CN219917070U - Thickness measuring device for silicon wafer - Google Patents
Thickness measuring device for silicon wafer Download PDFInfo
- Publication number
- CN219917070U CN219917070U CN202321191025.5U CN202321191025U CN219917070U CN 219917070 U CN219917070 U CN 219917070U CN 202321191025 U CN202321191025 U CN 202321191025U CN 219917070 U CN219917070 U CN 219917070U
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- China
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- silicon wafer
- measuring table
- mounting plate
- distance sensors
- measuring
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 58
- 239000010703 silicon Substances 0.000 title claims abstract description 58
- 235000012431 wafers Nutrition 0.000 claims abstract description 57
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 101000900567 Pisum sativum Disease resistance response protein Pi49 Proteins 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a thickness measuring device for silicon wafers, which belongs to the technical field of silicon wafer processing and comprises a measuring table, a storage seat arranged on the measuring table and a measuring mechanism arranged on the measuring table, wherein a silicon wafer storage groove is formed on the storage seat, an inverted U-shaped bearing frame is fixedly welded on the top wall of the measuring table, an inner mounting plate and an outer mounting plate are welded on the bottom wall of the bearing frame, the measuring mechanism comprises a plurality of first distance sensors arranged on the bottom wall of the inner mounting plate, a plurality of second distance sensors arranged on the bottom wall of the outer mounting plate, a display screen and a controller, the display screen and the controller are arranged on the side wall of the bearing frame, the first distance sensors are distributed on the inner mounting plate in a circumferential array, and the second distance sensors are distributed on the outer mounting plate in a circumferential array. The thickness measuring device of the silicon wafer obtains the thickness value of the silicon wafer in a state of ensuring the maintenance level of the silicon wafer, so that the measured thickness value is more accurate.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer processing, and particularly relates to a thickness measuring device for a silicon wafer.
Background
Silicon wafers, also known as wafers, are fabricated from silicon ingots, and millions of transistors can be etched on a silicon wafer by specialized processes, which are widely used in the fabrication of integrated circuits.
In carrying out the present utility model, the inventors have found that at least the following problems exist in this technology: in the process of processing and manufacturing silicon wafers, it is necessary to measure the thickness of the silicon wafer. Most of the current measuring apparatuses cannot detect the levelness of a silicon wafer, resulting in inaccurate data for measuring the thickness of the silicon wafer in a state where the silicon wafer is not level.
For this reason, we propose a thickness measuring device for silicon wafers that solves the above-mentioned problems.
Disclosure of Invention
The utility model mainly aims to provide a thickness measuring device for a silicon wafer, which can obtain the thickness value of the silicon wafer in a state of ensuring the holding level of the silicon wafer, so that the measured thickness value is more accurate, and the problems in the background technology can be effectively solved.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the thickness measuring device for the silicon wafer comprises a measuring table, a storage seat arranged on the measuring table and a measuring mechanism arranged on the measuring table, wherein a silicon wafer storage groove is formed on the storage seat, an inverted U-shaped bearing frame is fixedly welded on the top wall of the measuring table, and an inner mounting disc and an outer mounting disc are welded on the bottom wall of the bearing frame;
the measuring mechanism comprises a plurality of first distance sensors arranged on the bottom wall of the inner mounting disc, a plurality of second distance sensors arranged on the bottom wall of the outer mounting disc, a display screen arranged on the side wall of the bearing frame and a controller, wherein the first distance sensors are distributed in a circumferential array on the inner mounting disc, and the second distance sensors are distributed in a circumferential array on the outer mounting disc;
the inner mounting plate and the outer mounting plate are horizontally arranged and the heights of the bottom walls of the inner mounting plate and the outer mounting plate are the same, the first distance sensor and the second distance sensor are installed in the vertical direction and are measured in the vertical direction, and the first distance sensor, the second distance sensor and the display screen are all connected with the controller in a coupling mode.
As a preferable implementation scheme, one side of the measuring table is fixedly provided with a cylinder, and the cylinder is coaxially connected with a telescopic rod; the cylinder is horizontally arranged.
As a preferred embodiment, the inner cavity of the measuring table is arranged on the top wall and the two side walls of the measuring table, the two sides of the inner cavity of the measuring table are respectively provided with a side chute, and one end of the telescopic rod is connected with the inner wall of one side chute; so that the telescopic rod can be telescopic in the sideslip groove.
As a preferred embodiment, a sliding rod is fixedly welded in the other side sliding groove, a conveying base is horizontally arranged in the inner cavity of the measuring table, one end of the conveying base is connected with the telescopic rod, and the other end of the conveying base is sleeved on the sliding rod in a sliding manner; so that the telescopic rod can drive the conveying base to translate along the sliding rod when being telescopic.
