CN219917153U - High-power double-layer water-cooling heat dissipation plate - Google Patents
High-power double-layer water-cooling heat dissipation plate Download PDFInfo
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- CN219917153U CN219917153U CN202320665636.2U CN202320665636U CN219917153U CN 219917153 U CN219917153 U CN 219917153U CN 202320665636 U CN202320665636 U CN 202320665636U CN 219917153 U CN219917153 U CN 219917153U
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- flow channel
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 28
- 238000001816 cooling Methods 0.000 title claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 69
- 238000005192 partition Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 8
- 239000000498 cooling water Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-power double-layer water-cooling heat dissipation plate which comprises a substrate, a cover plate, a baffle plate and a plurality of heat radiators, wherein the substrate is provided with a water inlet, a water outlet and a water tank with an opening at the upper side; the radiator is discontinuously arranged in the upper-layer runner and the lower-layer runner. The high-power double-layer water-cooling heat-dissipating plate can conduct high-power heat dissipation, is rapid in cooling and good in heat dissipation effect.
Description
Technical Field
The utility model relates to heat dissipation equipment, in particular to a high-power double-layer water-cooling heat dissipation plate.
Background
The wafer can generate high heat, and if the heat is not discharged in time, the temperature of the wafer can be increased, the performance of the wafer is affected, and even the wafer is burnt out in severe cases, so that the wafer needs to be quickly cooled by using a cooling plate. At present, a water-cooling heat dissipation plate is generally used for cooling a wafer, and a water tank is arranged on a heat dissipation substrate to enable cooling water to continuously flow, so that the wafer is transferred to the heat dissipation substrate, and the cooling water takes away heat. However, the conventional water-cooled heat sink has very limited heat dissipation power, and has poor heat dissipation effect for high-power chips.
Disclosure of Invention
The utility model aims to provide a high-power double-layer water-cooling heat-dissipating plate which has high power, rapid heat dissipation and good heat dissipation effect.
In order to achieve the above purpose, the high-power double-layer water-cooling heat dissipation plate provided by the utility model comprises a substrate, a cover plate, a baffle plate and a plurality of heat sinks, wherein the substrate is provided with a water inlet, a water outlet and a water tank with an opening at the upper side, the cover plate is arranged at the upper side of the substrate and hermetically covers the opening of the water tank, the baffle plate is arranged in the water tank to divide the water tank into an upper-layer flow channel and a lower-layer flow channel, the water inlet is communicated with one end of the upper-layer flow channel and one end of the lower-layer flow channel, and the water outlet is communicated with the other end of the upper-layer flow channel and the other end of the lower-layer flow channel; the radiator is discontinuously arranged in the upper-layer runner and the lower-layer runner.
Compared with the prior art, the heat dissipation device has the advantages that the water tank is arranged on the substrate, the partition plate is arranged in the water tank, the water tank is divided into the upper-layer flow channel and the lower-layer flow channel by the partition plate, and the radiator is arranged in the upper-layer flow channel and the lower-layer flow channel, so that double-layer flow channel heat dissipation can be performed, heat dissipation power is doubled, and high-power heat dissipation can be performed rapidly. In addition, through the radiator is intermittently arranged in the upper-layer runner and the lower-layer runner, a certain distance is reserved between two adjacent radiators in the same runner, so that turbulence is generated when water flows from the former radiator to the latter radiator, interaction is achieved, water flow resistance is reduced, heat dissipation capacity is further improved, and heat dissipation effect is greatly improved.
Preferably, the radiator comprises an upper plate, a lower plate and a plurality of connecting plates, one end of each connecting plate is fixedly connected with the upper plate, the other end of each connecting plate is fixedly connected with the lower plate, and the length extending direction of each connecting plate is the same as the extending direction of the water tank. Therefore, the radiator is provided with a plurality of radiating surfaces which are contacted with water flow and perform heat exchange, the radiating area is greatly increased, the radiating effect is improved, and high-power radiation is realized.
Preferably, a first step is arranged at the edge of the opening of the water tank, and the cover plate is arranged on the surface of the first step. Therefore, the cover plate can cover the opening of the water tank, and the cover plate is flush with the surface of the base plate, so that the surface contact with the wafer is facilitated.
