CN219926151U - Shearing device for semiconductor component production and manufacturing - Google Patents
Shearing device for semiconductor component production and manufacturing Download PDFInfo
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- CN219926151U CN219926151U CN202320804575.3U CN202320804575U CN219926151U CN 219926151 U CN219926151 U CN 219926151U CN 202320804575 U CN202320804575 U CN 202320804575U CN 219926151 U CN219926151 U CN 219926151U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 60
- 238000010008 shearing Methods 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000005520 cutting process Methods 0.000 claims abstract description 30
- 230000007246 mechanism Effects 0.000 claims abstract description 3
- 238000012546 transfer Methods 0.000 claims description 7
- 238000012216 screening Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 13
- 238000009826 distribution Methods 0.000 abstract description 2
- 230000005012 migration Effects 0.000 abstract 1
- 238000013508 migration Methods 0.000 abstract 1
- 239000002994 raw material Substances 0.000 description 5
- 238000013459 approach Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- Shearing Machines (AREA)
Abstract
The utility model discloses a shearing device for producing and manufacturing semiconductor components, which relates to the field of producing and manufacturing semiconductor components and comprises a main body frame and a second hydraulic air rod, wherein an auxiliary frame is arranged in the main body frame, a first hydraulic air rod is arranged in the auxiliary frame, an inner cavity is arranged at the output end of the first hydraulic air rod, an adjusting component for moving the position is arranged in the inner cavity, the adjusting component comprises a servo motor, a screw rod, a connecting sleeve plate and a guide rod, the output end of the servo motor is provided with the screw rod, the connecting sleeve plate is arranged on the external thread of the screw rod, the guide rod is arranged outside the left side of the connecting sleeve plate in a sliding mode, and the adjusting component is provided with two groups. This shearing mechanism for semiconductor components and parts production is made through two sets of adjustment subassembly position distribution designs, is convenient for carry out the horizontal migration of optional position to cutting motor and cutting knife, is convenient for cut the semiconductor components and parts after spacing, uses in a flexible way.
Description
Technical Field
The utility model relates to the field of semiconductor component production and manufacturing, in particular to a shearing device for semiconductor component production and manufacturing.
Background
The semiconductor device is an electronic device having a conductive property between a good conductor and an insulator, and generally, when manufacturing the semiconductor device, a raw material needs to be sheared to obtain a semiconductor device of a desired size.
The utility model of application number CN202122921423.5 provides a shearing device for producing and manufacturing semiconductor components, which comprises a machine table and a machine frame fixed on the machine table. When raw materials pass through the material conveying opening, the clamping work is performed by pressing the upper part of the raw materials through the vertical clamping plates, and then the front side and the rear side of the raw materials are clamped through the horizontal clamping plates, so that the stability of clamping the raw materials can be improved, and the problem that the conventional clamping direction is generally unidirectional clamping and is unfavorable for shearing work is solved.
Similar to the above-mentioned application, there are currently disadvantages:
the existing shearing device needs to manually place the semiconductor device in a working area when shearing the semiconductor device, and most of the shearing device is placed singly, so that the shearing device is inconvenient to place in groups according to the type of the semiconductor device, and the shearing efficiency is affected.
Accordingly, in view of the above, research and improvement have been made on the conventional structure and defects, and a shearing apparatus for manufacturing semiconductor devices has been proposed.
Disclosure of Invention
The utility model aims to provide a shearing device for producing and manufacturing semiconductor components, which solves the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a shearing mechanism is used in semiconductor components and parts production, includes main part frame and second hydraulic pressure gas pole, the inside of main part frame is provided with the auxiliary frame, and the internally mounted of auxiliary frame has first hydraulic pressure gas pole, the output of first hydraulic pressure gas pole is provided with built-in chamber, and the inside of built-in chamber is provided with the adjustment subassembly that is used for carrying out the position and removes, the adjustment subassembly includes servo motor, lead screw, linking sleeve plate and guide bar, and installs the lead screw in servo motor's output, the external screw thread of lead screw installs the linking sleeve plate, and links up sleeve plate left side outside and slide and be provided with the guide bar, the adjustment subassembly is provided with two sets of, a set of adjustment subassembly externally mounted has cutting motor, and cutting motor's output is provided with the cutting knife, the built-in frame is installed to the below of cutting knife, and the inside slidable mounting of built-in frame has the locating plate, second hydraulic pressure gas pole sets up in locating plate one side surface middle part, the locating plate surface slides and is provided with the auxiliary assembly that is used for spacing to semiconductor components, and auxiliary assembly includes coupling spring and accessory plate, the tip of coupling spring installs the accessory plate.
Furthermore, the connecting springs and the auxiliary plates are arranged in two groups, and the connecting springs and the auxiliary plates are of an integrated structure.
Further, a conveyor belt is installed below the built-in frame, and a collecting frame is arranged outside the bottom of the conveyor belt.
