CN219876292U - Soft and hard combined board - Google Patents
Soft and hard combined board Download PDFInfo
- Publication number
- CN219876292U CN219876292U CN202320542963.9U CN202320542963U CN219876292U CN 219876292 U CN219876292 U CN 219876292U CN 202320542963 U CN202320542963 U CN 202320542963U CN 219876292 U CN219876292 U CN 219876292U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board
- flexible
- circuit layer
- insert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 230000000149 penetrating effect Effects 0.000 claims abstract description 9
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 36
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A soft and hard combined board comprises a soft circuit board, a hard circuit board and an insert. The flexible circuit board comprises a flexible substrate, a first circuit layer formed on the flexible substrate and an opening penetrating through the first circuit layer and the flexible substrate. The hard circuit board comprises at least one insulating substrate, at least one second circuit layer formed on the insulating substrate and a conductive through hole penetrating through the at least one second circuit layer and the at least one insulating substrate. The insert penetrates through the opening and the conductive through hole, and the insert is electrically connected with the first circuit layer and the at least one second circuit layer.
Description
The utility model relates to a soft and hard combined plate and a soft and hard combined plate combined structure (application number: 2022224292196, application date: 2022, 9 months and 14 days) of Chinese patent application.
Technical Field
The present utility model relates to a circuit board, and more particularly to a flexible-rigid board.
Background
The soft and hard combined board (rib-flex circuit board) is formed by a soft circuit board (flexible circuit board) and a hard circuit board (rigid circuit board) through an adhesive in a pressing mode, wherein the adhesive is mainly bisphenol A type epoxy resin, and has a plurality of toxic and harmful byproducts. In order to avoid harm to human health and environment, strict laws are prescribed by developed countries or health organizations to prohibit the import, vending and production of products containing harmful chemicals, so as to reduce the use of harmful chemicals such as adhesives or soldering tin. In view of this, improvement of the rigid-flex board is needed.
Disclosure of Invention
The utility model relates to a rigid-flex board for reducing the use of adhesive or solder and other harmful chemicals.
The utility model provides a soft and hard combined board, which comprises a soft circuit board, a hard circuit board and an insert. The flexible circuit board comprises a flexible substrate, a first circuit layer formed on the flexible substrate and an opening penetrating through the first circuit layer and the flexible substrate. The hard circuit board comprises at least one insulating substrate, at least one second circuit layer formed on the insulating substrate and a conductive through hole penetrating through the at least one second circuit layer and the at least one insulating substrate. The insert penetrates through the opening and the conductive through hole, and the insert is electrically connected with the first circuit layer and the at least one second circuit layer.
For a better understanding of the above and other aspects of the utility model, reference will now be made in detail to the following examples, examples of which are illustrated in the accompanying drawings.
Drawings
FIG. 1 is a schematic diagram of a flexible printed circuit according to an embodiment of the utility model;
fig. 2 is a schematic diagram of a hard circuit board according to an embodiment of the utility model;
FIG. 3 is a schematic view of an insert according to an embodiment of the utility model; and
Fig. 4A and 4B are schematic diagrams illustrating an assembly of a rigid-flex board according to an embodiment of the utility model.
Wherein:
100, a soft and hard combined plate;
110, a flexible circuit board;
112, a soft substrate;
114, a first circuit layer;
115, conducting wires;
115a, line segment;
115b, a drilling part;
116, opening;
120 rigid circuit board
122 an insulating substrate;
124 a second wiring layer;
125 conductive vias;
126 a conductive layer;
130, an insert;
131 tip;
132, a body;
133, concave holes;
134, a joint;
136 serrated surfaces;
wa, first line width;
wb, second line width.
Detailed Description
Referring to fig. 1-3, fig. 1 is a schematic diagram of a flexible circuit board 110 according to an embodiment of the utility model, fig. 2 is a schematic diagram of a rigid circuit board 120 according to an embodiment of the utility model, and fig. 3 is a schematic diagram of an interposer 130 according to an embodiment of the utility model. In the present embodiment, the flexible printed circuit board 110 and the rigid printed circuit board 120 are connected by the insert 130 to replace the conventional adhesive or solder with the flexible printed circuit board 100 (see fig. 4B). The rigidity of the hard circuit board 120 provides stability, while the flexibility of the soft circuit board 110 provides flexibility required for installation in a small space. The rigid-flex board 100 can miniaturize the product and reduce its weight, helping to reduce the number of connectors between the rigid-flex board and the flexible board to improve the performance of the product.
