CN210089468U

CN210089468U - Liquid-cooled temperature-uniforming plate heat-radiating device

Info

Publication number: CN210089468U
Application number: CN201920952802.0U
Authority: CN
Inventors: 张文前; 刘洪兵; 姚福仁; 刘佰鑫; 卜宝刚
Original assignee: Xinbaitu Technology (huizhou) Co Ltd
Current assignee: Xinbaitu Technology (huizhou) Co Ltd
Priority date: 2019-06-24
Filing date: 2019-06-24
Publication date: 2020-02-18
Anticipated expiration: 2029-06-24

Abstract

The utility model discloses a liquid cooling type uniform temperature plate heat dissipation device in the technical field of heat dissipation equipment, which comprises a uniform temperature plate body, a heat conduction plate, a temperature sensor, a heat conduction copper column, water injection pipes, a heat dissipation sheet, a booster pump, a water tank, a heat conduction rod and a heat dissipation fan, wherein the top of the uniform temperature plate body is connected with the heat conduction plate, the temperature sensor is arranged at the joint of the bottom of the heat conduction plate and the uniform temperature plate body, the heat conduction copper column is arranged in the middle of the top of the heat conduction plate, two water injection pipes are arranged at two sides of the top of the heat conduction plate, the heat dissipation sheet is arranged at the outer walls of the water injection pipes and the heat conduction copper column, the booster pump is arranged at the top of the two water injection pipes, the water tank is arranged at the top of the booster pump, the heat conduction rod is arranged at, the temperature change time is reduced while the temperature is freely controlled, the temperature change speed is increased, and the economical and practical performance is high.

Description

Liquid-cooled temperature-uniforming plate heat-radiating device

Technical Field

The utility model relates to a heat dissipation equipment technical field specifically is a liquid cooling formula temperature-uniforming plate heat abstractor.

Background

Cavity vapor plate technology is similar in principle to heat pipes, but differs in the manner of conduction. The heat pipe is one-dimensional linear heat conduction, and the heat in the vapor chamber is conducted on a two-dimensional surface, so that the efficiency is higher.

Specifically, after absorbing the heat of the chip, the liquid at the bottom of the vacuum chamber evaporates and diffuses into the vacuum chamber, transfers the heat to the heat dissipation fins, and then condenses into liquid to return to the bottom. The evaporation and condensation process of the air conditioner similar to a refrigerator is quickly circulated in the vacuum cavity, and high heat dissipation efficiency is realized.

The automatic adjustment of the existing temperature equalizing plate heat dissipation device has poor reaction performance, long cooling process, and incapability of rapidly cooling, and more electric elements of the internal device, thus increasing the cost and having poor heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a liquid cooling formula temperature-uniforming plate heat abstractor to solve the poor problem of the radiating effect of the current temperature-uniforming plate heat abstractor who provides among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a liquid cooling formula temperature-uniforming plate heat abstractor, includes temperature-uniforming plate body, heat-conducting plate, temperature sensor, heat conduction copper post, water injection pipe, fin, booster pump, water tank, heat conduction pole and radiator fan, the top and the heat-conducting plate of temperature-uniforming plate body are connected, temperature sensor installs the junction in the bottom of heat-conducting plate and temperature-uniforming plate body, heat conduction copper post installs in the middle of the top of heat-conducting plate, two the top both sides at the heat-conducting plate are installed to the water injection pipe, the outer wall at water injection pipe and heat conduction copper post is installed to the fin, the booster pump is installed two the top of water injection pipe, the top at the booster pump is installed to the water tank, the top at heat conduction copper post is installed.

Preferably, two limiting plates are symmetrically arranged on the left side wall and the right side wall of the heat conducting plate, and limiting screw holes are formed in the limiting plates.

Preferably, the left side and the right side of the top of the heat conducting plate are respectively provided with a water inlet hole and a water drain hole, and the water inlet hole and the water drain hole are both connected with a water injection pipe.

Preferably, the water tank is provided with a temperature controller, and the temperature controller is connected with a temperature sensor, a booster pump and a cooling fan.

Preferably, open in the middle of the water tank has circular through-hole, the heat conduction pole runs through the through-hole, evenly open the louvre on the heat conduction pole, the top casing of water tank is the ring form copper, the water tank is the aluminum alloy box.

Compared with the prior art, the beneficial effects of the utility model are that: through the arrangement of the liquid-cooled temperature-equalizing plate heat dissipation device, the structural design is reasonable, the heat conduction plate is arranged at the top of the temperature-equalizing plate, the heat conduction plate is fixed through the limiting plates arranged at the left side and the right side, the screws penetrate through the limiting screw holes on the limiting plates to fix the limiting plates, the water injection pipe is connected with the heat conduction plate, the top end of the water injection pipe is connected with the water tank through the booster pump, purified water is injected into the water tank, a value is set for the temperature controller through an external control device, when the temperature sensor detects that the temperature of the temperature-equalizing plate body is higher than the set value, the detection information is transmitted to the temperature controller, the temperature controller controls the rotation of the heat dissipation fan, the booster pumps are controlled to be started simultaneously, the two booster pumps are started simultaneously, the circulation speed of the purified water is accelerated, the water in the heat conduction plate is enabled to circulate all, when the heat conduction copper post takes the heat to the middle part, dispel the heat through the fin, dispel the heat through louvre on the heat conduction pole with the heat when taking the top, radiator fan rotates and guides the heat that gives off to reduce thermal retention, the device simple structure, electrical component is few, and is with low costs, and the radiating rate is fast.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic top view of the heat-conducting plate of the present invention;

FIG. 3 is a schematic view of the bottom structure of the water tank of the present invention;

fig. 4 is a schematic diagram of the system structure of the present invention.

