CN219916720U - Pressure control DRAM system level test chip test socket - Google Patents
Pressure control DRAM system level test chip test socket Download PDFInfo
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- CN219916720U CN219916720U CN202320581516.4U CN202320581516U CN219916720U CN 219916720 U CN219916720 U CN 219916720U CN 202320581516 U CN202320581516 U CN 202320581516U CN 219916720 U CN219916720 U CN 219916720U
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- 238000012360 testing method Methods 0.000 title claims abstract description 65
- 239000000523 sample Substances 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 4
- 238000012544 monitoring process Methods 0.000 claims description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims 1
- 235000017491 Bambusa tulda Nutrition 0.000 claims 1
- 241001330002 Bambuseae Species 0.000 claims 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims 1
- 239000011425 bamboo Substances 0.000 claims 1
- 238000004891 communication Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000007747 plating Methods 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model relates to the technical field of semiconductor memory chip sealing and testing, in particular to a pressure control DRAM system level test chip test socket which comprises a base, a cover plate arranged above the base, an IC detachably arranged between the base and the cover plate and a conductor arranged at the lower end of the base and used for connecting the IC and a circuit board circuit, wherein a lifting slide cylinder is movably arranged in the middle of the cover plate. In the utility model, firstly, the improved probe structure is formed by combining the conductive adhesive column and the conductive metal ball, so that the contact friction force and impact force between the probe and the IC and the PCB are effectively reduced, the problems of falling off of a plating layer on the surface of the PCB, poor contact and the like are reduced, and secondly, the contact pressure of the test socket can be intuitively identified by adding the T-shaped pressure head, the sheet pressure sensor and the miniature digital display screen on the basis of the original test socket structure, and the problems of poor contact, overvoltage and the like in the test process are reduced, so that the yield of PCB test is improved.
Description
Technical Field
The utility model relates to the technical field of semiconductor memory chip sealing and testing, in particular to a pressure control DRAM system-level test chip test socket.
Background
In the system-level test of a chip storage system, a chip test Socket (Socket) is a connector Socket for connecting a chip and a PCB, and has the main effects of meeting the connection requirement of a chip pin terminal and a PCB test main board, and the chip can be detached and replaced at any time in a chip test link without damaging the chip and the PCB, so that the quick and efficient test is realized.
At present, the structure has two pain points, one is that the probe is easy to cause the surface damage of the PCB, and the plating layer on the surface of the PCB is removed after the probe is used for a period of time, so that poor contact is caused, and the service life of the PCB is influenced; secondly, ensure that the contact is good through controlling the stroke, in long-term use, chip test socket mechanical structure can be because the deviation of IC size and spring ageing in the structure, and the stroke is unchangeable down contact pressure changes, can't discern contact pressure directly perceivedly, leads to contact failure or excessive pressure, influences the test yield and damages the product even.
Therefore, the design and manufacture of the chip test socket capable of effectively reducing contact scratches and controlling pressure in the test process is particularly important in dynamic random access memory system level test.
Disclosure of Invention
The utility model aims at: in order to solve the problems that the IC and the PCB are easy to damage in the use process and the downward pressure can not be accurately controlled in the traditional chip test socket, the pressure control DRAM system-level test chip test socket is provided.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a pressure control DRAM system level test chip test socket, includes the base, sets up the apron in the base top, demountable installation is at the IC between base and the apron and set up the electric conductor that is used for connecting IC and circuit board circuit at the base lower extreme, the middle part movable mounting of apron has a lift slide, the lower extreme fixedly connected with of lift slide is with the preforming of laminating each other with the IC up end, be provided with the pressure sensing portion that is used for the monitoring of IC test in-process down pressure between lift slide and the preforming.
As a further description of the above technical solution:
the pressure sensing part comprises a T-shaped pressure head movably arranged in the middle of the lifting slide cylinder, a sheet pressure sensor arranged at the upper end of the pressing sheet and positioned below the T-shaped pressure head, and a miniature digital display screen embedded above the T-shaped pressure head and electrically connected with the sheet pressure sensor.
As a further description of the above technical solution:
a buckling part for combining and fixing the base and the cover plate is arranged between the base and the cover plate.
As a further description of the above technical solution:
the buckling part comprises two outer screw buckling blocks which are symmetrically arranged above the cover plate and surround the lifting sliding cylinder, an inner screw sleeve which is installed between the two outer screw buckling blocks through screw threads in a screwed mode, buckling strips which are fixed outside the outer screw buckling blocks and cover the base and the cover plate laterally, and buckling grooves which are formed in the base laterally and correspond to the buckling strips.
As a further description of the above technical solution:
two folding spring plates are symmetrically and fixedly connected between the two sides of the upper end of the pressing plate and the lower end of the cover plate.
As a further description of the above technical solution:
the upper end of the base is concave downwards, and a limit frame for IC auxiliary positioning is detachably arranged at the upper end of the base.
As a further description of the above technical solution:
the base is provided with a plurality of through holes for communicating the IC and the circuit board, and the conductor is arranged at the inner side of the through holes.