Preferably, a second step is arranged in the middle of the inner wall of the water tank, and the partition board is borne on the surface of the second step. Through setting up the second step, can be right the baffle is fixed a position fast, improves the convenience of equipment to effectively prevent that the baffle from taking place to shift in the use, guarantee the integrality of upper strata flow channel and lower floor's flow channel.
Preferably, the width of the upper layer flow channel is larger than the width of the lower layer flow channel. Therefore, the radiator can be quickly arranged on the lower-layer runner and the upper-layer runner, and the convenience of assembly is improved.
Preferably, the water inlet joint and the water outlet joint are further included, the water inlet joint is arranged at the water inlet, and the water outlet joint is arranged at the water outlet. Therefore, the water inlet and the water outlet can be quickly connected to the pipeline of the external equipment, and the convenience of connection is improved.
Preferably, the cover plate is provided with a connecting lug, the base plate is provided with a connecting hole corresponding to the connecting lug, and the connecting lug is connected to the connecting hole through a screw, so that the cover plate is fixed on the base plate.
Drawings
Fig. 1 is a perspective view of a high-power double-layer water-cooled heat sink of the present utility model.
Fig. 2 is an internal structural view of the high-power double-layer water-cooling heat sink of the present utility model.
Fig. 3 is an exploded view of the high power double-layered water-cooled heat sink of the present utility model.
Fig. 4 is a structural view of a substrate of the high-power double-layer water-cooled heat sink of the present utility model.
Fig. 5 is a structural view of a radiator of the high-power double-layer water-cooled heat dissipating plate of the present utility model.
Fig. 6 is a cross-sectional view taken along A-A in fig. 2.
Detailed Description
In order to describe the technical content, the constructional features and the effects achieved by the present utility model in detail, the following description is made with reference to the embodiments in conjunction with the accompanying drawings.
As shown in fig. 1 to 4 and fig. 6, the high-power double-layer water-cooling heat dissipating plate 100 of the present utility model comprises a substrate 1, a cover plate 2, a partition plate 3, and a plurality of heat sinks 4, wherein the substrate 1 is provided with a water inlet 11, a water outlet 12, and a water tank 13 with an opening on the upper side, the cover plate 2 is disposed on the upper side of the substrate 1 and hermetically covers the opening of the water tank 13, and the cover plate 2 is hermetically connected with the substrate 1 by brazing. The partition plate 3 is arranged in the water tank 13 to divide the water tank 13 into an upper-layer flow channel 131 and a lower-layer flow channel 132, the water inlet 11 is communicated with one ends of the upper-layer flow channel 131 and the lower-layer flow channel 132, and the water outlet 12 is communicated with the other ends of the upper-layer flow channel 131 and the lower-layer flow channel 132; the radiator 4 is intermittently arranged in the upper-layer runner 131 and the lower-layer runner 132, the radiator 4 positioned at the lower layer is in contact with the partition plate 3, and the radiator 4 positioned at the upper layer is respectively in contact with the partition plate 3 and the cover plate 2 so as to be beneficial to heat conduction.
Referring to fig. 5, the heat spreader 4 includes an upper plate 41, a lower plate 42, and a plurality of connecting plates 43, wherein the upper plate 41, the lower plate 42, and the connecting plates 43 are made of a material with better heat conductivity, such as aluminum; one end of the connecting plate 43 is fixedly connected with the upper plate 41, the other end is fixedly connected with the lower plate 42, the length extending direction of the connecting plate 43 is the same as the extending direction of the water tank 13, and a plurality of connecting plates 43 are arranged side by side and form a gap 4a for water to pass through between adjacent two. Therefore, the radiator 4 is provided with a plurality of radiating surfaces which are contacted with water flow and perform heat exchange, the radiating area is greatly increased, the radiating effect is improved, and high-power radiation is realized.
Referring to fig. 4 again, a first step 13a is disposed at the edge of the opening of the water tank 13, and the cover 2 is disposed on the surface of the first step 13 a. Thus, the cover plate 2 can cover the opening of the water tank 13, and the cover plate 2 can be flush with the surface of the base plate 1, so that the surface contact with the wafer is facilitated. The middle part of the inner wall of the water tank 13 is provided with a second step 13b, and the partition plate 3 is supported on the surface of the second step 13 b. By arranging the second step 13b, the partition plate 3 can be rapidly positioned, the convenience of assembly is improved, the partition plate 3 is effectively prevented from shifting in the use process, and the integrity of the upper layer flow channel 131 and the lower layer flow channel 132 is ensured. The width of the upper layer flow channel 131 is greater than the width of the lower layer flow channel 132. This facilitates rapid mounting of the radiator 4 to the lower layer flow path 132 and the upper layer flow path 131, and improves convenience of assembly.