As a preferred embodiment, the inner cavity of the conveying base is formed on the top wall of the conveying base, and the bottom of the storage base is anastomosed and inserted into the inner cavity of the conveying base; so that the storage seat can translate along with the translation of the conveying base.
In summary, the technical effects and advantages of the present utility model are:
according to the thickness measuring device for the silicon wafer, the heights of different positions on the silicon wafer are measured through the plurality of first distance sensors, when the plurality of height data are the same, the silicon wafer is kept level, the plurality of first distance sensors transmit electric signals to the controller, so that a plurality of data are displayed on the display screen, the thickness value of the silicon wafer can be obtained through subtracting the value of the data from the distance between the second distance sensor and the bottom wall of the silicon wafer storage groove, and the thickness value of the silicon wafer is obtained under the condition that the silicon wafer is kept level, so that the measured thickness value is more accurate;
the second distance sensors work to detect the distance value between the second distance sensors and the storage groove and transmit an electric signal to the controller, and when the silicon wafer storage groove is kept horizontal, the distance value at the measuring positions of the second distance sensors is the same, so that the bottom wall of the storage groove is ensured to be horizontal, and the thickness of the silicon wafer is calculated;
according to the thickness measuring device for the silicon wafer, the cylinder is driven to operate to drive the telescopic rod to extend, so that the object placing table and the silicon wafer on the object placing table can be automatically output, and the silicon wafer can be ensured to be stably output before and after measurement.
Drawings
FIG. 1 is a schematic view of a structure of one side of the present utility model;
FIG. 2 is a schematic view of another embodiment of the present utility model;
FIG. 3 is a horizontal cross-sectional view of the present utility model;
fig. 4 is a vertical cross-sectional view of the present utility model.
In the figure: 1. a measuring station; 2. a storage seat; 3. a silicon wafer storage tank; 4. a bearing frame; 5. an inner mounting plate; 6. a first distance sensor; 7. an outer mounting plate; 8. a second distance sensor; 9. a display screen; 10. a controller; 11. a cylinder; 12. a side chute; 13. a telescopic rod; 14. a slide bar; 15. and (5) conveying the base.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1 to 4, a thickness measuring apparatus for silicon wafers comprises a measuring table 1, a placement seat 2 arranged on the measuring table 1, and a measuring mechanism arranged on the measuring table 1, wherein a silicon wafer placement groove 3 is formed on the placement seat 2, an inverted U-shaped receiving frame 4 is fixedly welded on the top wall of the measuring table 1, and an inner mounting plate 5 and an outer mounting plate 7 are welded on the bottom wall of the receiving frame 4;
the measuring mechanism comprises a plurality of first distance sensors 6 arranged on the bottom wall of the inner mounting disc 5, a plurality of second distance sensors 8 arranged on the bottom wall of the outer mounting disc 7, a display screen 9 and a controller 10 which are arranged on the side wall of the bearing frame 4, wherein the plurality of first distance sensors 6 are circumferentially distributed on the inner mounting disc 5, the plurality of second distance sensors 8 are circumferentially distributed on the outer mounting disc 7, the first distance sensors 6 are used for detecting the distance between the first distance sensors 6 and the silicon wafer, the second distance sensors 8 are used for detecting the distance between the first distance sensors and the bottom wall of the silicon wafer storage tank 3, the inner mounting disc 5 and the outer mounting disc 7 are horizontally arranged, the heights of the bottom walls of the inner mounting disc 5 and the outer mounting disc 7 are the same, the first distance sensors 6 and the second distance sensors 8 are of the same type, the first distance sensors 6 and the second distance sensors 8 are the same, the first distance sensors 6 and the second distance sensors 8 are all arranged in the vertical direction, and are measured in the vertical direction, the first distance sensors 6, the second distance sensors 8 and the display screen 9 are all connected with the controller 10, and the first distance sensor 6 and the second distance sensor 8 are coupled with the controller 10 can refer to the model PR10, and the model number of the principle of the sensor can refer to the model number PR 10;
one side of the measuring table 1 is fixedly provided with an air cylinder 11, the air cylinder 11 is coaxially connected with a telescopic rod 13, the air cylinder 11 is horizontally arranged, the inner cavity of the measuring table 1 is formed in the top wall and two side walls of the measuring table, two sides of the inner cavity of the measuring table 1 are respectively provided with a side sliding groove 12, one end of the telescopic rod 13 is connected with the inner wall of one side sliding groove 12, the telescopic rod 13 can stretch out and draw back in the side sliding groove 12, the inner side of the other side sliding groove 12 is fixedly welded with a sliding rod 14, a conveying base 15 is horizontally arranged in the inner cavity of the measuring table 1, one end of the conveying base 15 is connected with the telescopic rod 13, the other end of the conveying base 15 is slidably sleeved on the sliding rod 14, the conveying base 15 can be driven to translate along the sliding rod 14 when the telescopic rod 13 stretches out and draws back, the inner cavity of the conveying base 15 is formed in the top wall of the inner cavity of the conveying base 15, and the bottom of the object placing base 2 is anastomosedly inserted into the inner cavity of the conveying base 15, so that the object placing base 2 can translate along with the translation of the conveying base 15.
