CN219876351U - High alignment's lamination circuit board alignment structure and circuit board pressfitting structure - Google Patents
High alignment's lamination circuit board alignment structure and circuit board pressfitting structure Download PDFInfo
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- CN219876351U CN219876351U CN202320066599.3U CN202320066599U CN219876351U CN 219876351 U CN219876351 U CN 219876351U CN 202320066599 U CN202320066599 U CN 202320066599U CN 219876351 U CN219876351 U CN 219876351U
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- 238000003475 lamination Methods 0.000 title claims abstract description 37
- 230000004927 fusion Effects 0.000 claims abstract description 23
- 238000003825 pressing Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 abstract description 15
- 230000001174 ascending effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 6
- 238000009826 distribution Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Abstract
The utility model provides a laminated circuit board alignment structure with high alignment and a circuit board lamination structure, wherein the alignment structure is arranged on a rectangular laminated circuit board frame and used for lamination positioning of circuit board layers, and comprises PIN nail positioning holes, fusion positioning PAD, rivet positioning holes and reference targets; simultaneously, make four PIN nail locating holes pairwise correspond to be the cross and distribute and set up on the board frame side, fuse the location PAD setting on the board frame side, rivet locating hole and reference target point set up on board frame side or diagonal, improved the face in the ascending degree of fixation of each direction, reduced dislocation and the slide of multiple pressfitting in-process.
Description
Technical Field
The utility model relates to the field of PCB manufacturing, in particular to a laminated circuit board alignment structure with high alignment degree and a circuit board lamination structure.
Background
Along with the rapid development and wide application of integrated circuits, the types and applications of electronic devices are rapidly developed, electronic products are more intelligent and miniaturized, the types of PCBs are matched with the electronic devices, the types of PCBs are continuously updated, the circuits arranged on the PCBs are more and more dense, and the application of high-level and mixed-pressure (multiple-press-fit) PCBs is also more and more extensive, so that the requirements on the precision and reliability of the PCBs are also higher and higher, and particularly when the high-speed, high-frequency and low-loss PCBs such as automobile radar boards are manufactured, the characteristic of high-density intercommunication (HDI) of the circuits is generally ensured by using a structure of multiple press-fitting. When the PCB is manufactured by multiple pressing, the interconnection of the internal circuit and the external circuit among the laminated circuit boards in the process is ensured, so that the laminated circuit boards are firstly pressed for one time, then the laminated circuit boards are perforated for circuit manufacture, and then the laminated circuit boards after the first pressing and the outer circuit boards are pressed for the second time (more times of pressing can be included for three times or more) for overall manufacture of the PCB, thereby realizing high-density interconnection of the circuits with the whole PCB layers. The design of the high-layer board multiple press-fit structure realizes high-density interconnection among the PCB boards, ensures the electrical performance of the PCB boards, is beneficial to saving the size and the dimension of the circuit board and reduces the manufacturing cost of the high-layer board.
However, in order to realize high-density interconnection and intercommunication of the circuit of the whole PCB and ensure the reliability of multi-press fit production of the high-layer board, high-precision alignment is required to be carried out when the PCB is pressed for the first time and pressed for the second time subsequently, three processes of PIN nails, hot melting and rivets are usually adopted in the actual production process of the high-layer board, and in order to realize high-precision alignment between layers, the process mode of 'hot melting plus PIN nails' is often adopted to realize alignment between layers, but in practice, some problems still exist:
1. because the core board of the PCB is made of resin materials, and the PCB is manufactured by commonly using hot pressing, the resin materials can be expanded and contracted during hot pressing, so that the positions of PIN holes on the laminated circuit board are changed along with the thermal expansion and contraction of the materials when the laminated circuit board is pressed for the first time, the alignment precision of the PIN holes is affected, and the PIN holes still need to be used as alignment sites for subsequent pressing for repeated use, and the alignment degree of the PCB during integral board pressing is affected;
2. when the PCB with high speed and high frequency such as an automobile radar board is manufactured, the antenna surface of the PCB needs to be designed with both blind holes and through holes, and the alignment requirement is extremely high; in order to realize high-speed and high-frequency transportation, high-speed and high-frequency PCB boards such as an automobile radar board are often mixed and pressed by using various materials, the thermal expansion difference among different materials is large, the board bending phenomenon is easy to generate in the mixing and pressing process, the required pressure is large when the high-speed boards are mixed and pressed, and the dislocation and the sliding board are easy to occur in the PCB board in the manufacturing process of multiple pressing due to the thermal expansion difference of the materials and the excessive pressure during the mixing and pressing.