The flexible-rigid printed circuit board 100 includes a flexible printed circuit 110, a rigid printed circuit 120 and an interposer 130. The flexible circuit board 110 includes a flexible substrate 112, a first circuit layer 114 formed on the flexible substrate 112, and an opening 116 penetrating the first circuit layer 114 and the flexible substrate 112. The hard circuit board 120 includes at least one insulating substrate 122, at least one second circuit layer 124 formed on the insulating substrate 122, and a conductive via 125 penetrating the at least one second circuit layer 124 and the at least one insulating substrate 122. The interposer 130 penetrates the opening 116 and the conductive via 125, and the interposer 130 is electrically connected to the first circuit layer 114 and the at least one second circuit layer 124.
As shown in fig. 1, the flexible substrate 112 is made of an organic polymer material such as polyimide (polyimide), the first circuit layer 114 is formed on the surface of the substrate, the first circuit layer 114 may be a single-layer or double-layer circuit, and the first circuit layer 114 is formed of a conductive material (e.g., a metal such as copper) that is electroplated or electroless-plated. The conductive lines 115 on the first circuit layer 114 are formed with a predetermined circuit pattern, for example, through an etching process or an electroplating process, and in order to reduce the use of adhesive, openings 116 of a predetermined size are formed on the conductive lines 115 of the first circuit layer 114. The opening 116 is formed by penetrating the wire 115 with a laser or a drill, for example, and has a size smaller than or equal to a line width of the wire 115.
As shown in fig. 1, the first circuit layer 114 includes a plurality of conductive lines 115, and each conductive line 115 has a line segment 115a with a first line width Wa and a drilled portion 115b with a second line width Wb. The first line width Wa is smaller than the second line width Wb, that is, the hole portion 115b is located on a wire portion having a wider line width to form an opening 116 of a predetermined size on the wire 115. The opening 116 may be sized to fit the insert 130 such that the insert 130 can be inserted into the opening 116 of the bore 115b.
In addition, referring to fig. 2, the hard circuit board 120 includes, for example, a plurality of insulating substrates 122 and a plurality of second circuit layers 124 stacked on each other. The insulating substrate 122 is, for example, an epoxy glass fiber substrate such as FR-4, and the second circuit layer 124 may be formed between two adjacent insulating substrates 122 and on the surface of the outermost insulating substrate 122. In addition, the second circuit layer 124 may be formed with a predetermined circuit pattern through an etching process or an electroplating process, and conductive vias 125 of a predetermined size are formed in the hard circuit board 120 in order to reduce the use of adhesive. The conductive via 125 is drilled through the insulating substrate 122, for example, with a laser or with a drill, and a conductive layer 126 (e.g., copper layer) is formed inside the via. The size of the conductive via 125 may be made according to the size of the insert 130 such that the insert 130 can be inserted into the conductive via 125.
Referring to fig. 3, the insert 130 includes a body 132 and a coupling portion 134, the coupling portion 134 extends outwardly from two sides of the body 132, and the coupling portion 134 has a serrated surface 136. The joint 134 is substantially perpendicular to the body 132 to form a T-shaped structure. The bonding portion 134 and the body 132 are integrally formed, such as by casting, and may be made of a metal such as copper, so as to form a desired shape.
As shown in fig. 3, the body 132 of the insert 130 may be a cylinder having a recess 133, and the recess 133 passes through the center of the cylinder. When the insert 130 is inserted into the flexible circuit board 110 and the rigid circuit board 120, the body 132 of the insert 130 is fastened in the conductive via 125 of the rigid circuit board 120 by the shrinkage cavity 133, so that the body 132 of the insert 130 is electrically connected with the conductive layer 126 (e.g. copper layer) of the conductive via 125.
In one embodiment, the recess 133 is, for example, elongated, and extends along the axial direction of the body 132, so that the recess 133 has enough space for retraction. In addition, the body 132 of the insert 130 has a tapered tip 131, whose size is smaller than the inner diameter of the conductive via 125, so that the tip 131 of the insert 130 protrudes from one side of the rigid circuit board 120 through the conductive via 125, but the utility model is not limited thereto.
In addition, the bonding portion 134 is, for example, an elongated shape, and the bonding portion 134 is located at the top of the body 132 and horizontally extends on two opposite sides of the body 132. The lower surface (i.e., the serrated surface 136) of the bonding portion 134 may be pressed against the edge of the opening 116 of the flexible circuit board 110, so that the serrated surface 136 of the bonding portion 134 is bonded to the first circuit layer 114. In one embodiment, the tips of the serrated surfaces 136 of the bonding portion 134 may be inserted into the first circuit layer 114 to enable the serrated surfaces 136 to bite onto the first circuit layer 114.
