CN219946235U - Wafer clamping manipulator - Google Patents

Abstract

The utility model discloses a wafer clamping manipulator which comprises a supporting device for integrally bearing and limiting forward and backward sliding, wherein a connecting device for providing rotating power and guiding movement is arranged in front of the supporting device, and the wafer clamping manipulator further comprises a rotating device which is arranged at the bottom of the connecting device and used for uniformly stretching and clamping wafers in a circumference manner. According to the wafer clamping manipulator, through the design that the limiting grooves limit the moving direction of the sliding rods, the rotating disc rotates to drive the sliding rods and the clamping blocks to move inwards, and the wafer is clamped simultaneously from four directions, so that the clamping precision and the clamping stability are improved; through the design that the turntable drives all clamping blocks to move simultaneously, all the clamping blocks can be driven to move only by a single motor, so that the production cost of the device is reduced; the design that drives rotary device back and forth through the rack and pinion is convenient for finely tune the clamping position, and the complex production environment of better adaptation improves wafer removal convenience.

Description

Wafer clamping manipulator

Technical Field

The utility model belongs to the field of auxiliary equipment for wafer processing, and particularly relates to a wafer clamping manipulator.

Background

The wafer refers to a flaky base material made of a silicon material through a series of processing processes. The wafer is generally used as a base material for manufacturing integrated circuits, and various electronic components and circuit structures are engraved on the surface of the wafer, and the wafer is sequentially processed and connected in a subsequent process to finally form a chip with a certain function. Wafer technology is one of the essential basic technologies in the modern electronics industry.

The Chinese patent with the reference to application number CN202120731473.4 discloses a wafer clamping manipulator, which is characterized by comprising: the wafer end effector comprises a supporting plate, the supporting plate is of a Y-shaped structure, two front end limiting blocks are symmetrically and fixedly arranged at the front end, a rear end limiting block is fixedly arranged at the opposite rear end, the rear end limiting block is provided with a crescent arc side surface corresponding to a wafer, the top surface of the rear end limiting block is flush with the upper surface of the wafer, the wafer is supported on the supporting plate, and the wafer is clamped between the front end limiting block and the rear end limiting block; the clamping assembly comprises a clamping plate and a guide rod, the clamping plate is telescopically arranged on the top surface of the rear end limiting block and is provided with a clamping end and a fixed end which are opposite to each other, the clamping end clamps or releases the edge of the wafer from the upper surface of the wafer, the first end of the guide rod is fixedly connected with the fixed end, and the second end of the guide rod is in transmission connection with the first driving assembly; the first driving assembly drives the guide rod to move linearly along the axial direction of the guide rod and drives the clamping end to move in a telescopic manner along the radial direction of the wafer.

The disadvantages of the above patents are: through one side application of force, the wafer is clamped in a mode that one side is fixed, errors are easily caused in wafer positioning, and clamping accuracy is reduced.

Disclosure of Invention

The present utility model is directed to a wafer clamping robot to solve the above-mentioned problems.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the wafer clamping manipulator comprises a supporting device for integrally bearing and limiting front and back sliding, a connecting device for providing rotating power and guiding movement is arranged in front of the supporting device, and a rotating device for uniformly stretching and clamping wafers in circumference is arranged at the bottom of the connecting device; the rotating device comprises a rotating disc, a gear ring is fixedly arranged at the top of the rotating disc, four limiting grooves are uniformly formed in the circumference of the bottom of the rotating disc, a sliding rod is arranged in the middle of each limiting groove, and a clamping block is rotatably arranged at the bottom of each sliding rod.

Further: the supporting device comprises a supporting sleeve, a first gear is rotatably arranged in front of the supporting sleeve, a first motor is arranged on one side of the first gear, and a plurality of mounting holes are uniformly formed in the back of the supporting sleeve.

Further: the connecting device comprises a telescopic frame, a rack is fixedly arranged at the top of the telescopic frame, a connecting frame is fixedly arranged at the bottom of the telescopic frame, four limiting frames are uniformly and fixedly arranged on the circumference of the bottom of the connecting frame, a second gear is rotatably arranged behind the connecting frame, and a second motor is arranged at the top of the second gear.

Further: the support sleeve is made of 3A21 aluminum, and the first motor is connected with the support sleeve through bolts.

Further: the limiting groove is arc-shaped.