As shown in fig. 2 and 3, the high-power double-layer water-cooling heat dissipation plate 100 further includes a water inlet joint 5 and a water outlet joint 6, the water inlet joint 5 is disposed at the water inlet 11, and the water outlet joint 6 is disposed at the water outlet 12. In this way, the water inlet 11 and the water outlet 12 can be quickly connected to the pipeline of the external equipment, and the convenience of connection is improved.
As shown in fig. 3 and 4, the cover plate 2 is provided with a connecting lug 21, the base plate 1 is provided with a connecting hole 14 corresponding to the connecting lug 21, and the cover plate 2 is fixed to the base plate 1 by connecting the connecting hole 14 through the connecting lug 21 by a screw.
Compared with the prior art, the utility model has the advantages that the water tank 13 is arranged on the substrate 1, the partition plate 3 is arranged in the water tank 13, the water tank 13 is divided into the upper-layer flow channel 131 and the lower-layer flow channel 132 by the partition plate 3, and the radiator 4 is arranged in the upper-layer flow channel 131 and the lower-layer flow channel 132, so that double-layer flow channel heat dissipation can be carried out, the heat dissipation power can be multiplied, and the high-power heat dissipation can be rapidly cooled. In addition, the heat sinks 4 are intermittently arranged in the upper-layer flow channel 131 and the lower-layer flow channel 132, and a certain distance is reserved between two adjacent heat sinks 4 in the same flow channel, so that turbulence is generated when water flows from the former heat sink 4 to the latter heat sink 4, interaction is achieved, water flow resistance is reduced, heat dissipation capacity is further improved, and heat dissipation effect is greatly improved.
The foregoing disclosure is merely illustrative of the principles of the present utility model, and thus, it is intended that the scope of the utility model be limited thereto and not by this disclosure, but by the claims appended hereto.
Claims (2)
1. A high-power double-deck water-cooling heating panel, its characterized in that: the water tank is divided into an upper-layer flow channel and a lower-layer flow channel by the partition plate, and the width of the upper-layer flow channel is larger than that of the lower-layer flow channel; the edge of the opening of the water tank is provided with a first step, and the cover plate is arranged on the surface of the first step; the middle part of the inner wall of the water tank is provided with a second step, and the partition board is supported on the surface of the second step; the water inlet is communicated with one ends of the upper-layer runner and the lower-layer runner, and the water outlet is communicated with the other ends of the upper-layer runner and the lower-layer runner; the radiator is discontinuously arranged in the upper-layer runner and the lower-layer runner; the radiator comprises an upper plate, a lower plate and a plurality of connecting plates, one end of each connecting plate is fixedly connected with the upper plate, the other end of each connecting plate is fixedly connected with the lower plate, and the length extension direction of each connecting plate is the same as the extension direction of the corresponding water tank; the high-power double-layer water-cooling heat dissipation plate further comprises a water inlet connector and a water outlet connector, wherein the water inlet connector is arranged at the water inlet, and the water outlet connector is arranged at the water outlet.
2. The high-power double-layer water-cooling heat sink according to claim 1, wherein: the cover plate is provided with a connecting lug, the base plate is provided with a connecting hole corresponding to the connecting lug, and the connecting lug is connected to the connecting hole through a screw, so that the cover plate is fixed on the base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320665636.2U CN219917153U (en) | 2023-03-29 | 2023-03-29 | High-power double-layer water-cooling heat dissipation plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320665636.2U CN219917153U (en) | 2023-03-29 | 2023-03-29 | High-power double-layer water-cooling heat dissipation plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219917153U true CN219917153U (en) | 2023-10-27 |
Family
ID=88466133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320665636.2U Active CN219917153U (en) | 2023-03-29 | 2023-03-29 | High-power double-layer water-cooling heat dissipation plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219917153U (en) |
-
2023
- 2023-03-29 CN CN202320665636.2U patent/CN219917153U/en active Active
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