The thickness measuring device of the silicon wafer: firstly, placing a storage seat 2 above a conveying base 15, and placing a silicon wafer to be measured in a silicon wafer storage groove 3; the driving cylinder 11 operates to drive the telescopic rod 13 to extend, so that the telescopic rod 13 drives the conveying base 15 to translate along the sliding rod 14, and the conveying base 15 is moved to the position shown in the figure 1; at this time, the distance between the silicon wafer and the silicon wafer can be measured by the first distance sensors 6 (data one is obtained), the distance between the silicon wafer and the bottom wall of the silicon wafer storage tank 3 can be measured by the second distance sensors 8 (data two is obtained), when the first data values are the same, the silicon wafer is in a horizontal state, and when the second data values are the same, the storage seat 2 and the silicon wafer storage tank 3 are both horizontal; the first distance sensor 6 and the second distance sensor 8 both transmit electric signals to the controller 10, so that the controller 10 transmits electric signals to the display screen 9 to display two data, and the thickness value of the silicon wafer can be obtained by subtracting the data I from the data II; then the cylinder 11 is operated to drive the telescopic rod 13 to extend continuously, so that the conveying base 15 outputs the object placing base 2 and the silicon wafer thereon.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (5)
1. The thickness measuring device for the silicon wafer comprises a measuring table (1), a storage seat (2) arranged on the measuring table (1) and a measuring mechanism arranged on the measuring table (1), and is characterized in that a silicon wafer storage groove (3) is formed in the storage seat (2), an inverted U-shaped bearing frame (4) is fixedly welded on the top wall of the measuring table (1), and an inner mounting disc (5) and an outer mounting disc (7) are welded on the bottom wall of the bearing frame (4);
the measuring mechanism comprises a plurality of first distance sensors (6) arranged on the bottom wall of the inner mounting disc (5), a plurality of second distance sensors (8) arranged on the bottom wall of the outer mounting disc (7), a display screen (9) arranged on the side wall of the bearing frame (4) and a controller (10), wherein the plurality of first distance sensors (6) are circumferentially distributed on the inner mounting disc (5) in an array manner, and the plurality of second distance sensors (8) are circumferentially distributed on the outer mounting disc (7) in an array manner;
the inner mounting plate (5) and the outer mounting plate (7) are horizontally arranged and the heights of the bottom walls of the inner mounting plate and the outer mounting plate are the same, the first distance sensor (6) and the second distance sensor (8) are installed in the vertical direction and are measured in the vertical direction, and the first distance sensor (6), the second distance sensor (8) and the display screen (9) are all connected with the controller (10) in a coupling mode.
2. The thickness measuring device for a silicon wafer according to claim 1, wherein an air cylinder (11) is fixedly arranged on one side of the measuring table (1), and a telescopic rod (13) is coaxially connected to the air cylinder (11).
3. The thickness measuring device of a silicon wafer according to claim 2, wherein the inner cavity of the measuring table (1) is provided with a top wall and two side walls, two sides of the inner cavity of the measuring table (1) are provided with side sliding grooves (12), and one end of the telescopic rod (13) is connected with the inner wall of one side sliding groove (12).
4. A thickness measuring apparatus for silicon wafers according to claim 3, wherein a slide bar (14) is fixedly welded in the other side sliding groove (12), a conveying base (15) is horizontally arranged in the inner cavity of the measuring table (1), one end of the conveying base (15) is connected with the telescopic rod (13), and the other end is slidably sleeved on the slide bar (14).
5. A thickness measuring device for silicon wafers according to claim 4, wherein the cavity of the delivery base (15) is formed in the top wall thereof, and the bottom of the placement base (2) is inserted into the cavity of the delivery base (15) in a fitting manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321191025.5U CN219917070U (en) | 2023-05-17 | 2023-05-17 | Thickness measuring device for silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321191025.5U CN219917070U (en) | 2023-05-17 | 2023-05-17 | Thickness measuring device for silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219917070U true CN219917070U (en) | 2023-10-27 |
Family
ID=88423001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321191025.5U Active CN219917070U (en) | 2023-05-17 | 2023-05-17 | Thickness measuring device for silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219917070U (en) |
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2023
- 2023-05-17 CN CN202321191025.5U patent/CN219917070U/en active Active
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