In the figure: 100 temperature-equalizing plate bodies, 200 heat-conducting plates, 201 water discharging holes, 202 water inlet holes, 210 temperature sensors, 220 limiting plates, 221 limiting screw holes, 230 heat-conducting copper columns, 240 water injection pipes, 250 radiating fins, 260 booster pumps, 270 water tanks, 280 heat-conducting rods, 281 radiating holes and 290 radiating fans.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model provides a following technical scheme: a liquid-cooled vapor chamber heat dissipation device, which is used to increase the heat dissipation rate of the vapor chamber and reduce the cost, as shown in fig. 1-3, and includes a vapor chamber body 100, a heat conduction plate 200, a temperature sensor 210, a heat conduction copper pillar 230, a water injection pipe 240, a heat sink 250, a booster pump 260, a water tank 270, a heat conduction rod 280, and a heat dissipation fan 290;

referring to fig. 1-3 again, the top of the vapor chamber body 100 is connected to the heat conductive plate 200, the temperature sensor 210 is installed at the connection between the bottom of the heat conductive plate 200 and the vapor chamber body 100, the heat conductive copper column 230 is installed in the middle of the top of the heat conductive plate 200, the two water injection pipes 240 are installed at both sides of the top of the heat conductive plate 200, the heat sink 250 is installed at the outer walls of the water injection pipes 240 and the heat conductive copper column 230, the booster pump 260 is installed at the top of the two water injection pipes 240, the water tank 270 is installed at the top of the booster pump 260, the heat conductive rod 280 is installed at the top of the heat conductive copper column 230, the heat dissipation fan 290 is installed at the top of the heat conductive rod 280, specifically, the connection between the vapor chamber and the heat conductive plate 200 is provided with a limiting groove, when the heat conductive plate 200 is connected to the vapor chamber, the heat conductive plate, so that the heat conducting plate 200 has no gap in the middle when the heat conducting plate body 100 is connected, the heat radiation performance of the heat conducting plate 200 to the heat conducting plate body 100 is improved, the heat conducting copper column 230 and the heat conducting plate 200 are connected through a screw, the material of the screw is copper, a copper plate is arranged between the heat conducting copper column 230 and the heat conducting plate 200, the copper plate is used for increasing the heat conducting area of the heat conducting copper column 230, the water injection pipe 240 is a copper pipe, the heat radiation performance of water in the water injection pipe 240 is improved, the water injection pipe 240 is clamped with the heat conducting plate 200 and the booster pump 260, sealing rings are sleeved between the water injection pipe 240 and the heat conducting plate 200 and the booster pump 260, the sealing performance of the joint of the heat conducting plate 200 and the booster pump 260 is improved, the heat radiation fin 250 is sleeved between the heat conducting copper column 230 and the water injection pipe 240, a collar is arranged at the joint, the outer wall of the collar is welded with the heat sink 250, the heat dissipation performance of the heat sink 250 to the heat conducting copper column 230 and the water injection pipe 240 is improved, the output end of the left booster pump 260 is connected with the water injection pipe 240, the input end water tank 270 of the booster pump 260 is connected, the input end of the right booster pump is connected with the water injection pipe 240, the output end water tank 270 of the booster pump 260 is connected, the working voltage of the booster pump 260 is 24v, the two booster pumps 260 are simultaneously started during working, and the running power of the booster pump 260 is automatically adjusted according to a temperature controller, so that the circulation speed of water is automatically adjusted, the heat conducting rod 280 and the heat conducting copper column 230 are integrally formed, the heat brought to the top by the heat conducting copper column 230 is dissipated through the heat conducting rod 280, the heat dissipation area is improved, the bottom end of the heat dissipating fan 290 is in threaded connection with the heat conducting, the air is driven to flow, thereby quickly guiding the heat to be discharged.

Referring to fig. 1 again, in order to fix the heat conducting plate 200 and achieve the effect of fixing the temperature equalizing plate body 100, two limiting plates 220 are symmetrically installed on the left and right side walls of the heat conducting plate 200, a limiting screw hole 221 is formed on the limiting plate 220, the limiting plate 220 and the heat conducting plate 200 are integrally formed, and the connection stability between the limiting plate 220 and the heat conducting plate 200 is increased.

Referring to fig. 2 again, in order to facilitate the connection, detachment and replacement between the heat conducting plate 200 and the water injection pipe 240, the left side and the right side of the top of the heat conducting plate 200 are respectively provided with a water inlet 202 and a water outlet 201, the water inlet 202 and the water outlet 201 are both connected with the water injection pipe 240, the water injection pipe 240 is clamped with the water inlet 202 and the water outlet 201, and the joints between the water injection pipe 240 and the water inlet 202 and the water outlet 201 are both provided with sealing rings, so that the sealing performance between the water inlet 202 and the water outlet 201 and the water injection pipe 240 is improved, and the water overflow is.

Referring to fig. 4 again, in order to facilitate the control of the temperature sensor 210, the booster pump 260, and the cooling fan 290, a temperature controller is installed on the water tank 270, the temperature controller is connected to the temperature sensor 210, the booster pump 260, and the cooling fan 290, and the temperature controller is a temperature controller, and the temperature controller is used for setting values for starting the booster pump 260 and the cooling fan 290, and controlling the working power of the booster pump 260, so as to control the speed of water circulation, and at the same time, controlling the rotation speed of the cooling fan 290, thereby achieving the purpose of controlling the flow rate of the guided air.

Referring to fig. 3 again, in order to facilitate the heat transfer of the heat conductive copper pillar 230 to the heat conductive rod 280 for rapid dispersion, a circular through hole is formed in the middle of the water tank 270, the heat conductive rod 280 penetrates through the through hole, heat dissipation holes 281 are uniformly formed in the heat conductive rod 280, the top shell of the water tank 270 is a circular copper plate, the water tank 270 is an aluminum alloy tank, after the heat conductive copper pillar 230 transfers the heat to the heat conductive rod 280, the heat conductive rod 280 transfers the heat to the heat dissipation holes 281, and the heat can be rapidly discharged through the heat dissipation holes 281, thereby improving the dispersion efficiency of the heat.

In the specific using process, the heat conducting plate 200 is arranged at the top of the temperature equalizing plate, the heat conducting plate 200 is fixed through the limiting plates 220 arranged at the left side and the right side, screws penetrate through the limiting screw holes 221 on the limiting plates 220 to fix the limiting plates 220, the water injection pipe 240 is connected with the heat conducting plate 200, the top end of the water injection pipe 240 is connected with the water tank 270 through the booster pump 260, purified water is injected into the water tank 270, a value is set for the temperature controller through an external control device, when the temperature sensor 210 detects that the temperature of the temperature equalizing plate body 100 is higher than the set value, the detection information is transmitted to the temperature controller, the temperature controller controls the rotation of the radiating fan 290 to simultaneously control the start of the booster pumps 260, the two booster pumps 260 are simultaneously started to accelerate the circulation speed of the purified water, so that the water in the heat conducting plate 200 is always circulated, unnecessary heat is transmitted to the heat conduction copper post 230 through the heat conduction plate 200, and when the heat conduction copper post 230 took the heat to the middle part, dispelled the heat through the fin 250, took the top time with the heat through the last louvre 281 of heat conduction pole 280 dispel the heat, radiator fan 290 rotated and guided the heat that gives off to reduce thermal retention.

While the invention has been described above with reference to certain embodiments, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the various embodiments disclosed herein can be used in any combination with one another, and the description of such combinations that is not exhaustive in this specification is merely for brevity and resource saving. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. A liquid cooling type uniform temperature plate heat dissipation device is characterized in that: including temperature-uniforming plate body (100), heat-conducting plate (200), temperature sensor (210), heat conduction copper post (230), water injection pipe (240), fin (250), booster pump (260), water tank (270), heat conduction pole (280) and radiator fan (290), the top and the heat-conducting plate (200) of temperature-uniforming plate body (100) are connected, the junction at the bottom and the temperature-uniforming plate body (100) of heat-conducting plate (200) is installed in temperature sensor (210), heat conduction copper post (230) are installed in the middle of the top of heat-conducting plate (200), two the top both sides at heat-conducting plate (200) are installed to water injection pipe (240), the outer wall at water injection pipe (240) and heat conduction copper post (230) is installed in fin (250), booster pump (260) are installed two the top of water injection pipe (240), the top at booster pump (260) is installed to water tank (270), the heat conducting rod (280) is arranged on the top of the heat conducting copper column (230), and the heat radiating fan (290) is arranged on the top of the heat conducting rod (280).

2. The liquid-cooled vapor panel heat sink of claim 1, wherein: two limiting plates (220) are symmetrically arranged on the left side wall and the right side wall of the heat conducting plate (200), and limiting screw holes (221) are formed in the limiting plates (220).

3. The liquid-cooled vapor panel heat sink of claim 1, wherein: the left side and the right side of the top of the heat conducting plate (200) are respectively provided with a water inlet hole (202) and a water drain hole (201), and the water inlet hole (202) and the water drain hole (201) are both connected with a water injection pipe (240).

4. The liquid-cooled vapor panel heat sink of claim 1, wherein: and a temperature controller is arranged on the water tank (270), and is connected with a temperature sensor (210), a booster pump (260) and a cooling fan (290).

5. The liquid-cooled vapor panel heat sink of claim 1, wherein: open in the middle of water tank (270) has circular through-hole, heat conduction pole (280) run through the through-hole, evenly open on heat conduction pole (280) has louvre (281), the top casing of water tank (270) is the ring form copper, water tank (270) is the aluminum alloy case.