CN219917076U - Adhesive film fixing ring removing device - Google Patents
Adhesive film fixing ring removing device Download PDFInfo
- Publication number
- CN219917076U CN219917076U CN202320682137.4U CN202320682137U CN219917076U CN 219917076 U CN219917076 U CN 219917076U CN 202320682137 U CN202320682137 U CN 202320682137U CN 219917076 U CN219917076 U CN 219917076U
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- CN
- China
- Prior art keywords
- adhesive film
- pressing portion
- fixing ring
- removing device
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 104
- 239000004065 semiconductor Substances 0.000 claims abstract description 45
- 239000007787 solid Substances 0.000 claims 4
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 238000012536 packaging technology Methods 0.000 claims 1
- 238000012858 packaging process Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a device for removing a fixed ring of an adhesive film, which is used for separating the adhesive film and the fixed ring of the adhesive film adopted by a semiconductor packaging process, wherein the middle part of the fixed ring of the adhesive film is provided with a hollow area, when a semiconductor wafer positioned in the hollow area is arranged on the adhesive film, a first annular interval space is arranged between the outer edge of the semiconductor wafer and the inner side wall of the fixed ring of the adhesive film, and the device for removing the fixed ring of the adhesive film comprises a pressing part and an operating part. The pressing part is of an annular structure capable of being placed in the first interval space; the operation part is arranged on one side of the pressing part, and comprises an operation handle and a connecting part for connecting the operation handle and the pressing part, and the operation handle is spaced from the pressing part. The adhesive film fixing ring removing device is convenient for separating the adhesive film fixing ring from the adhesive film, the pressing part presses the adhesive film inside the adhesive film fixing ring, the adhesive film inside the pressing part is protected from being influenced by external force for removing the adhesive film fixing ring, and the yield of the semiconductor wafer is improved.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to an adhesive film fixing ring removing device.
Background
In semiconductor packaging, it is often necessary to adhesively secure a semiconductor device or semiconductor structure to an operating platform via a blue film, which is then packaged to form a semiconductor wafer or semiconductor product. The blue membrane is usually fixed to the operating platform by a fixing ring (also called ring). It is often necessary to separate the blue film from the retaining ring after packaging is complete. In the related art, the operator usually directly presses the edge of the blue film by hand, then lifts and peels off the fixing ring, the blue film and the fixing ring are separated with a certain difficulty, and the original form of the blue film is easily damaged in the process of lifting and peeling off the fixing ring by hand pressing, so that the damage to the semiconductor wafer or the semiconductor product is easily caused.
Disclosure of Invention
The utility model provides a device for removing a binding film fixing ring, which is used for separating the binding film and the binding film fixing ring adopted in a semiconductor packaging process, wherein the middle part of the binding film fixing ring is provided with a hollow area, and when a semiconductor wafer positioned in the hollow area is arranged on the binding film, a ring-shaped first interval space is arranged between the outer edge of the semiconductor wafer and the inner side wall of the binding film fixing ring, and the device for removing the binding film fixing ring comprises:
a pressing portion having an annular structure capable of being placed in the first space;
and the operation part is arranged on one side of the pressing part and comprises an operation handle and a connecting part for connecting the operation handle and the pressing part, and the operation handle is spaced from the pressing part.
In some embodiments, the pressing portion is a closed loop structure.
In some embodiments, the pressing portion has a circular shape in orthographic projection in a thickness direction.
In some embodiments, a radial dimension of an inner edge of the pressing portion is greater than a radial dimension of the semiconductor wafer, and/or;
the radial dimension of the outer edge of the pressing part is smaller than or equal to the radial dimension of the inner side wall of the adhesive film fixing ring.
In some embodiments, a distance between an outer edge of the pressing portion and an inner sidewall of the adhesive film fixing ring is less than or equal to a distance between an inner edge of the pressing portion and the semiconductor wafer.
In some embodiments, the pressing portion has a radial dimension of 1cm-2cm.
In some embodiments, the connection portion extends in a direction that coincides with a thickness direction of the pressing portion.
In some embodiments, the connecting portion includes at least two connecting portions provided on the same side as the pressing portion, and the operating handle is connected to at least two of the connecting portions.
In some embodiments, the at least two connection portions are uniformly arranged on the same side of the pressing portion.
In some embodiments, the operating handle is spaced from the pressing portion by a distance of 5cm to 15cm.
