CN219949408U - Special power belt for semiconductor equipment - Google Patents
Special power belt for semiconductor equipment Download PDFInfo
- Publication number
- CN219949408U CN219949408U CN202321508080.2U CN202321508080U CN219949408U CN 219949408 U CN219949408 U CN 219949408U CN 202321508080 U CN202321508080 U CN 202321508080U CN 219949408 U CN219949408 U CN 219949408U
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- power belt
- wave
- wave fiber
- semiconductor
- transmission power
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 230000005540 biological transmission Effects 0.000 claims abstract description 52
- 239000000835 fiber Substances 0.000 claims description 56
- 239000000178 monomer Substances 0.000 claims description 15
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 16
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
The utility model discloses a special power belt for semiconductor equipment, which belongs to the technical field of semiconductor conveying equipment, and comprises a transmission power belt, wherein five turning positions are arranged on the transmission power belt, a closed loop structure is formed through five turning positions, a first large driving roller, a second large driving roller, a first medium driven roller and a small driven roller are respectively arranged on the inner side surface of the transmission power belt and four turning positions of the transmission power belt, a large support frame is arranged on the outer side of the transmission power belt and the second medium driven roller at the other turning position of the transmission power belt, a driving assembly is arranged on one side of the large support frame, so that friction and collision between a conveying belt and a wafer can be reduced to the greatest extent, damage to a semiconductor working area can not be caused when the semiconductor is supported, damage to a semiconductor wafer in the manufacturing process can be reduced, and protection to the semiconductor is realized when the semiconductor is conveyed.
Description
Technical Field
The utility model relates to the technical field of semiconductor conveying equipment, in particular to a special power belt for semiconductor equipment.
Background
Semiconductor materials are a class of electronic materials that have semiconducting properties (conductivity between conductors and insulators, and resistivity in the range of about 1mΩ -cm to about 1gΩ -cm) and can be used to fabricate semiconductor devices and integrated circuits.
The semiconductor material process is required to be operated in a clean room, and operators need to replace clean clothes and clean shoes and blow dust through an air dust-removing room. The reason is that the semiconductor material is quite delicate and fragile, and any dust or improper touch or impact can damage the semiconductor material. Most semiconductor materials, such as solar panels, wafers, etc., are subjected to numerous procedures before packaging is completed and the position is moved continuously by a conveyor.
Based on the above, the present inventors found that:
when most conveying equipment carries out the transportation of semiconductor, the unavoidable production is touched with the semiconductor wafer surface, and in the transportation, conveying equipment and semiconductor wafer surface part occupy the great part of semiconductor wafer surface, and in the transportation, any friction and collision between conveyer belt and the wafer all probably destroys the wafer, and then influences the quality of semiconductor wafer when following the use.
Accordingly, the present utility model has been made in view of the above circumstances, and an object of the present utility model is to provide a power belt for a semiconductor device, which has a higher practical value.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems existing in the prior art, the utility model aims to provide a special power belt for semiconductor equipment, which can reduce friction and collision between a conveying belt and a wafer to the greatest extent, further can not cause any damage to a semiconductor working area when aiming at semiconductor support, and can reduce the damage of a semiconductor wafer in the process of manufacturing, thereby realizing the protection of the semiconductor during the transportation of the semiconductor.
2. Technical proposal
In order to solve the problems, the utility model adopts the following technical scheme.
The special power belt for the semiconductor equipment comprises a transmission power belt, wherein five turning positions are arranged on the transmission power belt, a closed loop structure is formed by five turning positions, a first large driving roller, a second large driving roller, a first medium driven roller and a small driven roller are respectively arranged on the inner side surface of the transmission power belt and at four turning positions of the transmission power belt, a second medium driven roller is arranged on the outer side surface of the transmission power belt and at the other turning position of the transmission power belt, a large supporting frame is jointly arranged on the outer sides of the first large driving roller and the second large driving roller, and a driving assembly is arranged on one side of the large supporting frame;
the transmission power belt comprises low-wave fiber lines and high-wave fiber lines, and the low-wave fiber lines and the high-wave fiber lines are mutually wound to form a compact surface.
Further, the low-wave fiber lines comprise a plurality of low-wave arc monomers, the high-wave fiber lines comprise a plurality of high-wave arc monomers, and the total number of the low-wave arc monomers is equal to the total number of the high-wave arc monomers.
Furthermore, the end parts of the low-wave fiber lines and the high-wave fiber lines, which are positioned in the same direction, are attached to each other, and connection points are fixed.
Further, the lowest point of the low-wave fiber line is close to the highest point of the high-wave fiber line, and the highest point of the low-wave fiber line is close to the lowest point of the high-wave fiber line.
Further, the upper part of the transmission power belt is mutually wound with the low-wave fiber lines and the high-wave fiber lines to form a triangular dividing surface.
Further, the driving assembly comprises a driving motor, the driving motor is fixed on the outer side of the large supporting frame, the output end of the driving motor is connected with a chain wheel and chain transmission structure through a coupling in a transmission mode, and two rotation centers of the chain wheel and chain transmission structure are fixedly connected with the first large driving roller and the second large driving roller respectively.
Further, the small driven roller has a smaller cross-sectional diameter than the first and second intermediate driven rollers.
3. Advantageous effects
Compared with the prior art, the utility model has the advantages that:
according to the scheme, in the semiconductor transportation process, the semiconductor is placed on the transmission power belt, when the transmission power belt is in contact with the semiconductor, the contact potential is distributed on the edge of the semiconductor crystal, at the moment, the contact area with the semiconductor wafer can be greatly reduced, meanwhile, as the edge of the semiconductor wafer usually comprises a narrow blank area, a circuit is not paved in the blank area, the blank area is an unused area, then, the transmission is formed by matching with a plurality of rollers through driving, the transportation of the semiconductor can be realized, in the transportation process, friction and collision between the conveying belt and the wafer can be reduced to the greatest extent, further, when the semiconductor is supported, no damage is caused to the semiconductor working area, the damage of the semiconductor wafer in the manufacturing process is reduced, and the protection of the semiconductor in the semiconductor transportation process is realized.
Drawings
FIG. 1 is a schematic view of the constituent structure of a transmission power belt of the present utility model;
FIG. 2 is an enlarged schematic view of the portion A of FIG. 1 according to the present utility model;
FIG. 3 is a schematic view of the overall power belt of the present utility model;
fig. 4 is a schematic structural view of a power belt transmission portion of the present utility model.
The reference numerals in the figures illustrate:
1. a transmission power belt;
101. a low wave fiber line; 1011. a low wave arc monomer; 102. a high wave fiber line; 1021. a high-wave arc monomer; 103. a connection point;
2. a first large drive roll;
3. a second large drive roll;
4. a first medium-sized driven roller;
5. a small driven roller;
6. a second medium driven roller;
7. a large support frame;
8. a drive assembly;
801. a driving motor; 802. chain wheel and chain transmission structure.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model; it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present utility model are within the protection scope of the present utility model.
Examples:
referring to fig. 1 to 4, a power belt special for semiconductor equipment comprises a transmission power belt 1, wherein five turning positions are arranged on the transmission power belt 1, a closed loop structure is formed by turning for five times, a first large driving roller 2, a second large driving roller 3, a first medium driven roller 4 and a small driven roller 5 are respectively arranged at the inner side surface of the transmission power belt 1 and four turning positions, a second medium driven roller 6 is arranged at the outer side surface of the transmission power belt 1 and the other turning position, a large supporting frame 7 is jointly arranged at the outer sides of the first large driving roller 2 and the second large driving roller 3, and a driving component 8 is arranged at one side of the large supporting frame 7; the driving component 8 is used as a power source to control the first large driving roller 2 and the second large driving roller 3 to actively rotate, and is matched with the driven rotation of the first medium driven roller 4, the second medium driven roller 6 and the small driven roller 5 to realize the circular rotation of the transmission power belt 1.
The transmission power belt 1 comprises a low-wave fiber line 101 and a high-wave fiber line 102, and the low-wave fiber line 101 and the high-wave fiber line 102 are mutually wound to form a compact surface.
Referring to fig. 1 and 2, the low wave fiber line 101 includes a plurality of low wave arc monomers 1011, the high wave fiber line 102 includes a plurality of high wave arc monomers 1021, and the total number of the low wave arc monomers 1011 is equal to the total number of the high wave arc monomers 1021. The low-wave fiber line 101 and the high-wave fiber line 102 are formed by repeatedly superposing and connecting monomers, so that the ordering of the low-wave fiber line 101 and the high-wave fiber line 102 during winding can be ensured.
Referring to fig. 1 and 2, the low-wave fiber strand 101 and the high-wave fiber strand 102 are attached to each other at the end portions in the same direction, and a connection point 103 is fixed. By the connection point 103, the low wave fiber line 101 and the high wave fiber line 102 are prevented from being scattered after being connected.
Referring to fig. 1 and 2, the lowest point of the low-wave fiber line 101 is close to the highest point of the high-wave fiber line 102, and the highest point of the low-wave fiber line 101 is close to the lowest point of the high-wave fiber line 102. The low-wave fiber lines 101 and the high-wave fiber lines 102 are bound to each other by peak points, and a regular structure can be formed.
Referring to fig. 1 and 2, the upper pass low wave fiber line 101 and high wave fiber line 102 of the transmission power belt 1 are intertwined to form a triangular dividing plane. The triangular dividing surface has stability and can reduce the supporting area.
Referring to fig. 3 and 4, the driving assembly 8 includes a driving motor 801, the driving motor 801 is fixed on the outer side of the large supporting frame 7, and an output end of the driving motor 801 is connected with a sprocket chain transmission structure 802 through a coupling transmission, and two rotation centers of the sprocket chain transmission structure 802 are fixedly connected with the first large driving roller 2 and the second large driving roller 3 respectively. When the driving motor 801 works, the chain wheel and chain transmission structure 802 is circularly transmitted, so that the first large driving roller 2 and the second large driving roller 3 are controlled to continuously rotate.
Referring to fig. 3 and 4, the small driven roller 5 has a smaller sectional diameter than the first and second middle driven rollers 4 and 6. The vertical distance value between the transmission power belts 1 at the lower end of the small driven roller 5 is smaller, the semiconductor can be conveniently fed at the vertical distance value, the feeding fall of the semiconductor is reduced during feeding, and the damage probability during the feeding of the semiconductor is further reduced.
When in use: when the semiconductor is transported, the semiconductor is placed on the transmission power belt 1, at the moment, a driving motor 801 in a driving assembly 8 works, a chain wheel and chain transmission structure 802 is controlled to form a transmission relation, and then the first large driving roller 2 and the second large driving roller 3 are controlled to synchronously rotate through the transmission relation of the chain wheel and chain transmission structure 802, in the process, the first medium driven roller 4, the second medium driven roller 6 and the small driven roller 5 form a driven action, so that the circulating rotation of the transmission power belt 1 is realized, and the transportation of the semiconductor on the transmission power belt 1 is realized.
In the transportation process, the lowest point of the low-wave fiber line 101 is close to the highest point of the high-wave fiber line 102 and forms a supporting point, the highest point of the low-wave fiber line 101 is close to the lowest point of the high-wave fiber line 102 and forms a supporting point, when the transmission power belt 1 is in contact with a semiconductor, the contact potential is distributed on the edge of the semiconductor crystal, the contact area with the semiconductor wafer can be greatly reduced, meanwhile, the edge of the semiconductor wafer usually comprises a narrow blank area, and the blank area is not paved with a circuit and is an unused area, so that no damage is caused to a semiconductor working area when the semiconductor is supported, the damage of the semiconductor wafer in the manufacturing process is reduced, and the protection of the semiconductor during the semiconductor transportation is realized.
Finally, it should be noted that: in the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
The above description is only of the preferred embodiments of the present utility model; the scope of the utility model is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present utility model, and the technical solution and the improvement thereof are all covered by the protection scope of the present utility model.
Claims (7)
1. The utility model provides a special power area of semiconductor equipment, includes transmission power area (1), its characterized in that: five turning positions are arranged on the transmission power belt (1) and form a closed loop structure through five turning, a first large driving roller (2), a second large driving roller (3), a first medium driven roller (4) and a small driven roller (5) are respectively arranged at the four turning positions on the inner side surface of the transmission power belt (1), a second medium driven roller (6) is arranged at the other turning position on the outer side surface of the transmission power belt (1), a large supporting frame (7) is jointly arranged at the outer sides of the first large driving roller (2) and the second large driving roller (3), and a driving assembly (8) is arranged at one side of the large supporting frame (7);
the transmission power belt (1) comprises a low-wave fiber line (101) and a high-wave fiber line (102), and the low-wave fiber line (101) and the high-wave fiber line (102) are mutually wound to form a compact surface.
2. A semiconductor device dedicated power belt as defined in claim 1, wherein: the low-wave fiber line (101) comprises a plurality of low-wave arc-shaped monomers (1011), the high-wave fiber line (102) comprises a plurality of high-wave arc-shaped monomers (1021), and the total number of the low-wave arc-shaped monomers (1011) is equal to the total number of the high-wave arc-shaped monomers (1021).
3. A semiconductor device dedicated power belt as defined in claim 2, wherein: the end parts of the low-wave fiber lines (101) and the high-wave fiber lines (102) which are positioned at the same direction are bonded, and a connecting point (103) is fixed.
4. A semiconductor device dedicated power belt as defined in claim 1, wherein: the lowest point of the low-wave fiber line (101) is close to the highest point of the high-wave fiber line (102), and the highest point of the low-wave fiber line (101) is close to the lowest point of the high-wave fiber line (102).
5. A semiconductor device dedicated power belt as defined in claim 1, wherein: the upper part of the transmission power belt (1) is mutually wound with the low-wave fiber lines (101) and the high-wave fiber lines (102) to form a triangular dividing surface.
6. A semiconductor device dedicated power belt as defined in claim 1, wherein: the driving assembly (8) comprises a driving motor (801), the driving motor (801) is fixed on the outer side of the large supporting frame (7), the output end of the driving motor (801) is connected with a chain wheel and chain transmission structure (802) through a coupling, and two rotation centers of the chain wheel and chain transmission structure (802) are fixedly connected with the first large driving roller (2) and the second large driving roller (3) respectively.
7. A semiconductor device dedicated power belt as defined in claim 1, wherein: the cross-sectional diameter of the small driven roller (5) is smaller than the cross-sectional diameters of the first medium driven roller (4) and the second medium driven roller (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321508080.2U CN219949408U (en) | 2023-06-14 | 2023-06-14 | Special power belt for semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321508080.2U CN219949408U (en) | 2023-06-14 | 2023-06-14 | Special power belt for semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219949408U true CN219949408U (en) | 2023-11-03 |
Family
ID=88547664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321508080.2U Active CN219949408U (en) | 2023-06-14 | 2023-06-14 | Special power belt for semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219949408U (en) |
-
2023
- 2023-06-14 CN CN202321508080.2U patent/CN219949408U/en active Active
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