Disclosure of Invention
The utility model aims to overcome at least one defect of the prior art, and provides a laminated circuit board alignment structure with high alignment, which is characterized in that three processes of PIN nails, fusion and rivets are used for comprehensively positioning by arranging sites on a laminated circuit board, so that the alignment degree in the whole lamination process of the PCB is improved, the whole fixation degree of the PCB is improved, and the dislocation and sliding plate in the lamination process are reduced.
The technical scheme provides a laminate circuit board alignment structure of high alignment degree, is used for circuit board lamination location on board frame (110) of laminate circuit board (100) of rectangle, including PIN nail locating hole (200), fusing location PAD (300), rivet locating hole (400) and reference target (500), include four PIN nail locating holes (200) at least, set up respectively on board frame (110) side, two liang correspond, are the cross and distribute, fusing location PAD (300) set up on board frame (110) side, rivet locating hole (400) and reference target (500) set up on board frame (110) side or diagonal.
In the technical scheme, the alignment structure is arranged at the edge of the laminated circuit board, so that the board surface of the whole laminated circuit board is conveniently controlled, and the alignment degree between layers is ensured without influencing the internal circuit layer. The alignment structure comprises four types of sites including PIN holes, fusion positioning PAD, rivet positioning holes and reference targets, and the reference targets are simultaneously used as positioning references of other three types of positioning holes on the plate surface; preferably, the reference target point is manufactured by etching, and the positioning accuracy is consistent with the circuit pattern in the laminated circuit board, so that the alignment degree of each laminated circuit board is consistent; meanwhile, three processes of PIN nails, fusion and rivets are comprehensively used for carrying out high-precision alignment on the laminated circuit board, so that the alignment degree of the whole board is ensured. Before interlayer lamination, fixing the laminated circuit board by using rivets, wherein rivet positioning holes and reference targets are arranged on the side edges or opposite angles of the board frame, so that the laminated circuit board is prevented from rotating and misplacement; then fusing and pre-positioning are carried out at the fusing and positioning PAD, the fusing and positioning PAD is arranged on the side edge of the board frame, the edge of the laminated circuit board is fixed, and the alignment precision during lamination is improved; finally, PIN hole positioning is carried out, four PIN nail positioning holes are correspondingly distributed on the side edges of the plate frame in a cross mode, the laminated circuit board to be pressed is axially fixed in the horizontal and vertical directions, and alignment accuracy during pressing is further improved.
Further, the two rivet positioning holes (400) and the reference target point (500) form a group, and the four groups of rivet positioning holes (400) and the reference target point (500) are respectively arranged on four opposite angles of the plate frame (110).
Preferably, the two rivet positioning holes (400) and one reference target point (500) form an isosceles triangle, the one reference target point (500) is positioned at the vertex of the isosceles triangle, and the two rivet positioning holes (400) are positioned at two ends of the bottom side of the isosceles triangle.
Preferably, the reference target point (500) is located at the inner side of the plate frame (110), and the rivet positioning holes (400) are located at the outer side of the plate frame (110) and distributed at two sides of an angle connecting line of the reference target point (500) and the plate frame (110).
In the technical scheme, the rivet positioning holes and the positioning target points are arranged at four opposite angles of the plate frame, so that the laminated circuit board can be effectively fixed, the alignment degree of four corners of the plate surface during the pressing process is further improved, and meanwhile, two rivet positioning holes and one reference target point form a group for alignment, so that the fixity of rivets is further enhanced, and the alignment precision is improved; preferably, two rivet positioning holes and one reference target point in each group form an isosceles triangle, the alignment center of the rivet positioning holes coincides with the alignment center of the reference target point, and the positions of the rivet positioning holes and the reference target point are fixed, so that the actual alignment precision of the rivet is determined by the relative alignment precision between the rivet positioning and the reference target point, the requirement on the alignment precision of the single rivet positioning is reduced, the fault tolerance is improved, and the method is more suitable for the actual production process. Preferably, on the board frame, the reference target point is located the inboard of board frame, and the rivet locating hole is located the outside of board frame and distributes in the both sides of reference target point and board frame angle link, and laminate circuit board forms after once pressfitting, and the deformation volume in the region that is close to the middle circuit distribution area of face is less than the region that keeps away from the middle circuit distribution area of face far away, and the reference target point is the benchmark of three kinds of setpoint, consequently can guarantee the alignment accuracy of reference target point in the inboard setting of board frame preferentially with the reference target point to guarantee the alignment degree when laminating between the whole sheet layer.
