CN219938600U - Bendable double-sided copper-clad substrate - Google Patents
Bendable double-sided copper-clad substrate Download PDFInfo
- Publication number
- CN219938600U CN219938600U CN202321117804.0U CN202321117804U CN219938600U CN 219938600 U CN219938600 U CN 219938600U CN 202321117804 U CN202321117804 U CN 202321117804U CN 219938600 U CN219938600 U CN 219938600U
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- China
- Prior art keywords
- sided copper
- double
- clad
- protective film
- bendable
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- 239000000758 substrate Substances 0.000 title claims abstract description 34
- 238000012545 processing Methods 0.000 claims abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 41
- 229910052782 aluminium Inorganic materials 0.000 claims description 41
- 230000001681 protective effect Effects 0.000 claims description 38
- 238000005452 bending Methods 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 22
- 229920001187 thermosetting polymer Polymers 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 230000002441 reversible effect Effects 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000013255 MILs Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a bendable double-sided copper-clad substrate, which solves the problems of higher use cost and the like of a flexible circuit board. The utility model has the advantages of good structural stability, effective reduction of processing cost and the like.
Description
Technical Field
The utility model belongs to the technical field of electronic elements, and particularly relates to a bendable double-sided copper-clad substrate.
Background
The copper-clad laminate is a plate-like material, called copper-clad plate for short, which is prepared by impregnating electronic glass fiber cloth or other reinforcing materials with resin, and coating copper foil on one or both sides and hot-pressing. Various printed circuit boards with different forms and different functions are manufactured by selectively performing working procedures such as processing, etching, drilling, copper plating and the like on a copper-clad plate. Because of the dress subsides of supporting electronic components, often design to the hard board structure for the circuit board that car light was used, and the hard board can't realize three-dimensional bending, and when car light module function was many, installation space is little, when needs bending, often can select flexible circuit board to add aluminium stiffening plate, realizes bending and heat dissipation, but the cost of flexible circuit board is generally higher than the hard board and is approximately 30-40%.
In order to solve the defects existing in the prior art, long-term exploration is performed, and various solutions are proposed. For example, chinese patent literature discloses a bendable aluminum-based copper-clad plate [201822263253.4], which comprises a copper-clad plate main body, wherein aluminum substrates are fixedly installed at two ends of the copper-clad plate main body, transverse extending grooves are formed in two side surfaces of the aluminum substrates, a connecting groove is formed in the surface of one side of the aluminum substrates, a first slot is formed in one side surface of the connecting groove, mounting holes are formed in two side surfaces of the inner part of the connecting groove, flexible connecting plates are installed between the aluminum substrates, two ends of each flexible connecting plate are installed in the connecting groove respectively, and second slot is formed in the other two side surfaces of the flexible connecting plates, which are located in the connecting groove, in a penetrating manner.
The scheme solves the problem of bending the copper-clad substrate to a certain extent, but the scheme still has a plurality of defects, such as higher use cost of the flexible circuit board.
Disclosure of Invention
The utility model aims to solve the problems and provide the bendable double-sided copper-clad substrate which is reasonable in design and effectively reduces the use cost.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a can buckle two-sided copper-clad base plate, includes two-sided copper-clad plate, and two-sided copper-clad plate is the form of buckling, and two-sided copper-clad plate openly covers has positive protection film and printing ink layer, and two-sided copper-clad plate reverse side is laminated through the thermosetting glue film has reverse side protection film and aluminum sheet, and reverse side protection film and aluminum sheet junction point are glued and are handled. The double-sided copper-clad plate and the aluminum sheet are bent, and are pressed through the thermosetting adhesive layer, so that the processing production cost is effectively reduced compared with that of a flexible circuit board.
In the bendable double-sided copper-clad substrate, two sides of the bending part of the double-sided copper-clad plate are respectively provided with a strip-shaped hollowed-out opening, and an aluminum strip is reserved between the hollowed-out opening and the edge of the double-sided copper-clad plate. The reserved aluminum strips play a role in strengthening the edges of the copper-clad substrate.
In the bendable double-sided copper-clad substrate, the double-sided copper-clad plate is made of FR4 material, and the bending angle is 75-180 degrees. The FR4 hard board material double-sided copper-clad plate has lower use cost.
In the bendable double-sided copper-clad substrate, the thickness of the double-sided copper-clad plate is 0.1+/-0.05 mm. By controlling the thickness of the double-sided copper-clad plate, the double-sided copper-clad plate is ensured to have good bending property.
In the bendable double-sided copper-clad substrate, the front protective film and the back protective film are respectively provided with the PI film and the AD layer which are mutually attached. The flexible front protective film and the flexible back protective film are stably attached to the double-sided copper-clad plate through the AD layer.
In the bendable double-sided copper-clad substrate, the PI film thickness of the front protective film is 1 MIL+/-0.05 MIL, and the AD layer thickness of the front protective film is 30 um+/-5 um.