Further: the clamping blocks are in sliding connection with the limiting frames, and the rotary table is in bearing connection with the connecting frames.

Compared with the prior art, the utility model has the beneficial effects that:

1. through the design of limiting the moving direction of the sliding rod by the limiting groove, the rotating disc rotates to drive the sliding rod and the clamping block to move inwards, and the wafer is clamped simultaneously from four directions, so that the clamping precision and the clamping stability are improved;

2. through the design that the turntable drives all clamping blocks to move simultaneously, all the clamping blocks can be driven to move only by a single motor, so that the production cost of the device is reduced;

3. the design that drives rotary device back and forth through the rack and pinion is convenient for finely tune the clamping position, and the complex production environment of better adaptation improves wafer removal convenience.

Drawings

FIG. 1 is a schematic view of a wafer clamping robot according to the present utility model;

FIG. 2 is a schematic view of a supporting device of a wafer clamping robot according to the present utility model;

FIG. 3 is a schematic view of a connection device of a wafer clamping robot according to the present utility model;

FIG. 4 is a schematic view of a rotating apparatus of a wafer clamping robot according to the present utility model;

fig. 5 is a schematic diagram of the working principle of a connection device and a rotation device of a wafer clamping robot according to the present utility model.

In the reference numerals: 1. a support device; 101. a support sleeve; 102. a first gear; 103. a first motor; 104. a mounting hole; 2. a connecting device; 201. a telescoping frame; 202. a rack; 203. a connection frame; 204. a limit frame; 205. a second gear; 206. a second motor; 3. a rotating device; 301. a turntable; 302. a gear ring; 303. a limit groove; 304. a slide bar; 305. and clamping blocks.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, a wafer clamping manipulator comprises a supporting device 1 for integrally bearing and limiting forward and backward sliding, a connecting device 2 for providing rotating power and guiding movement is arranged in front of the supporting device 1, and a rotating device 3 for uniformly stretching and clamping a wafer circumferentially is arranged at the bottom of the connecting device 2.

In this embodiment: the supporting device 1 comprises a supporting sleeve 101 for supporting sliding and fixed connection, the supporting sleeve 101 is L-shaped, the supporting sleeve 101 is made of 3A21 aluminum materials, a first gear 102 for transmitting rotation power is connected to a bearing in front of the supporting sleeve 101, a first motor 103 serving as a power source is connected to one side of the first gear 102 in a parallel key manner, the first motor 103 is connected with the supporting sleeve 101 through bolts, a plurality of mounting holes 104 for being connected with an external power source are uniformly formed in the rear of the supporting sleeve 101 up and down, the mounting holes 104 are circular, the whole device is fixedly connected with the external power source through the mounting holes 104, and the supporting sleeve 101 supports the first motor 103 to drive the first gear 102 to rotate;

in this embodiment: the connecting device 2 comprises a telescopic frame 201 for driving the rotating device 3 to move forwards and backwards, the telescopic frame 201 is in sliding connection with the supporting sleeve 101, the telescopic frame 201 is made of 3A21 aluminum materials, a rack 202 for converting rotary power into linear power is connected to the top of the telescopic frame 201 through bolts, a connecting frame 203 for supporting the rotating disc 301 to rotate is welded at the bottom of the telescopic frame 201, the connecting frame 203 is in a round frame shape, four limiting frames 204 for limiting the sliding direction of the clamping blocks 305 are uniformly welded and connected to the circumference of the bottom of the connecting frame 203, a second gear 205 for transmitting rotary power is connected to the rear surface of the connecting frame 203 through bearings, a second motor 206 for driving the rotating disc 301 is connected to the top flat key of the second gear 205, the second motor 206 is connected with the connecting frame 203 through bolts, the bottom rack 202 drives the telescopic frame 201 to move forwards and backwards, the telescopic frame 201 drives the rotating device 3 to a dome to be clamped through the connecting frame 203, the external power source drives the device to descend integrally until the clamping blocks 305 move to the position parallel to the side edges of the wafer, the connecting frame 203 supports the second motor 206 to drive the second gear 205 to rotate, and the meshing gear 302 drives the rotating disc 301 to rotate;