Further, the PIN nail positioning holes are oblong and have a length direction and a width direction, and the length direction of each PIN nail positioning hole overlaps with the length direction of the opposite PIN nail positioning hole.
Further, the PIN nail locating hole comprises two sections of circular arcs and two sections of straight lines, and the length in the width direction is equal to the diameter of the circular arcs.
Further, the length direction of the PIN nail positioning holes is between 6 and 12mm, the width direction of the PIN nail positioning holes is between 3 and 6mm, and edges formed by two straight lines of two opposite PIN nail positioning holes are mutually aligned.
In this technical scheme, four PIN nail locating hole crosses correspond to set up in the board frame four sides, and PIN nail locating hole corresponds each other in relative both sides and set up, the lamination circuit board has been fixed to axial during the interlaminar pressure, PIN nail locating hole is long circular, and constitute by two sections circular arcs and two sections straight lines, the width of PIN nail locating hole equals the diameter of circular arc, the size of circular arc corresponds with the size cooperation of PIN nail, be 2-4 times of PIN nail in the length direction, provide the change space along with lamination circuit board at axial thermal expansion in the pressfitting process of PIN locating hole many times, and then guarantee the alignment precision of PIN hole when multiple times use in the pressfitting process many times.
Further, the fusion positioning PAD (300) at least comprises two on each side of the plate frame (110), and the fusion positioning PAD is symmetrically arranged on two sides of the PIN nail positioning holes (200). In the technical scheme, two fusion positioning PADs on each side are arranged, so that the fixing degree and the fusion alignment precision of each side of the laminated circuit board are improved; and the fusion positioning PAD on each side is symmetrically arranged on two sides of the PIN nail positioning hole, and the positions on two sides of the PIN nail positioning hole in the width direction are fused and fixed, so that the expansion and contraction change of the PIN nail positioning hole is concentrated in the length direction, the fact that the PIN nail positioning hole can be repeatedly used in the repeated pressing process is further ensured, and meanwhile, the alignment precision of the PIN nail is also ensured.
Further, this technical scheme still provides a circuit board lamination structure, including two or more lamination circuit boards (100), at least one prepreg is pressed from both sides between per two lamination circuit boards (100), and every lamination circuit board (100) all are provided with the lamination circuit board alignment structure of high alignment degree that provides in this technical scheme, and PIN nail locating hole (200), fusion location PAD (300) and rivet locating hole (400) of every lamination circuit board (100) correspond, set up the through-hole corresponding with PIN nail locating hole (200) and rivet locating hole (400) on the prepreg.
Further, the rivet positioning holes (400) of all the laminated circuit boards (100) are penetrated with positioning rivets, and prepregs clamped between every two laminated circuit boards (100) are melted at the positions of the fusion positioning PAD (300) to fix the two laminated circuit boards (100) together.
The technical scheme also provides a circuit board lamination structure, including two or more than two lamination circuit boards (100), at least one prepreg is clamped between every two lamination circuit boards (100), the board frame of each lamination circuit board (100) and the board edge of the prepreg are both provided with the lamination circuit board alignment structure with high alignment degree provided in the technical scheme, during lamination, lamination circuit boards are aligned including prepreg lamination board, and the lamination circuit boards are positioned in all directions of the board surface through rivets, fusion positioning and PIN nail positioning in sequence at the board frame position of the lamination circuit board, including the position of the prepreg is completely fixed, and then lamination is carried out, and the prepreg between the lamination circuit boards is fused and connected between the lamination circuit boards. The improvement of the fixation degree between the laminated circuit boards ensures the alignment degree between the laminated circuit board compression structures, and also ensures that the laminated circuit boards are not easy to generate position change to generate dislocation or sliding plates under higher compression pressure.
Compared with the prior art, the utility model has the beneficial effects that:
1. the alignment structure is arranged at the edge of the laminated circuit board, the board surface of the whole laminated circuit board is convenient to control, the alignment degree between layers is ensured, the internal circuit layer is not influenced, four types of sites including a PIN hole, a fusion positioning PAD, a rivet positioning hole and a reference target point are arranged on the alignment structure, the high-precision alignment is performed on the laminated circuit board by comprehensively using the positioning of the PIN nail, the fusion PAD and the rivet relative to the reference target point on the board surface, and the alignment degree of the whole board is ensured.