According to the adhesive film fixing ring removing device provided by the embodiment of the utility model, the pressing part can be arranged in the first interval space to press on the adhesive film, and the adhesive film is fixed by applying the acting force through the operating part, so that the adhesive film fixing ring can be separated from the adhesive film easily, in the process of removing the adhesive film fixing ring, the pressing part presses on the adhesive film inside the adhesive film fixing ring, the adhesive film inside the pressing part is protected, namely, the adhesive film area bonded by a semiconductor wafer is not influenced by the external force of the adhesive film fixing ring, and the yield of the semiconductor wafer is improved.
Drawings
FIG. 1 is a top view of an adhesive film retaining ring removal device according to an exemplary embodiment of the present utility model;
FIG. 2 is a side view of an adhesive film retaining ring removal device according to an exemplary embodiment of the present utility model;
fig. 3 to 5 are partial process drawings showing removal of an adhesive film fixing ring according to an exemplary embodiment of the present utility model.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the utility model. Rather, they are merely examples of apparatus and methods consistent with aspects of the utility model as detailed in the accompanying claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. The use of the terms "a" or "an" and the like in the description and in the claims do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" means two or more. The word "comprising" or "comprises", and the like, means that elements or items appearing before "comprising" or "comprising" are encompassed by the element or item recited after "comprising" or "comprising" and equivalents thereof, and that other elements or items are not excluded. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms "upper" and/or "lower" and the like are used for ease of description only and are not limited to one position or one spatial orientation. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The utility model provides a device for removing a fixed ring of an adhesive film, which is used for separating the adhesive film and the fixed ring of the adhesive film adopted by a semiconductor packaging process, wherein the middle part of the fixed ring of the adhesive film is provided with a hollow area, when a semiconductor wafer positioned in the hollow area is arranged on the adhesive film, a first annular interval space is arranged between the outer edge of the semiconductor wafer and the inner side wall of the fixed ring of the adhesive film, and the device for removing the fixed ring of the adhesive film comprises a pressing part and an operating part. The pressing part is of an annular structure capable of being placed in the first interval space; the operation part is arranged on one side of the pressing part and comprises a connection part for connecting the operation handle with the pressing part, and the operation handle is spaced from the pressing part. According to the adhesive film fixing ring removing device, the pressing part can be arranged in the first interval space to press the adhesive film, and the adhesive film is fixed by applying the acting force through the operating part, so that the adhesive film fixing ring can be separated from the adhesive film easily, and in the process of removing the adhesive film fixing ring, the pressing part presses the adhesive film inside the adhesive film fixing ring, so that the adhesive film inside the pressing part is protected, namely, the adhesive film area bonded by a semiconductor wafer is not influenced by the external force for removing the adhesive film fixing ring, and the yield of the semiconductor wafer is improved.
The adhesive film fixing ring removing device of the present utility model will be described in detail with reference to fig. 1 to 5.
Referring to fig. 1, and referring to fig. 2 to 5 when necessary, the adhesive film fixing ring removing apparatus 100 is used for separating an adhesive film 300 and an adhesive film fixing ring 200 used in a semiconductor packaging process, wherein a hollow area 2001 is formed in the middle of the adhesive film fixing ring 200, and a first annular space 3001 is formed between an outer edge 401 of the semiconductor wafer 400 and an inner sidewall 201 of the adhesive film fixing ring 200 when the semiconductor wafer 400 located in the hollow area 2001 is disposed on the adhesive film 300.
The adhesive film fixing ring removing device 100 includes a pressing portion 10 and an operating portion 20. The pressing portion 10 is an annular structure that can be placed in the first space 3001. An operation part 20 is provided on one side of the pressing part 10, and includes an operation handle 21 and a connection part 22 connecting the operation handle 21 and the pressing part 10, and the operation handle 21 is spaced from the pressing part 10 so as to be held by an operator's hand.
The pressing portion 10 may be made of a rigid material such as stainless steel, which is not easy to deform, so as to ensure that the pressing portion 10 is not easy to deform. Accordingly, the pressing portion 10 may be a steel ring. The material of the operation portion 20 may be identical to that of the pressing portion 10, so that the operation portion 20 and the pressing portion 10 may be integrally formed. Of course, in other embodiments, the operation portion 20 and the pressing portion 10 may not be made of the same material, or may not be integrally formed.
It is understood that the semiconductor packaging process is performed on an operating platform (also known as a support platform or platen) for packaging. Adhesive film 300 herein may be a blue film, or other adhesive film having a similar function. Adhesive film retaining ring 200 may be used to flatten and secure the adhesive film to the handling platform. At the completion of the semiconductor packaging process, the adhesive film fixing ring 200 needs to be removed from the adhesive film 300.
The adhesive film fixing ring removing apparatus 100 used herein may be directly performed on a handling platform (not shown) after the encapsulation process is completed. Or transferring to a platform such as an electrostatic table or an electrostatic station. When adhesive film holding ring 200 is removed, adhesive film 300 faces the handling platform, and adhesive film holding ring 200 and semiconductor wafer 400 are located on the side of adhesive film 300 facing away from the handling platform.
As shown in fig. 3 to 5, when the adhesive film fixing ring 200 is removed by using the adhesive film fixing ring removing device 100, the pressing portion 10 of the adhesive film fixing ring removing device 100 presses the adhesive film 300 on the same side of the adhesive film fixing ring 200 and the semiconductor wafer 400 in the region corresponding to the first space 3001. Further, the operator can remove the adhesive film fixing ring 200 by applying a pressing force to the operation handle 21 of the operation portion 20 toward the pressing portion 10 and simultaneously applying a pulling force to the adhesive film fixing ring 200 away from the adhesive film 300.
With continued reference to fig. 1, in some embodiments, the pressing portion 10 has a closed ring structure, so that when the adhesive film fixing ring 200 is operated to remove the adhesive film fixing ring 200, even if there is a certain pulling force on the adhesive film 300 by the adhesive film fixing ring 200, the pressing portion 10 can block the stress outside the entire ring-shaped pressing portion 10 from extending inward, thereby ensuring that the adhesive film 300 inside the pressing portion 10 is not affected.
Of course, in other embodiments, the pressing portion may also be a ring-shaped structure having a partial disconnection. It will be appreciated that the broken area is much smaller than the annular body, so that a relatively good blocking of the transmission of stresses on the adhesive film outside the pressing portion to the inner area of the pressing portion is ensured.
It will be appreciated that in some embodiments, the peripheral profile of the semiconductor wafer is generally circular and the adhesive film retaining ring is also generally correspondingly circular. Accordingly, in some embodiments, the orthographic projection of the pressing portion 10 in the thickness direction T is in a circular ring shape.
Of course, in other embodiments, the orthographic projection of the pressing portion in the thickness direction T may take other shapes, and may be correspondingly configured according to the specific shapes of the semiconductor wafer and the adhesive film fixing ring.
As shown in fig. 3 and 4, in some embodiments, the radial dimension D1 of the inner edge 101 of the pressing portion 10 is greater than the radial dimension D1 of the semiconductor wafer 400, so that damage to the semiconductor wafer 400 caused by the pressing portion 10 contacting the semiconductor wafer 400 can be effectively avoided or reduced when the pressing portion 10 is located in the first spacing space 3001.
In some embodiments, the radial dimension D2 of the outer edge of the pressing portion 10 is less than or equal to the radial dimension D2 of the inner sidewall 201 of the adhesive film fixing ring 200. Preferably, the radial dimension D2 of the outer edge of the pressing part 10 is smaller than the radial dimension D2 of the inner sidewall 201 of the adhesive film fixing ring 200 to ensure or reduce the pressing of the pressing part 10 to the adhesive film fixing ring 200 so that the adhesive film fixing ring 200 is not easily pulled up.
In some embodiments, the distance between the outer edge of the pressing portion 10 and the inner sidewall 201 of the adhesive film fixing ring 200 is smaller than or equal to the distance between the inner edge 101 of the pressing portion 10 and the semiconductor wafer 400, which is more beneficial to avoid damage to the semiconductor wafer 400 caused by the contact of the pressing portion 10 with the semiconductor wafer 400.
In some embodiments, the radial dimension d of the pressing portion 10 is 1cm-2cm, which can achieve a better separation effect.
Alternatively, in some embodiments, the radial dimension of the first spacing space 3001 may be 5cm-6cm. The radial dimension d of the pressing portion 10 is set to 1cm to 2cm, so that the pressing portion 10 can be set to have a good pressing action while also being capable of well avoiding the pressing portion 10 from contacting the semiconductor wafer 400 and the adhesive film fixing ring 200.
