CN219938818U - Semiconductor heat exchange module - Google Patents
Semiconductor heat exchange module Download PDFInfo
- Publication number
- CN219938818U CN219938818U CN202321005928.XU CN202321005928U CN219938818U CN 219938818 U CN219938818 U CN 219938818U CN 202321005928 U CN202321005928 U CN 202321005928U CN 219938818 U CN219938818 U CN 219938818U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- heat exchange
- exchange module
- swing arm
- baffle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- -1 intraocular lenses Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a semiconductor heat exchange module, which comprises a bottom plate, wherein the inner surface of the bottom plate is fixedly connected with a locking screw, the outer part of the locking screw is provided with a heat radiating device, the inner part of the heat radiating device is provided with a start-stop device, the heat radiating device comprises an outer cover, a through groove is formed in the wall of the outer cover, and a radiating fin is arranged at the top of the through groove.
Description
Technical Field
The utility model relates to the technical field of heat exchange, in particular to a semiconductor heat exchange module.
Background
The species exist in a wide variety of forms, solid, liquid, gas, plasma, and the like. We generally refer to materials that are poorly or poorly electrically and thermally conductive, such as diamond, intraocular lenses, amber, ceramic, etc., as insulators. Metals with good electric and thermal conductivity, such as gold, silver, copper, iron, tin, aluminum, etc., are called conductors. The material between the conductor and the insulator may simply be referred to as a semiconductor. The discovery of semiconductor materials is the latest compared to conductors and insulators, and the existence of semiconductors has not been truly accepted by the academia until the 30 s of the 20 th century as the purification technology of materials has improved.
In the prior art, for example, the Chinese patent number is: a semiconductor heat exchange module for a heater of CN110425725a, comprising: the module body is made of a heat-conducting material; the medium channels comprise a plurality of first channels positioned at the upper part and a plurality of second channels positioned at the lower part, the first channels and the second channels are sequentially connected in series to form a serpentine structure, and two ends of the medium channels respectively form a medium inlet and a medium outlet on the surface of the module body; the heating channel is positioned in the module body, is positioned between the first channel and the second channel, and is internally provided with a semiconductor heating pipe with a matched shape; the heat exchange device is reasonable in structural design, and the module body is used as a heat exchange main body by adopting a modularized design and a semiconductor heating pipe, so that the heat can be effectively utilized, and the heating efficiency and the heat exchange efficiency of the heater are ensured.
However, in the prior art, although the above-mentioned patent has the technical advantages, the disadvantage is that the equipment needs to monitor the working temperature in real time when in use, and when the temperature is too high, the heat dissipation module needs to be opened manually, so that the degree of automation is low, and the traditional method is to add a starter on the heat dissipation module, but energy loss is generated.
Disclosure of Invention
In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides a semiconductor heat exchange module, includes the bottom plate, the internal surface fixedly connected with locking screw of bottom plate, locking screw's outside is provided with heat abstractor, heat abstractor's inside is provided with opens and stops the device, heat abstractor includes the dustcoat, open the groove has been seted up in the wall of dustcoat, the top of opening the groove is provided with the fin, the surface fixedly connected with metal pole of fin, open and stop the device and include the motor, the surface rotation of motor is connected with the pivot, the surface fixedly connected with lantern ring of pivot, the surface fixedly connected with blade of lantern ring, the bottom of blade is provided with extension spring, extension spring's both sides are provided with the swing arm, the bottom fixedly connected with counter weight plate of swing arm, the outside of counter weight plate is provided with the hawser, the bottom fixedly connected with baffle of hawser, the through-hole has been seted up in the wall of baffle, and whole equipment passes through locking screw with the bottom plate fixed at external stationary plane, and the motor drives the pivot and rotates the swing arm.
As a preferred embodiment, the outer surface of the radiating fin is fixedly connected with the outer surface of the outer cover, the radiating fin is arranged along the outer surface of the outer cover, the counterweight plates at the bottom ends of the swing arms are outwards expanded under the action of centrifugal force, the bottom ends of the swing arms move upwards, and the ropes lift the baffle plates upwards.