In the bendable double-sided copper-clad substrate, the PI film thickness of the back protective film is 0.5 MIL+/-0.05 MIL, and the AD layer thickness of the front protective film is 15 um+/-1.5 um. Through limiting the thickness of PI film and AD layer, do not influence two-sided copper-clad plate normal bending.
In the bendable double-sided copper-clad substrate, the thickness of the thermosetting adhesive layer is 0.07+/-0.02 mm. The thermosetting adhesive layer meets the pressing requirements of the double-sided copper-clad plate, the reverse-side protective film and the aluminum sheet.
In the bendable double-sided copper-clad substrate, the thickness of the aluminum sheet is 1.0+/-0.1 mm. Limiting the thickness of the aluminum sheet ensures the balance of its bendability and structural strength.
In the bendable double-sided copper-clad substrate, the joint of the back protective film and the aluminum sheet is subjected to dispensing treatment by using UV0281 adhesive. And the bending part of the lead is subjected to key protection in a dispensing mode.
Compared with the prior art, the utility model has the advantages that: the hard double-sided copper-clad substrate and the aluminum sheet are selected to be bent synchronously, and the lamination effect of the copper-clad substrate and the protective film is ensured through the thermosetting adhesive layer, so that the cost is lower compared with that of the flexible circuit board; the aluminum strips reserved after the two sides of the double-sided copper-clad substrate are hollowed out improve the structural stability after bending; by attaching the aluminum sheet, the double-sided copper-clad plate has better heat conduction performance.
Drawings
FIG. 1 is a schematic diagram of a bending state of the present utility model;
FIG. 2 is a schematic view of the utility model in a flattened state;
FIG. 3 is a cross-sectional view of the structure of the present utility model;
FIG. 4 is a partial cross-section of the present utility model;
in the figure, a double-sided copper-clad plate 1, a front protective film 2, an ink layer 3, a thermosetting adhesive layer 4, a back protective film 5, an aluminum sheet 6 and an aluminum strip 7.
Detailed Description
The utility model will be described in further detail with reference to the drawings and the detailed description.
As shown in fig. 1-4, a bendable double-sided copper-clad substrate comprises a double-sided copper-clad plate 1, wherein the double-sided copper-clad plate 1 is in a bent shape, the front surface of the double-sided copper-clad plate 1 is covered with a front surface protection film 2 and an ink layer 3, the back surface of the double-sided copper-clad plate 1 is attached with a back surface protection film 5 and an aluminum sheet 6 through a thermosetting adhesive layer 4 and is fixed in a pressing and curing mode, and the double-sided copper-clad plate has higher production efficiency. The joint of the reverse side protective film 5 and the aluminum sheet 6 is subjected to dispensing treatment, so that the wires at the bending part are well protected, and the wires are prevented from being broken, so that the unlit defects of the module LED and the like are caused.
Specifically, two sides of the bending part of the double-sided copper-clad plate 1 are respectively provided with a strip-shaped hollowed-out opening, and an aluminum strip 7 is reserved between the hollowed-out opening and the edge of the double-sided copper-clad plate 1. The aluminum strips 7 reserved after hollowed out strengthen the edge of the bending part of the double-sided copper-clad plate 1 to ensure bending stability, and play a role in isolating and protecting the circuit board on the double-sided copper-clad plate 1.
In depth, the double-sided copper-clad plate 1 is made of FR4 material, and the bending angle is 75-180 degrees. The traditional copper-clad substrate is formed by combining an FR4 hard plate and an aluminum plate, and cannot be bent, and the double-sided copper-clad plate 1 provided by the utility model adopts the combination of the thin FR4 hard plate and the aluminum plate 6, so that a large bending angle can be realized, and the three-dimensional installation requirement of a car lamp module is met.
Further, the thickness of the double-sided copper-clad plate 1 is 0.1+/-0.05 mm. The double-sided copper-clad plate 1 with the thickness of 0.1mm is generally selected to meet the requirements of structural strength and circuit arrangement. The double-sided copper-clad plate 1 made of hard plates is selected, so that the cost can be reduced by 30-40%.
Further, the front protective film 2 and the back protective film 5 have PI films and AD layers, respectively, attached to each other. The front protective film 2 is not covered by the ink layer 3 on the surface of the double-sided copper-clad plate 1, and the ink layer 3 of the hard plate is fragile and cannot be bent, so that the design that the ink layer 3 covers the edge of the front protective film 2 is adopted, the bending flexibility of the double-sided copper-clad plate 1 is ensured, and the copper exposure problem at the joint of the front protective film 2 and the ink layer 3 is avoided.
In addition, the PI film thickness of the front protective film 2 is 1 mils±0.05 MILs, and the AD layer thickness of the front protective film 2 is 30um±5um. The PI film thickness of the front protective film 2 is usually 1MIL, and the AD layer is 30um thick and is attached to the double-sided copper-clad plate 1.