2. Rivet locating holes and reference targets in the alignment structure are arranged on the side edges or opposite angles of the plate frame, the laminated circuit board is prevented from rotating and misplacing, fusion locating PAD is arranged on the side edges of the plate frame, the edges of the laminated circuit board are fixed, four PIN nail locating holes are correspondingly arranged on the side edges of the plate frame in a cross distribution mode, the laminated circuit board to be pressed is axially fixed in the horizontal and vertical directions, the alignment precision during pressing is improved, the fixing degree of the plate surface in each direction is improved, and misplacement and sliding plates in the multiple pressing process are reduced.
Drawings
Fig. 1 is a schematic structural diagram of a high alignment structure of a laminated circuit board according to the present utility model.
Fig. 2 is a schematic structural diagram of a circuit board pressing structure according to the present utility model.
Reference numerals: circuit board 100, board frame 110, PIN nail locating hole 200, fusion locating PAD 300, rivet locating hole 400, reference target 500.
Detailed Description
The drawings are for illustrative purposes only and are not to be construed as limiting the utility model. For better illustration of the following embodiments, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the actual product dimensions; it will be appreciated by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Example 1
As shown in fig. 1, the present embodiment provides a laminated circuit board alignment structure with high alignment, which is disposed on a board frame 110 of a rectangular laminated circuit board 100 for lamination positioning between circuit boards, and includes four positioning hole points, namely PIN nail positioning holes 200, fusion positioning PADs 300, rivet positioning holes 400 and reference targets 500. Four PIN nail locating holes 200 are respectively arranged on four sides of the plate frame 110 of each laminated circuit board, the two PIN nail locating holes 200 on the two corresponding sides are in pairwise correspondence, the four PIN nail locating holes 200 are distributed in a cross shape, each PIN nail locating hole is in an oblong shape and has a length direction and a width direction, each PIN nail locating hole consists of two sections of circular arcs and two sections of straight lines, the length in the width direction is equal to the diameter of the circular arc, the diameters of the two straight lines are matched with the diameters of matched PIN nails, the diameters of the PIN nail locating holes in the width direction are 3-6mm, the diameters of the PIN nail locating holes in the length direction are 6-12mm, and the edges formed by the two straight lines of the two opposite PIN nail locating holes are mutually aligned;
the side edges of the plate frame 110 are also provided with fusion positioning PADs 300, and each side edge of the plate frame 110 is provided with two fusion positioning PADs 300 which are symmetrically arranged at two sides of the PIN nail positioning holes 200;
the rivet positioning holes 400 and the reference targets 500 are arranged on four opposite angles of the plate frame 110, two rivet positioning holes 400 and one reference target 500 form a group, two rivet positioning holes 400 and one reference target 500 of each group form an isosceles triangle, the reference targets 500 are positioned on the inner side of the plate frame 110, the rivet positioning holes 400 are positioned on the outer side of the plate frame 110 and distributed on two sides of the corner connecting line of the reference targets 500 and the plate frame 110.
Example 2
As shown in fig. 1 and 2, the present embodiment provides a circuit board lamination structure with high alignment degree of laminated circuit board alignment structure, which includes two or more laminated circuit boards 100, and at least one prepreg PP is sandwiched between each two laminated circuit boards 100, and is characterized in that each laminated circuit board 100 is provided with the high alignment degree laminated circuit board alignment structure as described in embodiment 1, PIN positioning holes 200, fusion positioning PADs 300 and rivet positioning holes 400 of each laminated circuit board 100 are corresponding, and through holes corresponding to PIN positioning holes 200 and rivet positioning holes 400 are also formed in the laminated prepregs PP. When the laminated circuit boards are pressed together, positioning rivets are penetrated into the rivet positioning holes 400 of all the laminated circuit boards 100, and the prepregs PP clamped between every two laminated circuit boards 100 are melted at the position of the fusion positioning PAD 300 to fix the two laminated circuit boards 100 together.
It should be understood that the foregoing examples of the present utility model are merely illustrative of the present utility model and are not intended to limit the present utility model to the specific embodiments thereof. Any modification, equivalent replacement, improvement, etc. that comes within the spirit and principle of the claims of the present utility model should be included in the protection scope of the claims of the present utility model.
Claims (10)
1. The utility model provides a laminate circuit board alignment structure of high alignment degree, sets up and is used for circuit board lamination location on board frame (110) of rectangle laminate circuit board (100), including PIN nail locating hole (200), fusing location PAD (300), rivet locating hole (400) and reference target (500), its characterized in that includes four PIN nail locating holes (200) at least, sets up respectively on board frame (110) side, and two pair corresponds, is the cross and distributes, fusing location PAD (300) set up on board frame (110) side, rivet locating hole (400) and reference target (500) set up on board frame (110) side or diagonal.
2. The high alignment laminated circuit board alignment structure according to claim 1, wherein the two rivet positioning holes (400) and one reference target point (500) form a group, and four groups of rivet positioning holes (400) and reference target points (500) are respectively disposed on four opposite corners of the board frame (110).
3. The high alignment laminated circuit board alignment structure according to claim 2, wherein the two rivet positioning holes (400) and one reference target point (500) form an isosceles triangle, the one reference target point (500) is located at the vertex of the isosceles triangle, and the two rivet positioning holes (400) are located at both ends of the base of the isosceles triangle.
4. The high alignment laminated circuit board alignment structure according to claim 2, wherein the reference target (500) is located at an inner side of the board frame (110), and the rivet positioning holes (400) are located at an outer side of the board frame (110) and distributed at both sides of an angular connection line of the reference target (500) and the board frame (110).
5. The high alignment laminated circuit board alignment structure of any of claims 1-4, wherein the PIN alignment holes are oblong having a length direction and a width direction, the length direction of each PIN alignment hole overlapping the length direction of the opposite PIN alignment hole.
6. The high alignment laminated circuit board alignment structure according to claim 5, wherein the PIN nail positioning hole is composed of two circular arcs and two straight lines, and the length in the width direction is equal to the diameter of the circular arcs.
7. The high alignment laminated circuit board alignment structure of claim 6, wherein the PIN alignment holes have a length dimension of between 6 and 12mm and a width dimension of between 3 and 6mm, and edges of two straight lines of two opposite PIN alignment holes are aligned with each other.
8. The high alignment laminated circuit board alignment structure according to any one of claims 1 to 4, wherein the fusion positioning PAD (300) comprises at least two on each side of the board frame (110), symmetrically disposed on both sides of the PIN positioning hole (200).
9. The circuit board lamination structure comprises two or more than two laminated circuit boards (100), at least one prepreg is clamped between every two laminated circuit boards (100), and the circuit board lamination structure is characterized in that each laminated circuit board (100) is provided with the lamination circuit board alignment structure with high alignment degree according to any one of claims 1-8, PIN positioning holes (200), fusion positioning PAD (300) and rivet positioning holes (400) of each laminated circuit board (100) correspond, and through holes corresponding to the PIN positioning holes (200) and the rivet positioning holes (400) are formed in the prepregs.
10. The circuit board pressing structure according to claim 9, wherein the rivet positioning holes (400) of all the laminated circuit boards (100) are penetrated with positioning rivets, and the two laminated circuit boards (100) are fixed together after the prepreg sandwiched between each two laminated circuit boards (100) is melted at the position of the fusing positioning PAD (300).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320066599.3U CN219876351U (en) | 2023-01-06 | 2023-01-06 | High alignment's lamination circuit board alignment structure and circuit board pressfitting structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202320066599.3U CN219876351U (en) | 2023-01-06 | 2023-01-06 | High alignment's lamination circuit board alignment structure and circuit board pressfitting structure |
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| CN219876351U true CN219876351U (en) | 2023-10-20 |
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| CN202320066599.3U Active CN219876351U (en) | 2023-01-06 | 2023-01-06 | High alignment's lamination circuit board alignment structure and circuit board pressfitting structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117998769A (en) * | 2024-04-03 | 2024-05-07 | 广州添利电子科技有限公司 | Positioning system and positioning method for improving continuous lamination alignment precision of HDI (high density interconnect) board |
-
2023
- 2023-01-06 CN CN202320066599.3U patent/CN219876351U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117998769A (en) * | 2024-04-03 | 2024-05-07 | 广州添利电子科技有限公司 | Positioning system and positioning method for improving continuous lamination alignment precision of HDI (high density interconnect) board |
| CN117998769B (en) * | 2024-04-03 | 2024-06-04 | 广州添利电子科技有限公司 | Positioning system and positioning method for improving continuous lamination alignment precision of HDI (high density interconnect) board |
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