As a preferable implementation mode, the outer surface of the motor is fixedly connected with the upper surface of the bottom plate, the upper surface of the bottom plate is fixedly connected with the lower surface of the outer cover, the through groove of the side wall of the outer cover is opened, the tension spring is extruded and contracted, and the through groove is communicated with the through hole.
As a preferred embodiment, the outer surface of the rotating shaft is in sliding connection with the inner surface of the baffle, the bottom end of the tension spring is fixedly connected with the upper surface of the baffle, the blades suck external hot air into the outer cover, and the radiating fins and the metal rods increase the radiating efficiency by increasing the contact area with the air.
As a preferred embodiment, the top end of the cable is fixedly connected with the lower surface of the swing arm, and the top end of the swing arm is rotatably connected with the lower surface of the lantern ring.
As a preferred embodiment, the outer surface of the baffle is slidingly coupled to the inner surface of the housing.
The beneficial effects of the utility model are as follows:
according to the utility model, when the device is used, the bottom plate is fixed on the external fixing surface through the locking screw, the motor drives the rotating shaft to rotate, the lantern ring drives the swing arm to rotate, the counterweight plate at the bottom end of the swing arm is outwards expanded under the action of centrifugal force, the bottom end of the swing arm moves upwards, the cable lifts the baffle plate upwards, the through groove on the side wall of the outer cover is opened, the extension spring is extruded and contracted, the through groove is communicated with the through hole, the blade sucks external hot air into the outer cover, and the radiating fin and the metal rod increase the contact area with the air so as to improve the radiating efficiency.
Drawings
FIG. 1 is a front view of the present utility model;
FIG. 2 is a cross-sectional view of the present utility model;
FIG. 3 is a schematic diagram of a heat dissipating device according to the present utility model;
fig. 4 is a schematic structural view of the start-stop device of the present utility model.
In the figure: 1. a bottom plate; 2. locking the screw rod; 3. a heat sink; 4. a start-stop device; 5. an outer cover; 6. a through groove; 7. a heat sink; 8. a metal rod; 9. a motor; 10. a rotating shaft; 11. a collar; 12. a blade; 13. a tension spring; 14. swing arms; 15. a weight plate; 16. a cable; 17. a baffle; 18. and a through hole.
Detailed Description
The utility model will be described in further detail with reference to the drawings and the detailed description. The embodiments of the utility model have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.
Embodiment one:
referring to fig. 1-4, the present utility model provides a technical solution: the semiconductor heat exchange module comprises a bottom plate 1, the inner surface fixedly connected with locking screw 2 of bottom plate 1, the outside of locking screw 2 is provided with heat abstractor 3, the inside of heat abstractor 3 is provided with opens and stops device 4, heat abstractor 3 includes dustcoat 5, open slot 6 has been seted up in the wall of dustcoat 5, the top of open slot 6 is provided with fin 7, the surface fixedly connected with metal pole 8 of fin 7, open and stop device 4 includes motor 9, the surface rotation of motor 9 is connected with pivot 10, the surface fixedly connected with lantern ring 11 of pivot 10, the surface fixedly connected with blade 12 of lantern ring 11, the bottom of blade 12 is provided with extension spring 13, the both sides of extension spring 13 are provided with swing arm 14, the bottom fixedly connected with counter weight plate 15 of swing arm 14, the outside of counter weight plate 15 is provided with hawser 16, the bottom fixedly connected with baffle 17 of hawser 16, the through-hole 18 has been seted up in the wall of baffle 17.
The whole equipment is fixed the bottom plate 1 on external fixed surface through locking screw rod 2, and motor 9 drives pivot 10 and rotates, and the lantern ring 11 drives swing arm 14 rotation, and the counter weight 15 of swing arm 14 bottom outwards expands under the effect of centrifugal force.
The outer surface of the heat sink 7 is fixedly connected to the outer surface of the housing 5, and the heat sink 7 is arranged along the outer surface of the housing 5. The outer surface of the motor 9 is fixedly connected with the upper surface of the bottom plate 1, and the upper surface of the bottom plate 1 is fixedly connected with the lower surface of the outer cover 5.
The bottom end of the swing arm 14 moves upwards, the cable 16 lifts the baffle 17 upwards, the through groove 6 on the side wall of the outer cover 5 is opened, the tension spring 13 extrudes and contracts, and the through groove 6 is communicated with the through hole 18.