Meanwhile, the PI film thickness of the reverse side protective film 5 is 0.5 mils±0.05 MILs, and the AD layer thickness of the front side protective film 2 is 15um±1.5um. The PI film of the reverse side protective film 5 is 0.5MIL, and the AD layer is attached to the thermosetting adhesive layer 4 and has a thickness of 15um.
The thermosetting adhesive layer 4 is attached to the back surface of the double-sided copper-clad plate 1, the thickness is 0.07+/-0.02 mm, and the thermosetting adhesive layer 4 with the thickness of 0.07mm is generally attached to and pressed against the back surface protective film 5 and the aluminum sheet 6.
Obviously, the thickness of the aluminum sheet 6 is 1.0+/-0.1 mm, the aluminum sheet 6 with the thickness of 1mm is usually selected to support the double-sided copper-clad plate 1, the thermosetting adhesive layer 4 is utilized to partition, and the aluminum sheet 6 is used for rapidly dissipating the heat of the circuit on the double-sided copper-clad plate 1.
Preferably, the joint of the back protective film 5 and the aluminum sheet 6 is subjected to dispensing treatment by using UV0281 glue. And after the solidification is finished, the reverse side protective film 5 is connected with the aluminum sheet 6, and mainly the conducting wire at the bending part of the double-sided copper-clad plate 1 is subjected to key protection.
In summary, the principle of this embodiment is as follows: the front and back sides of the double-sided copper-clad plate 1 are respectively attached with protective films, and form a bending structure after being attached with an aluminum sheet 6, so that the three-dimensional mounting requirement of the car lamp module is met, the partial structural strength of the aluminum strip reserved after the bending part is hollowed out is improved, and the wire at the bending part is mainly protected by glue dispensing treatment.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the utility model. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the utility model or exceeding the scope of the utility model as defined in the accompanying claims.
Although terms such as the double-sided copper-clad plate 1, the front protective film 2, the ink layer 3, the thermosetting adhesive layer 4, the rear protective film 5, the aluminum sheet 6, the aluminum strip 7, etc. are used more herein, the possibility of using other terms is not excluded. These terms are used merely for convenience in describing and explaining the nature of the utility model; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present utility model.
Claims (10)
1. The utility model provides a double-sided copper-clad base plate of can buckling, includes double-sided copper-clad plate (1), its characterized in that, double-sided copper-clad plate (1) be the form of buckling, double-sided copper-clad plate (1) openly cover and have positive protection film (2) and printing ink layer (3), double-sided copper-clad plate (1) reverse side have reverse side protection film (5) and aluminum sheet (6) through laminating of thermosetting glue film (4), reverse side protection film (5) and aluminum sheet (6) handing-over department point glue processing.
2. The bendable double-sided copper-clad substrate according to claim 1, wherein strip-shaped hollowed-out openings are respectively formed in two sides of a bent part of the double-sided copper-clad plate (1), and an aluminum strip (7) is reserved between each hollowed-out opening and the edge of the double-sided copper-clad plate (1).
3. The bendable double-sided copper-clad substrate according to claim 1, wherein the double-sided copper-clad plate (1) is made of FR4 material and has a bending angle of 75-180 degrees.
4. The bendable double-sided copper-clad substrate according to claim 1, wherein the thickness of the double-sided copper-clad plate (1) is 0.1+/-0.05 mm.
5. The bendable double-sided copper-clad substrate according to claim 1, wherein the front protective film (2) and the back protective film (5) are respectively provided with a PI film and an AD layer which are mutually attached.
6. The bendable double-sided copper-clad substrate according to claim 5, wherein the PI film thickness of the front protective film (2) is 1MIL + -0.05 MIL, and the AD layer thickness of the front protective film (2) is 30um + -5 um.
7. The bendable double-sided copper-clad substrate according to claim 5, wherein the PI film thickness of the back protective film (5) is 0.5 MILs ±0.05 MILs, and the AD layer thickness of the front protective film (2) is 15um±1.5um.
8. The bendable double-sided copper-clad substrate according to claim 1, wherein the thickness of the thermosetting adhesive layer (4) is 0.07+ -0.02 mm.
9. The bendable double-sided copper-clad substrate according to claim 1, wherein the thickness of the aluminum sheet (6) is 1.0+ -0.1 mm.
10. The bendable double-sided copper-clad substrate according to claim 1, wherein the joint of the reverse side protective film (5) and the aluminum sheet (6) is subjected to dispensing treatment by using UV0281 adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321117804.0U CN219938600U (en) | 2023-05-09 | 2023-05-09 | Bendable double-sided copper-clad substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321117804.0U CN219938600U (en) | 2023-05-09 | 2023-05-09 | Bendable double-sided copper-clad substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219938600U true CN219938600U (en) | 2023-10-31 |
Family
ID=88498087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321117804.0U Active CN219938600U (en) | 2023-05-09 | 2023-05-09 | Bendable double-sided copper-clad substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219938600U (en) |
-
2023
- 2023-05-09 CN CN202321117804.0U patent/CN219938600U/en active Active
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