In some embodiments, the extension direction of the connection portion 22 coincides with the thickness direction T of the pressing portion 10.
Here, the extending direction of the connection portion 22 coincides with the thickness direction T of the pressing portion 10, and in some embodiments, it may be understood that the extending direction of the connection portion 22 is parallel or substantially parallel to the thickness direction T of the pressing portion 10, i.e. the extending direction of the connection portion 22 is perpendicular to a plane defined by the pressing portion 10.
Of course, in other embodiments, it is also understood that the connecting portion 22 extends entirely from the pressing portion 10 toward a side facing away from the pressing portion 10.
In some embodiments, the connecting portion 22 includes at least two connecting portions 22 disposed on the same side of the pressing portion 10, and the operating handle 21 is connected to at least two connecting portions 22, so that when a pressing force is applied to the operating handle 21, the force can be better transferred to the pressing portion 10 in a dispersed manner, so that the circumferential force of the pressing portion 10 is dispersed, and the concentrated force applied to the adhesive film 300 is reduced.
In some embodiments, the at least two connecting portions 22 are uniformly arranged on the same side of the pressing portion 10, so as to make the circumferential acting force of the pressing portion 10 relatively uniform.
In some embodiments, the distance d3 between the operating handle 21 and the pressing portion 10 is 5cm to 15cm, so that the user can hold the operation.
In the present utility model, the structural embodiments and the method embodiments may complement each other without collision.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather to enable any modification, equivalent replacement, improvement or the like to be made within the spirit and principles of the utility model.
Claims (10)
1. The utility model provides a cohesive film solid fixed ring remove device for the cohesive film and the fixed ring of cohesive film that adopts of semiconductor packaging technology separate, cohesive film solid fixed ring middle part has the cavity district, be equipped with on the cohesive film be located when the semiconductor wafer of cavity district, have cyclic annular first interval space between the outward flange of semiconductor wafer and the inside wall of cohesive film solid fixed ring, its characterized in that, cohesive film solid fixed ring remove device includes:
a pressing portion having an annular structure capable of being placed in the first space;
and the operation part is arranged on one side of the pressing part and comprises an operation handle and a connecting part for connecting the operation handle and the pressing part, and the operation handle is spaced from the pressing part.
2. The adhesive film holding loop removing device according to claim 1, wherein the pressing portion has a closed loop structure.
3. The adhesive film fixing ring removing device according to claim 2, wherein an orthographic projection of the pressing portion in a thickness direction is annular.
4. An adhesive film holding ring removing device according to any one of claims 1 to 3, wherein a radial dimension of an inner edge of the pressing portion is larger than a radial dimension of the semiconductor wafer, and/or;
the radial dimension of the outer edge of the pressing part is smaller than or equal to the radial dimension of the inner side wall of the adhesive film fixing ring.
5. The adhesive film fixing ring removing apparatus according to claim 4, wherein a distance between an outer edge of the pressing portion and an inner side wall of the adhesive film fixing ring is smaller than or equal to a distance between an inner edge of the pressing portion and the semiconductor wafer.
6. An adhesive film holding ring removing device according to any one of claims 1 to 3, wherein the pressing portion has a radial dimension of 1cm to 2cm.
7. The adhesive film fixing ring removing device according to claim 1, wherein an extending direction of the connecting portion coincides with a thickness direction of the pressing portion.
8. The adhesive film holding loop removing device according to claim 1, wherein said connecting portion includes at least two connecting portions provided on the same side as said pressing portion, and said operating handle is connected to at least two of said connecting portions.
9. The adhesive film holding loop removing device according to claim 8, wherein the at least two connecting portions are uniformly arranged on the same side of the pressing portion.
10. The adhesive film holding loop removing device according to claim 1, wherein a distance between the operating handle and the pressing portion is 5cm to 15cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320682137.4U CN219917076U (en) | 2023-03-30 | 2023-03-30 | Adhesive film fixing ring removing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320682137.4U CN219917076U (en) | 2023-03-30 | 2023-03-30 | Adhesive film fixing ring removing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219917076U true CN219917076U (en) | 2023-10-27 |
Family
ID=88424827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320682137.4U Active CN219917076U (en) | 2023-03-30 | 2023-03-30 | Adhesive film fixing ring removing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219917076U (en) |
-
2023
- 2023-03-30 CN CN202320682137.4U patent/CN219917076U/en active Active
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