in this embodiment: the rotating device 3 comprises a rotary table 301 for supporting and rotating and driving a slide bar 304 to slide, the rotary table 301 is in a circular ring shape, the rotary table 301 is made of 3A21 aluminum materials, the rotary table 301 is connected with a connecting frame 203 through a bearing, a gear ring 302 for receiving rotating power is connected to the top of the rotary table 301 through bolts, four limiting grooves 303 for limiting and driving to move are uniformly formed in the circumference of the bottom of the rotary table 301, the limiting grooves 303 are circular arcs, slide bars 304 for driving a clamping block 305 to move are arranged in the middle of the limiting grooves 303, the clamping block 305 for clamping wafers from different directions are hinged to the bottom of the slide bars 304, the clamping block 305 is Fang Tiaoxing, a slope which is convenient for the wafers to slide is arranged on the inner side of the clamping block 305, the clamping block 305 is connected with the limiting frame 204 in a sliding mode, the sliding mode is used for driving the slide bars 304 to slide along the limiting grooves 303 in the rotating process of the rotary table 301, and meanwhile the clamping block 305 at the bottom of the sliding bar 304 only slides inside and outside the limiting frame 204, and because the two ends of the limiting grooves 303 are respectively located on the inner side and outer side of the rotary table 301, and therefore the rotary table 301 rotates and drives the four clamping blocks 305 to move at equal distance to the center, wafers located in the center are clamped from the four directions, and the wafer clamping operation is completed.

Working principle: the whole is fixedly connected with an external power source through the mounting hole 104, the support sleeve 101 supports the first motor 103 to drive the first gear 102 to rotate, the meshing bottom rack 202 drives the telescopic frame 201 to move back and forth, the telescopic frame 201 drives the rotating device 3 to move to the dome part of the wafer to be clamped through the connecting frame 203, the external power source drives the device to wholly descend until the clamping block 305 moves to a position flush with the side edge of the wafer, the connecting frame 203 supports the second motor 206 to drive the second gear 205 to rotate, the meshing gear ring 302 drives the turntable 301 to rotate, the sliding rod 304 is driven to slide along the limiting groove 303 in the rotating process of the turntable 301, meanwhile, the clamping block 305 at the bottom of the sliding rod 304 only can slide inside and outside the limiting frame 204, and because the two ends of the limiting groove 303 are respectively positioned at the inner side and the outer side of the turntable 301, the turntable 301 is driven to move to the center equidistantly, the wafer at the center is clamped by the four clamping blocks 305, and the wafer clamping and fixing operation is completed.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a wafer centre gripping manipulator, is including being used for whole bearing and spacing fore-and-aft sliding strutting arrangement (1), strutting arrangement (1) are provided with connecting device (2) that are used for providing rotation power and guide to remove in the front, its characterized in that: the wafer clamping device also comprises a rotating device (3) which is arranged at the bottom of the connecting device (2) and is used for uniformly stretching and clamping the wafer circumferentially;

the rotating device (3) comprises a rotary table (301), a gear ring (302) is fixedly arranged at the top of the rotary table (301), four limiting grooves (303) are uniformly formed in the circumference of the bottom of the rotary table (301), sliding rods (304) are arranged in the middle of the limiting grooves (303), and clamping blocks (305) are rotatably arranged at the bottoms of the sliding rods (304).

2. The wafer clamping robot of claim 1, wherein: the supporting device comprises a supporting sleeve (101), a first gear (102) is rotatably arranged in front of the supporting sleeve (101), a first motor (103) is arranged on one side of the first gear (102), and a plurality of mounting holes (104) are uniformly formed in the back of the supporting sleeve (101) up and down.

3. The wafer clamping robot of claim 1, wherein: connecting device (2) are including flexible frame (201), flexible frame (201) top is fixed to be provided with rack (202), flexible frame (201) bottom is fixed to be provided with connecting frame (203), connecting frame (203) bottom circumference evenly is fixed to be provided with four spacing frames (204), it is provided with second gear (205) to rotate behind connecting frame (203), second motor (206) are installed at second gear (205) top.

4. The wafer clamping robot of claim 2, wherein: the support sleeve (101) is made of 3A21 aluminum, and the first motor (103) is connected with the support sleeve (101) through bolts.

5. The wafer clamping robot of claim 1, wherein: the limiting groove (303) is arc-shaped.

6. A wafer chucking robot as recited in claim 3, wherein: the clamping blocks (305) are in sliding connection with the limiting frames (204), and the rotary table (301) is in bearing connection with the connecting frames (203).