As a further description of the above technical solution:
the electric conductor is a probe formed by combining a conductive rubber column in the middle and conductive metal balls at two ends.
In summary, due to the adoption of the technical scheme, the beneficial effects of the utility model are as follows:
1. in the utility model, the original rigid probe structure is scientifically and reasonably improved, and the improved probe structure is formed by combining the conductive adhesive column and the conductive metal ball, so that the contact friction force and impact force between the probe and the IC and between the probe and the PCB are effectively reduced under the condition of ensuring normal power connection test, and the problems of falling off of a plating layer on the surface of the PCB, poor contact and the like are reduced, thereby prolonging the service life of the PCB test.
2. According to the utility model, the T-shaped pressure head, the sheet pressure sensor and the miniature digital display screen are added on the basis of the original test socket structure, when the T-shaped pressure head is pressed down, the sheet pressure sensor between the T-shaped pressure head and the pressing sheet can intuitively monitor the downward pressure of the T-shaped pressure head and transmit data to the miniature digital display screen for display, and the structure can intuitively identify the contact pressure of the test socket, so that the occurrence of the problems of poor contact or overvoltage and the like in the test process is reduced, and the yield of PCB test is improved.
Drawings
FIG. 1 is a schematic diagram of a test socket for a system-level test chip of a pressure-controlled DRAM according to the present utility model;
FIG. 2 is a perspective view of the present utility model;
FIG. 3 is a schematic perspective exploded view of the present utility model;
FIG. 4 is a schematic view of a partial longitudinal cut of a cover plate according to the present utility model;
FIG. 5 is a schematic diagram of the structure of the probe according to the present utility model.
Legend description:
1. a base; 101. a buckling groove; 102. a through hole; 103. a limit frame; 2. a cover plate; 3. an outer screw button block; 301. a buckling strip; 4. an inner spiral sleeve; 5. lifting the sliding cylinder; 6. a T-shaped pressure head; 7. a miniature digital display screen; 8. a probe; 801. a conductive adhesive column; 802. conductive metal balls; 9. tabletting; 10. a sheet pressure sensor; 11. folding the spring plate; 12. an IC.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the present utility model provides a technical solution: the utility model provides a pressure control DRAM system level test chip test socket, including base 1, the apron 2 of setting in base 1 top, demountable installation is at the IC12 between base 1 and apron 2 and the conductor that sets up at base 1 lower extreme and be used for connecting IC12 and circuit board circuit, the middle part movable mounting of apron 2 has lift slide 5, the lower extreme fixedly connected with of lift slide 5 and the preforming 9 of laminating each other with IC12 up end, symmetrical fixedly connected with two folding shell fragments 11 between the upper end both sides of preforming 9 and the apron 2 lower extreme, be provided with the pressure sensing portion that is used for IC12 in-process down pressure monitoring between lift slide 5 and the preforming 9, wherein, the upper end of base 1 is concave, the upper end demountable installation of base 1 has spacing frame 103 that is used for IC12 assistance localization real-time, spacing frame 103's setting can make the contact on the IC12 can be accurate contact with the conductive metal ball 802 on the probe 8.
Specifically, as shown in fig. 1, 3 and 4, the pressure sensing portion includes a T-shaped pressure head 6 movably mounted in the middle of the lifting slide 5, a sheet pressure sensor 10 mounted at the upper end of the pressing sheet 9 and located below the T-shaped pressure head 6, and a micro digital display screen 7 embedded above the T-shaped pressure head 6 and electrically connected with the sheet pressure sensor 10, wherein an MCU for data processing is integrated on the micro digital display screen 7, so that pressure data transmitted by the sheet pressure sensor 10 can be analyzed and calculated, and then transmitted to the micro digital display screen 7 for display.
Specifically, as shown in fig. 1-3, a buckling part for combining and fixing the base 1 and the cover plate 2 is arranged between the base 1 and the cover plate 2, the buckling part comprises two outer screw buckling blocks 3 symmetrically arranged above the cover plate 2 and surrounding the lifting slide cylinder 5, an inner screw sleeve 4 arranged between the two outer screw buckling blocks 3 in a screwed mode, buckling strips 301 fixed outside the outer screw buckling blocks 3 and wrapping the base 1 and the cover plate 2 laterally, and buckling grooves 101 formed in the base 1 laterally and corresponding to the buckling strips 301, when the two outer screw buckling blocks 3 are buckled above the cover plate 2, the buckling strips 301 are buckled into the buckling grooves 101 on the base 1, the inner screw sleeve 4 is screwed between the two outer screw buckling blocks 3, and the cover plate 2 is locked above the base 1.
Specifically, as shown in fig. 2, 3 and 5, a plurality of through holes 102 for communicating the IC12 with the circuit board are formed in the base 1, the conductors are arranged at the inner sides of the through holes 102, the conductors are probes 8 formed by combining conductive adhesive columns 801 in the middle and conductive metal balls 802 at the two ends, and the conductive adhesive columns 801 are arranged to buffer and absorb impact force when the two conductive metal balls 802 contact with the contacts on the premise of not affecting the power connection test, so that the problem that the probes 8 scratch the contacts of the PCB is reduced.
Working principle: when the test socket is used, the IC12 for test is positioned and mounted in the base 1 through the limiting frame 103, then the cover plate 2 can be buckled on the base 1, and then when the two half outer screw buckling blocks 3 are buckled outside the lifting slide cylinder 5, the buckling strips 301 on the outer screw buckling blocks 3 can be buckled in the buckling grooves 101 of the base 1, the inner screw sleeve 4 can be screwed between the two outer screw buckling blocks 3, so that the assembly operation of the test socket is completed, in the actual test process, the test socket is connected with a test equipment circuit, the conductive metal balls 802 below the base 1 are aligned with contacts on corresponding points on the PCB and are pressed downwards, an operator can intuitively feel the downward pressure among the IC12, the probe 8 and the PCB by observing the pressure value on the miniature digital display screen 7, and the subsequent PCB test operation can be carried out after the pressure reaches the normal range.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (8)
1. The utility model provides a pressure control DRAM system level test chip test socket, includes base (1), apron (2) of setting in base (1) top, demountable installation IC (12) between base (1) and apron (2) and the electric conductor that sets up at base (1) lower extreme and be used for connecting IC (12) and circuit board circuit, a serial communication port, mid-section of thick bamboo movable mounting of apron (2) has lift slide (5), the lower extreme fixedly connected with of lift slide (5) is laminated preforming (9) each other with IC (12) up end, be provided with the pressure sense portion that is arranged in IC (12) test in-process down pressure monitoring between lift slide (5) and preforming (9).
2. The pressure control DRAM system level test chip test socket according to claim 1, wherein the pressure sensing part comprises a T-shaped pressure head (6) movably mounted in the middle of the lifting slide cylinder (5), a sheet pressure sensor (10) mounted at the upper end of the pressing sheet (9) and positioned below the T-shaped pressure head (6), and a miniature digital display screen (7) embedded above the T-shaped pressure head (6) and electrically connected with the sheet pressure sensor (10).
3. The pressure control DRAM system level test chip test socket of claim 1, wherein a snap-fit portion for fixing the base (1) and the cover (2) in combination is provided between the base (1) and the cover (2) exterior.
4. A pressure control DRAM system level test chip test socket according to claim 3, wherein the fastening part comprises two outer screw fastening blocks (3) symmetrically arranged above the cover plate (2) and surrounding the lifting slide cylinder (5), an inner screw sleeve (4) installed between the two outer screw fastening blocks (3) through screw screwing, a fastening strip (301) fixed outside the outer screw fastening blocks (3) and covering the base (1) and the cover plate (2) laterally, and a fastening groove (101) opened at the base (1) laterally and corresponding to the fastening strip (301).
5. The pressure control DRAM system level test chip test socket according to claim 1, wherein two folding spring plates (11) are symmetrically and fixedly connected between two sides of the upper end of the pressing plate (9) and the lower end of the cover plate (2).
6. The pressure control DRAM system level test chip test socket as defined in claim 1, wherein the upper end of the base (1) is concave downward, and a limit frame (103) for auxiliary positioning of the IC (12) is detachably mounted on the upper end of the base (1).
7. The pressure control DRAM system level test chip test socket of claim 1, wherein a plurality of through holes (102) for communicating the IC (12) with the circuit board are formed in the base (1), and the conductors are disposed inside the through holes (102).
8. The pressure control DRAM system level test chip test socket of claim 7, wherein said electrical conductor is a probe (8) having a middle portion of conductive paste pillars (801) and two ends of conductive metal balls (802).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320581516.4U CN219916720U (en) | 2023-03-20 | 2023-03-20 | Pressure control DRAM system level test chip test socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320581516.4U CN219916720U (en) | 2023-03-20 | 2023-03-20 | Pressure control DRAM system level test chip test socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219916720U true CN219916720U (en) | 2023-10-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320581516.4U Active CN219916720U (en) | 2023-03-20 | 2023-03-20 | Pressure control DRAM system level test chip test socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219916720U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117368545A (en) * | 2023-12-05 | 2024-01-09 | 苏州微飞半导体有限公司 | Plug-injection type conductive adhesive testing module |
| CN118197944A (en) * | 2024-03-17 | 2024-06-14 | 苏州奥金斯电子有限公司 | Test burning seat for wafer-level packaging chip |
-
2023
- 2023-03-20 CN CN202320581516.4U patent/CN219916720U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117368545A (en) * | 2023-12-05 | 2024-01-09 | 苏州微飞半导体有限公司 | Plug-injection type conductive adhesive testing module |
| CN118197944A (en) * | 2024-03-17 | 2024-06-14 | 苏州奥金斯电子有限公司 | Test burning seat for wafer-level packaging chip |
| CN118197944B (en) * | 2024-03-17 | 2024-08-20 | 苏州奥金斯电子有限公司 | Test burning seat for wafer-level packaging chip |
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