The outer surface of the rotating shaft 10 is in sliding connection with the inner surface of the baffle 17, and the bottom end of the tension spring 13 is fixedly connected with the upper surface of the baffle 17. The top end of the cable 16 is fixedly connected with the lower surface of the swing arm 14, and the top end of the swing arm 14 is rotatably connected with the lower surface of the lantern ring 11. The outer surface of the baffle 17 is slidably connected to the inner surface of the housing 5.
The blades 12 suck external hot air into the inside of the housing 5, and the heat radiation fins 7 and the metal rods 8 increase the heat radiation efficiency by increasing the contact area with the air.
Working principle:
when the equipment is used, the whole equipment is fixed on an external fixing surface through the locking screw 2, the motor 9 drives the rotating shaft 10 to rotate, the lantern ring 11 drives the swing arm 14 to rotate, the counterweight plate 15 at the bottom end of the swing arm 14 is outwards expanded under the action of centrifugal force, the bottom end of the swing arm 14 moves upwards, the cable 16 upwards lifts the baffle 17, the through groove 6 on the side wall of the outer cover 5 is opened, the tension spring 13 extrudes and contracts, the through groove 6 is communicated with the through hole 18, the blade 12 sucks external hot air into the outer cover 5, and the radiating fins 7 and the metal rods 8 improve the radiating efficiency by increasing the contact area with the air.
It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present utility model without the inventive step, are intended to be within the scope of the present utility model. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.
Claims (6)
1. Semiconductor heat exchange module, including bottom plate (1), its characterized in that: the utility model provides a heat dissipation device for floor (1), internal surface fixedly connected with locking screw (2), the outside of locking screw (2) is provided with heat abstractor (3), the inside of heat abstractor (3) is provided with opens and stops device (4), heat abstractor (3) are including dustcoat (5), open groove (6) have been seted up in the wall of dustcoat (5), the top of leading to groove (6) is provided with fin (7), the surface fixedly connected with metal pole (8) of fin (7), open and stop device (4) include motor (9), the surface rotation of motor (9) is connected with pivot (10), the surface fixedly connected with lantern ring (11) of pivot (10), the surface fixedly connected with blade (12) of lantern ring (11), the bottom of blade (12) is provided with extension spring (13), the both sides of extension spring (13) are provided with swing arm (14), the bottom fixedly connected with board (15) of swing arm (14), the outside of counter weight board (15) is provided with hawser (16), the bottom fixedly connected with baffle (17) in baffle (17).
2. The semiconductor heat exchange module of claim 1, wherein: the outer surface of the radiating fins (7) is fixedly connected with the outer surface of the outer cover (5), and the radiating fins (7) are arranged along the outer surface of the outer cover (5).
3. The semiconductor heat exchange module of claim 1, wherein: the outer surface of the motor (9) is fixedly connected with the upper surface of the bottom plate (1), and the upper surface of the bottom plate (1) is fixedly connected with the lower surface of the outer cover (5).
4. The semiconductor heat exchange module of claim 1, wherein: the outer surface of the rotating shaft (10) is in sliding connection with the inner surface of the baffle plate (17), and the bottom end of the tension spring (13) is fixedly connected with the upper surface of the baffle plate (17).
5. The semiconductor heat exchange module of claim 1, wherein: the top end of the mooring rope (16) is fixedly connected with the lower surface of the swing arm (14), and the top end of the swing arm (14) is rotatably connected with the lower surface of the lantern ring (11).
6. The semiconductor heat exchange module of claim 1, wherein: the outer surface of the baffle (17) is in sliding connection with the inner surface of the outer cover (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321005928.XU CN219938818U (en) | 2023-04-28 | 2023-04-28 | Semiconductor heat exchange module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321005928.XU CN219938818U (en) | 2023-04-28 | 2023-04-28 | Semiconductor heat exchange module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219938818U true CN219938818U (en) | 2023-10-31 |
Family
ID=88498015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321005928.XU Active CN219938818U (en) | 2023-04-28 | 2023-04-28 | Semiconductor heat exchange module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219938818U (en) |
-
2023
- 2023-04-28 CN CN202321005928.XU patent/CN219938818U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |