through the crystallization furnace body, the screw cap, the screw nut, the bellows, the miniature motor, the fan blades and the ventilation openings, air exchange can be effectively performed, the cooling speed is increased, the cooling effect of the cooling pipeline is improved, and the use efficiency is increased;
3. this semiconductor material crystallization furnace, crystallization furnace body, spout, slider, chassis, furnace gate that pass through set up, can be convenient carry out crystallization furnace body with the semiconductor material crystallization propelling movement that carries out heat treatment, be convenient for carry out follow-up centre gripping and remove this crystallization, increase safety in utilization.
Drawings
FIG. 1 is a side cross-sectional view of the present utility model;
FIG. 2 is a view showing the connection between the bellows and the crystallization furnace body;
FIG. 3 is a view showing the connection between the furnace door and the crystallization furnace body;
fig. 4 is a block diagram of the present utility model.
In the figure: 1. a crystallization furnace body; 2. a cooling pipe; 3. a screw cap; 4. a cooling water pump; 5. a water storage tank; 6. a water inlet pipe; 7. a furnace door; 8. a clamping block structure; 81. a connecting block; 82. a concave clamping block; 83. a convex clamping block; 84. a spring; 85. a connection box; 86. a limit groove; 9. a wind box; 10. a vent; 11. a limiting block; 12. a micro motor; 13. a fan blade; 14. a nut; 15. a slide block; 16. a chute; 17. a chassis; 18. a loop bar; 19. a sleeve; 20. a water pipe.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
The preferred embodiment of the crystallization furnace for semiconductor materials provided by the present utility model is shown in fig. 1 to 4: the utility model provides a semiconductor material crystallization furnace, includes crystallization furnace body 1, the outer wall fixedly connected with cooling water pump 4 of crystallization furnace body 1, the output shaft fixedly connected with cooling pipe 2 of cooling water pump 4, the one end fixedly connected with storage water tank 5 of cooling pipe 2, the bottom fixedly connected with raceway 20 of storage water tank 5, the outer wall fixedly connected with cooling water pump 4 of raceway 20, the outer wall fixedly connected with crystallization furnace body 1 of cooling pipe 2, the top fixedly mounted of storage water tank 5 has inlet channel 6. The crystallization furnace body 1 can be effectively cooled by water circulation, so that overhigh working end temperature of the crystallization furnace is avoided, cooling time of the crystallization furnace is saved, timely cooling of all parts of equipment is ensured, and ageing is reduced.
In this embodiment, the outer wall fixedly connected with nut 3 of crystallization stove body 1, the inner wall threaded connection of nut 3 has nut 14, and the outer wall threaded connection of nut 14 has bellows 9, and the inner wall fixedly connected with micro-motor 12 of bellows 9, the output shaft of micro-motor 12 is through coupling fixedly connected with flabellum 13, and vent 10 has been seted up to the inner wall of bellows 9 is fixed. Can effectually carry out air exchange for cooling rate promotes cooling tube 2's cooling effect, increases availability factor.
Example 2
On the basis of embodiment 1, a preferred embodiment of the crystallization furnace for semiconductor materials provided by the present utility model is shown in fig. 1 to 4: the inner wall fixedly connected with spout 16 of crystallization furnace body 1, the inner wall sliding connection of spout 16 has slider 15, and the outer wall fixedly connected with chassis 17 of slider 15, the outer wall fixedly connected with furnace gate 7 of chassis 17. The semiconductor material crystals subjected to heat treatment can be conveniently pushed out of the crystallization furnace body 1, so that the crystals can be conveniently clamped and moved subsequently, and the use safety is improved.
In this embodiment, the outer wall of the furnace door 7 is fixedly connected with a loop bar 18, the outer wall of the loop bar 18 is slidably connected with a sleeve 19, and the outer wall of the sleeve 19 is fixedly connected with the crystallization furnace body 1. The furnace door 7 can be supported, the stability of the furnace door 7 is increased, and the use safety is ensured.
Further, the top fixedly connected with fixture block structure 8 of sleeve 19, fixture block structure 8 is including connecting block 81, the inner wall fixedly connected with concave type fixture block 82 of connecting block 81, the inner wall laminating of concave type fixture block 82 is connected with protruding type fixture block 83, the outer wall fixedly connected with spring 84 of protruding type fixture block 83, the outer wall laminating of concave type fixture block 82 is connected with junction box 85, spacing groove 86 has been seted up to the inner wall of junction box 85, the inner wall laminating of spacing groove 86 is connected with spring 84, the outer wall fixedly connected with furnace gate 7 of connecting block 81, the outer wall fixedly connected with sleeve 19 of junction box 85. The stability of the semiconductor material crystallization furnace during operation is guaranteed, the firm connection and the connection of the furnace door 7 and the crystallization furnace body 1 are improved, the use method is simple and convenient, and the practicability is improved.
Furthermore, the top of the crystallization furnace body 1 is fixedly connected with the same two clamping block structures 8, and the bottoms of the clamping block structures 8 are fixedly arranged at two sides of the crystallization furnace body 1. The semiconductor crystal material can be conveniently taken and placed, and the way of taking and placing is prevented from being blocked.
In addition, the outer wall of the bellows 9 is fixedly connected with a limiting block 11, and a cooling pipeline 2 is fixedly connected in a crack between the crystallization furnace body 1 and the bellows 9. The cooling pipeline 2 is prevented from being aged and damaged due to the fact that the bellows 9 presses the cooling pipeline 2, and use safety is improved.
The electrical components are all connected with an external main controller and 220V mains supply, and the main controller can be conventional known equipment for controlling a computer and the like.
When the device is used, after the crystallization furnace body 1 carries out crystallization heating treatment on a semiconductor material, the furnace door 7 is pulled outwards, the convex clamping block 83 is extruded to enable the spring 84 to be compressed inwards, the connecting block 81 drives the concave clamping block 82 to slide outwards to be out of the connecting box 85, the sliding block 15 slides in the sliding groove 16, the chassis 17 slowly moves outwards of the crystallization furnace body 1, the crystallization material placed on the chassis 17 can be taken out by using a pot clamp, the cooling water pump 4 is started to enable water flow to be pumped into the cooling pipeline 2 from the water pipe 20 to be transmitted, the transmitted water flow finally falls into the water storage tank 5, the water inlet pipeline 6 can be used for supplementing a water source in the water storage tank 5, the miniature motor 12 is started to enable the fan blade 13 to rotate, and air in a crack between the bellows 9 and the crystallization furnace body 1 is replaced.
In conclusion, the crystallization furnace for semiconductor materials can effectively cool the crystallization furnace body 1 by utilizing water circulation, so that the working end temperature of the crystallization furnace is prevented from being too high, the cooling time of the crystallization furnace is saved, the timely cooling of each part of equipment is ensured, the aging is reduced, the semiconductor material crystals subjected to heat treatment can be conveniently pushed out of the crystallization furnace body 1, the subsequent clamping and moving of the crystals are facilitated, and the use safety is improved.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A crystallization furnace for semiconductor materials, comprising a crystallization furnace body (1), characterized in that: the crystallization furnace is characterized in that the outer wall of the crystallization furnace body (1) is fixedly connected with a cooling water pump (4), the output shaft of the cooling water pump (4) is fixedly connected with a cooling pipeline (2), one end of the cooling pipeline (2) is fixedly connected with a water storage tank (5), the bottom of the water storage tank (5) is fixedly connected with a water pipe (20), the outer wall of the water pipe (20) is fixedly connected with the cooling water pump (4), the outer wall of the cooling pipeline (2) is fixedly connected with the crystallization furnace body (1), and the top of the water storage tank (5) is fixedly provided with a water inlet pipeline (6).
2. A crystallization furnace for semiconductor material according to claim 1, wherein: the outer wall fixedly connected with nut (3) of crystallization stove body (1), the inner wall threaded connection of nut (3) has nut (14), the outer wall threaded connection of nut (14) has bellows (9), the inner wall fixedly connected with micro motor (12) of bellows (9), the output shaft of micro motor (12) passes through coupling fixedly connected with flabellum (13), vent (10) have been seted up to the inner wall of bellows (9) is fixed.
3. A crystallization furnace for semiconductor material according to claim 1, wherein: the inner wall fixedly connected with spout (16) of crystallization stove body (1), the inner wall sliding connection of spout (16) has slider (15), the outer wall fixedly connected with chassis (17) of slider (15), the outer wall fixedly connected with furnace gate (7) of chassis (17).
4. A crystallization furnace for semiconductor material according to claim 3, wherein: the outer wall of furnace gate (7) fixedly connected with loop bar (18), the outer wall sliding connection of loop bar (18) has sleeve (19), the outer wall fixedly connected with crystallization furnace body (1) of sleeve (19).
5. A crystallization furnace for semiconductor material according to claim 4, wherein: the utility model provides a clamping block structure (8) is fixedly connected with at top of sleeve (19), clamping block structure (8) is including connecting block (81), the inner wall fixedly connected with concave type fixture block (82) of connecting block (81), the inner wall laminating of concave type fixture block (82) is connected with protruding type fixture block (83), the outer wall fixedly connected with spring (84) of protruding type fixture block (83), the outer wall laminating of concave type fixture block (82) is connected with junction box (85), spacing groove (86) have been seted up to the inner wall of junction box (85), the inner wall laminating of spacing groove (86) is connected with spring (84), the outer wall fixedly connected with furnace gate (7) of connecting block (81), the outer wall fixedly connected with sleeve (19) of junction box (85).
6. A crystallization furnace for semiconductor material according to claim 1, wherein: the top of the crystallization furnace body (1) is fixedly connected with two identical clamping block structures (8), and the bottoms of the clamping block structures (8) are fixedly arranged on two sides of the crystallization furnace body (1).
7. A crystallization furnace for semiconductor material according to claim 2, wherein: the outer wall of the bellows (9) is fixedly connected with a limiting block (11), and a cooling pipeline (2) is fixedly connected in a crack of the crystallization furnace body (1) and the bellows (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222325564.5U CN219977109U (en) | 2022-08-31 | 2022-08-31 | Semiconductor material crystallization furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222325564.5U CN219977109U (en) | 2022-08-31 | 2022-08-31 | Semiconductor material crystallization furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219977109U true CN219977109U (en) | 2023-11-07 |
Family
ID=88583107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222325564.5U Active CN219977109U (en) | 2022-08-31 | 2022-08-31 | Semiconductor material crystallization furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219977109U (en) |
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2022
- 2022-08-31 CN CN202222325564.5U patent/CN219977109U/en active Active
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