CN219889831U - Oven for packaging semiconductor chip - Google Patents
Oven for packaging semiconductor chip Download PDFInfo
- Publication number
- CN219889831U CN219889831U CN202320374271.8U CN202320374271U CN219889831U CN 219889831 U CN219889831 U CN 219889831U CN 202320374271 U CN202320374271 U CN 202320374271U CN 219889831 U CN219889831 U CN 219889831U
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- Prior art keywords
- oven
- blower
- air
- packaging
- side wall
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 230000000149 penetrating effect Effects 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 8
- 238000001816 cooling Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses an oven for packaging a semiconductor chip, which comprises an oven main body and a blower, wherein the oven main body is used for baking the semiconductor chip during packaging, the blower is arranged on the inner side wall of the oven main body in a penetrating way, the blower is arranged on the outer side wall of the oven main body at the position of the mounting hole, and an adjusting valve used for controlling the opening and closing of the mounting hole is arranged between the blower and the oven main body. According to the utility model, the existing oven structure is modified, and the air feeder with the openable and closable air opening is arranged on the outer side wall of the oven main body, so that air can be supplied to the oven main body to assist in cooling, thereby achieving the purpose of improving cooling efficiency and further improving the production efficiency of semiconductor chips.
Description
Technical Field
The utility model relates to the technical field of semiconductor chip packaging, in particular to an oven for packaging a semiconductor chip.
Background
Fig. 1 is a schematic diagram of an oven for a semiconductor chip packaging process, when a semiconductor chip is packaged and baked, the temperature of the interior of a box 01 is reduced only through an exhaust pipe 02 at the rear of the oven, the temperature is reduced from 175 ℃ to 100 ℃, 5 hours are usually required, the temperature reduction speed is low, the processing efficiency of the semiconductor chip is affected, and the temperature is reduced to 100 ℃ and still higher, if the oven door is required to be opened at this time, a certain risk is brought to an operator, and in addition, when the oven door is opened under the condition, heat is easily dispersed into a workshop, so that the workshop temperature is at risk of exceeding the standard.
Based on this, an oven for packaging semiconductor chips is proposed to solve the above-mentioned problems.
Disclosure of Invention
The utility model aims to provide an oven for packaging a semiconductor chip, which improves the cooling efficiency of an oven main body.
In order to solve the above technical problems, the present utility model provides an oven for packaging a semiconductor chip, including an oven body for baking the semiconductor chip during packaging, and further comprising: the air feeder, the mounting hole has been seted up in the oven main part inside wall run through, just the oven main part outside wall is located the mounting hole position department installs the air feeder, the air feeder with install between the oven main part be used for controlling the mounting hole opens and closes adjusting valve.
Further, the regulating valve comprises an air duct, a sealing sphere, an electric lifting rod and a driving connecting rod, wherein two ends of the air duct are respectively connected with the mounting hole and the air outlet end of the air blower, the sealing sphere is rotatably arranged in the air duct through a transmission shaft, the electric lifting rod is hinged to the outer side wall of the oven main body, and the driving connecting rod is respectively hinged with the electric lifting rod and the transmission shaft; the center of the sealing sphere is provided with an air guide channel in a penetrating mode, and the air guide channel is perpendicular to the transmission shaft.
Furthermore, the air duct is provided with mounting flanges at two ends, and fixing holes are formed in the end faces of the mounting flanges in a penetrating mode.
Furthermore, the end face of the mounting flange is provided with a sealing ring.
Further, a filter assembly for purifying air drawn into the blower is installed at an end of the blower remote from the adjusting valve.
Further, the filter assembly comprises an inner cylinder, an outer cylinder and a filter screen; the inner cylinder is installed at the air inlet end of the air feeder, a placing groove used for placing the filter screen is formed in the outer cylinder, first threads are formed in the side wall of the placing groove, and second threads matched with the first threads are formed in the outer side wall of the inner cylinder.
Compared with the prior art, the utility model has at least the following beneficial effects:
according to the utility model, the existing oven structure is modified, and the air feeder with the openable and closable air opening is arranged on the outer side wall of the oven main body, so that air can be supplied to the oven main body to assist in cooling, thereby achieving the purpose of improving cooling efficiency and further improving the production efficiency of semiconductor chips.
Drawings
Fig. 1 is a schematic view of a structure of an oven for packaging a semiconductor chip in the prior art;
fig. 2 is a schematic structural diagram of an oven for packaging semiconductor chips according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of a regulating valve according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a filter assembly according to an embodiment of the present utility model.
Detailed Description
The oven for packaging semiconductor chips of the present utility model will be described in more detail with reference to the drawings, in which preferred embodiments of the present utility model are shown, it being understood that the present utility model described herein can be modified by those skilled in the art, while still achieving the advantageous effects of the present utility model. Accordingly, the following description is to be construed as broadly known to those skilled in the art and not as limiting the utility model.
The utility model is more particularly described by way of example in the following paragraphs with reference to the drawings. Advantages and features of the utility model will become more apparent from the following description and from the claims. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the utility model.
As shown in fig. 2, an embodiment of the utility model provides an oven for packaging a semiconductor chip, which comprises an oven main body 1 and a blower 2, wherein the oven main body 1 is used for baking the semiconductor chip during packaging, a mounting hole is formed in the inner side wall of the oven main body 1 in a penetrating manner, the blower 2 is mounted at the position of the mounting hole on the outer side wall of the oven main body 1, and an adjusting valve 3 for controlling the opening and closing of the mounting hole is mounted between the blower 2 and the oven main body 1.
Among them, baking of the oven body 1 at the time of packaging the semiconductor chip belongs to the prior art, and the description thereof is omitted in the present utility model.
In this embodiment, when needs are cooled down to oven main part 1 inside, open governing valve 3, open forced draught blower 2 simultaneously, forced draught blower 2 can be to the inside air supply of oven main part 1 to supplementary oven main part 1 cooling has promoted the cooling looks rate of oven main part 1, and then has promoted the machining efficiency of semiconductor chip.
In a specific embodiment, referring to fig. 3 in combination, the adjusting valve 3 includes an air duct 31 with two ends respectively connected to the mounting hole and the air outlet end of the blower 2, a sealing ball 32 rotatably mounted in the air duct 31 through a transmission shaft, an electric lifting rod 33 hinged to the outer sidewall of the oven body 1, and a driving link 34 hinged to the electric lifting rod 33 and the transmission shaft respectively; the center of the sealing sphere 32 is provided with an air guide channel 35, and the air guide channel 35 is arranged vertically, for example.
In this embodiment, the electric lifting rod 33 is driven to rotate the sealing sphere 32, so that the air guide channel 35 is not connected with the internal channel of the air guide tube 31, the internal channel of the air guide tube 31 is closed, and when the central axis of the air guide channel 35 is completely coincident with the central axis of the internal channel of the air guide tube 31, the internal channel of the air guide tube 31 is completely opened.
Optionally, the air duct 31 both ends all are provided with mounting flange 5, mounting flange 5 terminal surface runs through and has seted up fixed orifices 6, just mounting flange 5 terminal surface is provided with sealing washer 7, realizes adjusting valve 3's dismantlement sealing installation.
In a specific embodiment, the blower 2 is provided with a filter assembly 4 for purifying the air drawn into the blower 2 at an end remote from the regulating valve 3.
Specifically, referring to fig. 4 in combination, the filter assembly 4 includes an inner cylinder 41, an outer cylinder 42, and a filter screen 43; the inner cylinder 41 is installed at the air inlet end of the blower 2, a placing groove 421 for placing the filter screen 43 is formed in the outer cylinder 42, a first thread 422 is formed in the side wall of the placing groove, and a second thread 411 matched with the first thread 422 is formed in the outer side wall of the inner cylinder 41.
Utilize filter screen 43's setting in filter unit 4, can filter the air current that gets into inside oven main part 1, reduce the inside probability that produces the pollution of oven main part 1, filter screen 43 adopts threaded connection's inner tube 41 and urceolus 42 to install simultaneously, conveniently dismantle and install filter screen 43 to maintain clearance or change filter screen 43.
It should be noted that the present utility model may be improved in the structure as shown in fig. 1, that is, the exhaust duct may still be remained, and the air flow provided by the blower 2 enters the oven main body 1 and is exhausted from the exhaust duct, so that the heat dissipation efficiency is greatly improved. It was found that the baking temperature was reduced from 175 ℃ to 40 ℃ for only 50 minutes.
In summary, the utility model improves the existing oven structure, and installs the blower with the openable and closable air opening on the outer side wall of the oven main body, so as to blow air into the oven main body to assist cooling, thereby achieving the purpose of improving cooling efficiency and further improving the production efficiency of semiconductor chips.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (6)
1. An oven for packaging a semiconductor chip, comprising an oven body for baking the semiconductor chip during packaging, characterized by further comprising: a blower;
the oven is characterized in that the inner side wall of the oven body is provided with a mounting hole in a penetrating mode, the outer side wall of the oven body is provided with a blower at the position of the mounting hole, and an adjusting valve for controlling the opening and closing of the mounting hole is arranged between the blower and the oven body.
2. The oven for packaging semiconductor chips as claimed in claim 1, wherein said adjusting valve comprises an air duct having both ends respectively connected to said mounting hole and an air outlet end of the blower, a sealing ball rotatably installed in said air duct via a transmission shaft, an electric lifting rod hinged to an outer sidewall of said oven body, and a driving link hinged to said electric lifting rod and said transmission shaft, respectively; the center of the sealing sphere is provided with an air guide channel in a penetrating mode, and the air guide channel is perpendicular to the transmission shaft.
3. The oven for packaging semiconductor chips as recited in claim 2 wherein said air duct has mounting flanges at both ends thereof, and said mounting flanges have fixing holes formed therethrough.
4. The oven for packaging a semiconductor chip as claimed in claim 3, wherein the mounting flange end face is provided with a sealing ring.
5. The oven for packaging semiconductor chips of claim 1 wherein an end of said blower remote from said regulator valve is provided with a filter assembly for purifying air drawn into said blower.
6. The oven for packaging semiconductor chips as recited in claim 5 wherein said filter assembly comprises an inner cylinder, an outer cylinder and a filter screen; the inner cylinder is installed at the air inlet end of the air feeder, a placing groove used for placing the filter screen is formed in the outer cylinder, first threads are formed in the side wall of the placing groove, and second threads matched with the first threads are formed in the outer side wall of the inner cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320374271.8U CN219889831U (en) | 2023-03-03 | 2023-03-03 | Oven for packaging semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320374271.8U CN219889831U (en) | 2023-03-03 | 2023-03-03 | Oven for packaging semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219889831U true CN219889831U (en) | 2023-10-24 |
Family
ID=88401191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320374271.8U Active CN219889831U (en) | 2023-03-03 | 2023-03-03 | Oven for packaging semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219889831U (en) |
-
2023
- 2023-03-03 CN CN202320374271.8U patent/CN219889831U/en active Active
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