Further, the inside of collecting the frame is hollow structure, and the inside of collecting the frame is provided with the collection subassembly that is used for carrying out screening collection.
Further, collection subassembly includes filter, spliced pole, adapter piece and electric putter, and the surface of filter is provided with the spliced pole, the adapter piece is installed at the top of spliced pole, electric putter is installed to the bottom of adapter piece.
Further, the locating plate is fixed with the second hydraulic air rod through screws, two groups of locating plates are arranged, and one group of locating plates far away from the second hydraulic air rod is fixedly connected with the outer surface of the auxiliary frame.
Furthermore, the built-in frame and the auxiliary frame are of an integrated structure, and the built-in frame is of a hollow rectangular structure.
The utility model provides a shearing device for producing and manufacturing semiconductor components, which has the following beneficial effects:
1. according to the utility model, through the position distribution design of the two groups of adjusting components, the horizontal movement of any position of the cutting motor and the cutting knife is facilitated, the semiconductor components after limiting are conveniently cut, and the use is flexible.
2. According to the utility model, the positioning plates can be driven to move in position through the design of the second hydraulic air rod, so that the two groups of positioning plates are conveniently moved to be close to each other through the position movement of the positioning plates, the semiconductor components to be sheared can be limited, the two groups of auxiliary plates can be mutually close to each other through the elasticity of the connecting springs, the semiconductor components placed between the two groups of auxiliary plates can be conveniently limited, after the semiconductor components limited by the positioning plates are sheared, a user can manually slide and place multiple groups of semiconductor components limited by the auxiliary components between the two groups of positioning plates, and the two groups of auxiliary components are mutually close to be secondarily limited by the positioning plates, so that the stability in the shearing process is ensured.
3. The utility model is convenient for collecting and classifying the cutting scraps and the semiconductor components through the design of the collecting assembly, and saves time and labor.
Drawings
FIG. 1 is a schematic view showing a front view and a perspective structure of a shearing device for manufacturing semiconductor devices according to the present utility model;
FIG. 2 is a schematic view showing the internal connection structure of an auxiliary frame of a shearing device for manufacturing semiconductor devices according to the present utility model;
FIG. 3 is a schematic view showing the bottom structure of a built-in cavity of a shearing device for manufacturing semiconductor devices according to the present utility model;
FIG. 4 is a schematic diagram showing a connection structure of a positioning plate of a shearing device for manufacturing semiconductor devices according to the present utility model;
FIG. 5 is an enlarged schematic view of the structure of the shearing device for manufacturing semiconductor devices of the present utility model at A in FIG. 1;
fig. 6 is a schematic view showing an internal connection structure of an auxiliary assembly of a shearing apparatus for manufacturing semiconductor devices according to the present utility model.
In the figure: 1. a main body frame; 2. an auxiliary frame; 3. a positioning plate; 4. a built-in frame; 5. a conveyor belt; 6. a collection assembly; 601. a filter plate; 602. a connecting column; 603. a transfer block; 604. an electric push rod; 7. a collection frame; 8. a built-in cavity; 9. a first hydraulic gas lever; 10. an adjustment assembly; 1001. a servo motor; 1002. a screw rod; 1003. a linking sleeve plate; 1004. a guide rod; 11. a cutting motor; 12. a cutting knife; 13. a second hydraulic air lever; 14. an auxiliary component; 1401. a connecting spring; 1402. and an auxiliary plate.
Detailed Description
Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.
As shown in fig. 1, 2, 3 and 4, a shearing device for manufacturing semiconductor components comprises a main body frame 1, an auxiliary frame 2, a positioning plate 3, a built-in frame 4, a conveyor belt 5, a collecting assembly 6, a filter plate 601, a connecting column 602, a transfer block 603, an electric push rod 604, a collecting frame 7, a built-in cavity 8, a first hydraulic pressure air rod 9, an adjusting assembly 10, a servo motor 1001, a screw rod 1002, a joint sleeve plate 1003, a guide rod 1004, a cutting motor 11, a cutting blade 12, a second hydraulic pressure air rod 13, an auxiliary assembly 14, a connecting spring 1401 and an auxiliary plate 1402, wherein the auxiliary frame 2 is arranged in the main body frame 1, the first hydraulic pressure air rod 9 is arranged in the auxiliary frame 2, the built-in cavity 8 is arranged at the output end of the first hydraulic pressure air rod 9, the adjusting assembly 10 for position movement is arranged in the built-in cavity 8, the adjusting assembly 10 comprises the servo motor 1001, the screw rod 1002, the joint sleeve plate 1003 and the guide rod 1004, and the output end of the servo motor 1001 is provided with a screw rod 1002, the external thread of the screw rod 1002 is provided with a joint sleeve plate 1003, the left side of the joint sleeve plate 1003 is externally provided with a guide rod 1004 in a sliding manner, the whole built-in cavity 8 can be driven to move up and down by the design of the first hydraulic air rod 9, so that the screw rod 1002 can be driven to rotate by the servo motor 1001 to drive the joint sleeve plate 1003 to move, and meanwhile, the guide rod 1004 is utilized to limit the position so as to facilitate the movement in the horizontal direction, the adjusting component 10 is provided with two groups, the outside of one group of adjusting components 10 is provided with a cutting motor 11, the output end of the cutting motor 11 is provided with a cutting knife 12, the adjusting components 10 are provided with two groups and are vertically distributed, thereby realizing the longitudinal and transverse movement of the cutting motor 11 and the cutting knife 12 arranged in the adjusting component 10, facilitating the cutting of semiconductor components, the lower part of the cutting knife 12 is provided with a built-in frame 4, the inside of the built-in frame 4 is slidably provided with a positioning plate 3, the built-in frame 4 and the auxiliary frame 2 are of an integrated structure, the built-in frame 4 is of a hollow rectangular structure, the positioning plate 3 and the second hydraulic air rod 13 are fixed by screws, the positioning plate 3 is provided with two groups, one group of positioning plates 3 far away from the second hydraulic air rod 13 is fixedly connected with the outer surface of the auxiliary frame 2, the lower part of the built-in frame 4 is provided with a conveyor belt 5, the outer part of the bottom of the conveyor belt 5 is provided with a collecting frame 7, the inside of the collecting frame 7 is of a hollow structure, the inside of the collecting frame 7 is provided with a collecting assembly 6 for screening and collecting, the collecting assembly 6 comprises a filter plate 601, a connecting column 602, a transfer block 603 and an electric push rod 604, the outer surface of the filter plate 601 is provided with the connecting column 602, the top of the connecting column 602 is provided with a transfer block 603, the electric push rod 604 is arranged at the bottom of the adapter 603, cutting scraps can fall on the upper surface of the filter plate 601 in the collecting frame 7 through the design of the filter plate 601, when the collecting amount of the collecting frame 7 is more, the scraps can be collected inside the collecting frame 7 by utilizing the designs of the connecting column 602, the adapter 603 and the electric push rod 604, so that the fluffy scraps are compacted, the collecting frame 7 can store more scraps, the sheared semiconductor devices or scraps can be collected by utilizing the design of the conveying belt 5 after the shearing work is finished and conveyed into the collecting frame 7, the second hydraulic air rod 13 is arranged in the middle part of the outer surface of one side of the locating plate 3, the locating plate 3 can be driven to move through the design of the second hydraulic air rod 13, the two groups of locating plates 3 are convenient to be mutually close through the position movement of the locating plate 3, thereby being capable of limiting the semiconductor components which need to be sheared.
As shown in fig. 1, 5 and 6, the outer surface of the positioning plate 3 is slidably provided with an auxiliary assembly 14 for limiting the semiconductor device, and the auxiliary assembly 14 comprises a connecting spring 1401 and an auxiliary plate 1402, the end part of the connecting spring 1401 is provided with the auxiliary plate 1402, the connecting spring 1401 and the auxiliary plate 1402 are provided with two groups, and the connecting spring 1401 and the auxiliary plate 1402 are of an integrated structure, and the two groups of auxiliary plates 1402 can be made to approach each other by the elastic force of the connecting spring 1401, so that the semiconductor device placed between the two groups of auxiliary plates 1402 can be limited, after the semiconductor device limited by the positioning plate 3 is sheared, a user can manually slide a plurality of groups of semiconductor devices limited by the auxiliary assembly 14 between the two groups of positioning plates 3, and the two groups of semiconductor devices are limited by the mutual approach of the positioning plate 3, so that the stability in the shearing process is ensured, and the shearing operation is facilitated.
In summary, the shearing device for semiconductor component production and manufacture can drive the whole built-in cavity 8 to move up and down through the design of the first hydraulic air rod 9 according to the structure shown in fig. 1-6, thereby driving the adapter sleeve plate 1003 to move when the lead screw 1002 is driven to rotate by the servo motor 1001, and simultaneously limiting by the guide rod 1004, facilitating the movement in the horizontal direction, the adjusting component 10 is provided with two groups and vertically distributed, thereby realizing the vertical and horizontal movement of the cutting motor 11 and the cutting knife 12 arranged in the adjusting component 10, facilitating the shearing of semiconductor components, facilitating the position movement of the positioning plate 3 through the design of the second hydraulic air rod 13 when the semiconductor components are fixed, facilitating the mutual approaching of the two groups of positioning plates 3 through the position movement of the positioning plate 3, limiting the semiconductor components required to be sheared, or facilitating the limiting of the semiconductor components placed between the two groups of the auxiliary plates 1402 through the elasticity of the connecting spring 1401, facilitating the limiting of the semiconductor components placed between the two groups of the auxiliary plates 1402, facilitating the shearing of the semiconductor components to be sheared by the two groups of the filter plate 3, and the semiconductor components to be sheared by the aid of the two groups of the filter plate 3, and the semiconductor components can be placed between the two groups of the filter plates to be sheared by the two groups of the filter plates to be placed in advance by the design of the filter plates 5, and the carrier plates to be placed between the two groups of the filter plates to be cut and the semiconductor components to be cut by the carrier plates to be placed in the carrier frame 5 after the carrier tape is placed in the carrier tape is stable after the cutting is placed on the carrier frame with the semiconductor components and cut by the carrier tape is in the carrier frame with the carrier tape 5, and can be cut by the chip cut and cut in the chip is stable before stable position is in the cutting cut in the position near the position before cutting position can is in the cutting cut can placed and cut can near the chip cut can cut can and cut can cut, can collect frame 7 collection volume more time, can utilize the design of spliced pole 602, adapter 603 and electric putter 604 to collect the inside piece of collecting frame 7 and oppress, be convenient for make fluffy piece compaction for collect frame 7 deposit more piece.
The embodiments of the utility model have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (7)
1. The utility model provides a shearing mechanism is used in semiconductor components and parts production, includes main part frame (1) and second hydraulic pressure gas pole (13), its characterized in that, the inside of main part frame (1) is provided with auxiliary frame (2), and auxiliary frame (2) internally mounted has first hydraulic pressure gas pole (9), the output of first hydraulic pressure gas pole (9) is provided with built-in chamber (8), and the inside of built-in chamber (8) is provided with adjustment subassembly (10) that are used for carrying out the position and remove, adjustment subassembly (10) include servo motor (1001), lead screw (1002), link up sleeve plate (1003) and guide bar (1004), and the output of servo motor (1001) is installed lead screw (1002), the external screw thread of lead screw (1002) is installed and is linked up sleeve plate (1003), and the outside slip of linking sleeve plate (1003) left side is provided with guide bar (1004), adjustment subassembly (10) are provided with two sets of, and a set of adjustment subassembly (10) externally mounted has cutting motor (11), and the output of cutting motor (11) is provided with cutting knife (12), the frame (3) below is installed in the inside of two side of frame (3) and is located the fixed a position plate (13), the outer surface of the positioning plate (3) is slidably provided with an auxiliary assembly (14) for limiting the semiconductor device, the auxiliary assembly (14) comprises a connecting spring (1401) and an auxiliary plate (1402), and the auxiliary plate (1402) is mounted at the end part of the connecting spring (1401).
2. The shearing apparatus for semiconductor device manufacturing according to claim 1, wherein the connection spring (1401) and the auxiliary plate (1402) are provided in two groups, and the connection spring (1401) and the auxiliary plate (1402) are of an integrated structure.
3. The shearing apparatus for semiconductor device manufacturing according to claim 1, wherein a conveyor belt (5) is installed below the built-in frame (4), and a collecting frame (7) is provided outside the bottom of the conveyor belt (5).
4. A shearing apparatus for semiconductor device manufacturing according to claim 3, wherein the inside of the collecting frame (7) is hollow, and a collecting unit (6) for screening and collecting is provided inside the collecting frame (7).
5. The shearing device for semiconductor component production and manufacturing according to claim 4, wherein the collecting assembly (6) comprises a filter plate (601), a connecting column (602), a transfer block (603) and an electric push rod (604), the outer surface of the filter plate (601) is provided with the connecting column (602), the transfer block (603) is installed at the top of the connecting column (602), and the electric push rod (604) is installed at the bottom of the transfer block (603).
6. The shearing device for manufacturing semiconductor components according to claim 1, wherein the positioning plate (3) and the second hydraulic air rod (13) are fixed by screws, two groups of positioning plates (3) are arranged, and one group of positioning plates (3) far away from the second hydraulic air rod (13) is fixedly connected with the outer surface of the auxiliary frame (2).
7. The shearing device for semiconductor component production and manufacturing according to claim 1, wherein the built-in frame (4) and the auxiliary frame (2) are of an integrated structure, and the built-in frame (4) is of a hollow rectangular structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320804575.3U CN219926151U (en) | 2023-04-12 | 2023-04-12 | Shearing device for semiconductor component production and manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320804575.3U CN219926151U (en) | 2023-04-12 | 2023-04-12 | Shearing device for semiconductor component production and manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219926151U true CN219926151U (en) | 2023-10-31 |
Family
ID=88502834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320804575.3U Active CN219926151U (en) | 2023-04-12 | 2023-04-12 | Shearing device for semiconductor component production and manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219926151U (en) |
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2023
- 2023-04-12 CN CN202320804575.3U patent/CN219926151U/en active Active
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