Referring to fig. 4A and 4B, an assembly schematic diagram of a rigid-flex board 100 according to an embodiment of the utility model is shown. In fig. 4A, the flexible circuit board 110 is first placed on one side of the rigid circuit board 120, and the opening 116 of the flexible circuit board 110 needs to be aligned with the conductive via 125 of the rigid circuit board 120, so that the opening 116 overlaps with the conductive via 125 for positioning. In fig. 4B, the insert 130 is inserted into the opening 116 from one side of the flexible circuit board 110 and the outer diameter of the body 132 of the insert 130 is substantially equal to the inner diameter of the conductive via 125, so that the insert 130 is fastened in the rigid circuit board 120. Meanwhile, the bonding portion 134 of the insert 130 is pressed against the flexible circuit board 110, so that the flexible circuit board 110 and the rigid circuit board 120 are combined into a flexible-rigid board 100 by the insert 130.
In another embodiment, if more rigid circuit boards 120 or flexible circuit boards 110 are to be combined, different types of inserts 130 can be fabricated. For example, the insert 130 having an elongated length may be used to bond more than two rigid circuit boards 120 and at least one flexible circuit board 110. To combine two flexible circuits on opposite sides of the hard circuit board 120, one insert 130 may be inserted from one side of the hard circuit board 120 to connect to one flexible circuit board 110 and the hard circuit board 120, and another insert 130 may be inserted from the other side of the hard circuit board 120 to connect to the other flexible circuit board 110 and the hard circuit board 120. Therefore, the soft and hard plate bonding structure of the present embodiment is not limited to only one, and is not limited to the bonding method.
The soft and hard combined board 100 and the soft and hard combined structure thereof according to the above embodiments of the present utility model connect the soft circuit board 110 and the hard circuit board 120 through the insert 130 to replace the conventional adhesive or solder, so that the use of harmful chemicals such as adhesive or solder can be reduced. In addition, the body 132 of the insert 130 may be fastened in the conductive via 125 of the rigid circuit board 120 by shrinking the recess 133, so that the body 132 of the insert 130 is electrically connected with the conductive layer 126 (e.g., copper layer) of the conductive via 125. In addition, the tips of the serrated surfaces 136 of the bonding portion 134 can be inserted into the circuit layer of the flexible circuit board 110, so that the serrated surfaces 136 can be snapped onto the circuit layer, thereby improving the bonding stability.
In summary, although the present utility model has been described above by way of examples, it is not limited thereto. Those skilled in the art will appreciate that various modifications and adaptations can be made without departing from the spirit and scope of the present utility model. Accordingly, the scope of protection of the present utility model is defined by the claims.
Claims (7)
1. A rigid-flex board, comprising:
a flexible circuit board, which comprises a flexible substrate, a first circuit layer formed on the flexible substrate and an opening penetrating the first circuit layer and the flexible substrate;
the hard circuit board comprises at least one insulating substrate, at least one second circuit layer formed on the insulating substrate and a conductive through hole penetrating through the at least one second circuit layer and the at least one insulating substrate; and
and the insert penetrates through the opening and the conductive through hole and is electrically connected with the first circuit layer and the at least one second circuit layer.
2. The board as claimed in claim 1, wherein the insert includes a body and a coupling portion extending outwardly from both sides of the body, and the coupling portion has a serrated surface.
3. The board of claim 2, wherein the body passes through the opening and the conductive via and is fastened in the conductive via of the rigid circuit board.
4. The flexible-rigid composite board according to claim 2, wherein the body includes a cylinder having an outer diameter corresponding to an inner diameter of the conductive via.
5. The rigid-flex board according to claim 4, wherein said cylinder has a concave hole passing through a center of said cylinder.
6. The board as claimed in claim 2, wherein the body and the joint are integrally formed as a T-shaped structure.
7. The flexible printed circuit board as claimed in claim 2, wherein the bonding portion protrudes from the flexible printed circuit board, and the bonding portion is pressed against an edge of the opening of the flexible printed circuit board, and the serrated surface of the bonding portion is bonded to the first circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320542963.9U CN219876292U (en) | 2022-09-14 | 2022-09-14 | Soft and hard combined board |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222429219.6U CN219068482U (en) | 2022-09-14 | 2022-09-14 | Soft and hard board combining structure |
| CN202320542963.9U CN219876292U (en) | 2022-09-14 | 2022-09-14 | Soft and hard combined board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222429219.6U Division CN219068482U (en) | 2022-09-14 | 2022-09-14 | Soft and hard board combining structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219876292U true CN219876292U (en) | 2023-10-20 |
Family
ID=86364829
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320542963.9U Active CN219876292U (en) | 2022-09-14 | 2022-09-14 | Soft and hard combined board |
| CN202222429219.6U Active CN219068482U (en) | 2022-09-14 | 2022-09-14 | Soft and hard board combining structure |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222429219.6U Active CN219068482U (en) | 2022-09-14 | 2022-09-14 | Soft and hard board combining structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN219876292U (en) |
-
2022
- 2022-09-14 CN CN202320542963.9U patent/CN219876292U/en active Active
- 2022-09-14 CN CN202222429219.6U patent/CN219068482U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN219068482U (en) | 2023-05-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |